JP2007094563A - Non-contact data carrier inlet, non-contact data carrier inlet roll and non-contact data carrier, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal-applicable type non-contact data carrier capable of transmitting and receiving data from two different directions without degrading productivity. <P>SOLUTION: This non-contact data carrier 1 comprises a magnetic base material J1 formed in a plate shape from a magnetic material such as ferrite; an IC chip C having a storage circuit and a communication control circuit and mounted on chip mounting patterns 5a, 5b formed in pattern on one main face 19a of the magnetic base material J1; and an antenna coil A electrically connected to the IC chip C and constituted by the layer-to-layer connection, through the magnetic base material J1, of a first antenna pattern E1 wired around one main face 19a of the magnetic base material J1, and a second antenna pattern E2 wired around the other main face 19b of the magnetic base material J1. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a non-contact type data carrier, and relates to a non-contact type data carrier inlet, a non-contact type data carrier inlet roll and the non-contact type data carrier, and manufacturing methods thereof.

  If there is a conductor such as a metal in the field of the AC magnetic field, an eddy current is generated inside the conductor, and this eddy current becomes a demagnetizing field in a direction to cancel the AC magnetic field. For this reason, the non-contact type data carrier employing the electromagnetic induction method may not be able to respond to the reader / writer in an environment where eddy currents may be generated.

Therefore, in order to prevent electromagnetic waves from passing through a conductor such as a metal, a magnetic material such as ferrite having a high magnetic permeability is disposed between the conductor and the antenna coil on the non-contact data carrier side. Techniques for preventing the generation of current have been proposed. (For example, refer to Patent Document 1).
JP 2002-261524 A

  Here, the above document discloses a non-contact data carrier (tag) in which an antenna coil is formed on one main surface of a plate-like magnetic body such as a film or a sheet. However, in this case, data can be transmitted and received only on one side of the non-contact data carrier, that is, on the side where the antenna coil is formed on the plate-like magnetic material. Therefore, for example, when a non-contact type data carrier is attached to a metal article or the like and used, there is a problem that the non-contact type data carrier cannot be used if the attachment surface is wrong.

  Further, the above-mentioned patent document also discloses a non-contact type data carrier formed by winding an antenna coil spirally around a shaft core of a rod-shaped magnetic body. However, in the case of the non-contact type data carrier having this configuration, the manufacturing process of the antenna coil becomes a relatively complicated process, and the productivity is lowered.

  Therefore, the present invention has been made to solve the above-described problems, and can be used in a close position of a metal conductor without reducing productivity, and can transmit and receive data from two different directions. An object of the present invention is to provide a non-contact type data carrier inlet, a non-contact type data carrier inlet roll, a non-contact type data carrier, and a method of manufacturing the same.

  In order to achieve the above object, a non-contact type data carrier inlet according to the present invention is formed of a magnetic material, and a second main surface located on a side opposite to the first main surface and the first main surface. And an IC chip that has at least a memory circuit and a communication control circuit and is mounted on the first or second main surface of the magnetic substrate, and is electrically connected to the IC chip. The magnetic base material includes a first antenna portion provided on the first main surface of the magnetic base material and a second antenna portion provided on the second main surface of the magnetic base material. And an antenna element configured by interlayer connection through the antenna.

  A non-contact type data carrier inlet according to the present invention is formed of a magnetic material and includes a first main surface and a second main surface located on a side opposite to the first main surface. An IC chip having at least a memory circuit and a communication control circuit and mounted on the first or second main surface of the magnetic base material, and electrically connected to the IC chip, The first antenna pattern wired around the first main surface and the second antenna pattern wired around the second main surface of the magnetic base material via the magnetic base material. And an antenna coil configured by interlayer connection.

  That is, in these inventions, the constituent elements of the antenna element such as the antenna coil connected to the single IC chip having the memory circuit and the communication control circuit are opposed to the first main surface of the magnetic substrate. Disposed in a distributed manner on each of the second main surfaces located on the side. Therefore, according to these inventions, for example, it is possible to transmit and receive data from two different directions without using a manufacturing method that leads to a decrease in productivity, such as winding an antenna around the outer shape (outer periphery) of a magnetic material. In addition, it is possible to obtain a metal-compatible non-contact data carrier that can be used at a position close to the metal conductor.

  Specifically, when the non-contact type data carrier to which these inventions are applied is formed in a plate shape such as a card type, it is attached to the metal conductor without worrying about the front and back (mounting surface) of the non-contact type data carrier. Can be used. Here, the magnetic base material (magnetic body) formed of the above-described magnetic material is a so-called soft magnetic body or metal-based magnetic body.

In the non-contact data carrier inlet of the present invention, the first antenna pattern and the second antenna pattern respectively wired on the first and second main surfaces of the magnetic base The wiring is performed so as to avoid the overlapping of the pattern formation regions in the direction orthogonal to the first and second main surfaces.
According to the present invention, the difference in the parasitic capacitance caused by the difference in the degree of overlap between the first and second antenna patterns, that is, the variation in the capacitor component that can be caused by the alignment error due to the patterning of the antenna pattern, for example, is suppressed. Therefore, it is possible to contribute to the adjustment of the target resonance frequency in the LC circuit.

The contactless data carrier inlet of the present invention is characterized in that the first antenna pattern and the second antenna pattern are interlayer-connected using caulking or through holes.
In the present invention, for example, when caulking is applied, the process for performing interlayer connection can be simplified, and when interlayer connection using a through hole is applied, interlayer connection is achieved. Reliability can be improved.

Furthermore, in the non-contact type data carrier inlet of the present invention, the first antenna pattern and the second antenna pattern constituting the antenna coil are formed on the first and second main surfaces of the magnetic substrate. When viewed from one of the main surfaces, the winding directions are the same.
According to the present invention, the directions of electromagnetic induction generated by the first and second antenna patterns can be made uniform.

In the non-contact type data carrier inlet of the present invention, the antenna element or the antenna coil is laminated on the first and second main surfaces of the magnetic base material via an adhesive layer. And
Here, the adhesive layer is preferably made of a material having resistance to an etching process.
That is, according to the above-described invention, it is possible to suppress the corrosion of the magnetic base material due to the influence of, for example, an etching solution used in the etching process by the above-described adhesive layer.

Furthermore, the non-contact type data carrier inlet of the present invention is connected to the antenna coil on the magnetic base material, and the capacitance of the entire LC circuit can be adjusted by removing at least part of the magnetic base material. And a further capacitance adjustment pattern.
In this invention, the resonance frequency of the non-contact type data carrier inlet can be tuned by selectively removing or not removing at least part of the capacitance adjustment pattern from the magnetic substrate.

In the non-contact type data carrier inlet of the present invention, the magnetic base material is characterized in that a reinforcing layer having electrical insulation for reinforcing the base material itself is laminated.
In this invention, since the mechanical strength of the magnetic substrate itself can be improved, for example, relatively high tensile stress or bending stress can be applied in the supply of manufactured parts of a metal-compatible non-contact data carrier. Parts can be suitably supplied in the form of a roll, thereby improving the productivity of the non-contact data carrier.

