JP2007041908A - Non-contact type data carrier inlet, non-contact type data carrier inlet roll and non-contact type data carrier, and manufacturing method of them - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve productivity by improving the mechanical strength of a manufactured component of a metal correspondence type non-contact type data carrier. <P>SOLUTION: The non-contact type data carrier 1 is provided with an IC chip C on which at least a storage circuit and a communication control circuit are mounted, an antenna coil A formed on one face side of a base material film P1 and connected electrically to the IC chip C, and a reinforcement magnetic base material H1 arranged on a side facing the base material film P1 with the antenna coil A sandwiched and composed of a magnetic layer J1 made of materials such as ferrite and a base material film P2 laminated on a face side of the magnetic layer J1 as a reinforcement layer for reinforcing the magnetic layer J1 and made of PET. That is, the reinforcement magnetic base material H1 is adapted as a manufactured component of a metal correspondence type non-contact type data carrier to thereby realize component supply in the form of a roll which can improve productivity. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a non-contact type data carrier, and relates to a non-contact type data carrier inlet, a non-contact type data carrier inlet roll, a non-contact type data carrier, and a manufacturing method thereof.

  If there is a conductor such as a metal in the field of the AC magnetic field, an eddy current is generated inside the conductor, and this eddy current becomes a demagnetizing field in a direction to cancel the AC magnetic field. For this reason, the non-contact type data carrier employing the electromagnetic induction method may not be able to respond to the reader / writer in an environment where eddy currents may be generated.

Therefore, in order to prevent electromagnetic waves from passing through a conductor such as a metal, a magnetic material such as ferrite having a high magnetic permeability is disposed between the conductor and the antenna coil on the non-contact data carrier side. Techniques for preventing the generation of current have been proposed. (For example, refer to Patent Document 1).
Japanese Patent No. 3262948

  By the way, in a metal-compatible non-contact type data carrier taking such measures, for example, as a magnetic material, metal-based flakes are mixed with a resin binder such as rubber to form a high-viscosity composition, which is further expanded. In some cases, a compressed sheet is used. However, such a magnetic sheet has a problem of low mechanical strength against bending and pulling.

  In other words, considering the productivity including the manufacturing cost of the non-contact type data carrier, in the manufacturing process, the constituent material of the non-contact type data carrier can be continuously supplied from the roll. Although it is desirable, in the case of the magnetic material sheet having the above configuration, use in the form of a roll is difficult in terms of strength.

  Accordingly, the present invention has been made to solve the above-described problems, and can improve productivity by increasing the mechanical strength of a manufacturing part of a metal-compatible non-contact data carrier. It is an object of the present invention to provide a data carrier inlet, a non-contact type data carrier inlet roll, a non-contact type data carrier, and manufacturing methods thereof.

  In order to achieve the above object, a non-contact data carrier inlet according to the present invention includes an insulating base material having electrical insulation, an IC chip on which at least a memory circuit and a communication control circuit are mounted, and the insulating base material. An antenna formed on one surface side and electrically connected to the IC chip; and a magnetic layer made of a magnetic material, disposed on a side facing the insulating substrate with the antenna interposed therebetween, And a reinforcing magnetic base material comprising a reinforcing layer laminated on at least one surface side of the magnetic material layer to reinforce the magnetic material layer.

  The non-contact type data carrier inlet according to the present invention includes an insulating base material having electrical insulation, an antenna coil formed on one surface side of the insulating base material, and one surface side of the insulating base material. And a pair of chip mounting patterns each having one pattern connected to one end of the antenna coil, and at least a memory circuit and a communication control circuit mounted on the pair of chip mounting patterns. And the other end of the antenna coil is connected to the other end of the antenna coil so as to straddle the surrounding portion of the antenna coil across the insulating substrate. The other end portion is disposed on the side facing the insulating substrate with the antenna coil sandwiched between the other pattern of the chip mounting pattern and the interlayer connection, A reinforcing magnetic base material composed of a magnetic layer composed of a natural material and a reinforcing layer that is laminated on at least one surface side of the magnetic layer and reinforces the magnetic layer. And

  Furthermore, the non-contact type data carrier inlet according to the present invention includes an insulating base material having electrical insulation, an antenna coil formed on one surface side of the insulating base material, and one end and the other end of the antenna coil. A pair of chip mounting patterns formed on one surface side of the insulating base material in a state where one and the other patterns are connected to the part, respectively, and provided at positions straddling the surrounding portion of the antenna coil, and An IC chip on which at least a memory circuit and a communication control circuit are mounted on a pair of chip mounting patterns, and a magnetic material that is disposed on the side facing the insulating substrate with the antenna coil interposed therebetween and is made of a magnetic material A reinforcing magnetic base material comprising a body layer and a reinforcing layer laminated on at least one surface side of the magnetic body layer to reinforce the magnetic body layer. To.

In these inventions, a reinforced magnetic base material in which a magnetic layer and, for example, an insulating resin-based reinforcing layer for improving the mechanical strength of the magnetic layer is laminated, is used for a metal-compatible non-contact data carrier. By applying it as a manufactured part, it is possible to supply parts in the form of a roll that can be applied with relatively high tensile stress, bending stress, etc., thereby increasing the productivity of non-contact data carriers Can do.
Here, the magnetic body constituting the magnetic layer in the above-described reinforced magnetic base material is a so-called soft magnetic body or metal-based magnetic body. In the non-contact type data carrier manufactured using the non-contact type data carrier inlet of the present invention, the side facing the antenna with the reinforcing magnetic base material interposed therebetween is the attachment side to a conductor such as metal.

Moreover, the non-contact type data carrier inlet according to the present invention is characterized in that the reinforcing layer in the reinforcing magnetic substrate is disposed at least on the surface side of the magnetic layer facing the antenna.
According to the present invention, in addition to improving the strength of the magnetic layer, the separation distance between the antenna and the magnetic layer can be increased, so that the communication distance of the non-contact type data carrier that is the product is increased, and the communication Sensitivity characteristics can be improved.

Further, the non-contact type data carrier inlet according to the present invention is provided with a plurality of the magnetic layers in the reinforced magnetic base material, and further, the reinforcing layer in the reinforced magnetic base material includes the plurality of magnetic layers. It is characterized by being interposed between the two.
In the present invention, in addition to the improvement of the strength of the magnetic layer described above, a reinforced magnetic layer composed of a plurality of magnetic layers and a reinforcing layer is formed without forming a thick magnetic layer that is generally difficult to manufacture. In the laminated structure portion of the substrate, an effect almost equivalent to that of a single magnetic layer having a thickness corresponding to the total thickness of the laminated structure portion can be expected.
That is, according to the present invention, the communication distance of the non-contact type data carrier as the product can be substantially extended as in the case where a relatively thick magnetic layer is formed.

