JP4271009B2 - Non-contact type IC media manufacturing method and non-contact type IC media - Google Patents

Description

  The present invention relates to a non-contact type IC medium manufacturing method and a non-contact type IC medium in which an antenna portion is formed by intersecting pattern lines when an IC chip is mounted on a wound antenna pattern.

  In recent years, for example, a technology related to non-contact type media (non-contact type IC card or the like) called RF-ID (Radio Frequency Identification) has been rapidly advanced, and its use has been various. Such an RF-ID is manufactured by forming an antenna pattern serving as an antenna portion on a base material and attaching what is called an inlet having an IC chip mounted thereon to another base base material. In manufacturing such an RF-ID, reduction of manufacturing processes from formation of an antenna pattern to attachment to a base substrate to be an RF-ID, improvement of throughput, and the like are desired.

  For example, in the above-described RF-ID, it is common to form a loop by winding a plurality of antenna patterns of an antenna unit for communication at an inlet, and an IC chip is mounted between terminals at both ends of the pattern. It is necessary to cross pattern lines. Regarding the formation of such an antenna pattern, the following patent document discloses its form and manufacturing method.

JP 2002-288612 A JP 2002-294197 A

  Patent Document 1 discloses a non-contact type IC card as a so-called luggage tag, and an IC chip having an insulating layer interposed between both land portions of an antenna portion formed on the surface of a sheet substrate as its structure. The interposer on which is mounted is pasted. Further, Patent Document 2 discloses a non-contact type IC media bonding adhesive, and as a manufacturing process thereof, an antenna portion is formed on one half of a substrate, an IC chip is mounted, and the like. A jumper portion and an insulating layer are formed on the other half, and one terminal of the IC chip and a terminal of the antenna portion are short-circuited by the jumper portion by applying a bonding adhesive and bending and bonding.

  By the way, when it is necessary to cross pattern lines such as forming a circuit pattern in a winding form, such as the non-contact type IC card shown in Patent Documents 1 and 2 above, insulation is provided at the crossing portion. A layer is formed, and a jumper line is formed on the insulating layer to form a multilayer structure. That is, when the above pattern lines are crossed, an insulating layer must be formed, and the manufacturing process and equipment for forming the insulating layer are required for that, and it is not necessary to attach to the base substrate. There is a problem that a process is required, resulting in high costs and a decrease in throughput.

  Accordingly, the present invention has been made in view of the above problems, and provides a non-contact type IC media manufacturing method and non-contact type IC media that enable one-pass production, reduce manufacturing steps, reduce costs, and improve throughput. For the purpose.

In order to solve the above-mentioned problem, in the invention of claim 1, an antenna portion of a winding pattern is formed on at least three pieces of insulating base material that are continuously provided , and a predetermined piece is provided between the end portions of the antenna portion. A method of manufacturing a non-contact type IC medium in which an IC chip is mounted by short-circuiting with a predetermined number of extensions formed on at least one surface of any two pieces of the base material and a predetermined surface of another piece A step in which an adhesive layer is formed, and two pieces in which the adhesive layer is formed on at least one surface, and a pair of the antenna portion and the extension portion are formed on separate pieces. A step of forming a predetermined number of through portions in corresponding portions to which the antenna portions and the extension portions are connected, and the antenna portions on each of the other two surfaces of which at least one surface has an adhesive layer formed and extension conductive Lee · The formed by printing on the same plane by a predetermined number of separate pieces of a pair by the steps of the conductive ink is filled into the through portion, of the two pieces of the antenna portion and the extension portion is formed, The step of mounting the IC chip between the terminals of the antenna unit or the extension unit for each predetermined number, and the two through-hole adhesive layers facing each other so as to face each other, and the penetrating portions facing each other The conductive ink filled in is made conductive, and the other piece is superposed on the surface of one or both pieces on which the antenna portion or the extension portion is formed via the adhesive layer. Adhering step.

In the inventions of claims 2 and 3, "the other piece is superposed and bonded on the surface of the piece on which the antenna part or the extension part on which the IC chip is mounted is formed",
“When the antenna part and the extension part are paired to form two or more pieces on two pieces each having an adhesive layer formed on at least one surface, the individual antenna part and extension are finally formed. Are separated as a single piece including a part. "