Furthermore, in the non-contact type data carrier inlet of the present invention, the magnetic substrate has a plurality of magnetic layers each formed of a magnetic material, and the reinforcing layer is interposed between the plurality of magnetic layers. It is characterized by being interposed.
In this invention, in addition to the improvement of the strength of the magnetic layer described above, a laminated structure composed of a plurality of magnetic layers and reinforcing layers without forming a thick magnetic layer that is generally difficult to manufacture. In this portion, an effect almost equivalent to that of a single magnetic layer having a thickness corresponding to the total thickness of the laminated structure portion can be expected.
That is, according to the present invention, the communication distance of the non-contact type data carrier as the product can be substantially extended, as well as the case where a relatively thick magnetic layer is formed, and shielding against a conductor such as metal is possible. (Eddy current generation prevention function) can be improved.

In the non-contact type data carrier inlet of the present invention, the antenna element or the antenna coil is formed directly on the first and second main surfaces of the magnetic base material by plating or vapor deposition. It is characterized by that.
According to the present invention, it is possible to reduce the thickness of the produced non-contact data carrier.
Here, in this invention, since the conductive antenna coil is directly formed on the main surface of the magnetic base material, the magnetic material for forming the magnetic base material is a highly insulating material. For example, it is desirable to apply Mn—Zn ferrite, Ni—Zn ferrite, or the like.

The non-contact type data carrier inlet roll of the present invention is characterized in that a sheet-like member on which a plurality of non-contact type data carrier inlets are mounted is wound into a roll shape. .
According to the present invention, the magnetic base material is reinforced by the reinforcing layer so that it can withstand relatively high tensile stress and bending stress. Supply can be realized, which can increase the productivity of the non-contact data carrier.

  Furthermore, the non-contact type data carrier of the present invention is characterized in that one of the non-contact type data carrier inlets described above is covered with an exterior.

  In addition, the method for manufacturing a non-contact type data carrier inlet according to the present invention uses a magnetic base material comprising a first main surface and a second main surface located on the side opposite to the first main surface as a magnetic material. And forming a first antenna portion on the first main surface of the formed magnetic substrate and providing a second antenna portion on the second main surface, and A step of producing an antenna substrate by mounting an antenna element constituted by connecting the second antenna portions to each other on the magnetic substrate, and an electrical connection between the antenna element and the antenna element of the produced antenna substrate. Mounting an IC chip having at least a memory circuit and a communication control circuit on the first or second main surface of the magnetic base material.

  Furthermore, the method of manufacturing a non-contact type data carrier inlet according to the present invention includes a magnetic material comprising a first main surface and a second main surface located on the side opposite to the first main surface. And forming the second antenna pattern by routing the first antenna pattern around the first main surface of the formed magnetic base material and wiring around the second main surface. And forming the antenna base by providing an antenna coil formed by connecting the first and second antenna patterns between the layers on the magnetic base, and the prepared antenna base Mounting an IC chip having at least a memory circuit and a communication control circuit on the first or second main surface of the magnetic base material so as to be electrically connected to the antenna coil. And wherein the Rukoto.

Furthermore, the manufacturing method of the non-contact type data carrier inlet roll according to the present invention comprises a roll of a sheet-like member carrying a plurality of non-contact type data carrier inlets produced by the method described above. A non-contact type data carrier inlet roll is produced by winding.
The non-contact type data carrier inlet manufacturing method of the present invention is characterized in that the non-contact type data carrier inlet manufactured by the above-described method is covered with an exterior.

  Thus, according to the present invention, a non-contact type data carrier inlet that enables use at a close position of a metal conductor without reducing productivity, and enables transmission / reception of data from two different directions, A non-contact type data carrier inlet roll and a non-contact type data carrier, and a manufacturing method thereof can be provided.

The best mode for carrying out the present invention will be described below with reference to the drawings.
(First embodiment)
1 is a view of the non-contact type data carrier inlet according to the first embodiment of the present invention as viewed from one main surface side, and FIG. 2 is a cross-sectional view of the non-contact type data carrier inlet as viewed from the side. These are the figures which looked at this non-contact-type data carrier inlet from the other main surface side. FIG. 4 is a block diagram functionally showing the configuration of this non-contact type data carrier inlet, and FIG. 5 shows a non-contact type data carrier constructed by covering the non-contact type data carrier inlet with an exterior. FIG. 6 is a cross-sectional view of the non-contact data carrier of FIG. 5 as viewed from the side.

  1, 3 and 5 show the conductor pattern including the antenna coil in the form of hatching. In each figure, the conductor pattern located on the near side and the conductor located on the far side from the near side are shown. Each pattern is distinguished by changing the direction of hatching with the pattern. Moreover, about the conductor pattern located in the side (back side) far from the near side, the outline is shown with the broken line.

  As shown in FIGS. 1 to 4, the non-contact type data carrier inlet 2 a according to this embodiment is a rectangular and plate-like (sheet-like) magnetic substrate formed using a magnetic material (magnetic material). (Magnetic substrate) J1, an IC chip C having at least a memory circuit and a communication control circuit, and an antenna coil A as an antenna element electrically connected to the IC chip C. The magnetic substrate J1 includes two main surfaces, one (first) main surface 19a and the other (second) main surface 19b located on the side opposite to the main surface. The IC chip C is mounted on a pair of chip mounting patterns 5a and 5b formed in a pattern on one main surface 19a of the magnetic substrate J1. The antenna coil A spirally circulates on the first antenna pattern E1 and the other main surface 19b of the magnetic base material J1 that are wound around the one main surface 19a of the magnetic base material J1 in a spiral shape. The second antenna pattern E2 thus wired is connected by interlayer connection via a magnetic base material J1.

  The non-contact type data carrier inlet 2a is wired so as to extend on one main surface 19a and the other main surface 19b on the magnetic base material J1, and is connected to the antenna coil A in parallel. A plurality of pairs of tuning patterns (capacitance adjustment patterns) 15a respectively wired on the one main surface 19a and the other main surface 19b via the pair of connection patterns 8a and 8b. , 15 b, 16 a, 16 b, 17 a, 17 b, 18 a, 18 b, and through-hole-forming regions (tunable execution regions) 15, 16, 17, 18.

  Specifically, the one end portion 3a of the first antenna pattern E1 constituting the antenna coil A and the base end portion of the one connection pattern 8a are respectively connected to the one chip mounting pattern 5a. One of the connection bumps 9a of the IC chip C is connected to one chip mounting pattern 5a. The other end 3b of the first antenna pattern E1 constituting the antenna coil A is wired on the other main surface 19b of the magnetic base material J1 through the through hole G3 (constituting the antenna coil A). ) An interlayer connection is made to one end 10a of the second antenna pattern E2. Further, the other end portion 10b of the second antenna pattern E2 is provided between the base end portion of the other chip mounting pattern 5b wired on the one main surface 19a of the magnetic base material J1 through the through hole G4. It is connected. The other connection pattern 8b described above is connected to the other end portion 10b of the second antenna pattern E2. In this way, the first antenna pattern E1 and the second antenna pattern E2 are connected in series to form the antenna coil A as an antenna element.