Further, the non-contact type data carrier inlet according to the present invention comprises a metal layer disposed on the side facing the antenna with at least one magnetic layer constituting the reinforcing magnetic substrate and the reinforcing layer interposed therebetween. Furthermore, it is characterized by comprising.
In the present invention, the resonance frequency including the metal layer is taken into consideration in consideration of the use environment of the non-contact type data carrier in which a conductor such as metal is in the close position, that is, the fluctuation of the resonance frequency of the non-contact type data carrier. Can be tuned by a single data carrier, which improves communication sensitivity and other characteristics.

Furthermore, the non-contact type data carrier inlet according to the present invention sandwiches the insulating base material in place of the reinforcing magnetic base material disposed on the side facing the insulating base material with the antenna in between. The magnetic material layer made of a magnetic material is laminated on the side facing the antenna to form a reinforced magnetic base material.
According to the present invention, since the magnetic layer can be substantially reinforced without providing the above-described individual reinforcing layers, it is possible to suitably supply components in the form of the roll described above. With this configuration, the non-contact data carrier body can be made thinner and smaller. Here, the non-contact type data carrier manufactured using the non-contact type data carrier inlet of the present invention has an insulating base and a magnetic layer sandwiched between the side facing the antenna and the attachment side to a conductor such as metal. It becomes.
Moreover, in this invention, the said metal layer may further be arrange | positioned on the side facing the said antenna on both sides of the said insulation base material and the said magnetic body layer. In this case, similarly to the above-described invention, the resonance frequency including the metal layer can be tuned in advance by a single data carrier, so that characteristics such as communication sensitivity can be improved.

The non-contact type data carrier inlet according to the present invention is characterized in that the magnetic layer and / or the reinforcing layer are laminated directly or via an adhesive layer on another adjacent layer.
In the present invention, for example, a magnetic powder and a resin binder may be applied to form the magnetic layer directly on the reinforcing layer. Alternatively, a sheet-like magnetic body may be formed via an adhesive or the like. For example, you may make it stick on the reinforcement layer side. The material for forming the magnetic layer may be, for example, a magnetic sheet having a laminated structure in which an adhesive layer or the like is laminated in advance on at least one surface. Here, when a magnetic layer is laminated on another adjacent layer (for example, a reinforcing layer) via an adhesive layer, high adhesion strength between the layers can be obtained.
Furthermore, in the present invention, when the magnetic layer is formed directly or on the antenna pattern or the relay pattern without interposing an insulating layer, the magnetic body As a constituent material of the layer, it is desirable to apply, for example, Ni—Zn ferrite having high insulating properties.

Furthermore, the non-contact data carrier inlet according to the present invention is characterized in that the metal layer is laminated directly or via an adhesive layer with respect to other adjacent layers.
In the present invention, a metal layer may be formed on other adjacent layers by using so-called sputtering, metal plating, or the like. You may make it stick to a layer. Further, as a material for forming the metal layer, for example, a metal sheet having a laminated structure in which an adhesive layer or the like is laminated in advance on at least one surface may be applied.

In addition, the non-contact type data carrier inlet roll according to the present invention is configured by winding a sheet-like member on which a plurality of the non-contact type data carrier inlets described above are mounted in a roll shape. It is characterized by being.
According to the present invention, the magnetic layer is reinforced so that it can withstand relatively high tensile stress and bending stress, so that it is possible to supply components in the form of a roll when manufacturing a non-contact type data carrier. This can increase the productivity of the non-contact data carrier.

  Furthermore, the non-contact type data carrier according to the present invention is configured by covering the non-contact type data carrier inlet with an exterior.

  In addition, the non-contact type data carrier inlet manufacturing method according to the present invention includes a step of forming an antenna base by forming an antenna on one surface side of the first insulating base, A step of mounting an IC chip on which at least a memory circuit and a communication control circuit are mounted so as to be electrically connected to the antenna; and a magnetic material on at least one surface side of the second insulating base. Forming a reinforced magnetic substrate reinforced by forming a magnetic layer, and bonding the prepared reinforced magnetic substrate to the antenna coil forming surface side of the manufactured antenna substrate. It is characterized by having.

  Further, the non-contact type data carrier inlet manufacturing method according to the present invention is replaced with a step of manufacturing the reinforcing magnetic substrate and a step of bonding the reinforcing magnetic substrate to the antenna forming surface side of the antenna substrate. Then, a step of forming a magnetic layer using a magnetic material on the non-forming surface side of the antenna of the antenna base material is performed.

Furthermore, the manufacturing method of the non-contact type data carrier inlet according to the present invention is a non-forming surface of the antenna coil on the antenna substrate after finishing the process of mounting the IC chip instead of the manufacturing method of the invention. On the side, a step of forming a magnetic layer using a magnetic material is performed.
In the present invention, when the magnetic layer is directly formed on the reinforcing layer or the like by applying, for example, magnetic powder and a resin binder on the non-forming surface side of the antenna on the antenna substrate (that is, for example, the magnetic body is formed). In the case of forming a magnetic layer by coating or the like, it can be said that this is an effective production method.
In other words, for example, when an IC chip is mounted after applying the magnetic layer, the IC chip may be mounted in a soft state before the magnetic layer is completely cured. Variations occur, and this can cause variations in the characteristics of the non-contact data carrier, particularly the resonance frequency. Therefore, the IC chip is first mounted on the antenna substrate, and then the magnetic material is applied to the antenna substrate on which the IC chip is already mounted to produce a non-contact type data carrier inlet. Variations can be suppressed.

Furthermore, the manufacturing method of the non-contact type data carrier inlet roll according to the present invention comprises a roll of a sheet-like member carrying a plurality of non-contact type data carrier inlets produced by the method described above. A non-contact type data carrier inlet roll is produced by winding.
The non-contact type data carrier inlet manufacturing method of the present invention is characterized in that the non-contact type data carrier is manufactured by covering the non-contact type data carrier inlet manufactured by the above-described method with an exterior.

  As described above, according to the present invention, the non-contact type data carrier inlet and the non-contact type capable of improving the productivity by increasing the mechanical strength of the manufacturing part of the metal-compatible non-contact type data carrier. A data carrier inlet roll, the non-contact data carrier, and a manufacturing method thereof can be provided.

The best mode for carrying out the present invention will be described below with reference to the drawings.
(First embodiment)
FIG. 1 is a view of the non-contact type data carrier inlet according to the first embodiment of the present invention as viewed from one side, FIG. 2 is a cross-sectional view of the non-contact type data carrier inlet as viewed from the side, and FIG. FIG. 3 is a view of the non-contact data carrier inlet as viewed from the other surface side. FIG. 4 is a block diagram functionally showing the configuration of this non-contact type data carrier inlet, and FIG. 5 shows a non-contact type data carrier constructed by covering the non-contact type data carrier inlet with an exterior. FIG. 6 is a cross-sectional view of the non-contact data carrier of FIG. 5 viewed from the side. 1, 3 and 5 show the conductor pattern including the antenna coil in the form of hatching. In each figure, the conductor pattern located on the near side and the conductor located on the far side from the near side are shown. The pattern is distinguished from the pattern by changing the direction of hatching.