According to a fourth aspect of the present invention, there is provided a non-contact type IC media manufacturing method according to at least one of the first to third aspects, wherein an antenna portion having a winding pattern is formed, and an end portion of the antenna portion is formed. A non-contact type IC medium that is short-circuited by a predetermined number of extension portions, wherein an antenna portion of a winding pattern is formed on a predetermined surface by printing with conductive ink , and the extension portion is connected A corresponding number of through portions are formed in a predetermined portion of the antenna portion, the second base material is filled with the conductive ink in the through portion, and the second base material is connected to the predetermined surface, An extension that short-circuits between the ends of the antenna portion formed on the second base is formed by printing with conductive ink on the same surface as the antenna portion, and the extension portion of the antenna portion Corresponding to the connection with the specified end The through portion of the formation, and the third base in which the conductive ink in the through portion is filled, the predetermined position of the antenna portion formed on the second substrate or the third substrate An IC chip mounted at a predetermined position of the formed extension, and a surface of the second base material or the third base material on which the IC chip is mounted, on which the antenna part is not formed, and the extension part configuration but intended to be adhered by superposition by bending a plane that is not formed, that having a, and the adhesive layer to a conductive state the filled electrically conductive ink between said penetrating portion of one another facing after bonding Let's make it.

According to the present invention, a predetermined number of corresponding portions where the antenna portion and the extension portion are connected to two pieces in which an adhesive layer is formed on at least one surface of an insulating base material composed of at least three pieces provided in series. The antenna part and the extension part are formed on each of the other surfaces of the two pieces by a conductive ink and printed on the same surface in pairs, and the formed through part is After the conductive ink is filled, the IC chip is mounted, and the two adhesive layers are made to face each other and bonded to each other, thereby bringing the conductive inks filled in the opposing through portions into a conductive state. At the same time, the base material on which the extension part or the antenna part is formed becomes an insulating layer by superposing and bonding another piece on the surface of either or both of the parts on which the antenna part or the extension part is formed. From, extend separately It is possible to eliminate the formation of an insulating layer for forming the substrate, reduce the manufacturing process, enable one-pass production, reduce the manufacturing cost, and improve the throughput. is there.

  In addition, the above-mentioned manufacturing method is achieved by forming a non-contact type IC medium in which at least two pieces are bonded with an adhesive layer and the antenna part and the extension part are in a conductive state by the non-contact type IC medium manufacturing method as described above. As a result, the cost of the non-contact type IC media can be reduced by reducing the manufacturing cost by the method and improving the throughput.

  Hereinafter, the best embodiment of the present invention will be described with reference to the drawings. In the drawings shown in the present embodiment, the cross-sectional view is shown with the dimensions and the like ignored for the sake of explanation. Moreover, in this embodiment, as a case where an adhesive layer is formed on at least one surface of any two pieces of the base material and a predetermined surface of the other piece, the entire front and back surfaces of the base material are improved in terms of manufacturing efficiency. In the following description, the adhesive layer is formed.

  FIG. 1 shows a configuration diagram of a first embodiment of a non-contact type IC medium according to the present invention. 1A is a cross-sectional view of a predetermined portion of a non-contact type IC medium according to the present invention, FIG. 1B is a partial plan view in a developed state, and FIG. 1C is a conceptual perspective view in the middle of manufacturing. 1 (A) to 1 (C), the non-contact type IC medium 11 is formed of an insulating first to fourth base materials 12 to 15 such as a film or paper as shown in FIG. 1 (A). It is composed of four pieces, each of which is laminated and adhered in four layers via an adhesive layer 16.

  As shown in FIGS. 1A and 1B, a predetermined number of turns of the antenna portion 15 are wound on the other surface of the second base material 13 (actually on the surface of the adhesive layer 16). The formed antenna portion 17 is formed by, for example, screen printing using a conductive member, for example, a conventionally known conductive ink. As the conductive ink, for example, there is one in which conductive metal particles are mixed in ink usually used for screen printing. Then, both end portions of the antenna portion 17 become antenna terminals 17A and 17B, and through portions 18A and 18B are formed at the tip portions of the antenna terminals 17A and 17B so as to be filled with the conductive ink.

  On the other hand, on the other surface (actually on the surface of the adhesive layer 16) of the third base material 14, extensions 19 and 20 are formed, for example, in a straight line (the shape is free). 19 and 20 are formed of the same conductive ink as that of the antenna unit 15, and through portions 19A and 20A are formed in portions corresponding to the antenna terminals 17A and 17B when they are superimposed on the second base material 13, respectively. Thus, the conductive ink is filled. The extension portions 19 and 20 are mounted with the IC chip 21 on the other end of the end portion where the through portions 19A and 20A are formed, and are formed at intervals corresponding to the terminals of the IC chip 21. The IC chip 21 is mounted, for example, by forming terminals such as bumps on the IC chip 21 and connecting and mounting the extension parts 19 and 20 in a welded form.