  Here, the first antenna pattern E1 and the second antenna pattern E2 constituting the antenna coil A are viewed from one main surface side of the first and second main surfaces of the magnetic base material. The wires are wired so that their winding directions are the same. In the present embodiment, in FIG. 1, each of the first and second antenna patterns E1, E2 is formed in a left-handed pattern, for example, from the inner circumference side toward the outer circumference side. According to the configuration described above, it is possible to align the directions of electromagnetic induction generated in the first and second antenna patterns E1 and E2 in a certain direction.

  In addition, the constituent elements (first and second antenna patterns E1 and E2) of the antenna coil A connected to the IC chip C as a single antenna element (element) in this way are connected to one and the other of the magnetic substrate J1. By separately arranging on the main surfaces 19a and 19b, it is possible to transmit and receive data from one main surface 19a side and the other main surface 19b side of the magnetic substrate J1, that is, from two different directions. A metal-compatible non-contact data carrier can be obtained.

  Further, each of the pair of tuning patterns 15a, 15b, 16a, 16b, 17a, 17b, 18a, and 18b described above is formed of the pair of connection patterns 8a and 8b on one and the other main surfaces 19a and 19b of the magnetic substrate J1. The magnetic base material J1 that is connected to each tip portion and also functions as a dielectric is disposed at a position facing each other with the magnetic base material J1 interposed therebetween. Each pair of tuning patterns is formed in a substantially circular shape and functions as a capacitor pattern. Here, the tuning pattern may be formed in a rectangular (quadrangle) shape. In addition, the IC chip C is mounted with a capacitor 9b in addition to a rewritable nonvolatile memory and an RF circuit for wireless communication that do not require power supply backup (see FIG. 4). Thus, the antenna coil A having the first and second antenna patterns E1 and E2 provided on the magnetic substrate J1, the capacitor 9b in the IC chip C, and the tuning patterns 15a, 15b, 16a, 16b, and 17a, respectively. , 17b, 18a, and 18b constitute an LC resonance circuit as shown in FIG.

  Further, the through-hole-formable regions 15, 16, 17, and 18 on the magnetic substrate J1 provided for adjusting the resonance frequency of the entire antenna are respectively paired tuning patterns 15a, 15b, 16a, 16b, 17a, and 17b. , 18a, 18b is secured as an area where a through-hole can be drilled for pulling out one set from the magnetic base material J1 (or any set tuning pattern may not be pulled out). Yes. These through-hole-formable regions 15, 16, 17, and 18 are outer peripheral edges of the tuning patterns 15b, 16b, 17b, and 18b that are formed slightly larger in outer shape than the tuning patterns 15a, 16a, 17a, and 18a. Is a circular region surrounded by an outer peripheral edge slightly offset to the outside. In the present embodiment, it is assumed that a frequency approximate to the resonance frequency target value of 13 and 56 MHz is obtained in a state in which neither set of tuning patterns is removed, and the through hole is not perforated. Is illustrated.

  Here, as shown in FIGS. 5 and 6, the non-contact data carrier (also referred to as RFID [Radio Frequency Identification] tag or the like) 1 of the present embodiment is a metal-compatible type having a function of preventing the generation of eddy currents. Non-contact data carrier. That is, as shown in FIGS. 2 and 6, the above-described magnetic substrate J1 of the non-contact type data carrier inlet 2a is made of a magnetic material having a high magnetic permeability such as ferrite.

  Further, an antenna coil A having the first and second antenna patterns E1 and E2, a pair of chip mounting patterns 5a and 5b, a tuning pattern, an IC chip C, and the like are mounted on the magnetic substrate J1. As shown in FIGS. 5 and 6, the non-contact type data carrier 1 is configured by covering the non-contact type data carrier inlet 2 a to be configured with an exterior. In the present embodiment, a card-type non-contact type data carrier (by using a pair of protective films 7a and 7b made of a rectangular vinyl chloride resin so as to sandwich the magnetic base material J1 from both sides, thereby providing a card-type non-contact type data carrier ( IC card) 1 is configured. Here, in addition to the card-type form, for example, a pouch-type non-contact data carrier obtained by pouching, a label type provided with an adhesive layer obtained by labeling or a release paper covering it Non-contact type data carrier of high temperature resistance obtained by processing molded products using so-called engineering plastics such as PPS (polyphenylene sulfide) and PSF (polysulfone) Can also be configured.

  Next, a manufacturing method of the metal-compatible non-contact type data carrier inlet 2a which is a component of the non-contact type data carrier 1 configured as described above will be described with reference to FIGS. 7a to 7h and FIGS. 8a to 8e. Give an explanation. Here, FIGS. 7a to 7h are cross-sectional views for explaining each manufacturing process of the non-contact type data carrier inlet 2a of the present embodiment, and FIG. 8a is for forming the magnetic base sheet F2 of FIG. 7a. It is a figure which shows a manufacturing apparatus schematically. 8b schematically shows a manufacturing apparatus used in the manufacturing steps of FIGS. 7b to 7g, and FIG. 8c shows an IC chip C mounted on the antenna substrate (antenna substrate sheet) M1 of FIG. 7g. It is sectional drawing which shows the manufacturing apparatus for this. 8d is a plan view showing the non-contact type data carrier inlet sheet F3 produced by the manufacturing apparatus of FIG. 8c, and FIG. 8e is a non-contact type of the non-contact type data carrier inlet sheet F3 in FIG. 8d. It is sectional drawing which shows the manufacturing apparatus for obtaining the data carrier inlet 2a single-piece | unit.

  First, as shown in FIGS. 7a and 8a, after applying the magnetic material F1 on the base 28a from the coating device 28, the magnetic material F1 is pressed and dried by the press machine 29a of the drying / pressing device 29, for example, 50 A magnetic substrate sheet F2 (magnetic substrate J1) having a thickness of ˜500 μm is obtained.

  Here, as a constituent material of the magnetic substrate J1, for example, a magnetic material having high insulation properties such as Mn—Zn ferrite and Ni—Zn ferrite is suitable. In forming the magnetic base material J1, a resin binder mixed with the ferrite magnetic powder or the like may be applied. This resin binder is mainly composed of a thermoplastic resin, and if necessary, coupling agents such as silane, titanate and aluminum which improve the affinity between the magnetic powder and the resin, phthalic acid and sulfone which improve the fluidity of the resin. Acidic, phosphoric acid and epoxy plasticizers, stearic acid, stearates, fatty acid amides, waxes and other lubricants that increase the fluidity of the mixture, and hindered phenols to prevent oxidation of fillers, sulfur Those to which antioxidants such as those based on phosphorus and phosphorus are appropriately added are suitable.

  Next, as shown in FIG. 7b and FIG. 8b, it penetrates using the punching apparatus 25 which has the laser irradiation apparatus 25a in the position of two places which should perform interlayer connection on the magnetic base material sheet F2 (magnetic base material J1). Holes G1 and G2 are drilled, respectively. Next, as shown in FIG. 7c and FIG. 8b, as a base layer on the surface layer of the magnetic substrate J1, that is, on the one and other main surfaces 19a, 19b of the magnetic substrate J1 and the inner wall surfaces of the through holes G1, G2. For example, metal layers (conductor layers) K 1 and K 2 made of copper or the like are formed using the sputtering apparatus 26. Next, as shown in FIGS. 7d and 8b, on the metal layers (including the inner wall surfaces of the through holes G1 and G2) K1 and K2 formed as the base layer, the metal made of, for example, copper as a material for the conductor layer Layers (conductor layers) K3 and K4 are stacked through the plating tank 27. As a result, through holes G3 and G4 for substantially interlayer connection between the antenna pattern E1 and the antenna pattern E2 constituting the antenna coil A are formed.