  As shown in FIGS. 1 to 4, the non-contact type data carrier inlet 2a according to this embodiment includes a rectangular base film P1 made of PET (polyethylene terephthalate), which is a first insulating base, and a base film P1. The antenna coil A formed above and a pair of connection patterns 8a and 8b connected in parallel to the antenna coil A on the base film P1 are provided. Further, the non-contact type data carrier inlet 2a includes an IC chip C mounted on the pair of chip mounting patterns 5a and 5b formed on one surface side of the base film P1, and the base film P1. A plurality of pairs of tuning patterns (capacitance adjustment patterns) 15a, 15b, 16a, 16b, 17a, 17b, 18a respectively wired on one surface side and the other surface side via a pair of connection patterns 8a, 8b. , 18b and through-hole-forming regions (tunable execution regions) 15, 16, 17, 18 are provided.

  The base film P1 having electrical insulation includes two main surfaces, one surface (one main surface) 19a and the other surface (the other main surface) 19b. The antenna coil A is formed so as to go around the surface 19a of the base film P1 a plurality of times. Further, the pair of connection patterns 8a and 8b are electrically connected to the antenna coil A on the base film P1, respectively, and wired so as to extend on one surface 19a and the other surface 19b of the base film P1, respectively. Has been. Specifically, the one end 3a of the antenna coil A and the base end portion of the one connection pattern 8a are connected to the one chip mounting pattern 5a described above, and on the one chip mounting pattern 5a. One of the connection bumps 9a of the IC chip C is connected.

The other end portion 3b of the antenna coil A is connected to one end portion Ya of a jumper wire Y as a relay pattern wired on the other surface 19b of the base film P1 via a caulking portion 6a. The other end portion Yb of the line Y is connected to the base end portion of the other chip mounting pattern 5b wired on the one surface 19a of the base film P1 through the crimping portion 6b. The other end of the connection bump 9a of the IC chip C is connected to the tip of the other chip mounting pattern 5b. Furthermore, the other end portion Yb of the jumper wire Y described above is connected to the base end portion of the other connection pattern 8b on the other surface 19b of the base film P1.
That is, the jumper wire Y thus wired is formed on the other surface 19b side of the base film P1 so as to straddle the surrounding portion of the antenna coil A over the base film P1, and its one end Ya However, the other end portion 3b of the antenna coil A and the caulking portion 6a are interlayer-connected, and the other end Yb is interlayer-connected via the other chip mounting pattern 5b and the caulking portion 6b.

  In addition, each pair of tuning patterns 15a, 15b, 16a, 16b, 17a, 17b, 18a, 18b is formed on each of the pair of connection patterns 8a, 8b on one and other main surfaces 19a, 19b of the base film P1. It is connected to the tip part and is disposed at a position facing each other across the electrically insulating base film P1. Each pair of tuning patterns is formed in a substantially circular shape and functions as a capacitor pattern. Here, each pair of tuning patterns may be formed in a rectangular (quadrangle) shape. In addition, the IC chip C is mounted with a capacitor 9b in addition to a rewritable nonvolatile memory and an RF circuit for wireless communication that do not require power supply backup (see FIG. 4). As shown in FIG. 4, the antenna coil A, the capacitor 9b in the IC chip C, and the tuning patterns 15a, 15b, 16a, 16b, 17a, 17b, 18a, and 18b that are respectively connected on the base film P1 as described above. The resonance circuit of the whole antenna is configured.

  Further, the through-hole-formable regions 15, 16, 17, 18 on the base film P1 provided for adjusting the resonance frequency of the entire antenna are respectively paired tuning patterns 15a, 15b, 16a, 16b, 17a, 17b. , 18a, 18b is secured as an area where a through-hole for punching out a pair of the base film P1 (or any of the tuning patterns may not be pulled out) can be punched. Yes. These through-hole-formable regions 15, 16, 17, and 18 are outer peripheral edges of the tuning patterns 15b, 16b, 17b, and 18b that are formed slightly larger in outer shape than the tuning patterns 15a, 16a, 17a, and 18a. Is a circular region surrounded by an outer peripheral edge slightly offset to the outside. In the present embodiment, it is assumed that a frequency approximate to the resonance frequency target value of 13 and 56 MHz is obtained in a state in which neither set of tuning patterns is removed, and the through hole is not perforated. Is illustrated.

  Here, as shown in FIGS. 5 and 6, the non-contact data carrier (also referred to as RFID [Radio Frequency Identification] tag or the like) 1 of the present embodiment is a metal-compatible type having a function of preventing the generation of eddy currents. Non-contact data carrier. That is, as shown in FIGS. 2 and 6, one surface 19a side (the side facing the base film P1 across the antenna coil A) on the side where the antenna coil A is formed on the base film P1 described above. ) Includes a magnetic layer J1 made of a magnetic material having high permeability such as ferrite and a reinforcing layer (second layer) laminated on one surface side of the magnetic layer J1 to reinforce the magnetic layer J1. A reinforced magnetic base material H1 composed of a base film (PET layer: polyethylene terephthalate layer) P2 as an insulating base material is laminated and disposed via an adhesive layer S3.

  Further, on such a base film P1, an antenna coil A, a jumper wire Y, a pair of chip mounting patterns 5a and 5b, a tuning pattern, a base film (PET layer) P2, a magnetic layer J1, an IC chip C, etc. As shown in FIGS. 5 and 6, the non-contact type data carrier 1 is configured by covering the non-contact type data carrier inlet 2 a configured by mounting with an exterior as shown in FIGS. 5 and 6. In the present embodiment, a card-type non-contact data carrier (a card-type non-contact data carrier) is formed by applying a lamination (card) process so as to sandwich the base film P1 from both sides using a pair of rectangular protective films 7a and 7b made of vinyl chloride resin. IC card) 1 is configured. In this non-contact type data carrier 1 of the metal type, the side of the surface on which the magnetic layer J1 is formed on the basis of the position of the internal base film P1 (the antenna coil A with the reinforcing magnetic base H1 sandwiched therebetween) The side opposite to the surface is a mounting surface to a metal article or the like. Here, in addition to the card-type form, for example, a pouch-type non-contact data carrier obtained by pouching, a label type provided with an adhesive layer obtained by labeling or a release paper covering it Non-contact type data carrier of high temperature resistance obtained by processing molded products using so-called engineering plastics such as PPS (polyphenylene sulfide) and PSF (polysulfone) Can also be configured.

  Next, a manufacturing method of the metal-compatible non-contact type data carrier inlet 2a, which is a component of the non-contact type data carrier 1 configured as described above, will be described with reference to FIGS. 7a to 7g, FIGS. 8a and 8b, and FIGS. This will be described with reference to 9a to 9f. Here, FIGS. 7a to 7g are diagrams schematically showing a basic manufacturing process of a non-contact type data carrier inlet, and FIGS. 8a and 8b are diagrams for making the non-contact type data carrier inlet a metal-compatible type. FIGS. 9a to 9f schematically show a manufacturing apparatus used in the manufacturing process of FIGS. 7a to 7g, and FIGS. 8a and 8b.

