JP6938235B2 - Non-contact communication medium - Google Patents

Description

In the present invention, at least one or more circuit devices and a conductive pattern electrically connected to the circuit devices are provided on the support substrate, and the non-contact is suitable for use in, for example, RFID (Radio Frequency Identification). It relates to a communication medium, and in particular, proposes a technology that contributes to strengthening security in transmitting and receiving data to and from an external device.

In recent years, RFID has been used in various fields such as billing systems, security management systems, and distribution management systems, and readers / writers (external devices), RFID tags, contactless IC cards, and the like used for these have not been contacted. Development of communication media is also being actively carried out.

Among them, non-contact IC cards are installed in the system because the memory of the IC chip stores confidential information that requires high security, such as personal information, account information, room entry / exit system information, and electronic money information. Such information is read and written by wireless communication with a reader / writer. In wireless communication between a reader / writer, such information may be read due to unauthorized access by a third party, and there is an increasing demand for security measures.

Conventionally, as this kind of security measure, for example, there is a key encryption method on the IC chip side and a method of restricting communication by an antenna on the reader / writer side, but from the viewpoint of further security improvement, the IC chip or reader / It is desirable to take measures against information leakage such as user-only and use-time restrictions even for card configurations other than the writer.

For example, Patent Document 1 discloses a wireless information storage medium storage case capable of satisfactorily storing a wireless information storage medium such as an IC card and preventing unintended communication. Further, in Patent Document 2, the capacitance of the capacitor is changed according to the compressive force applied from the outside such as by being sandwiched by the user, whereby it is possible to switch between the communicable state and the non-communicable state. A non-contact identification tag that enables easy and reliable prevention of unauthorized access is disclosed.

Japanese Unexamined Patent Publication No. 9-269985 Japanese Unexamined Patent Publication No. 2006-216803

In Patent Document 1, communication can be prevented only while the contactless IC card is stored in a special case, which is sufficient to prevent unauthorized access to the contactless IC card by a third party other than the user. It is hard to say that it is a good security. In addition, when using it, it is necessary to put in and take out the non-contact type IC card in and out of the special case, which is inconvenient to handle.
In Patent Document 2, it is necessary to provide a special structure in the card that receives a compressive force for changing the capacitance of the capacitor, which complicates the manufacturing process and thus causes a problem that the manufacturing cost is greatly increased. be.

An object of the present invention is to solve such a problem of the prior art, and an object of the present invention is to manufacture the product at a relatively low cost without significantly changing the structure in order to prevent unauthorized access. It is an object of the present invention to provide a highly reliable non-contact communication medium capable of effectively preventing unauthorized access.

The non-contact communication medium of the present invention is a non-contact communication medium in which at least one or more circuit devices and a conductive pattern electrically connected to the circuit devices are provided on a support substrate. The sex pattern forms a non-linear linear shape as a whole connected to the antenna pattern portion with the antenna pattern portion that functions as an antenna, and communicates with an external device via the antenna pattern portion by contact with an external conductor. possess a contact pattern portion that permits, the contact pattern portion comprises a meander-shaped portion which meanders are bent at a plurality of locations, the length of the contact pattern portion relative to the length 1270mm antenna pattern part 250mm That is all.

In the non-contact communication medium of the present invention, the contact pattern portion changes the resonance frequency and / or the communicable distance with the external device of the antenna pattern portion by the contact of the external conductor with the contact pattern portion. It is preferable that the change enables communication with an external device via the antenna pattern portion.

It is preferable that the contact pattern portion is in contact with a human finger as an external conductor.

Before SL meander portion of the folding line meandering bent at a plurality of locations, the number included in the per unit length, it is preferable that the 2 lines / mm or more.
Further, it is preferable that the area ratio represented by the area of the pattern of the meander-shaped portion to the area surrounded by the outer edge of the meander-shaped portion is 15% or more .

The conductive wire constituting the conductive pattern is preferably coated with a self-bonding insulating film.

The non-contact communication medium of the present invention preferably further provides an insulating layer covering at least a part of the contact pattern portion of the conductive pattern on the support substrate, in this case. It is preferable that the contact pattern portion enables communication with an external device by contacting an external conductor via the insulating layer.

Further, the non-contact communication medium of the present invention covers at least a part of the circuit device and the conductive pattern on the surface side of the support substrate provided with the circuit device and the conductive pattern, and also covers the contact pattern. It is preferable that an exterior body having a through hole for exposing at least a part of the portion to the outside is further provided.