  Further, as shown in FIGS. 7e and 8b, a resist T is formed at predetermined positions on the metal layers K3 and K4 formed on the main surfaces of the magnetic substrate J1 by using rollers 31a and 31b of the resist printer 31. To print. Thereafter, as shown in FIGS. 7f and 8b, the metal layers K3 and K4 on the magnetic base material J1 on which the resist T is printed are etched through the etching tank 32, and further, the resist is peeled, washed and dried. In the chamber 33, the resist T is peeled off from the magnetic base material J1, and then washed and further dried.

  Thus, as shown in FIGS. 7g and 8b, on one surface 19a of the magnetic substrate J1, the antenna pattern E1 (for a plurality of non-contact type data carriers [see FIG. 8d]) and the pair of chips are mounted. The patterns 5a and 5b and one tuning pattern (capacitance adjustment pattern) 15a, 16a, 17a, and 18a are formed (see FIGS. 1 to 3). Further, on the other main surface 19b of the magnetic base material J1, the antenna pattern E2 (for a plurality of non-contact data carriers [see FIG. 8d]), the other tuning pattern (capacitance adjustment pattern) 15b, 16b , 17b, 18b are formed (see FIGS. 1 to 3).

  As a result, as shown in FIGS. 7g and 8b, the first antenna pattern E1 formed on one main surface 19a of the magnetic substrate J1 and the other main surface 19b of the magnetic substrate J1 were formed. An antenna base material (antenna base material sheet) M1 provided with an antenna coil A configured in such a manner that the second antenna pattern E2 is interlayer-connected through a through hole is obtained. Further, thereafter, as shown in FIGS. 7h and 8c, a pair of chip mounting patterns 5a on the antenna substrate M1, using a mounting device 37 including a suction type handling device 37a and a crimping device 38, for example, By mounting the IC chip C on 5b, a non-contact type data carrier inlet in which a plurality of metal-compatible data carrier inlets (2a) are arranged vertically and horizontally as shown in FIGS. 8c and 8d A sheet F3 is formed. Thereafter, as shown in FIGS. 7h and 8e, the non-contact type data carrier inlet sheet F3 is cut into a predetermined size by using a cutting device 51 having a plurality of blade portions 51a as a reference, and a plurality of metal A corresponding non-contact data carrier inlet 2a is produced.

  Therefore, in the non-contact type data carrier inlet 2a (non-contact type data carrier 1) of this embodiment manufactured in this way, the components (first and second) of the antenna coil A connected to a single IC chip. 2 antenna patterns E1, E2) are arranged in a distributed manner on one main surface 19a of the magnetic base material and on the other main surface 19b located on the opposite side. As a result, it is possible to obtain a metal-compatible non-contact type data carrier 1 that can transmit and receive data from two different directions and can be used at a position close to the metal conductor. Specifically, in the non-contact type data carrier 1 composed of the non-contact type data carrier inlet 2a as a material, the non-contact type data carrier inlet 2a can be used by being attached to a metal conductor without worrying about the front and back (attachment surface).

  Moreover, according to the manufacturing method of the non-contact type data carrier inlet 2a of this embodiment, since the interlayer connection of each layer is performed by the through holes G3 and G4, the connection reliability of the interlayer connection portion can be improved. In this embodiment, since the base layer (the main conductor layer) is formed after the base layer is formed, the antenna coil A and the like formed as the main conductor layer are connected to the magnetic substrate J1. High adhesion strength can be obtained.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. 9a to 9g and FIG. Here, FIGS. 9a to 9g are sectional views for explaining each manufacturing process of the non-contact type data carrier inlet 2b according to this embodiment, and FIG. 10 is a manufacturing apparatus used for the manufacturing process of FIGS. 9a to 9g. FIG.

  As shown in FIG. 9g, the non-contact type data carrier inlet 2b of this embodiment has an interlayer connection realized by using the through holes G3 and G4 of the non-contact type data carrier inlet 2a of the first embodiment. Realized by caulking. The non-contact type data carrier inlet 2b includes all the conductor patterns on the magnetic substrate J1 including the antenna pattern E1 and the antenna pattern E2 constituting the antenna coil A, a pair of chip mounting patterns 5a and 5b, a tuning pattern, and the like. Are laminated on the magnetic base material J1 (one and the other main surfaces 19a and 19b of the magnetic base material J1) via adhesive layers S1 and S2 having a thickness of about 2 to 20 μm, for example. Further, the manufacturing apparatus of the non-contact type data carrier inlet 2b of this embodiment is replaced with FIG. 10 instead of the punching apparatus 25, the sputtering apparatus 26, and the plating tank 27 included in the manufacturing apparatus shown in FIG. 8B of the first embodiment. As shown, the adhesive layer winding rollers 23a and 23b, the metal layer winding rollers 24a and 24b, the sticking rollers 22a and 22b, and the caulking machine 34 are configured.

  That is, in this embodiment, as shown in FIG. 9a, FIG. 9b and FIG. 10, first, both side surfaces of the magnetic substrate sheet F2 (magnetic substrate J1) (one and the other main surfaces 19a of the magnetic substrate J1) 19b), using the adhering rollers 22a and 22b, the metal layers K5 and K6 such as copper drawn out from the rollers 23a, 23b, 24a and 24b, respectively, are bonded via the adhesive layers S1 and S2.

  Specifically, an adhesive sheet formed of a material having high resistance (corrosion resistance) to the etching solution used in the etching tank 32 is wound around the adhesive layer winding rollers 23a and 23b. Here, the adhesive sheet for forming the adhesive layers S1 and S2 is suitable for use in so-called dry lamination, and is a two-component polyester polyurethane adhesive containing a curing agent. Etc. are applied as the material. In detail, the adhesive sheet is prepared by diluting the adhesive to a predetermined viscosity with a solvent such as ethyl acetate, MEK (Methyl Ethyl Ketone), IPA (Isopropyl Alcohol), etc. It is obtained by applying and then drying. The above-mentioned adhesive layers S1 and S2 constituted by such an adhesive sheet exhibit good solvent resistance and chemical resistance against either alkaline or acidic etching solution, and thereby the adhesive layer S1. , S2 lower magnetic base material J1 is inhibited from being corroded by the influence of the etching solution.

  A metal foil sheet made of copper or the like is wound around the metal layer winding rollers 24a and 24b. The adhering rollers 22a and 22b are attached to the magnetic base material J1 while pulling out the adhesive sheet and the metal foil sheet wound around the adhesive layer winding rollers 23a and 23b and the metal layer winding rollers 24a and 24b, respectively. Thereby, the metal layers K5 and K6 are laminated on both main surfaces of the magnetic substrate J1 via the adhesive layers S1 and S2.