  First, as shown in FIG. 7a and FIG. 9a, for example, a PET base film P1 having a thickness of about 30 to 100 μm is wound from a PET roll R1 wound in a roll shape to a sheet-like base material through an unwinding roller 30. Continuous feeding of the film P1 is started. Next, as shown in FIG. 7b and FIG. 9a, using the pasting rollers 22a and 22b on both sides of the fed base film P1, copper drawn out from the rollers 23a, 23b, 24a and 24b, respectively, etc. The metal layers K1 and K2 are attached via the adhesive layers S1 and S2. Further, as shown in FIGS. 7c and 9a, a resist T is printed using rollers 31a and 31b at predetermined positions on the metal layers K1 and K2 respectively attached to both surfaces of the base film P1.

  Thereafter, as shown in FIGS. 7d and 9a, the base film P1 on which the resist T on the metal layers K1 and K2 is printed is etched through the etching tank 32, and further, as shown in FIGS. 7e and 9a. Then, in the resist peeling / cleaning / drying chamber 33, the resist T is peeled off from the base film P1, and then washed and further dried. As a result, as shown in FIGS. 7d and 9a, the antenna coil A and the pair of chip mounting patterns 5a and 5b are provided on one surface 19a side (for a plurality of non-contact data carriers [see FIG. 9e]). As shown in FIG. 7f and FIG. 9a, the base film P1 is formed and the jumper line Y is formed on the other surface 19b side (for a plurality of non-contact data carriers [see FIG. 9e]). Interlayer connection between the other end portion 3b of the antenna coil A and one end portion Ya of the jumper wire Y through the caulking portion 6a, and caulking between the base end portion of the other chip mounting pattern 5b and the other end portion Yb of the jumper wire Y. Interlayer connection through the unit 6b is performed using a caulking machine 34 (see FIGS. 2 and 6).

  Thus, the antenna coil A (the other end 3b) and the chip mounting pattern (5b) formed on one surface side of the sheet-like base film P1, and the other surface side of the base film P1 The sheet-like antenna substrate M obtained by interlayer connection with the jumper wire Y formed on is wound up through the take-up roller 35 to form the antenna roll R2. Further, thereafter, as shown in FIGS. 7g and 9b, the continuous feeding of the antenna base material M from the antenna roll R2 is started through the unwinding roller 36, and the antenna base material M sent out in the form of a sheet is started. The IC chip C is mounted on the pair of chip mounting patterns 5a and 5b on the surface where the antenna coil A is formed using the mounting device 37 and the pressure bonding device 38. Further, as shown in FIG. 9b, in this way, the antenna base M on which the IC chip C is mounted is wound up through the winding roller 39 to form a roll-shaped inlet R3.

  On the other hand, as shown in FIG. 8a and FIG. 9c, for example, a PET base film P2 having a thickness of about 30 to 100 μm is wound from the PET roll R4 wound in a roll shape through the unwinding roller 40. Start continuous delivery. Next, the magnetic material layer J1 is formed on one surface of the fed base film P2 using the magnetic material coating device 41 provided with calendar rollers 41a, 41b, 41c. Here, as a constituent material of the magnetic layer J1, for example, Mn—Mg—Zn ferrite, Mn—Zn ferrite, Ni—Zn ferrite, hexagonal ferrite, and the like are suitable. In forming the magnetic layer J1, a resin binder mixed with magnetic powder such as ferrite may be applied. This resin binder is mainly composed of a thermoplastic resin, and if necessary, coupling agents such as silane, titanate and aluminum which improve the affinity between the magnetic powder and the resin, phthalic acid and sulfone which improve the fluidity of the resin. Acidic, phosphoric acid and epoxy plasticizers, stearic acid, stearates, fatty acid amides, waxes and other lubricants that increase the fluidity of the mixture, and hindered phenols to prevent oxidation of fillers, sulfur Those to which antioxidants such as those based on phosphorus and phosphorus are appropriately added are suitable.

  Next, as shown in FIG. 9 c, after the thickness of the magnetic layer J <b> 1 is adjusted to a thickness of about 50 to 500 μm, for example, by the pressurizing device 42, the magnetic layer J <b> 1 is dried through the drying furnace 43. Done. As shown in FIG. 9c, a sheet-like reinforcing magnetic substrate H1 obtained by integrating the magnetic layer J1 and the base film P2 in a manner to reinforce the magnetic layer J1 in this way, Winding through the winding roller 45 forms a PET / magnetic material roll R5. At this time, the roll length of the formed PET / magnetic material roll R5 needs to be longer than the distance (path) from the supply roll R4 to the discharge-side roll R5 of the manufacturing apparatus and is easy to handle the roll. For example, it is about 5 to 500 m. Here, since the magnetic layer J1 is reinforced by being integrated with the base film P2 so as to be able to withstand relatively high tensile stress and bending stress, in manufacturing the non-contact type data carrier 1, Component supply in the form of a simple roll (the above-mentioned PET / magnetic material roll R5) can be realized, whereby the productivity of the non-contact type data carrier 1 can be increased. In addition to PET, the insulating resin material for constituting the base film P2 as the reinforcing layer is, for example, phenol resin, urea resin, melamine resin, polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, polyether monkey Phon, polyphenylene sulfide, PBT, polyarylate, silicone resin, diallyl phthalate, polyimide, and the like can also be applied.

  Next, as shown in FIG. 9d, continuous feeding of the antenna substrate M on which the IC chip C is mounted is started from the roll-shaped inlet R3 (see FIGS. 7g and 9b) through the unwind roller 46. Next, as shown in FIG. 8b and FIG. 9d, the surface of the antenna base M that has been sent out on the mounting side of the IC chip C, that is, the side on which the antenna coil A is formed (the one side 19a side of the base film P1) , Refer to FIG. 2), using the adhering rollers 47 a and 47 b, the base film P <b> 2 (PET layer side) side of the reinforcing magnetic base H <b> 1 drawn from the PET / magnetic material roll R <b> 5 (see FIGS. 8 a and 9 c) is used. , And pasted through the adhesive layer S3 drawn out from the roll 48. Further, as shown in FIGS. 9 d and 9 e, the sheet-like member in which the plurality of metal-compatible data carrier inlets (2 a) are arranged in the vertical and horizontal directions is wound through the winding roller 49. And a metal-compatible non-contact type data carrier inlet roll R6 is formed. The non-contact type data carrier inlet roll length formed here needs to be longer than the distance (pass) from the supply roll to the discharge side roll of the subsequent manufacturing apparatus, and the size of the roll is easy to handle. For example, it is about 5 to 500 m.

  Thereafter, as shown in FIGS. 8b and 9f, the metal-compatible non-contact data carrier inlet (2a) is passed from the non-contact data carrier inlet roll R6 (see FIGS. 9d and 9e) through the unwinding roller 50. Starts continuous feeding of sheet-like members in a state where a plurality of are arranged vertically and horizontally. Next, the fed sheet-like member is cut into a predetermined size by using a cutting device 51 with a predetermined position as a reference, and a plurality of metal-compatible non-contact data carrier inlets 2a are produced. The remaining sheet-shaped cut pieces punched out of the non-contact type data carrier inlet 2a are wound up through the collection roller 52 and become the collection roll R7.