  Further, on the opposite surfaces of the antenna portion 17 and the extension portions 19 and 20 on which the second base material 13 and the third base material 14 are formed (one surface of the second and third base materials 13 and 14). When opposed to each other and bonded by the adhesive layer 16, the penetrating portion 18A of the antenna terminal 17A and the penetrating portion 19A of the extension portion 19 face each other and are made conductive by the conductive ink filled with each other, and the antenna terminal 17B. The penetrating portion 17B and the penetrating portion 20A of the extension portion 20 face each other and are made conductive by conductive ink filled with each other.

  For example, the conductive ink filled in the penetrating portions 18A, 18B, 19A, and 20A facing each other by the pressure at the time of bonding using the adhesive constituting the adhesive layer 16 as a pressure sensitive adhesive is brought into a close contact state and a conductive state. Become. As the pressure-sensitive adhesive, for example, an adhesive composed of natural rubber or natural rubber latex is filled with a fine particle filler such as silica, coast starch, starch, etc. The adhesive strength can be adjusted by the applied pressure.

  Predetermined information 22 and 23 are formed on one surface of the first and fourth substrates 12 and 15, but in practice, the information is formed on the surface of the adhesive layer 16 by printing. That is, as shown in FIG. 1C, when the base material 24 to which the first to fourth base materials 12 to 15 are connected is overlapped and bonded by so-called W-folding at a fold line 25, the information 22 described above is obtained. , 23 are displayed on the front and back surfaces of the non-contact type IC media 11.

  Here, FIG. 2 shows a configuration diagram of an example of a manufacturing system in manufacturing a circuit pattern forming module according to the present invention. In FIG. 2, the manufacturing system 31 includes a continuous base material supply unit 32, a printing unit 33A, a punching unit 34, a sewing machine unit 35, a printing unit 33B, a drying / curing unit 36, a mounting unit 37, a folding unit 38, and a cutting / crimping unit. 39 and the discharge part 40 are suitably provided. The continuous base material supply part 32 supplies the base material 24 connected with the first to second base materials 12 to 15 in a continuous state (continuous base material 24A) as shown in FIG. It is assumed that an adhesive layer (pressure sensitive) 16 is formed on both the front and back surfaces in advance.

  The printing unit 33A prints and prints the information 22 and 23 on one side of the position to be the first and fourth base materials 12 and 15, regardless of the printing method. For example, by offset printing Done. The perforated part 34 is connected to a portion where the antenna terminals 17A and 17B of the antenna part 17 and both ends of the extension parts 19 and 20 overlap when the first to fourth base materials 12 to 15 are folded. The through portions 18A, 18B, 19A, and 20A are formed. The sewing machine portion 35 forms a cut sewing wire (41) for forming a single base material 24 (first to fourth base materials 12 to 15), and also the first to fourth base materials 12. A fold line 25 for folding as -15 is formed. The sewing machine part 35 may be disposed in the subsequent process of the mounting part 37 in the subsequent process of the drying / curing part 36 to be described later, but here it will be described as being disposed in this position.

  The printing section 33B performs, for example, screen printing, and the printing ink used is conductive ink as described above. That is, the printing part 33B prints the antenna part 17 and the extension parts 18 and 20 on the other surface of the second and third base materials 13 and 14, and the through part 18A formed by the perforated part 34, 18B, 19A, and 20A are filled with conductive ink. Here, the filling means that at least the conductive ink is flush with or protrudes from one surface (pressure-sensitive adhesive layer 16 side) when the through-holes 18A, 18B, 19A, 20A are filled with the conductive ink. The degree to be done.

  The drying / curing unit 36 cures (fixes) the conductive ink by heating the second and second base materials 12 and 13 printed by the printing unit 33B at a predetermined temperature. The mounting portion 37 is mounted by connecting the IC chip 21 between the formed extensions 19 and 20 as described above, for example. The folding portion 38 folds the continuous first to fourth base materials 12 to 15 into a so-called W fold along the fold line 25 formed through the adhesive layer 16. In this case, as described above, between the second and third base materials 13 and 14, the opposite surfaces of the formed antenna portion 17 and extension portions 19 and 20 (second and third base materials 13 and 14). Of one side) and are folded over.

  Then, the cutting / crimping part 39 is cut by the cut sewing line (41) formed so as to make the first to fourth base materials 12 to 15 in a continuous state folded into a single base material 24. Then, the adhesive layers 16 are bonded to each other with a predetermined pressure by a pressure roller, and the non-contact type IC media 11 is discharged to the discharge unit 40.

