JP3793692B2 - Film continuous peeling apparatus and continuous peeling method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a film continuous peeling apparatus and a peeling method, and in particular, a film continuous peeling for peeling a continuous film affixed to a resist film on a substrate surface such as a semiconductor substrate, a printed wiring board, a glass substrate of LCD or PDP. The present invention relates to an apparatus and a peeling method.
[0002]
[Prior art]
As a conventional method of this kind, the film body to be attached as a base film, a resist film, etc. (hereinafter described as a film with a resist), and a cover film having a three-layer structure (hereinafter abbreviated as an integrated film) Using the film roll wound around the film supply shaft so that the base film is on the outer peripheral side and the cover film is on the inner peripheral side, the cover film is peeled off from the integrated film fed out from the film supply shaft, and the desired on the transport path The substrate is passed between a pair of pressure-bonding rollers so that the resist film and the base film, which are two layers according to the size of each substrate conveyed at a constant interval, are cut in the width direction so that the resist film is on the substrate surface side. There is a single-wafer method that is pasted every time.
[0003]
On the other hand, a continuous method has been proposed to further simplify the apparatus configuration. As the method, using a film roll in the same way as the single wafer method, after peeling the cover film from the integrated film fed out from the film supply shaft, a plurality of substrates that are conveyed on the conveyance path at a desired constant interval. Resist without cutting the base film after performing inter-substrate treatment to provide a protective tape on the resist film at the part corresponding to the part where bonding between the substrate and the resist film is not desired (hereinafter abbreviated as part corresponding to the part between the substrates) A first continuous method in which the film is attached to each substrate through a pair of pressure rollers so that the film is on the substrate surface side, that is, across the front and rear end portions of each substrate on which the protective tape is conveyed ( Japanese Patent Laid-Open No. 6-73343), or an integrated film fed from the film supply shaft has a desired constant interval on the conveyance path. The part where the cover film is cut at two places in the width direction at the front and back in a length corresponding to the part corresponding to the distance between the substrates of the plurality of substrates conveyed and the resist film is attached to the substrate while leaving the cover film corresponding to the distance between the substrates. (Hereinafter, abbreviated as substrate equivalent part) After the inter-substrate treatment to peel off the cover film, the resist film is placed on the substrate surface side, that is, the front and rear ends of each substrate on which the remaining cover film is transported There is a second continuous method (see Japanese Patent Application Laid-Open No. 9-174797) in which a resist film is attached to each substrate through a pair of pressure rollers.
[0004]
[Problems to be solved by the invention]
In the continuous method in the above-mentioned conventional technology, after the resist film is pasted, each substrate is connected to the base film, the resist film, and a protective tape or cover film corresponding to the portion between the substrates, so that the post-processing is performed. In order for these films to be separated.
[0005]
As a reliable separation method, the base film, the resist film, and the protective tape or cover film on the resist film between the substrates are cut by a cutter in the substrate conveyance path. According to this separation method, the cut film edge protrudes from the substrate edge, and the protruded film edge gets in the way when aligning the substrate for exposure processing etc. in the subsequent process. There is a problem that it cannot be processed properly.
[0006]
After attaching the resist film so that the film edge does not protrude from the substrate edge, put a cut through the resist film from the base film side in the width direction so as to reach the protective tape or cover film in the equivalent part between the substrates, It is also possible to separate the substrates from each other by peeling off the three layers of the cover film, resist film and protective tape or cover film in the width direction with an adhesive tape or the like. However, with this separation method, it is difficult to make a cut from the base film side without scratching the substrate. Also, if the cuts are made shallower due to fear of substrate damage, it becomes difficult to separate the substrates from each other.
[0007]
Therefore, conventionally, the base film stuck on the substrate surface is cut between the substrates, and the base film is peeled one by one using a hand or an apparatus. However, when a continuous film is cut for peeling, there is a problem that labor is required for collection.
[0008]
Moreover, when the film is cut, film scraps are generated at the time of cutting. Further, since the substrate is transported by being placed on a transport roller, dust associated with sliding friction is generated when it is attempted to secure the substrate suction force.
[0009]
In addition, since the substrate is mounted on the transfer roller with the substrate sticking surface facing up, it is transported together with the downflow in the clean room, so that dust accompanying peeling and sliding friction falls down and the substrate is dropped. Dust easily adheres to the affixing surface.