  As described above, in the non-contact type data carrier inlet 2a (non-contact type data carrier 1) of the present embodiment, the magnetic layer is provided with the reinforcing layer (base film P2) that reinforces the magnetic layer J1. The mechanical strength of J1 can be improved, so that, for example, in the supply of manufactured parts of a metal-compatible non-contact data carrier, for example, a roll form (PET) that can be applied with relatively high tensile stress, bending stress, etc. -Parts supply with magnetic body roll R5) is realizable. Therefore, according to this embodiment, the productivity of the non-contact data carrier 1 can be increased.

  Further, according to the non-contact type data carrier inlet 2a (non-contact type data carrier 1) of the present embodiment, as shown in FIGS. 2 and 6, on the surface of the magnetic layer J1 facing the antenna coil A, Since the base film (PET layer) P2 as the reinforcing layer is disposed, in addition to improving the strength of the magnetic layer J1, the distance between the antenna coil A and the magnetic layer J1 can be increased. As a result, the communication distance of the non-contact type data carrier 1 as a product is increased, and the communication sensitivity characteristics can be improved.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. 10a to 10c, FIG. 11 and FIG. Here, FIGS. 10a to 10c are diagrams schematically showing a manufacturing process of the magnetic layer of the non-contact type data carrier inlet 2b according to this embodiment, and FIG. 11 is a manufacturing process of the magnetic layer shown in FIG. 10b. FIG. 12 schematically shows a manufacturing apparatus used in the case of FIG. 12, which shows a case where a magnetic layer is provided on a non-contact data carrier inlet and a case where a magnetic layer and a metal layer are provided (the thickness of the magnetic layer) It is a graph which shows the change of the resonant frequency according to the change.

  As shown in FIG. 10c, the non-contact type data carrier inlet 2b according to this embodiment includes a magnetic layer J1 and a reinforcing layer in addition to the configuration of the non-contact type data carrier inlet 2a of the first embodiment. A metal layer K3 made of aluminum, for example, is further provided on the side facing the antenna coil A across the material film P2.

  That is, in this embodiment, as shown in FIG. 11, in addition to the configuration of the magnetic layer manufacturing apparatus described in FIG. 9c of the first embodiment, the pasting rollers 53a and 53b, the metal layer roll 54, and An adhesive layer roll 55 is provided. As shown in FIGS. 10a, 10b, and 11, an adhesive layer is formed on the other surface of the sheet-like base film P2 fed from the unwinding roller 40, that is, on the surface opposite to the surface on which the magnetic layer J1 is formed. In a state where the metal layer K3 is laminated via S4, the sheet-like member is subjected to thickness adjustment processing by the pressurizing device 42 and drying processing through the drying furnace 43. In this way, the reinforcing magnetic base material H2 with the metal layer in which the magnetic layer J1 and the metal layer K3 are formed on the base film P2 is taken up through the take-up roller 56, and the PET / magnetic body / metal roll R8 is taken up. Form. Thereafter, parts are supplied by PET / magnetic material / metal roll R8, and the antenna coil A forming surface side of the antenna base M on which the IC chip C shown in FIG. The non-contact type data carrier inlet 2b is obtained by bonding the reinforcing magnetic substrate H2 from the magnetic layer J1 side via the adhesive layer S3.

  Here, in FIG. 12, when the resonance frequency of the non-contact type data carrier inlet without the magnetic layer and the metal layer is set as a reference X, and this magnetic body is provided only in the non-contact type data carrier inlet, the magnetic body layer is provided. A change in resonance frequency corresponding to a change in layer thickness is indicated by W. On the other hand, a metal layer having a predetermined thickness (fixed thickness) in addition to the magnetic layer for the non-contact data carrier inlet. 5 is a graph showing the change in the resonance frequency according to the change in the thickness of the magnetic layer when V is provided.

  As is clear from FIG. 12, according to the non-contact type data carrier configured using the non-contact type data carrier inlet 2b of the present embodiment, the use of the non-contact type data carrier in which a metal or the like is in a close position is used. Consideration of the environment, that is, fluctuation of the resonance frequency of the non-contact data carrier (in the example in which a metal layer having a predetermined thickness is provided in addition to the magnetic layer, the thickness of the magnetic layer is close to 0.05 mm) In this case, the resonance frequency can be tuned in advance with a non-contact type data carrier inlet alone in consideration of the fact that the resonance frequency is greatly increased), so that characteristics such as communication sensitivity can be improved.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIGS. 13a to 13c and FIG. Here, FIGS. 13a to 13c are diagrams schematically showing a manufacturing process of the magnetic layer of the non-contact type data carrier inlets 2c and 2d according to this embodiment, and FIG. 14 is a non-contact type data shown in FIG. 13c. It is a figure which shows typically the non-contact-type data carrier inlet 2d comprised by laminating | stacking a metal layer further on the carrier inlet 2c.

  The non-contact type data carrier inlet 2c according to this embodiment replaces the configuration of the non-contact type data carrier inlet 2a of the first embodiment shown in FIG. 8b with a plurality of layers, for example, two magnetic layers J1, J2 is provided, and a base film P2 as a reinforcing layer is interposed between the plurality of magnetic layers J1 and J2.

That is, in this embodiment, as shown in FIGS. 13a and 13b, the reinforcing magnetic base material H3 configured by laminating the magnetic layers J1 and J2 on each surface of the base film P2, and the adhesive layer S3 are provided. Thus, the non-contact type data carrier inlet 2c is obtained by joining the antenna base M on which the IC chip C shown in FIG.
In this non-contact type data carrier inlet 2c, in addition to improving the strength of the magnetic layers J1, J2, a plurality of magnetic layers J1, J2 are formed without forming a thick magnetic layer that is generally difficult to manufacture. In the laminated structure portion constituted by the base film (reinforcing layer) P2, an effect substantially equivalent to that of a single magnetic layer having a thickness corresponding to the total thickness of the laminated structure portion can be expected.
That is, according to the non-contact type data carrier inlet 2c, the communication distance of the non-contact type data carrier as a product can be substantially extended as in the case where a relatively thick magnetic layer is formed.