  Here, FIG. 3 shows another configuration diagram of the manufacturing system in the production of the non-contact type IC media according to the present invention. The manufacturing system shown in FIGS. 3A and 3B is obtained by dividing the manufacturing system 31 shown in FIG. 2 into two parts, and is shown as one form of so-called one-pass production. 3A includes a continuous base material supply unit 32, a printing unit 33A, a perforation unit 34, a sewing machine unit 35, and a continuous base material winding unit 32A. That is, the continuous base material 24A is supplied from the continuous base material supply unit 32, and the printing unit 33A, the punching unit 34, and the sewing machine unit 35 perform the above-described processing and processing, and the continuous base material winding unit 32A takes up the processing. This is the continuous base material supply part 32B of the second manufacturing system 31B in FIG. 3 (B). The equipment configuration in the second manufacturing system 31B is the same as that after the printing unit 33B in FIG. In particular, it is advantageous when the continuous base material wound up by the continuous base material winding portion 32A is temporarily stored and the remaining manufacturing steps are performed when necessary.

  Therefore, FIGS. 4 and 5 are explanatory views of the production of the non-contact type IC media by the manufacturing system of FIG. First, as shown in FIG. 4A, both the front and back surfaces of a continuous base material 24A in which the base material 24 connected to the first to fourth base materials 12 to 15 supplied from the continuous base material supply unit 32 is made continuous. An adhesive layer (pressure-sensitive) 16 is applied in advance, and is not shown in the figure. In the continuous base material 24A on which the adhesive layer 16 is formed, information 22 and 23 are respectively formed on predetermined portions of one surface at positions where the first and fourth base materials 12 and 15 are to be formed in the printing unit 33A. . The continuous base material 24A on which the information 22 and 23 is formed is the base material 24 (first surface) when the through portions 18A, 18B, 19A, and 20A positioned in the perforated portion 34 as described above become the single unit. To fourth base materials 12 to 15) (FIG. 4B).

  Then, in the sewing machine part 35, the cut sewing line 41 which is a separation line for making the continuous base material 24 into a single is formed in the width direction of the continuous base material 24, respectively, and the folding line 25 is the said continuous line, for example It is formed in the longitudinal direction of the base material 24A (FIG. 4C). In the printing unit 33B, the antenna unit 17 is printed on the same surface of the other surface of the second and third substrates 13 and 14 of the continuous substrate 24A, for example, on the second substrate 13, and the third portion The extensions 19 and 20 are printed on the substrate 14. The formation positions of the antenna portion 17 and the extension portions 19 and 20 are determined by a plate in screen printing, and are formed to include the through portions 18A, 18B, 19A, and 20A, respectively. At this time, since the conductive ink is supplied by the squeegee, the conductive ink is filled in the through portions 18A, 18B, 19A, and 20A, and the supply amount of the conductive ink onto the plate is adjusted. The full state can be achieved (FIG. 4D).

  After the continuous base material 24A in which the antenna part 17 and the extension parts 19 and 20 are formed by the printing part 33B is fixed by the drying / curing part 36, the IC chip 21 is inserted between the extension parts 19 and 20 in the mounting part 37. It is mounted and mounted (FIG. 5B). Thereafter, the folded portions 38 are sequentially folded along the folding line 25 with the adhesive layer 16 interposed therebetween (FIG. 5B). The folded continuous base material 24A is separated into a single base material 24 (first to fourth base materials 12 to 15) in a state of being folded at the cutting / crimping part 39, and is sensed by the pressure roller. The pressure adhesives are bonded to each other (FIG. 5C). In addition, a groove for avoiding the IC chip 21 is formed in the pressure roller so that an excessive pressure is not applied to the IC chip 21 mounted at the time of pressure bonding (not shown, see 60 in FIG. 8).

  That is, the conductive ink filled in the penetrating portion 18A of the antenna terminal 17A of the antenna portion 17 and the conductive ink filled in the penetrating portion 19A of the extension portion 19 are brought into close contact with each other and become conductive. The conductive ink filled in the through portion 18B of the 17 antenna terminals 17B and the conductive ink filled in the through portion 20A of the extension portion 20 are brought into close contact with each other to become a conductive state, so that the non-contact type IC media 11 Is discharged to the discharge unit 40 (FIG. 5D).

  Thus, since the 3rd base material 14 in which the extension parts 19 and 20 were formed becomes an insulating layer, formation of the insulating layer for forming an extension part separately can be made unnecessary, and a manufacturing process is carried out. In addition to the reduction, since the antenna portion 17 and the extension portions 19 and 20 can be formed by printing on the same surface at a time, one-pass production is possible, manufacturing costs can be reduced, and throughput can be reduced. Can be improved. In addition, the non-contact type IC medium in which the second and third base materials 13 and 14 are bonded with an adhesive layer so that the antenna portion and the extension portion are in a conductive state by the above-described non-contact type IC media manufacturing method. By using the media 11, the cost of the non-contact type IC media can be reduced as a result of the reduction of the manufacturing cost by the above manufacturing method and the improvement of the throughput.