  Next, as shown in FIG. 9c and FIG. 10, a resist T is printed using rollers 31a and 31b at predetermined positions on the metal layers K5 and K6 attached to both side surfaces of the magnetic substrate J1, respectively. Thereafter, as shown in FIGS. 9d and 10, the metal layers K5 and K6 on the magnetic base material J1 on which the resist T is printed are etched through the etching tank 32, and further, the resist is peeled, washed and dried. After the resist T is peeled from the magnetic base material J1 in the chamber 33, it is washed and further dried.

  As a result, as shown in FIGS. 9e and 10, an antenna pattern E1, a pair of chip mounting patterns 5a and 5b, and one tuning pattern are formed on one main surface 19a of the magnetic substrate J1. Further, the antenna pattern E2 and the other tuning pattern are formed on the other main surface 19b of the magnetic substrate J1 (see FIGS. 1 to 3). As shown in FIG. 9f and FIG. 10, the magnetic base material J1 on which the respective conductor patterns are formed is passed through the caulking portion 6a between the other end portion 3b of the antenna pattern E1 and the one end portion 10a of the antenna pattern E2. Interlayer connection and interlayer connection through the caulking portion 6b between the other end portion 10b of the second antenna pattern E2 and the base end portion of the other chip mounting pattern 5b are performed using a caulking machine 34 (FIGS. 2 and 6). reference).

As a result, the first antenna pattern E1 formed on one main surface 19a of the magnetic substrate J1 and the second antenna pattern E2 formed on the other main surface 19b of the magnetic substrate J1 are caulked. Thus, an antenna base material (antenna base material sheet) M2 including an antenna coil A configured to be connected in layers is obtained. Further, by mounting the IC chip C on the antenna substrate M2, the non-contact type data carrier inlet 2b (and the non-contact type data carrier as the final product) shown in FIG. 9g is manufactured.
Therefore, according to the non-contact type data carrier inlet 2b of this embodiment, in addition to being able to transmit and receive data from two different directions, the magnetic substrate is affected by the influence of, for example, an etching solution used in the etching process. The corrosion of the material J1 can be suppressed by the adhesive layers S1 and S2 described above.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIGS. Here, FIG. 11 is a view of the non-contact type data carrier inlet 2c according to the present embodiment as viewed from one main surface 19a side, and FIG. 12 is a cross-sectional view of the non-contact type data carrier inlet 2c as viewed from the side. 13 is a view of the non-contact type data carrier inlet 2c as viewed from the other main surface 19b side.

The non-contact type data carrier inlet 2c of this embodiment includes a second antenna pattern E2 provided on the non-contact type data carrier inlet 2a of the first embodiment, and a (other) chip mounting pattern 5b (FIG. 1). In place of (see FIG. 3), as shown in FIGS. 11 to 13, a second antenna pattern E3 and (the other) chip mounting pattern 5c are provided.
That is, the non-contact type data carrier inlet 2c of this embodiment includes a first antenna pattern E1 and a second antenna pattern E3 wired on the first and second main surfaces 19a and 19b of the magnetic base material J1, respectively. Have the antenna coil A2 wired so as to avoid the overlapping of the pattern forming regions in the direction orthogonal to the first and second main surfaces 19a, 19b (thickness direction of the magnetic base material J1).

  Therefore, according to the non-contact type data carrier inlet 2c of this embodiment, the difference in parasitic capacitance caused by the difference in the degree of overlap between the first and second antenna patterns E1 and E3, that is, the alignment error due to the patterning of the antenna pattern. As a result, it is possible to suppress variations in capacitor components that may occur due to the influence of the above, and thus contribute to the adjustment of the target resonance frequency (13.56 MHz) in the LC circuit.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIGS. 14 and 15a to 15c. Here, FIG. 14 is a cross-sectional view showing a non-contact type data carrier inlet 2d according to this embodiment, and FIGS. 15a to 15c schematically show a manufacturing apparatus for producing the non-contact type data carrier inlet 2c of FIG. FIG. Specifically, FIG. 15a is a diagram showing a production apparatus for producing a reinforced magnetic substrate roll R5 in which a reinforced magnetic substrate (reinforced magnetic substrate sheet) H1 is wound in a roll shape. FIG. 15b is a view showing a manufacturing apparatus for producing the antenna base roll R2 produced based on the reinforcing magnetic base roll R5. Further, FIG. 15c is a view showing a manufacturing apparatus for producing a non-contact type data carrier inlet roll R3 produced based on the antenna substrate roll R2.

  The non-contact type data carrier inlet 2d of the present embodiment replaces the configuration of the non-contact type data carrier inlet 2b of the second embodiment (see FIG. 9g), as shown in FIG. The material H1 is applied. That is, the non-contact type data carrier inlet 2d has a structure for suitably responding to component supply in the form of a roll that can generate a relatively high tensile stress or bending stress. This reinforced magnetic base material H1 is a main layer on at least one side of the magnetic base material J1 to which the reinforcing layer (PET layer) P1 having electrical insulation that reinforces the base material itself is applied in the first to third embodiments. It is made up of layers stacked on the surface.

  Here, as the insulating resin material for constituting the reinforcing layer P1, in addition to the above PET (polyethylene terephthalate), for example, phenol resin, urea resin, melamine resin, polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, polyether Sulphone, polyphenylene sulfide, PBT, polyarylate, silicon resin, diallyl phthalate, polyimide and the like can also be applied.

  Next, a method for manufacturing the non-contact type data carrier inlet 2d according to this embodiment will be described. First, as shown in FIG. 15a, for example, a PET reinforcing sheet (reinforcing layer forming sheet) P1 having a thickness of about 30 to 100 μm is reinforced from a PET roll R4 wound in a roll shape through an unwinding roller 40. Continuous feeding of the sheet P1 is started. Next, a magnetic layer (a constituent part of the magnetic base material) J1 is formed on the main surface on one side of the fed reinforcing sheet P1 using the coating device 41 provided with calendar rollers 41a, 41b, 41c. As the constituent material of the magnetic layer, for example, the magnetic material F1 that is the constituent material of the magnetic substrate J1 described in the first embodiment is used. In addition, although the manufacturing method which forms a magnetic body layer directly with respect to the reinforcement sheet | seat (reinforcement layer) P1 is illustrated here, instead of this, a sheet-like magnetic body is passed through an adhesive etc. For example, you may make it stick on the reinforcement layer side. In this case, high adhesion strength can be obtained between the magnetic layer and the reinforcing layer adjacent to the magnetic layer.

  Further, as shown in FIG. 15 a, after the thickness of the magnetic layer J <b> 1 is adjusted to a thickness of about 50 to 500 μm, for example, by the pressure device 42, the magnetic layer J <b> 1 is dried through the drying furnace 43. Done. In this way, the reinforcing magnetic substrate (reinforcing magnetic substrate sheet) H1 obtained by integrating the reinforcing sheet (reinforcing layer) P2 and the magnetic layer J1 in a manner to reinforce the magnetic layer J1, Winding through the take-up roller 45 to produce a reinforced magnetic base roll R5. Here, since the magnetic base material portion is reinforced, the reinforced magnetic base material roll R5 can be formed with a long roll length. In addition, the roll length of the reinforcing magnetic base roll R5 is required to be longer than the distance (path) from the PET roll R4 to the reinforcing magnetic base roll R5 of the manufacturing apparatus, and the roll is easy to handle. For example, it is about 5 to 500 m from the necessity of being within the range.