Further, as shown in FIG. 14, the magnetic layers J1 and J2 are laminated on each surface of the base film P2, and the metal layer K3 is laminated on the magnetic layer J2 side via the adhesive layer S5. The antenna coil A of the antenna substrate M on which the IC chip C shown in FIG. 7g is mounted is formed on the non-formation surface side (magnetic layer J1 side) of the metal layer K3 of the reinforced magnetic substrate H4 with a metal layer. By joining to the surface side, a non-contact type data carrier inlet 2d is obtained.
According to this non-contact type data carrier inlet 2d, as described above, the communication distance of the non-contact type data carrier to be a product is extended, and, similarly to the above, the resonance frequency tuning including the metal layer is performed in advance. Since the data carrier inlet can be used alone, characteristics such as communication sensitivity can be improved.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIGS. 15a to 15c, FIG. 16 and FIG. Here, FIG. 15a to FIG. 15c are diagrams schematically showing a manufacturing process of the magnetic layer of the non-contact type data carrier inlet 2e according to this embodiment, and FIG. 16 is a manufacturing process of the magnetic layer shown in FIG. 15b. FIG. 17 schematically shows a manufacturing apparatus used for the case where FIG. 17 shows a case where a magnetic layer is provided on the surface of the base film P1 (antenna base material M) on which the antenna coil A is formed and It is a graph which shows the change of the communication distance (in response to the change of the resonant frequency) with the case where a magnetic body layer is provided in the non-formation surface side of A (formation surface side of jumper line Y). According to this graph, the communication distance is longer when the magnetic layer is provided on the non-formation surface side (the formation surface side of the jumper wire Y) of the antenna coil A of the base film P1 at a predetermined frequency of 13.5 MHz. Good communication sensitivity.

  The non-contact type data carrier inlet 2e according to this embodiment has a reinforcing layer such as a base film P2 provided in the non-contact type data carrier inlet of the first to third embodiments as shown in FIG. 15c. Without being provided, the magnetic layer J3 is directly provided on the side (the surface on which the jumper wire Y is formed) facing the antenna coil A across the base film P1.

  That is, in this embodiment, instead of the configuration of the magnetic layer manufacturing apparatus described with reference to FIG. 9f of the first embodiment, as shown in FIGS. An unwinding roller 57 for holding an antenna roll R9 (a roll whose jumper wire Y side is the outer peripheral side) wound in a direction opposite to the roll (a roll whose antenna coil 3 is the outer peripheral side and the jumper wire Y side is the inner peripheral side) R2. Is used. The other surface of the antenna substrate M (substrate film P1) before mounting the IC chip C shown in FIG. 15a (FIG. 7f) in the sheet form fed from the antenna roll R9 through the unwinding roller 57, that is, the antenna substrate M. In the state where the magnetic layer J3 is laminated on the surface where the jumper wire Y is formed (the surface where the antenna coil A is not formed) as shown in FIGS. The thickness adjustment process by 42 and the drying process through the drying furnace 43 are performed. The antenna base M on which the magnetic layer J3 is formed in this way is wound up through the winding roller 58 so that the surface on which the antenna coil A is formed is the outer peripheral side, thereby forming the anterol R10 with a magnetic body. . Thereafter, parts are supplied by the anterol R10 with a magnetic material, and the IC chip C is mounted on the pair of chip mounting patterns 5a and 5b on the antenna coil A forming surface side of the antenna base M shown in FIG. 15b. Thus, as shown in FIG. 15c, a non-contact data carrier inlet 2e is obtained. In addition, you may provide a metal layer in the outer side of the magnetic body layer J3 in the base film P1.

Here, as described above, when the IC chip C is mounted after the magnetic layer J3 is first laminated (coated) on the antenna base M, the IC is in a soft state before the magnetic layer is completely cured. There is a concern that the chip C may be mounted, the joint between the IC chip C and the antenna base M may vary, and the characteristics of the non-contact data carrier, particularly the resonance frequency, may vary accordingly. The Therefore, the IC chip C is first mounted on the antenna base M, and then the magnetic layer is formed on the surface of the antenna base M on which the IC chip C has already been mounted (the surface on which the antenna coil A is not formed). The above-described variation in resonance frequency may be suppressed by forming a non-contact type data carrier inlet by forming a magnetic material (applying a magnetic material).
In the non-contact type data carrier inlet 2e of this embodiment, since the magnetic layer J3 is directly formed on the jumper wire Y of the antenna base M, the constituent material of the magnetic layer J3 is, for example, A magnetic material having high insulating properties such as Ni-Zn ferrite is applied.

Here, as shown in FIG. 17, the magnetic body on the side facing the antenna (jumper wire Y side) with the antenna base interposed therebetween, as compared with the case where the magnetic body layer is provided on the antenna coil A side of the base film P1. When the layer is provided, the separation distance between the antenna coil A and the magnetic layer can be increased, and as a result, the communication distance is extended at a predetermined frequency (for example, 13.5 MHz) as shown in the graph. Is excellent.
Therefore, according to the non-contact type data carrier configured using the non-contact type data carrier inlet 2e of the present embodiment, the communication characteristics can be improved, and the antenna base film and the magnetic material reinforcing layer can be shared. The magnetic layer J3 can be substantially reinforced without providing a separate reinforcing layer, and this configuration can reduce the thickness and size of the non-contact data carrier body.

  Although the present invention has been specifically described with the embodiments, the present invention is not limited to these embodiments, and various modifications can be made without departing from the scope of the invention. For example, in the above-described embodiment, the calender roll is used to form the magnetic layer, but instead, the magnetic layer may be formed using a coating apparatus that can drop the magnetic material. The magnetic layer may be formed using electrostatic coating or the like. In addition, in forming the metal layers K1 and K2 which form the base for forming the antenna coil A and the jumper wire Y, in addition to the technique using the adhesive layer, vapor deposition may be applied, and the base is formed by vapor deposition or sputtering. After the formation, the metal layer may be formed using electrolytic plating.

  In the above-described embodiment, the interlayer connection between the antenna coil and chip mounting pattern side and the jumper wire side is performed by so-called caulking, but instead of this, the base film P1 is formed by laser processing or the like. After forming a through hole and forming a base layer in the through hole by sputtering or the like, for example, by performing a plating process, an interlayer connection is made between the antenna coil and chip mounting pattern side and the jumper line side. You may do it.

  Moreover, in the said embodiment, the conductor pattern which ensured the position of the chip mounting pattern of IC chip C using the jumper wire Y and interlayer connection which straddle the surrounding part of the antenna coil A over the base film P1 is two layers. Although the non-contact type data carrier has been exemplified, the present invention can be applied to a non-contact type data carrier having a single conductive pattern as shown in FIG. 18 instead. That is, in FIG. 18, on one side of the insulating base material, one and the other chip mounting patterns 62 a and 62 b connected to the one end 61 a and the other end 61 b of the antenna coil 61 are connected to the antenna coil 61. It is provided at a position straddling the circulation part. The IC chip C is mounted on the chip mounting patterns 62a and 62b across the circumference of the antenna coil 61. By forming a reinforced magnetic layer on an antenna substrate having a single conductor pattern, the same effects as those described above can be obtained.

In the embodiment described above, for example, a magnetic powder and a resin binder are applied, and the magnetic material layer is placed on the side facing the antenna with the base material film P2 as the reinforcing layer and the antenna base material of the antenna base material M interposed therebetween. However, instead of this, a sheet-like magnetic body may be attached to, for example, the reinforcing layer side via an adhesive or the like. Thereby, high adhesion strength can be obtained between the magnetic layer and the reinforcing layer adjacent to the magnetic layer.
In the above description of the embodiment, a coiled antenna (antenna coil) is exemplified as the shape of the antenna, but the antenna is, for example, a dipole antenna having a pair of linear conductors on one surface of an insulating base. Various shapes can be designed, and in the present application, these various shapes are collectively referred to as an antenna. Furthermore, the configuration of the present invention can be used as long as the antenna base is formed on one surface of the insulating base, such as an antenna base having a coiled antenna or a dipole antenna. It becomes possible to apply.