  Next, FIGS. 6 and 7 show manufacturing configuration diagrams of the second embodiment of the non-contact type IC media according to the present invention. In this embodiment, a plurality of antenna portions 17 and corresponding extensions 19 and 20 are formed and bonded to the second and third substrates 13 and 14 with the substrate 24 as a unit, and then a pair of antenna portions 17 and the corresponding extensions 19 and 20 are separated. First, an adhesive layer (pressure sensitive) 16 is applied to both the front and back surfaces of the continuous base material 24A, and the second and third base materials 13, 14 is formed with through portions 18A, 18B, 19A, and 20A corresponding to the plurality of antenna portions 17 and the extended portions 19 and 20 (FIG. 6A).

  And after the cut sewing line 41 and the folding line 25 which make the base material 24 for every unit are formed, a plurality (here, 4 pairs) of the second and third base materials 13 and 14 for each unit are formed. The antenna portion 17 and the extension portions 19 and 20 are formed by printing, and the IC chip 21 is mounted between the extension portions 19 and 20. (FIG. 6B).

  Subsequently, the continuous base material 24 </ b> A is folded along the folding line 25, cut for each base material 24 by the cut sewing line 41, and then bonded by pressure bonding (FIG. 7A). Then, the single non-contact type IC media 11 is formed by the cutting lines 42A and 42B or by die cutting (FIG. 7B). In this case, similarly to the above, each antenna part 15 and the extension parts 17 and 18 are brought into conduction by the conductive ink filled in the through parts 18A, 18B, 19A and 20A.

  Even when the non-contact type IC media 11 is manufactured as described above, it is not necessary to separately form an insulating layer for forming the extended portions 19 and 20 as described above, and the manufacturing process is reduced. Since the antenna portion 17 and the extension portions 19 and 20 can be formed on the same surface by printing at one time, one-pass production is possible, manufacturing costs can be reduced, and throughput can be improved. It is. As a result, the cost of the non-contact type IC media can be reduced.

  Next, FIG. 8 shows a configuration diagram of a third embodiment of the non-contact type IC media according to the present invention. In the present embodiment, the IC chip is mounted on the second base material (antenna part forming side). In FIG. 8, the non-contact type IC medium 11A is formed in a form in which a predetermined number of antenna portions 17 are wound on the other surface (actually on the adhesive layer 16) of the second base material 13, A mounting terminal portion 17C for mounting an IC chip is formed with conductive ink by, for example, screen printing. The antenna portion 17 includes the mounting terminal portion 17C. Then, both ends of the antenna portion 17 become antenna terminals 17A and 17B, a through portion 18A is formed at the tip portion of the antenna terminal 17A, and a through portion 18C is formed at one end of the mounting terminal portion 17C. The ink is full.

  On the other hand, the extension part 19 is formed on the third base material 14 with, for example, a conductive ink on a straight line. Both ends of the extension part 19 penetrate when overlapped with the second base material 13. Through portions 19A and 19B are formed in portions corresponding to the portions 18A and 18C, respectively, and the conductive ink is filled. When the second base member 13 and the third base member 14 are opposed to each other on the opposite surfaces of the antenna portion 17 and the extension portion 19 and bonded by the adhesive layer 16, the antenna terminal 17A The penetrating portion 18A and the penetrating portion 19A of the extension portion 19 are opposed to each other by conductive ink filled with each other, and the penetrating portion 18C of the mounting terminal portion 17C and the penetrating portion 19B of the extension portion 19 are opposed to each other. Conduction is performed by conductive inks filled with each other.

  Then, the first base material 12 on which the information (22) is appropriately formed is folded and bonded to the formation side of the antenna portion 17 as the second base material 13, and the information (23) is appropriately formed. The formed fourth base material 15 is the third base material 14 and is folded and adhered to the side where the extension 19 is formed.

  Thus, even when the IC chip 21 is mounted on the non-contact type IC medium 11A on the side where the antenna portion 17 of the base material is formed, the insulating layer for forming the extension portions 19 and 20 is the same as described above. Since the manufacturing process is reduced and the antenna part 17 and the extension parts 19 and 20 can be formed on the same surface by printing at the same time, one-pass production is possible and manufacturing is possible. Cost can be reduced and throughput can be improved. As a result, the cost of the non-contact type IC media can be reduced. Note that the non-contact type IC media 11A may be ones in which the first to fourth base materials constituting the non-contact type IC medium 11A are continuous, or may be single sheets as described later.