  Next, as shown in FIG. 15b, continuous feeding of the reinforcing magnetic substrate (reinforcing magnetic substrate sheet) H1 is started from the reinforcing magnetic substrate roll R5 manufactured as described above through the unwinding roller 30. . Thereafter, a manufacturing process similar to the manufacturing process described with reference to FIG. 10 of the second embodiment is performed, and the antenna substrate (antenna substrate sheet) M3 obtained thereby is wound through the winding roller 35. The antenna base roll R2 is produced. Next, as shown in FIG. 15c, continuous feeding of the antenna base material (reinforcing magnetic base material sheet) M3 from the antenna base material roll R2 through the unwinding roller 36 is started, and a pair of chips on the antenna base material M3 is started. The IC chip C is mounted on the mounting patterns 5a and 5b using the mounting device 37 and the crimping device 38. In this way, the antenna substrate (antenna substrate sheet) M3 on which the IC chip C is mounted is wound up through the winding roller 39 to form the non-contact type data carrier inlet roll R3. Thereafter, the non-contact type data carrier inlet roll R3 is used as a constituent material to produce a non-contact type data carrier inlet 2d (and a non-contact type data carrier that is the final product) shown in FIG.

  As described above, according to the non-contact type data carrier inlet 2d according to this embodiment, the reinforcing layer P1 is laminated on at least one main surface of the magnetic substrate J1 applied in the first to third embodiments. Since the reinforced magnetic base material H1 thus applied is applied, it is possible to suitably supply components in the form of a roll and improve the productivity of the non-contact type data carrier.

  Here, as shown in FIG. 16, a plurality of, for example, two magnetic layers (magnetic base materials) J1 and J2 are provided, and a reinforcing layer P1 is interposed between the magnetic layers J1 and J2. By applying the magnetic substrate H2, the non-contact type data carrier inlet 2e can be obtained. In the non-contact type data carrier inlet 2e, in addition to the improvement of the strength of the magnetic part described above, a plurality of magnetic layers J1, J2 and the like can be obtained without forming a thick magnetic layer that is generally difficult to manufacture. In the laminated structure portion constituted by the reinforcing layer P1, an effect substantially equivalent to that of a single magnetic layer having a thickness corresponding to the total thickness of the laminated structure portion can be expected. That is, according to the non-contact type data carrier inlet 2e, the communication distance of the non-contact type data carrier as a product can be substantially increased, as in the case where a relatively thick magnetic layer is formed, and metal or the like This can improve the shielding property (the function of preventing generation of eddy currents) with respect to the conductor.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described mainly based on FIG. Here, FIG. 17 is a cross-sectional view showing a non-contact type data carrier inlet 2f according to this embodiment.
The non-contact type data carrier inlet 2f of this embodiment is replaced with a base material as shown in FIG. 17 instead of the magnetic base material J1 of the non-contact type data carrier inlet 2a (see FIG. 7h) of the first embodiment. As a laminated base material, magnetic base materials J1 and J2 are laminated on each main surface (both side surfaces) of a metallic conductor base material K7. Here, in the non-contact type data carrier inlet 2f, in order to insulate the conductor base material K7 and the through holes G3 and G4, an insulating layer is formed between them (the portion which was the inner wall surface of the through holes G1 and G2). P2 is interposed. The insulating layer P2 is formed so as to cover the inner wall surfaces of the above-described through holes G1 and G2 by using a resin material having electrical insulating properties, for example, using a film formation technique such as vapor deposition or sputtering. Yes.

  Here, in the tuning of the resonance frequency of the non-contact type data carrier of the present embodiment configured such that the conductor base material K7 is interposed in the core portion, the conductor base material K7 and the magnetic base materials J1 and J2 are laminated. For any one antenna pattern that circulates on each main surface of the integrated laminated base material, a linear pattern that circulates continuously is further extended, and this extended portion (linear pattern) is provided as a capacity. Examples include a configuration that allows the resonance frequency of the entire LC circuit to be adjusted by functioning as a pattern and adjusting the length of the linear pattern of the extended portion (selecting cutting / non-cutting from a predetermined position). .

  Here, FIG. 18 is a graph showing changes in the resonance frequency when the magnetic layer is provided in the non-contact data carrier inlet and when the magnetic layer and the metal layer are provided. Specifically, FIG. 18 shows the case where the resonance frequency of a non-contact type data carrier inlet without a magnetic layer and a metal layer is defined as a reference X, and this magnetic property is obtained when only the magnetic layer is provided for the non-contact type data carrier inlet. The change of the resonance frequency according to the change of the thickness of the body layer is indicated by W. On the other hand, the metal having a predetermined thickness (fixed thickness) in addition to the magnetic layer for the non-contact type data carrier inlet. 5 is a graph showing a change in resonance frequency V according to a change in thickness of the magnetic layer when a layer and a magnetic layer are provided.

  As is apparent from FIG. 18, in the non-contact type data carrier inlet 2f, the use environment of the non-contact type data carrier in which a conductor such as metal is in the proximity position is considered, that is, the resonance frequency of the non-contact type data carrier. Considering fluctuations (in the example in which a metal layer having a predetermined thickness is provided in addition to the magnetic layer, when the thickness of the magnetic layer is close to 0.05 mm, the resonance frequency is greatly increased), Since the resonance frequency including the metal layer (conductor base material K7) can be tuned in advance by a single data carrier, characteristics such as communication sensitivity can be improved.

  In the non-contact type data carrier inlet 2h of the present embodiment, the mechanical strength of the base material itself can be improved by the metallic conductor base material K7 interposed between the magnetic base materials J1 and J2. Therefore, it is possible to suitably introduce component supply in the form of a roll to which a relatively high tensile stress or bending stress can be applied, thereby improving the productivity of the non-contact type data carrier.

Although the present invention has been specifically described with the embodiments, the present invention is not limited to these embodiments, and various modifications can be made without departing from the scope of the invention. For example, in the first and second embodiments described above, a non-contact type data carrier is provided by supplying parts in a sheet such as the magnetic base sheet F2, the antenna base sheets M1 and M2, and the non-contact type data carrier inlet sheet F3. Although illustrated about the manufacturing method which produces the inlets 2a and 2b, it replaces with this and the roll which wound the magnetic base material sheet | seat F2 shown to FIG. The roll-shaped parts of the antenna base sheets M1 and M2 and the non-contact type data carrier inlet sheet F3 produced based on the roll-shaped parts and the roll-shaped parts may be applied in each manufacturing process.
Further, as shown in FIGS. 5 and 6, the non-contact type data carrier inlet 1 is configured by covering the non-contact type data carrier inlet with the exterior, and such a non-contact type data carrier inlet is formed with the exterior. The non-contact type data carrier inlet roll can also be used in the post-covering process or printing on the surface of the non-contact type data carrier. In such post-processing and printing, since the path of the processing machine or the printing machine is short, a roll length of the non-contact type data carrier inlet roll to be used can be as short as about 2 m.