The figure which looked at the non-contact-type data carrier inlet which concerns on the 1st Embodiment of this invention from the one surface side. Sectional drawing which looked at the non-contact-type data carrier inlet of FIG. 1 from the side. The figure which looked at the non-contact-type data carrier inlet of FIG. 1 from the other surface side. The block diagram which shows the structure of the non-contact-type data carrier inlet of FIG. 1 functionally. The figure which looked at the non-contact-type data carrier comprised by covering the non-contact-type data carrier inlet of FIG. 1 with the exterior from one surface side. Sectional drawing which looked at the non-contact-type data carrier of FIG. 5 from the side. It is a figure for demonstrating the process for manufacturing the non-contact-type data carrier inlet of FIG. 1, Comprising: The figure which shows the cross section of a base film. Sectional drawing which shows the state by which the metal layer was laminated | stacked on the base film of FIG. FIG. 7B is a cross-sectional view showing a state in which a resist layer is formed on the metal layer of FIG. Sectional drawing which shows the state which etched the base film in which the resist layer was formed on the metal layer of FIG. 7c. Sectional drawing which shows the state which removed the resist layer from the base film in which the etching of FIG. Sectional drawing which shows the state which performed the crimping process to the base film from which the resist layer of FIG. 7e was removed. Sectional drawing which shows the state which mounted the IC chip in the base film which performed the crimping process of FIG. The figure for demonstrating the method for forming a magnetic body layer in the non-contact-type data carrier inlet of FIG. The figure which shows typically the structure of the non-contact-type data carrier inlet of FIG. The figure for showing roughly the device for carrying out the manufacturing process shown in Drawing 7a-Drawing 7f. The figure for showing roughly the device for carrying out the manufacturing process shown in Drawing 7g. The figure which shows roughly the apparatus for implementing the manufacturing process shown to FIG. 8a. The figure which shows roughly the apparatus for laminating | stacking a magnetic body layer on the non-contact-type data carrier inlet of FIG. The top view which shows the non-contact-type data carrier inlet roll produced with the apparatus of FIG. 9d. Sectional drawing which shows the manufacturing apparatus for obtaining the non-contact-type data carrier inlet single-piece | unit from the non-contact-type data carrier inlet roll of FIG. 9e. The figure for demonstrating the formation method of the magnetic body layer of the non-contact-type data carrier inlet which concerns on the 2nd Embodiment of this invention. The figure which shows the state by which the metal layer was laminated | stacked on the magnetic body layer of FIG. 10a. The figure which shows typically the structure of the non-contact-type data carrier inlet which concerns on 2nd Embodiment. The figure which shows schematically the manufacturing apparatus for laminating | stacking a metal layer on the magnetic body layer of FIG. 10b. The graph which shows the change of the resonant frequency with the case where a magnetic body layer is provided in a non-contact-type data carrier inlet, and the case where a magnetic body layer and a metal layer are provided. The figure for demonstrating the formation method of the magnetic body layer of the non-contact-type data carrier inlet which concerns on the 3rd Embodiment of this invention. The figure which shows the state by which the magnetic body layer was laminated | stacked also on the other surface in addition to the magnetic body layer laminated | stacked on one side of the base film shown to FIG. 13a. The figure which shows typically the structure of the non-contact-type data carrier inlet which concerns on 3rd Embodiment. The figure which shows typically the structure of the non-contact-type data carrier inlet comprised by laminating | stacking a metal layer further on the non-contact-type data carrier inlet of FIG. 13c. The figure for demonstrating the formation method of the magnetic body layer of the non-contact-type data carrier inlet which concerns on the 4th Embodiment of this invention. The figure which shows the state by which the magnetic body layer was laminated | stacked on the structure of FIG. The figure which shows typically the structure of the non-contact-type data carrier inlet which concerns on 4th Embodiment. The figure which shows schematically the manufacturing apparatus for laminating | stacking the magnetic body layer of FIG. 15b. The graph which shows the change of communication distance with the case where a magnetic body layer is provided in the formation surface of the antenna coil of a base film, and the case where a magnetic body layer is provided in the formation surface of the jumper wire of a base film. The figure for demonstrating the structure of the non-contact-type data carrier with one conductor pattern.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Non-contact type data carrier, 2a, 2b, 2c, 2d, 2e ... Non-contact type data carrier inlet, 5a, 5b ... Chip mounting pattern, 41a, 41b, 41c ... Calendar roller, 41 ... Magnetic substance coating device, 42 ... Pressurizing device, 53 ... Metal roll, A ... Antenna coil, C ... IC chip, H1, H2, H3, H4 ... Reinforcing magnetic substrate, J1, J2, J3 ... Magnetic layer, K3 ... Metal layer, M ... antenna base, P1, P2 ... base film, R6 ... non-contact data carrier inlet roll, S1, S2, S3, S4, S5 ... adhesive layer, Y ... jumper wire.

Claims (27)