According to the present invention, since the conductive pattern has an antenna pattern portion and a contact pattern portion, when the antenna is formed, the contact pattern portion is formed together with the antenna pattern portion, and the contact pattern portion is used. Since the security function can be added, the non-contact communication medium can be manufactured at a relatively low cost without significantly changing the structure to prevent unauthorized access.

Further, in this non-contact communication medium, since the external conductor comes into contact with the contact pattern portion, signals can be transmitted / received to / from an external device such as a reader / writer, so that the external conductor comes into contact with the contact pattern portion. Reading and writing of information is restricted while not. Therefore, it is highly reliable and unauthorized access can be effectively prevented.

It is a top view which shows typically the non-contact communication medium of one Embodiment of this invention by removing the exterior body of the support substrate surface. It is a top view which shows typically the non-contact communication medium of FIG. It is a cross-sectional view along the line AA of FIG. 2 and a cross-sectional view taken along the line BB of FIG. It is a cross-sectional view similar to FIG. 3A which schematically shows the non-contact communication medium of another embodiment of this invention. It is a graph which shows the change of the resonance frequency and the communicable distance with respect to the length of the contact pattern part in Example 1. FIG. It is a graph which shows the change of the resonance frequency and the communicable distance with respect to the linear density of the meander shape part in Example 2. FIG. It is a graph which shows the change of the resonance frequency and the communicable distance with respect to the area ratio of the meander shape part in Example 2. FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The non-contact communication medium of the embodiment of the present invention is an information medium used in an RFID system. An RFID system is an ID system that uses electromagnetic waves or light as a communication medium, and is a reader / that reads and writes information to a non-contact communication medium such as a non-contact IC card, which is an information medium, and a non-contact communication medium. It is composed of an external device such as a writer and can update information by non-contact communication.

The non-contact communication medium includes a circuit device dedicated to reading information or having a storage area in which information can be freely read and written, and can be operated by non-contact power transmission from a reader / writer, and is necessary at any time. Information can be retrieved and new information can be written as needed.

Typical types of communication methods for RFID systems are (1) electromagnetic coupling method that uses mutual induction of coils by an alternating magnetic field, and (2) electromagnetic waves in the long and medium wave bands in the 13.56 MHz band. There is an electromagnetic induction method.

The non-contact communication medium of the present invention preferably applies the electromagnetic induction method. In this case, an induced current is generated in the antenna coil by the electromagnetic wave transmitted from the reader / writer, and the frequency of the induced current and the resonance circuit. When the frequency at which the resonance phenomenon can be induced coincides with the frequency, the information processing unit of the circuit device can start processing the data.

FIG. 1 is a plan view schematically showing a circuit device and a conductive pattern of a non-contact communication medium according to an embodiment of the present invention. The non-contact communication medium illustrated in FIG. 1 has at least one circuit device 2 in the figure and a conductive pattern 3 electrically connected to the circuit device 2 on the surface of the support substrate 1. The conductive pattern 3 is provided and is capable of communicating with an external device (not shown), and the conductive pattern 3 is continuously provided from the antenna pattern portion 31 that functions as an antenna and the antenna pattern portion 31, and is non-linear as a whole. It has a linear contact pattern portion 32.

In this non-contact communication medium, when an external conductor comes into direct contact with the contact pattern portion 32 or indirectly via an insulating layer or the like described later, the resonance frequency of the antenna pattern portion 31 changes or the external device and the external device are used. It is designed so that the communicable distance of the above changes, and thereby it becomes possible to communicate with an external device via the antenna pattern unit 31 in the changed state. That is, by setting a limit on the communicable range on at least one of the resonance frequency and the communicable distance of the antenna pattern portion 31 with the external device, for example, when a non-contact communication medium is used, the contact pattern portion 32 Only when the external conductor comes into contact with the external conductor, the conditions of the resonance frequency and / or the communicable distance are satisfied and communication becomes possible. On the other hand, for example, when a non-contact communication medium is not used, the contact pattern portion When the external conductor is not in contact with the 32, the conditions of the resonance frequency and / or the communicable distance are not satisfied, and information cannot be transmitted / received.