  Further, in the manufacturing method of the non-contact type data carrier inlets 2b and 2d according to the second and fourth embodiments described based on FIGS. 9g, 10, 14, and 15b, the adhesive layers S1 and S2 are interposed. Thus, the conductor pattern (metal conductor layer) was formed on the substrate, but instead of this, using a vapor deposition device such as a vacuum vapor deposition device, directly on each main surface on the substrate, for example, You may make it vapor-deposit a conductor pattern (metal conductor layer) about 15-45 micrometers thick. In this case, the manufactured non-contact data carrier can be thinned.

  Furthermore, only in the third embodiment described with reference to FIGS. 11 to 13, the antenna coil A <b> 2 wired so as to avoid overlapping of the formation areas of the first antenna pattern and the second antenna pattern is applied. However, the antenna coil A2 having such a configuration may of course be applied in the first, second, fourth, and fifth embodiments.

  Furthermore, in the fourth embodiment, as shown in FIG. 15a, the calender roll is used to form the magnetic layer J1 on the reinforcing layer (PET layer) P1, but instead of this, a magnetic body is used. The magnetic layer may be formed using a coating apparatus that can be dropped, or the magnetic layer may be formed using electrostatic coating or the like.

  In the above embodiment, the antenna element has been described by exemplifying a coiled antenna (antenna coil). However, the antenna element can be designed in various shapes. Among them, these variously shaped elements are collectively referred to as antenna elements.

The figure which looked at the non-contact-type data carrier inlet which concerns on the 1st Embodiment of this invention from the one main surface side. Sectional drawing which looked at the non-contact-type data carrier inlet of FIG. 1 from the side. The figure which looked at the non-contact-type data carrier inlet of FIG. 1 from the other main surface side. The block diagram which shows the structure of the non-contact-type data carrier inlet of FIG. 1 functionally. The figure which looked at the non-contact-type data carrier comprised by covering the non-contact-type data carrier inlet of FIG. 1 with the exterior from one main surface side. Sectional drawing which looked at the non-contact-type data carrier of FIG. 5 from the side. It is a figure for demonstrating the manufacturing process of the non-contact-type data carrier inlet of FIG. 1, Comprising: The figure which shows the cross section of a magnetic base material (magnetic base material sheet). Sectional drawing which shows the state by which the through-hole was drilled in the magnetic base material of FIG. 7a. Sectional drawing which shows the state in which the base layer was formed in the surface layer of the magnetic base material of FIG. Sectional drawing which shows the state by which this conductor layer (metal layer) was laminated | stacked on the base layer of FIG. 7c. Sectional drawing which shows the state in which the resist layer was formed on the metal layer of FIG. Sectional drawing which shows the state which etched the magnetic base material in which the resist layer was formed on the metal layer of FIG. 7e. Sectional drawing which shows the state by which the antenna base material was obtained by removing a resist layer from the magnetic base material to which the etching of FIG. 7f was given. Sectional drawing which shows typically the structure of the non-contact-type data carrier inlet produced by mounting an IC chip on the magnetic base material from which the resist layer of FIG. The figure which shows schematically the manufacturing apparatus for forming the magnetic base material sheet of FIG. 7a. The figure which shows schematically the manufacturing apparatus used for the manufacturing process of FIGS. 7b-7g. Sectional drawing which shows the manufacturing apparatus for mounting an IC chip on the antenna base material (antenna base material sheet) of FIG. 7g. The top view which shows the non-contact-type data carrier inlet sheet produced with the manufacturing apparatus of FIG. 8c. Sectional drawing which shows the manufacturing apparatus for obtaining the non-contact-type data carrier inlet single-piece | unit of FIG. 7h from the non-contact-type data carrier inlet sheet | seat of FIG. 8d. It is a figure for demonstrating the manufacturing process of the non-contact-type data carrier inlet which concerns on the 2nd Embodiment of this invention, Comprising: The figure which shows the cross section of a magnetic base material (magnetic base material sheet). Sectional drawing which shows the state by which the metal layer was laminated | stacked through the contact bonding layer on the magnetic base material of FIG. 9a. FIG. 9B is a cross-sectional view showing a state in which a resist layer is formed on the metal layer of FIG. 9B. Sectional drawing which shows the state which etched the magnetic base material in which the resist layer was formed on the metal layer of FIG. 9c. Sectional drawing which shows the state which removed the resist layer from the magnetic base material with which the etching of FIG. 9d was given. Sectional drawing which shows the state which performed the crimping process to the magnetic base material from which the resist layer of FIG. 9e was removed. Sectional drawing which shows typically the structure of the non-contact-type data carrier inlet produced by mounting an IC chip on the magnetic base material which performed the crimping process of FIG. 9f. The figure which shows schematically the manufacturing apparatus used for the manufacturing process of FIGS. 9a-9f. The figure which looked at the non-contact-type data carrier inlet concerning the 3rd Embodiment of this invention from the one main surface side. Sectional drawing which looked at the non-contact-type data carrier inlet of FIG. 11 from the side. The figure which looked at the non-contact-type data carrier inlet of FIG. 11 from the other main surface side. Sectional drawing which shows typically the structure of the non-contact-type data carrier inlet which concerns on the 4th Embodiment of this invention. The figure which shows the manufacturing apparatus for producing the reinforcement magnetic base material roll by which the reinforcement magnetic base material sheet of the non-contact-type data carrier inlet of FIG. 14 was wound by roll shape. The figure which shows the manufacturing apparatus for producing the antenna base material roll produced based on the reinforcement magnetic base material roll of FIG. 15a. The figure which shows the manufacturing apparatus for producing the non-contact-type data carrier inlet roll produced based on the antenna base material roll of FIG. 15b. FIG. 15 is a cross-sectional view schematically showing another non-contact type data carrier inlet having a structure different from that of the non-contact type data carrier inlet of FIG. 14. Sectional drawing which shows typically the structure of the non-contact-type data carrier inlet which concerns on the 5th Embodiment of this invention. The graph which shows the change of the resonant frequency with the case where a magnetic body layer is provided in a non-contact-type data carrier inlet, and the case where a magnetic body layer and a metal layer are provided.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Non-contact type data carrier, 2a, 2b, 2c, 2d, 2e, 2f ... Non-contact type data carrier inlet, 5a, 5b, 5c ... Chip mounting pattern, 6a, 6b ... Caulking part, 7a, 7b ... Protection Film, 15a, 15b, 16a, 16b, 17a, 17b, 18a, 18b ... tuning pattern (capacitance adjustment pattern), 19a ... one of the magnetic substrate (first) main surface, 19b ... the other magnetic substrate (Second) main surface, 22a, 22b ... sticking roller, 26 ... sputtering device, 27 ... plating tank, 28, 41 ... coating device, 29 ... drying / pressing device, 37 ... mounting device, 51 ... cutting device, A , A2 ... antenna coil (antenna element), C ... IC chip, E1 ... first antenna pattern, E2, E3 ... second antenna pattern, F1 ... magnetic material, F2 ... Base material sheet, F3 ... non-contact type data carrier inlet sheet, H1, H2 ... reinforced magnetic base material (reinforced magnetic base material sheet), J1 ... magnetic base material (magnetic material layer), J2 ... magnetic material layer, K7 ... Metal conductor substrate, M1, M2, M3 ... antenna substrate (antenna substrate sheet), P1 ... reinforcing layer (reinforcing sheet / PET layer), R2 ... antenna substrate roll, R3 ... non-contact data carrier inlet Roll, R5: Reinforced magnetic base roll, S1, S2: Adhesive layer, G3, G4: Through hole.