An insulating substrate having electrical insulation;
An IC chip on which at least a memory circuit and a communication control circuit are mounted;
An antenna formed on one side of the insulating substrate and electrically connected to the IC chip;
A magnetic layer that is disposed on the side facing the insulating substrate with the antenna interposed therebetween and is laminated on at least one surface side of the magnetic layer to reinforce the magnetic layer A reinforced magnetic substrate composed of
A non-contact type data carrier inlet. An insulating substrate having electrical insulation;
An antenna coil formed on one side of the insulating substrate;
A pair of chip mounting patterns each formed on one surface side of the insulating base and having one pattern connected to one end of the antenna coil;
An IC chip on which at least a memory circuit and a communication control circuit are mounted on the pair of chip mounting patterns;
The antenna coil is formed on the other surface side of the insulating base so as to straddle the surrounding portion of the antenna base, and one end is interlayer-connected to the other end of the antenna coil and the other end is , A relay pattern layer-connected to the other of the chip mounting patterns,
Reinforcement that is disposed on the side facing the insulating substrate with the antenna coil interposed therebetween and is laminated on at least one surface side of the magnetic material layer and reinforcing the magnetic material layer. A reinforced magnetic substrate composed of layers,
A non-contact type data carrier inlet. An insulating substrate having electrical insulation;
An antenna coil formed on one side of the insulating substrate;
The one and other patterns are connected to one end and the other end of the antenna coil, respectively, and are formed on one surface side of the insulating base material and provided at positions straddling the surrounding portion of the antenna coil. A pair of chip mounting patterns;
An IC chip on which at least a memory circuit and a communication control circuit are mounted on the pair of chip mounting patterns;
Reinforcement that is disposed on the side facing the insulating substrate with the antenna coil interposed therebetween and is laminated on at least one surface side of the magnetic material layer and reinforcing the magnetic material layer. A reinforced magnetic substrate composed of layers,
A non-contact type data carrier inlet.   The non-contact type data carrier inlet according to any one of claims 1 to 3, wherein the reinforcing layer in the reinforcing magnetic substrate is made of an insulating resin material.   5. The non-contact type according to claim 1, wherein the reinforcing layer of the reinforcing magnetic substrate is disposed at least on a surface side of the magnetic layer facing the antenna. Data carrier inlet. A plurality of the magnetic layers in the reinforced magnetic substrate are provided,
The non-contact type data according to any one of claims 1 to 5, wherein the reinforcing layer in the reinforcing magnetic substrate is interposed between the plurality of magnetic layers. Carrier inlet.   7. The method according to claim 1, further comprising a metal layer disposed on a side facing the antenna with at least one magnetic layer constituting the reinforcing magnetic substrate and the reinforcing layer interposed therebetween. The non-contact type data carrier inlet according to any one of claims. In place of the reinforcing magnetic substrate disposed on the side facing the insulating substrate across the antenna,
7. The reinforced magnetic base material according to claim 1, wherein a magnetic material layer made of a magnetic material is laminated on a side facing the antenna across the insulating base material. The non-contact type data carrier inlet according to item.   9. The non-contact type data carrier inlet according to claim 8, wherein a metal layer is further disposed on the side facing the antenna with the insulating base and the magnetic layer interposed therebetween.   10. The non-contact according to claim 1, wherein the magnetic layer and / or the reinforcing layer is laminated on another adjacent layer directly or via an adhesive layer. Formula data carrier inlet.   The non-contact type data carrier inlet according to any one of claims 7 to 10, wherein the metal layer is laminated on another adjacent layer directly or via an adhesive layer.   A non-contact type data carrier inlet according to any one of claims 1 to 11, wherein a plurality of sheet-like members are mounted in a roll shape. Contact type data carrier inlet roll.   A non-contact type data carrier configured by covering the non-contact type data carrier inlet according to claim 1 with an exterior. Producing an antenna substrate by forming an antenna on one side of the first insulating substrate;
Mounting an IC chip on which at least a memory circuit and a communication control circuit are mounted so as to be electrically connected to the antenna on the antenna substrate;
Producing a reinforced magnetic substrate reinforced by forming a magnetic layer using a magnetic material on at least one surface side of the second insulating substrate;
Bonding the produced reinforcing magnetic substrate to the antenna forming surface side of the produced antenna substrate;
A method for producing a non-contact type data carrier inlet. A first pattern forming step of forming an antenna coil and a pair of chip mounting patterns in which one pattern is connected to one end of the antenna coil on one surface side of the first insulating base;
One end portion is interlayer-connected to the other end portion of the antenna coil, and the other end portion is interlayer-connected to the other of the pair of chip mounting patterns. A second pattern forming step of forming the antenna coil on the other surface side of the first insulating base so as to straddle the surrounding portion of the antenna coil over the insulating base;
After passing through the first and second pattern manufacturing steps, interlayer connection between one end of the relay pattern and the other end of the antenna coil, and the other end of the relay pattern and the pair of chip mounting Making an antenna substrate by performing interlayer connection with the other of the pattern;
Mounting an IC chip on which at least a memory circuit and a communication control circuit are mounted on the pair of chip mounting patterns of the manufactured antenna substrate;
Producing a reinforced magnetic substrate reinforced by forming a magnetic layer using a magnetic material on at least one surface side of the second insulating substrate;
Bonding the produced reinforcing magnetic substrate to the antenna coil forming surface side of the antenna substrate that has undergone the step of mounting the IC chip;
A method for producing a non-contact type data carrier inlet. An antenna coil and a pair of chip mounting patterns respectively connected to one end portion and the other end portion of the antenna coil and disposed at positions straddling the surrounding portion of the antenna coil. A step of producing an antenna substrate by forming on one surface side of the insulating substrate of 1;
A chip mounting step of mounting an IC chip on which at least a memory circuit and a communication control circuit are mounted on the pair of chip mounting patterns of the manufactured antenna substrate;
Producing a reinforced magnetic substrate reinforced by forming a magnetic layer using a magnetic material on at least one surface side of the second insulating substrate;
Bonding the produced reinforcing magnetic substrate to the antenna coil forming surface side of the antenna substrate that has undergone the step of mounting the IC chip;
A method for producing a non-contact type data carrier inlet.   The method of manufacturing a non-contact type data carrier inlet according to any one of claims 14 to 16, wherein the second insulating base is made of an insulating resin material.   18. The non-contact according to claim 14, wherein the second insulating substrate side of the reinforcing magnetic substrate and the antenna forming surface side of the antenna substrate are joined. Method of manufacturing a formula data carrier inlet.   19. The method according to claim 14, wherein in the step of manufacturing the reinforced magnetic substrate, a magnetic layer is formed on each of the one and the other surfaces of the second insulating substrate. The manufacturing method of the non-contact-type data carrier inlet described in 1. In the step of producing the reinforced magnetic base material, a metal layer is further formed on a member composed of the second insulating base material and at least one magnetic layer,
In the step of bonding the reinforcing magnetic substrate to the antenna substrate, the non-forming surface side of the metal layer of the reinforcing magnetic substrate and the antenna forming surface side of the antenna substrate are bonded. The method for manufacturing a non-contact type data carrier inlet according to any one of claims 14 to 19. In place of the step of producing the reinforcing magnetic substrate and the step of bonding the reinforcing magnetic substrate to the antenna forming surface side of the antenna substrate,
The non-contact type according to any one of claims 14 to 19, wherein a step of forming a magnetic material layer using a magnetic material is performed on the non-forming surface side of the antenna base material. Manufacturing method of data carrier inlet.   After the step of mounting the IC chip is completed, a step of forming a magnetic layer using a magnetic material on the non-forming surface side of the antenna on the antenna substrate is performed. The method of manufacturing a non-contact type data carrier inlet according to claim 21.   23. The method of manufacturing a non-contact type data carrier inlet according to claim 21, wherein a metal layer is further formed on a side of the magnetic material layer formed on the non-forming surface side of the antenna of the antenna substrate.   The layer composed of the second insulating base material for reinforcing the magnetic layer and / or the magnetic layer is laminated directly or via an adhesive layer on another adjacent layer. The method for producing a non-contact type data carrier inlet according to any one of claims 14 to 23.   The method for manufacturing a non-contact type data carrier inlet according to any one of claims 20 to 24, wherein the metal layer is laminated on another adjacent layer directly or via an adhesive layer.   A non-contact type data carrier inlet by rolling a sheet-like member carrying a plurality of non-contact type data carrier inlets manufactured by the method according to any one of claims 14 to 25 in a roll shape. A method for producing a non-contact type data carrier inlet roll, comprising producing a roll.   A non-contact type data carrier is manufactured by covering a non-contact type data carrier inlet manufactured by the method according to any one of claims 14 to 25 with an exterior. Method.

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