[0010]
In addition, when the substrate sizes are different, it is difficult to transport the substrates having different sizes by one transport device and peel the base film.
[0011]
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a base film peeling apparatus and a peeling method that do not require labor for collecting the peeled base film.
[0012]
Another object of the present invention is to continuously peel the base film on the lower side while adsorbing the continuous substrates on the upper surface, so that there is no dust adhesion to the substrates and the substrates can be reliably separated from each other. To provide a peeling apparatus and a peeling method for a base film.
[0013]
Another object of the present invention is to provide a base film peeling apparatus and a peeling method capable of reliably separating substrates even when the substrate sizes are different.
[0014]
[Means for Solving the Problems]
A feature of the present invention that achieves the above object is that a resist film obtained by peeling a cover film from a continuous integrated film having a three-layer structure of a base film, a resist film, and a cover film is spaced apart by a lami roll. In a film peeling apparatus for peeling the base film from a substrate attached, the lower surface of the substrate and the base film are transported at the same speed as the transport speed of the lami roll process while adsorbing the substrate from the upper surface. The base film is continuously peeled downward by a peeling shaft installed between the two.
[0015]
Another feature of the present invention is that a film with a resist in which a base film and a cover film are provided on each side of a resist-coated film and the cover film is peeled off from a continuous integrated film having a three-layer structure in a lamiroll process. In a film peeling method for attaching a substrate and peeling the base film on the surface of the substrate from the substrate in the peeling step, using the motor while adsorbing the continuous substrate from the upper surface, it is the same as the conveyance speed of the lami roll step. While continuously transporting at a speed, the base film on the surface is continuously peeled downward by a peeling shaft installed between the substrate and the film, leaving only the resist on the substrate.
[0016]
According to the method of the present invention, it is not necessary to recover the base film by continuously peeling the film. Moreover, it becomes unnecessary to cut | disconnect the continuous film for peeling, and the film waste at the time of a cutting | disconnection does not generate | occur | produce.
[0017]
In addition, it is possible to peel the base film downward by adsorbing and transporting the substrate to the lower side. By using it together with the down flow in the clean room, the dust at the time of peeling drops down and the substrate sticking surface is removed. Garbage is hard to adhere to.
[0018]
In addition, by using a fluororesin in the portion that slides with the suction belt, sliding friction is reduced and generation of dust is suppressed. In addition, by using a roller made of urethane or silicon rubber for the suction belt drive unit, it is possible to increase the frictional resistance with the belt, reduce the generation of dust due to slip, and transmit the driving force of the motor to the suction belt .
[0019]
Further, by dividing the suction box sucked by the blower and performing individual suction, the substrate suction force is not reduced due to the suction of air from other than the substrate contact surface when the substrate is continuously transported. Further, by separating the suction chamber for each substrate size, it is possible to transport substrates of different sizes with one apparatus.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
The method of the present invention will be described below based on one embodiment shown in FIGS. FIG. 1 is a schematic view of the overall configuration of a film sticking / peeling apparatus embodying an embodiment of the method of the present invention. This apparatus is composed of a base film, a resist film, and a cover film peeled off from a continuous integrated film F having a three-layer structure of a cover film, and a substrate 6 adhered to the resist film by a lami roll at regular intervals. The base film is peeled off.
[0021]
In FIG. 1, reference numeral 1 denotes a film supply shaft, around which a film F with resist is wound so that the base film is on the outside. The resist-attached film F includes a base film 2, a resist film 3, and a cover film 4. The base film 2 and the cover film 4 are attached to the upper and lower surfaces of the resist film 3 with the adhesiveness of the resist film 3, and the three-layer structure is integrated. Film (resist-attached film) F. On the other hand, the substrate 6 is a glass substrate for LCD in this embodiment, is gripped on the back surface by an articulated robot 16 having a vacuum suction hand 16A, and is transferred to the conveying means 20, and the conveying means 20 makes a pair. It is conveyed between the lami rolls 15.