Claims (26)

A magnetic base material formed of a magnetic material and comprising a first main surface and a second main surface located on the side opposite to the first main surface;
An IC chip having at least a memory circuit and a communication control circuit and mounted on the first or second main surface of the magnetic substrate;
A first antenna portion electrically connected to the IC chip and provided on the first main surface of the magnetic base material and a second antenna portion provided on the second main surface of the magnetic base material And an antenna element configured by interlayer connection with the antenna part via the magnetic base material,
A non-contact type data carrier inlet. A magnetic base material formed of a magnetic material and comprising a first main surface and a second main surface located on the side opposite to the first main surface;
An IC chip having at least a memory circuit and a communication control circuit and mounted on the first or second main surface of the magnetic substrate;
A first antenna pattern that is electrically connected to the IC chip and circulates on the first main surface of the magnetic substrate and circulates on the second main surface of the magnetic substrate. An antenna coil configured by interconnecting a wired second antenna pattern via the magnetic base material;
A non-contact type data carrier inlet.   The first antenna pattern and the second antenna pattern respectively wired on the first and second main surfaces of the magnetic base material are in a direction orthogonal to the first and second main surfaces. 3. The non-contact type data carrier inlet according to claim 2, wherein the non-contact type data carrier inlet is wired so as to avoid the overlapping of the pattern forming regions.   4. The non-contact type data carrier inlet according to claim 2, wherein the first antenna pattern and the second antenna pattern are connected to each other by caulking or through holes.   The first antenna pattern and the second antenna pattern constituting the antenna coil are wound with each other when viewed from one main surface side of the first and second main surfaces of the magnetic base material. The non-contact type data carrier inlet according to any one of claims 2 to 4, wherein the directions are the same direction.   The said antenna element or the said antenna coil is laminated | stacked on the said 1st and 2nd main surface of the said magnetic base material through the contact bonding layer, The Claim 1 characterized by the above-mentioned. Non-contact data carrier inlet as described.   The non-contact type data carrier inlet according to claim 6, wherein the adhesive layer is made of a material having resistance to an etching process.   It further comprises a capacitance adjustment pattern that is connected to the antenna coil on the magnetic substrate and that can adjust the capacitance of the entire LC circuit by removing at least part of the magnetic substrate. The non-contact type data carrier inlet according to any one of claims 2 to 7.   The non-contact type data carrier inlet according to any one of claims 1 to 8, wherein the magnetic base material is laminated with a reinforcing layer having electrical insulation that reinforces the base material itself.   The magnetic base material has a plurality of magnetic layers each formed of a magnetic material, and the reinforcing layer is interposed between the plurality of magnetic layers. Non-contact data carrier inlet.   The said antenna element or the said antenna coil is directly formed on the said 1st and 2nd main surface of the said magnetic base material by plating process or vapor deposition, The any one of Claim 1 thru | or 10 characterized by the above-mentioned. The non-contact type data carrier inlet according to item 1.   A non-contact type data carrier inlet according to any one of claims 9 to 11, wherein a plurality of sheet-like members are mounted in a roll shape. Contact type data carrier inlet roll.   A non-contact type data carrier configured by covering the non-contact type data carrier inlet according to claim 1 with an exterior. Forming a magnetic base material comprising a first main surface and a second main surface located on the side opposite to the first main surface from a magnetic material;
A first antenna portion is provided on the first main surface of the formed magnetic base material, a second antenna portion is provided on the second main surface, and the first and second antenna portions are disposed between each other. A step of producing an antenna substrate by mounting an antenna element constituted by connecting the layers on the magnetic substrate;
An IC chip having at least a memory circuit and a communication control circuit is electrically connected to the antenna element of the manufactured antenna base material on the first or second main surface of the magnetic base material. Mounting process;
A method for producing a non-contact type data carrier inlet. Forming a magnetic base material comprising a first main surface and a second main surface located on the side opposite to the first main surface from a magnetic material;
A first antenna pattern is routed around the first main surface of the formed magnetic base material, and a second antenna pattern is routed around the second main surface and routed. A step of producing an antenna substrate by providing an antenna coil formed by interlayer connection of the first and second antenna patterns on the magnetic substrate;
An IC chip having at least a memory circuit and a communication control circuit is electrically connected to the antenna coil of the manufactured antenna base material on the first or second main surface of the magnetic base material. Mounting process;
A method for producing a non-contact type data carrier inlet.   The first antenna pattern and the second antenna pattern wired respectively on the first and second main surfaces of the magnetic base material are arranged in a direction orthogonal to the first and second main surfaces. 16. The method of manufacturing a non-contact type data carrier inlet according to claim 15, wherein wiring is performed so as to avoid overlapping of the pattern forming regions.   17. The method of manufacturing a non-contact type data carrier inlet according to claim 15, wherein the first antenna pattern and the second antenna pattern are interconnected by caulking or through holes.   The first antenna pattern and the second antenna pattern constituting the antenna coil are wound with each other when viewed from one main surface side of the first and second main surfaces of the magnetic base material. The method for manufacturing a non-contact type data carrier inlet according to any one of claims 15 to 17, wherein the directions are the same.   The said antenna element or the said antenna coil is laminated | stacked on the said 1st and 2nd main surface of the said magnetic base material through the contact bonding layer, The any one of Claim 14 thru | or 18 characterized by the above-mentioned. The manufacturing method of the non-contact-type data carrier inlet of description.   The method for manufacturing a non-contact type data carrier inlet according to claim 19, wherein the adhesive layer is made of a material having resistance to etching.   It further comprises a capacitance adjustment pattern that is connected to the antenna coil on the magnetic substrate and that can adjust the capacitance of the entire LC circuit by removing at least part of the magnetic substrate. 21. A method of manufacturing a non-contact type data carrier inlet according to any one of claims 14 to 20.   The non-contact type data carrier inlet according to any one of claims 14 to 21, wherein the magnetic base material is laminated with a reinforcing layer having electrical insulation that reinforces the base material itself. Production method.   23. The magnetic base material according to claim 22, wherein the magnetic base material has a plurality of magnetic layers formed of a magnetic material, and the reinforcing layer is interposed between the plurality of magnetic layers. A method for manufacturing a non-contact data carrier inlet.   The said antenna element or the said antenna coil is directly formed on the said 1st and 2nd main surface of the said magnetic base material by a plating process or vapor deposition, The any one of Claim 14 thru | or 23 characterized by the above-mentioned. The manufacturing method of the non-contact-type data carrier inlet of description.   A non-contact type data carrier inlet by rolling a sheet-like member carrying a plurality of non-contact type data carrier inlets manufactured by the method according to any one of claims 22 to 24 in a roll shape. A method for producing a non-contact type data carrier inlet roll, characterized in that:   25. A method of manufacturing a non-contact type data carrier, wherein the non-contact type data carrier inlet manufactured by the method according to any one of claims 14 to 24 is covered with an exterior.

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