Here, the support substrate 1 has a predetermined thickness, is composed of a single layer or a plurality of layers, and at least one layer thereof can be made of a resin material. It is desirable to use a thermoplastic resin as the resin material constituting at least one layer of the support substrate 1. More specifically, for example, PETG (non-crystalline PET copolymer), PVC (polyvinyl chloride), PC (polycarbonate), PET (polyethylene terephthalate), foamed PET, PEN (polyethylene terephthalate), ABS (acrylonitrile butadiene). -A thermoplastic resin such as styrene copolymer synthetic resin) can be used. The thickness of the support substrate 1 is arbitrary, but can be, for example, 0.1 mm to 0.5 mm. Examples of the case where the support substrate 1 is composed of a plurality of layers include a paper substrate coated with a thermoplastic resin.

An IC chip is built in the circuit device 2. The IC chip is generally composed of a power supply circuit, a control circuit, a memory, and a transmission / reception circuit. The power supply circuit operates using the electric power received via the antenna pattern unit 31 as a drive power source, and supplies power to other circuit blocks. The transmission / reception circuit is a circuit that transmits / receives a signal via the antenna pattern unit 31. The control circuit is coupled to the transmission / reception circuit and the memory so that signals can be input / output, and mediates data transfer between the transmission / reception circuit and the memory. For example, the control circuit reads data from the memory according to the input signal from the transmission / reception circuit and transfers the data to the transmission / reception circuit, or writes data to the memory according to the input signal from the transmission / reception circuit. As is clear from the above description, the circuit device 2 is capable of communicating with an external communication device (external device), typically a reader / writer, via the antenna pattern unit 31.

The conductive pattern 3 includes an antenna pattern portion 31 that substantially functions as an antenna and a contact pattern portion 32 that changes at least one of the resonance frequency and the communicable distance of the antenna pattern portion 31 when an external conductor comes into contact with the antenna pattern portion 31. Have.

The antenna pattern portion 31 is set based on the frequency of the carrier wave used for communication, and in the embodiment shown in FIG. 1, it has a spiral shape that orbits the vicinity of the outer edge portion of the support substrate 1 a plurality of times. The antenna pattern portion 31 and the contact pattern portion 32 need to be electrically connected, and it is preferable that the antenna pattern portion 31 and the contact pattern portion 32 are formed in one continuous linear shape. This facilitates the formation of a conductive pattern during the manufacture of the non-contact communication medium.

The contact pattern portion 32 is designed based on a flat area that can be contacted by an external conductor, and in the illustrated embodiment, the contact pattern portion 32 is an antenna pattern that orbits in the vicinity of the outer edge portion of the support substrate 1. From a part of the innermost peripheral side of the portion 31, to a portion extending inward in a straight line parallel to the long side of the rectangular support substrate 1 in a plan view, then folded back, and then extending outward in the opposite direction. Includes a meander-shaped part that bends left and right at multiple points and meanders. The pattern form of the contact pattern portion 32 can be arbitrarily set, but in order to secure a sufficiently large contact point with the external conductor in a small flat area, a pattern form including the meander-shaped portion as described above is preferable.

In this case, in the meander-shaped portion, it is preferable to increase the number of folds of the folded portion that bends and meanders at a plurality of points within a predetermined flat area to make the fold lines dense, and a small flat area is sufficient with the external conductor. In order to secure a large contact point, it is preferable that the number of folded lines of the folded portion included per unit length (the number of folded lines per unit length) is 2 lines / mm or more. In the embodiment shown in FIG. 1, the meander-shaped portion is a folded portion formed by a folded line in which a bent portion having a relatively short length and a straight portion having a relatively long length are repeated, and the folded portion is folded. There are a plurality of straight lines that are proportional to the number of times when viewed in the direction parallel to the long side of the support substrate 1, and the number of lines per unit length of this straight line in the direction parallel to the long side is two. It is preferable that the value is / mm or more.
Further, it is preferable that the area ratio represented by the area of the pattern of the meander-shaped portion to the area surrounded by the outer edge of the meander-shaped portion is 15% or more. In FIG. 1, the area surrounded by the outer edge of the meander-shaped portion is a value calculated by multiplying the vertical and horizontal lengths of the outer edge of the meander-shaped portion shown by the broken line in the figure, and the area of the meander-shaped portion. The area of the pattern is a value calculated by multiplying the length and width of the line of the pattern existing in the portion surrounded by the outer edge.