[0022]
The integrated film F is fed out from the film supply shaft 1 and supplied between the pair of lami rolls 15 through the half cut means 7 and the back tension controller 14. The half cut means 7 is a means for forming a half cut in the integrated film F fed from the film supply shaft 1. The half-cut means 7 includes a pair of disk cutters arranged at a predetermined distance in the front-rear direction in the feeding direction (conveyance direction) of the integrated film F, and forms a cut, that is, a half-cut in the cover film 4 and the resist film 3. Is. The distance between the pair of disk cutters of the half-cut means 7 is a resist film corresponding to a portion corresponding to a portion between a plurality of substrates 6 being conveyed and a portion where bonding between the substrate 6 and the resist film 3 is not desired. This region is simply the total length of the three portions, and this region is simply called an inter-substrate equivalent portion or a resist removal portion.
[0023]
12 is a peeling roll of the cover film 4, the adhesive tape 10 fed from the adhesive tape roll 9 is pressed against the half-cut integrated film F, and the cover film 4 corresponding to the substrate portion is peeled from the integrated film F. Then, it is wound and collected by the cover film winding shaft 13. In this way, just before the substrate 6 is attached to the integrated film F, only the cover film 4 corresponding to the substrate portion is removed from the integrated film F.
[0024]
The substrate 6 is held by the articulated robot 16 having the vacuum suction hand 16 </ b> A so that the surface, that is, the surface to be bonded to the resist film 3 is on the lower side, and is transferred to the conveying means 20. The conveyance means 20 is an air levitation type conveyance means including a guide roller constituting the conveyance path, a floating plate 22 and a supply means for the pressurized air 23, and the substrate 6 is directed from the left side to the right side in the drawing, with the surface facing down. As it is, it is conveyed toward the pair of lami rolls 15. A heater 21 for heating the substrate 6 is provided on the opposite side, that is, the upper side of the conveying means 20 with the substrate 6 interposed therebetween. The pressurized air 23 supplied from the conveying means 20 is heated, and in the process of moving between the heater 21 and the conveying means 20, the substrate 6 is heated to a predetermined temperature suitable for the lami roll process.
[0025]
A backup roller 24 for adjusting the pressure is attached to the pair of lami rolls 15. In the lami roll process, the substrate 6 enters between the pair of lami rolls 15, and at the same time, the resist film 3 is pressurized by the pair of lami rolls 15, and the resist film 3 is thermocompression bonded to the substrate 6. And if the resist film 3 is thermocompression-bonded to the rear-end position of a board | substrate, the pressure of one lami roll will be cancelled | released and a lami roll will leave | separate from the surface of a board | substrate.
[0026]
Reference numeral 28 denotes cold air supply means for supplying cold air for rapidly cooling the substrate 6 that has become high temperature in the lami roll process. Reference numeral 30 denotes a base film removing means for removing the base film 2 and the resist 3 and the cover film 4 corresponding to the distance between the substrates, and includes a peeling roller 31 and a base film winding shaft 32. The peeling roller 31 is of a free roller type in which the shaft is cantilevered and arranged at right angles to the flow of the substrate 6. The base film 2 is separated from the substrate by peeling the continuous base film 2 from the substrate by the peeling roller 31 of the base film removing means 30 while adsorbing the substrate from the back surface by the suction conveyor 33, and the base film 2 and the substrate that have been peeled off. The corresponding portion of the resist 3 and the cover film 4 are removed, and the base film take-up shaft 32 is wound up and collected.
[0027]
The base film 2, the resist 3 and the cover film 4 corresponding to the distance between the substrates are removed, and the substrate 6 separated from each other is conveyed to the right in the figure by the suction conveyer 33, and is further armed. The transfer is carried out by the transfer robot 34 having the transfer 34 to the next process. In addition, it cannot be overemphasized that the film sticking apparatus is installed in the clean room.
[0028]
As described above, in the apparatus of FIG. 1, the substrate 6 is gripped by the hand of the robot 16, turned over, transferred to the transport unit 20, and a predetermined temperature suitable for the lami roll process in the process of moving between the heater 21 and the transport unit 20. The resist film 3 is pressed by a pair of lami rolls 15 in the lami roll process, and the resist film 3 is thermocompression bonded to the substrate 6. And the board | substrate 6 which became high temperature in the lami roll process is conveyed to the base film removal means 30, cooling rapidly, and here, the base film 2 continued with the peeling roller 31 while adsorb | sucking a board | substrate from the back surface by the adsorption conveyor 33 is carried out. The base film 2 and the resist 3 and the cover film 4 corresponding to the portion between the substrates are recovered by the base film take-up shaft 32. On the other hand, the separated substrates 6 are sucked and reversed by the robot 34 and transferred to the next process.