Next, FIG. 9 shows a configuration diagram of a fourth embodiment of the non-contact type IC medium according to the present invention. In FIG. 9, it is a thing at the time of making the insulating 1st-4th base materials 12-15, such as the above-mentioned film or paper material , into a sheet. In FIG. 9, the manufacturing system 51 includes a processing transport line for the first base 61A, a processing transport line for the second base 61B, a processing transport line for the third base 61C, and a transport processing for the fourth base. Lines are arranged in parallel, and corresponding single piece base material supply parts 52A to 52D, perforation parts 53B and 53C, printing parts 54A to 54D, and drying / effect parts 55A to 55D are sequentially arranged.

  Further, reversing units 56A and 56B are arranged downstream of the drying / curing units 55A and 55B in the processing conveyance line of the first and second base materials 61A and 61B, and drying in the processing conveyance line of the third base material 61C is performed. A mounting portion 57 is disposed after the effect portion 55C. The processing conveyance lines of the first to fourth base materials 61A to 61D are connected to a main conveyance line 58 for superposition and pressure bonding. Further, the main transport line 58 is provided with a sensor 59B for alignment at a portion where the first and second base materials 61A and 61B are overlapped, and is positioned at a portion where the third base material 61C is overlapped. A sensor 59C for positioning is provided, and a sensor 59D for positioning is provided in a portion where the fourth base material 61D is overlapped. And the crimping | compression-bonding part 60 is arrange | positioned in the back | latter stage of the superimposition process.

  In such a manufacturing system 51, the adhesive layer 16 is formed in advance on both the front and back surfaces of the first to fourth base materials 61A to 61D, and these are respectively attached to the single piece base material supply parts 52A to 52D. A predetermined number is set and supplied to the next process. The first base material 61A sequentially supplied from the single-piece base material supply unit 52A has the information 22 printed and printed on one side by the printing unit 54A, fixed by the drying / effect unit 55A, and then inverted by the reversing unit 56A. And supplied to the main transport line 58.

  In the conveyance processing line of the second base material 61B, the second base material 61B sequentially supplied from the single-piece base material supply part 52B is the perforation part 53B and the antenna terminals 17A and 17B of the antenna part 17 as described above. Through portions 18A and 18B are formed at portions corresponding to the tips and supplied to the printing portion 54A, and the antenna portion 17 is formed by screen printing while filling the through portions 18A and 18B with conductive ink. Then, the conductive ink supplied by the drying / curing unit 55B is fixed, reversed by the reversing unit 56B, and fed onto the first base 61A that has been transported on the main transport line 58. At this time, the sensor 59B is positioned on the main transport line 58 and superimposed on the first base material 61A.

  Moreover, in the processing conveyance line of the 3rd base material 61C, the 3rd base material 61C sequentially supplied from the single piece base material supply part 52C respond | corresponds to the front-end | tip of the extension parts 19 and 20 by the perforation part 53C as mentioned above. Through portions 19A and 20A are formed in the portions to be supplied and supplied to the printing portion 54C, and the extension portions 19 and 20 are formed by screen printing while filling the through portions 19A and 20A with conductive ink. Subsequently, after the conductive ink supplied by the drying / curing unit 55 </ b> C is fixed, the IC chip 21 is mounted between the extension portions 19 and 20 by the mounting unit 57 and supplied to the main transport line 58. At this time, the sensor 59C is positioned on the main transport line 58 and superimposed on the first and second substrates 61A and 61B.

  Further, in the processing conveyance line of the fourth base material 61D, the fourth base material 61D sequentially supplied from the single piece base material supply unit 52D is printed and printed with the information 23 on one side by the printing unit 54D. The toner is fixed by the drying / effect unit 55D and supplied to the main transport line 58. At this time, the sensor 59D is positioned on the main transport line 58 and is superposed on the first to third base materials 61A to 61C.

  Then, the first to fourth base materials 61A to 61D are bonded to each other with a predetermined pressure at the pressure-bonding portion 60 by the adhesive layer 16 applied to each of them, thereby producing the non-contact type IC media 11C. . At this time, a groove for avoiding the IC chip 21 is formed in the pressure-bonding roller in the pressure-bonding portion 60 so that an excessive pressure is not applied to the mounted IC chip 21.

  As described above, the insulating layers for forming the extension portions 19 and 20 can be formed by using the first to fourth base materials 61A to 61D constituting the non-contact type IC media 11B as a single sheet. There is no need to form it separately, the manufacturing process is reduced, the manufacturing cost can be reduced, and the throughput can be improved. As a result, the cost of the non-contact type IC media can be reduced. Note that the non-contact type IC medium 11A may be mounted on the antenna portion 17 formed on the second base 61B as shown in FIG.