From the same viewpoint, the length of the linear portion constituting the contact pattern portion 32 (that is, the length when the pattern form of the contact pattern portion 32 is solved and the contact pattern portion 32 is linearly stretched) is determined. It is preferably 250 mm or more. The length of the contact pattern portion 32 is measured by measuring the portion of the conductive pattern 3 in which the pattern form of the antenna pattern portion 31 changes as the contact pattern portion 32, and in the embodiment shown in FIG. 1, the support substrate 1 The portion extending inward from the innermost peripheral portion of the antenna pattern portion 31 that orbits the vicinity of the outer edge portion of the antenna pattern portion 31 is regarded as the contact pattern portion 32, and its length is measured.
The contact pattern portion 32 has a non-linear linear shape as a whole, but there may be a portion of the contact pattern portion 32 that becomes a straight line. That is, the contact pattern portion 32 includes at least one or more bent portions and / or curved portions.

The conductive pattern 3 can be formed by printing with a conductive ink such as silver paste or by etching a metal foil such as copper foil, but a circular wire having a certain diameter in a cross-sectional view is formed into a predetermined pattern. It is preferable to form the antenna pattern portion 31 and the contact pattern portion 32 as one continuous linear shape in that the contact pattern portion 32 can be easily formed.

When the conductive pattern 3 is composed of wires, the wires are configured to include at least conductive wires, preferably the conductive wires are coated with a self-bonding insulating coating. The conductive wire is, for example, a metal wire such as a copper wire, an iron wire, or a gold wire, but other materials may be used as long as they have conductivity. From the viewpoint of cost, it is preferable to use a copper wire as the conductive wire. The insulating coating that covers the conductive wire is an insulating resin coating, and the conductive wire coated with the insulating coating can be a commercially available enamel wire. Specific examples of the insulating resin coating include polyester, polyethylene, polyurethane, polyvinyl chloride, polyamide, polyimide, polyesterimide, polyamideimide, and fluororesin.

The diameter of the wire forming the conductive pattern 3 is, for example, 0.05 mm to 0.20 mm. The length of the wire depends on the pattern form of the conductive pattern 3, and can be, for example, 200 mm to 1500 mm for the antenna pattern portion 31 and 250 mm to 800 mm for the contact pattern portion 32.

The conductive pattern 3 can be formed on the support substrate 1 by typically routing the wire on the support substrate 1 and drawing a predetermined pattern form, in which at least the wire is supported. It can be fixed by embedding it in the surface of the support substrate 1 at the outer peripheral surface portion on the substrate 1 side.
Embedding the wire in the surface of the support substrate 1 can generally be realized, for example, by constructing at least the surface of the support substrate 1 with a thermoplastic resin and melting the resin surface, in this case ultrasonic fusion. It is desirable to embed the wire in the surface of the support substrate 1 by utilizing the principle of. When performing ultrasonic fusion, a wiring drawing device capable of embedding the wire in the surface of the support substrate 1 while feeding out the wire can be used. With the ultrasonic head provided in such a wiring drawing device, the wire can be embedded in the surface of the support substrate 1 by vibration and pressurization while feeding the wire onto the surface of the support substrate 1.
By embedding the wire in the surface of the support substrate 1, the conductive pattern can be positioned on the support substrate 1, and the misalignment of the wire due to an external impact or the like can be suppressed. Further, by embedding the wire in the surface of the support substrate 1, the degree of surface unevenness due to the arrangement of the wire on the surface of the support substrate 1 can be reduced. Since the wire can be easily embedded in the support substrate 1, it is preferable that at least the main portion of the surface of the support substrate 1 (the portion where the wire is arranged) is made of a thermoplastic resin.

FIG. 2 is a plan view schematically showing a non-contact communication medium according to an embodiment of the present invention, FIG. 3 (a) is a cross-sectional view taken along the line AA of FIG. 2, and FIG. 3 (b). ) Is a cross-sectional view taken along the line BB of FIG. In FIGS. Indicates a medium, for example, an IC card. Note that FIG. 1 shows a plan view in a state where the surface exterior body 51 is removed.