[0029]
Next, details of the base film removing means 30 and the suction conveyor 33 will be described with reference to FIGS. 2 is a perspective view showing details of the base film removing means 30 and the suction conveyor 33, FIG. 3 is a longitudinal sectional view taken along the line AA in FIG. 2, and FIG. 4 is taken along the line BB in FIG. It is the top view which cut down some adsorption conveyors 33.
[0030]
The suction conveyor 33 is disposed along the substrate conveyance path, and is provided with an adsorption belt 330 that conveys the upper surface of the substrate while adsorbing the upper surface of the substrate with a negative pressure, a plurality of suction boxes 331 for generating an adsorption force, and an adsorption belt. A tensioner 332 for applying tension, a duct 333 for exhausting the inside of each suction box with a blower to form a negative pressure source, and a roller 335 made of urethane or silicon rubber at the same speed as the substrate transport speed by the lami roll 15 A stepping motor for driving the suction belt 330 is provided. In the present embodiment, the suction conveyors 33 are arranged in three rows in the substrate transport direction. Further, the suction box 331 is also divided into a plurality by the chamber dividing plate 339.
[0031]
It is possible to peel the base film 2 downward by the base film removing means 30 while transporting the substrate while adsorbing the upper surface by the suction conveyer 33. By using it together with the down flow in the clean room, the garbage at the time of peeling. However, it falls down and it is difficult for dust to adhere to the substrate pasting surface.
[0032]
As shown in FIG. 4, the bottom surface of the suction box 331 along the top surface of the substrate is constituted by a fluororesin plate 337 having an elongated notch hole 336 extending in the substrate transport direction. The suction belt 330 has an endless structure and is provided with a large number of thin holes 338 corresponding to the cutout holes 336 of the fluororesin plate.
[0033]
As the operation of the suction conveyor 33, when the suction belt 330 is rotated by the motor 334 in a state where the suction box 331 is sucked with a blower and set to a negative pressure, the suction belt 331 is transported along the transport path of the substrate 6 below the suction box 331. When the substrate 6 closes the hole 338 of the suction belt, the upper surface of the substrate 6 can be sucked and conveyed while the substrate is sucked to the belt 330.
[0034]
By using a fluororesin plate 337 in a portion that slides on the suction belt 330, sliding friction is reduced and generation of dust is suppressed. In addition, by using a roller 335 made of urethane or silicon rubber for the suction belt drive unit, the frictional resistance with the belt 330 is increased, the generation of dust due to slip is reduced, and the driving force of the motor 334 is transmitted to the suction belt. be able to.
[0035]
On the substrate transport path, on the side opposite to the suction conveyor 33, that is, on the lower surface side of the substrate 6, a peeling roller 31 constituting the base film removing means 30 is arranged so as to cross the substrate transport path and continuously. The peeled base film 3 is wound on the base film winding shaft 32. By continuously peeling the base film, there is no need to cut a continuous film for peeling, and no film waste is generated during cutting.
[0036]
In addition, since the suction box 331 for sucking with the blower is divided into a plurality of front, rear, left, right, and plural in the substrate transport direction by the dividing plate 337 and each chamber is sucked by the individual blower, the substrate weight is about 2%. The substrate can be stably adsorbed with double the adsorption force, and the substrate can be transferred. That is, by dividing and individually sucking the suction box 331 sucked by the blower, when the substrate is continuously transported, the decrease in the substrate suction force due to the suction of air from other than the substrate contact surface is eliminated.
[0037]
In addition, by using the suction chamber of the suction box 331 separately for each substrate size, it is possible to transport substrates of different sizes with one apparatus.
[0038]
【The invention's effect】
As described above, according to the method of the present invention, it is possible to provide a peeling apparatus and a peeling method for a base film that do not require labor for collecting the peeled base film by continuously peeling the film. Moreover, it becomes unnecessary to cut | disconnect the continuous film for peeling, and the film waste at the time of a cutting | disconnection does not generate | occur | produce.