  Next, FIG. 10 shows a configuration diagram of a fifth embodiment of the non-contact type IC medium according to the present invention. This embodiment shows base materials 24A and 24B configured by connecting three pieces, and will be described with reference to the base material 24 configured by connecting four pieces shown in FIG. In FIG. 10A, non-contact type IC media 71A includes a base material 24A in which the second to fourth base materials 13 to 15 are connected and the adhesive layer (pressure sensitive) 16 is formed on both the front and back surfaces. An antenna portion 17 (including through portions 18A and 18B) is formed on the other surface of the second base material 13, and extensions 19 and 20 (including through portions 19A and 20A) are formed on the other surface of the third base material 14. Is formed.

  In addition, after the IC chip 21 is mounted between the extended portions 19 and 20 of the third base material 14, information (23) is formed on the one side as appropriate with the second and third base materials 13 and 14. The fourth base material 15 is folded and bonded by so-called Z-folding. Even in this case, in the Z-folding, the second and third base materials 13 and 14 are overlapped and bonded so that the opposite surfaces of the formation surface of the antenna portion 17 and the extension portions 19 and 20 face each other. 18B, 19A, and 20A face each other and become conductive.

  In addition, in order to protect the IC chip 21 mounted as a case where the non-contact type IC media 71A is manufactured with the three pieces of base material 24A, the base material (piece) on which the IC chip 21 is mounted is used as a protective base material. Although the fourth base material 15 is configured to be adjacent, when the non-contact type IC media 71A is attached to another member on the third base material 14 side, the IC chip 21 is It is good also as making a protection base material (it becomes the 1st base material 12 in this case) adjoin to the base material (piece) side which is not mounted. The same applies to the non-contact type IC media 71B shown in FIG.

  Further, the non-contact type IC medium 71B shown in FIG. 10B corresponds to FIG. 8, and the first to third base materials 12 to 14 are connected to each other, and an adhesive layer (pressure sensitive) is provided on both the front and back sides. ) The antenna portion 17 (including the mounting terminal portion 17C and the penetrating portions 18A and 18C) is formed on the other surface of the second substrate 13 in the substrate 24B on which the 16 is formed. An extension portion 19 (including through portions 19A and 19B) is formed in the direction.

  In addition, after the IC chip 21 is mounted between the antenna terminal 17B and the mounting terminal portion 17C of the second base material 13, the first base material 12 and the second base material 12 on which information (22) is appropriately formed on one side. In addition, the third base materials 13 and 14 are folded and bonded by so-called Z-folding. Even in this case, in the Z-folding, the second and third base materials 13 and 14 are overlapped and bonded so that the opposite surfaces of the formation surface of the antenna portion 17 and the extension portion 19 face each other, so that the through portions 18A, 18C, 19A and 19B are electrically connected to each other.

  Thus, even if the base material (piece) constituting the non-contact type IC media 71B is made into three pieces, there is no need to separately form an insulating layer for forming the extended portions 19 and 20 as described above. Since the manufacturing process is reduced, the antenna part 17 and the extension parts 19 and 20 can be formed on the same surface by printing at a time, so that one-pass production is possible and the manufacturing cost can be reduced. Throughput can be improved. As a result, similarly, the cost of the non-contact type IC media can be reduced as a result.

  By the way, although what was called Z-folding was shown in Drawing 10 (A) and (B), it is good also as what is called entrainment folding. That is, in FIG. 10A, the first base 12 is connected in place of the fourth base 15, and the second and third bases 13 and 14 are folded and bonded as described above. After that, the first substrate 12 is folded and bonded onto the third substrate 14. In FIG. 10B, a fourth base material 15 is connected in place of the first base material 12, and the second and third base materials 13 and 14 are folded and adhered as described above. After that, the fourth base material 15 is folded and adhered on the second base material 13.

  In addition, in producing the non-contact type IC media 11, 11 </ b> A to 11 </ b> C, 71 </ b> A, 71 </ b> B in each of the above-described embodiments, it is possible to apply a crimping postcard production facility that has been known for the configuration of the production system, It can be easily manufactured without the need for new equipment.

  By the way, in each said embodiment, the case where the screen printing was applied as a case where the antenna part 17 and the extension parts 19 and 20 were formed was shown, However, It can apply also with the printing form of an inkjet system, In this case In particular, the supply amount of the conductive ink to the through portions 18A to 18C, 19A, 19B, and 20A may be increased by controlling the ejection of the conductive ink.

  In each of the above embodiments, before the antenna portion 14 and the extension portions 19 and 20 are overlapped with each other, the through portions 18A to 18C, 19A, 19B, and 20A (including the periphery thereof) on the adhesive layer 16 side are overlapped. However, the conductive state between the penetrating portions can be made more reliable by applying a conductive agent such as a conductive paste.

  The non-contact type IC media manufacturing method and non-contact type IC media of the present invention can be applied to IC cards, IC tags, etc. used in RF-ID, single-piece inlet production of the RF-ID, etc. It can be done.

It is a block diagram of 1st Embodiment of the non-contact-type IC media based on this invention. It is a block diagram of an example of the manufacturing system in non-contact type IC media manufacture based on this invention. It is another block diagram of the manufacturing system in non-contact type IC media manufacture based on this invention. It is explanatory drawing (1) of non-contact-type IC media preparation by the manufacturing system of FIG. It is explanatory drawing (2) of non-contact-type IC media preparation by the manufacturing system of FIG. It is a manufacturing block diagram (1) of 2nd Embodiment of the non-contact-type IC media based on this invention. It is a manufacturing block diagram (2) of 2nd Embodiment of the non-contact-type IC media based on this invention. It is a block diagram of 3rd Embodiment of the non-contact-type IC media based on this invention. It is a block diagram of 4th Embodiment of the non-contact-type IC media based on this invention. It is a block diagram of 5th Embodiment of the non-contact-type IC media based on this invention.

Explanation of symbols

11, 71 Non-contact type IC media 12, 61A First base material 13, 61B Second base material 14, 61C Third base material 15, 61D Fourth base material 16 Pressure sensitive adhesive 17 Antenna portion 18A- 18C, 19A, 19B, 20A Through part 19, 20 Extension part 21 IC chip 22, 23 Information 24 Base material 25 Folding line 41 Cutting machine line 42 Cutting line

Claims (4)

An IC chip is formed by forming an antenna part of a winding pattern on at least three pieces of insulative base material to be connected and short-circuiting between the end parts of the antenna part with a predetermined number of extensions formed in a predetermined piece. A non-contact type IC media manufacturing method for mounting
Forming an adhesive layer on at least one surface of any two pieces of the substrate and a predetermined surface of the other piece;
The antenna portions and the extension portions in the case where a predetermined number of the antenna portions and the extension portions are formed in separate pieces are connected to the two pieces in which the adhesive layer is formed on at least one surface. A step in which a predetermined number of through portions are formed in the corresponding portion;
On each of the other surfaces of the two pieces on which the adhesive layer is formed on at least one surface, the antenna portion and the extension portion are formed on the same surface by a predetermined number of pairs in separate pieces with conductive ink , Filling the penetrating part with the conductive ink ;
A step of mounting the IC chip between terminals of the antenna unit or the extension portion for each predetermined number of the two pieces formed with the antenna portion and the extension portion;
The two pieces of the adhesive layers are made to face each other and bonded to each other so that the conductive inks filled in the facing through portions are brought into a conductive state, and the antenna portion or the extension portion is formed. A step of superposing and bonding the other piece on the surface of the one piece or both pieces via the adhesive layer;
A method for producing a non-contact type IC media, comprising:   2. The method of manufacturing a non-contact type IC medium according to claim 1, wherein the other piece is superposed and adhered on a surface of the piece on which the antenna portion or the extension portion on which the IC chip is mounted is formed. A method for producing a non-contact type IC medium.   3. The method of manufacturing a non-contact type IC medium according to claim 1, wherein the antenna part and the extension part are separated into two pieces each having an adhesive layer formed on the at least one surface. In the case of forming a plurality of each in a non-contact type IC media, the method is finally separated as a single piece including the individual antenna portions and extension portions. A non-contact type IC media manufacturing method according to any one of claims 1 to 3, wherein an antenna part of a winding pattern is formed, and a predetermined number of extension parts are provided between ends of the antenna part. Non-contact type IC media that is short-circuited at
An antenna portion of a winding pattern is formed on a predetermined surface by printing with conductive ink, and a corresponding number of through portions are formed in a predetermined portion of the antenna portion to which the extension portion is connected. A second substrate filled with conductive ink ;
The second and substrate and continuously provided, on a predetermined surface, conductive ink extending portion on the antenna portion and the same surface shorting between the ends of the antenna part which is formed on the second substrate And a third base material in which a corresponding number of penetrating portions are formed at a connection portion between the extension portion and the predetermined end portion of the antenna portion, and the penetrating portion is filled with the conductive ink. When,
An IC chip mounted at a predetermined position of the antenna portion formed on the second base material or at a predetermined position of the extension portion formed on the third base material;
The second substrate or the third substrate on which the IC chip is mounted has a surface on which the antenna portion is not formed and a surface on which the extension portion is not formed, and is bonded by overlapping. Then, an adhesive layer for bringing the conductive inks filled in each of the through parts facing each other after bonding into a conductive state ,
Contactless IC media, characterized in that it comprises a.

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