[0039]
In addition, it is possible to peel the base film downward by adsorbing and transporting the substrate to the lower side. By using it together with the down flow in the clean room, the dust at the time of peeling drops down and the substrate sticking surface is removed. Garbage is hard to adhere to.
[0040]
Furthermore, by using a fluororesin for the portion that slides with the suction belt, sliding friction is reduced and generation of dust is suppressed. In addition, by using a roller made of urethane or silicon rubber for the suction belt drive unit, it is possible to increase the frictional resistance with the belt, reduce the generation of dust due to slip, and transmit the driving force of the motor to the suction belt .
[0041]
Further, by dividing the suction box sucked by the blower and performing individual suction, the substrate suction force is not reduced due to the suction of air from other than the substrate contact surface when the substrate is continuously transported. Further, by separating the suction chamber for each substrate size, it is possible to transport substrates of different sizes with one apparatus.
[Brief description of the drawings]
FIG. 1 is a schematic view of the overall configuration of a film sticking / peeling apparatus embodying an embodiment of the method of the present invention.
FIG. 2 is a perspective view showing details of a base film removing means and a suction conveyor portion of FIG. 1;
FIG. 3 is a longitudinal sectional view taken along the line AA in FIG.
4 is a plan view showing a cross section of a part of the suction conveyor along the line BB in FIG. 3; FIG.
[Explanation of symbols]
F ... Integrated film 1 ... Film supply shaft 2 ... Base film 3 ... Resist film 4 ... Cover film 6 ... Substrate 7 ... Half cut means 12 ... Cover film stripping roll 13 ... Cover film take-up shaft 15 ... Lami roll 16 ... Robot DESCRIPTION OF SYMBOLS 20 ... Conveyance means 21 ... Heater 22 ... Floating plate 23 ... Pressurized air 28 ... Cold-air supply means 29 ... Base film removal means 30 ... Base film removal means 31 ... Peeling roller 32 ... Base film winding shaft 33 ... Adsorption conveyor

Claims (6)

The base film is peeled off from the film with the resist attached to the resist film, which has been peeled off from the continuous integrated film having a three-layer structure of the base film, the resist film, and the cover film, with a fixed interval by lami roll. In the film peeling device,
While the substrate is adsorbed from the upper surface, the base film is continuously peeled downward by a peeling shaft installed between the lower surface of the substrate and the base film while being transported at the same speed as the transport speed of the lami roll process. A film continuous peeling apparatus characterized by: In a film peeling apparatus that peels off the base film from a continuous integrated film having a three-layer structure with a base film and a cover film on each side of the resist-attached film and a substrate attached with a constant interval by a lami roll ,
While adsorbing the substrate from the upper surface, the substrate has an adsorption conveyor that conveys the substrate at the same speed as that of the lami roll process, and a peeling shaft installed between the lower surface of the substrate and the base film. A film continuous peeling apparatus comprising a base film removing means for continuously peeling to the side. The continuous film peeling apparatus according to claim 2, wherein the suction conveyor includes a suction box having a cutout hole corresponding to a substrate transport surface, and a suction belt made of a perforated fluororesin that continuously circulates in the cutout hole. A motor that rotates the suction belt while the suction box is sucked by a blower, and the substrate that has been transported under the suction box closes the hole of the suction belt, thereby sucking the substrate to the belt. A film continuous peeling apparatus characterized by carrying the upper surface. The film continuous peeling apparatus according to claim 2 or 3, wherein a plate made of fluororesin is installed on a surface of the suction belt that slides on the suction box, and a drive unit of the suction belt is made of urethane or silicon rubber. A continuous film peeling apparatus characterized by using a roller. The film continuous peeling apparatus according to claim 2 or 3, wherein the suction box is divided into a plurality of rooms in front, rear, left, and right in the substrate transport direction, and each of the rooms is sucked by an individual blower. Film continuous peeling device. In the lamiroll process, a base film and a cover film are provided on each side of the resist-coated film, and the resist-coated film and the substrate are peeled off from the continuous integrated film having a three-layer structure. In the film peeling method for peeling the base film on the substrate surface,
While continuously adsorbing the continuous substrate from the upper surface, using a motor, continuously transporting at the same speed as the transport speed of the lamiroll process, continuously peeling the base film on the surface downward, leaving only the resist on the substrate A film continuous peeling method characterized by the above.

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