As shown in FIGS. 3A and 3B, the non-contact communication medium as the IC card is electrically connected to at least the circuit device 2 and the circuit device 2 on the surface side of the support substrate 1. The property pattern 3 is provided, and the conductive pattern 3 is continuously provided from the antenna pattern portion 31 that functions as an antenna and the antenna pattern portion 31, and forms a non-linear linear contact pattern portion 32 as a whole. It has a laminated structure in which such a support substrate 1 is sandwiched between a back surface exterior body 52 and a front surface exterior body 51. The circuit device 2 is arranged in a space 11 provided inside the support substrate 1, and is electrically connected to the antenna pattern portion 31 of the conductive pattern 3. The front surface exterior body 51 is laminated on the front surface of the support substrate 1 provided with the conductive pattern 3, and the back surface exterior body 52 is laminated on the back surface which is the back side of the front surface. The back surface exterior body 52 and the front surface exterior body 51 may be printed if necessary.

The exterior bodies 51 and 52 can be bonded to each other by subjecting the front surface and the back surface of the support substrate 1 to heat treatment and / or press treatment. The resin materials constituting the exterior bodies 51 and 52 include, for example, PETG (non-crystalline PET copolymer), PVC (polyvinyl chloride), PC (polycarbonate), PET (polyethylene terephthalate), foamed PET, and PEN (polyethylene naphthalate). , ABS (acrylonitrile, butadiene, styrene copolymer synthetic resin) and the like can be used as a thermoplastic resin. Although not shown, the outer surfaces of the exterior bodies 51 and 52 may be further covered with a laminate film.

As can be seen from FIGS. 2 and 3, in this embodiment, the entire back surface of the support substrate 1 is covered with the back surface exterior body 52, and the front surface of the support substrate 1 is in contact with the support substrate 1. Except for the portion corresponding to the pattern portion 32, almost the entire surface thereof is covered with the surface exterior body 51. The surface exterior body 51 has a through hole 4 in a portion of the surface of the support substrate 1 where the contact pattern portion 32 exists, and the through hole 4 allows at least a part of the contact pattern portion 32, in this case, the contact pattern portion 32. Almost the whole is exposed to the outside. As a result, the external conductor can come into contact with the contact pattern portion 32 while covering and protecting the circuit device 2 and the antenna pattern portion 31 on the surface of the support substrate 1 with the surface exterior body 51.

FIG. 4 is a cross-sectional view schematically showing a non-contact communication medium according to another embodiment of the present invention. The other embodiment shown in FIG. 4 is different from the above-described embodiment in that the contact pattern portion 32 exposed to the outside from the through hole 4 of the surface exterior body 51 is covered with the insulating layer 6. do. Other configurations are substantially the same.

The coating layer 6 protects the contact pattern portion 32 exposed to the outside through the through hole 4 of the surface exterior body 51. If the conductive pattern 3 is a conductive wire coated with a self-bonding insulating layer, the coating layer 6 is not always necessary, but the coating layer 6 is supported by the conductive wire due to rubbing against an external electrode or the like. It is possible to prevent the wire from peeling off from the wire or breaking due to an impact. The coating layer 6 is an insulating resin layer, and specifically, a polyvinyl chloride resin, a polyvinyl acetate resin, a polyacrylic or polymethacrylic resin, a polyvinyl alcohol resin, an ethylene copolymer, and the like. Polyvinyl acetal resin, rubber resin, polyester resin, polyamide resin, polyimide resin, polyamideimide resin, polyolefin resin, phenol resin, amino-plast resin, epoxy resin, polyurethane resin, polyester urethane resin, Examples thereof include a composition containing one or more of a monomer, a prepolymer or an oligomer or a polymer constituting a silicone-based resin, a cellulose-based resin, or the like as a main component. The thickness of the coating layer 6 is, for example, 1 μm to 100 μm, preferably 1 μm to 50 μm. Further, the coating layer 6 may be colored so as to hide the contact pattern portion 32, and may be designed by printing. It is desirable that the coating layer 6 has a design and a shape so that the user can recognize the existence of the contact pattern portion 32 and can surely make contact without making a mistake, but the contact pattern portion 32 is visible from the outside. It doesn't need to be.

In the non-contact communication medium shown in FIG. 4, the resonance frequency of the antenna pattern portion 31 changes due to the external conductor indirectly contacting the contact pattern portion 32 via the coating layer 6, and / or the external device. The communicable distance with is changed. As a result, the external device can be communicated via the antenna pattern unit 31. That is, only when a non-contact communication medium in which the external conductor indirectly contacts the contact pattern portion 32 is used, the conditions of the resonance frequency and / or the communicable distance are satisfied and communication is possible, while the external conductor is on the other hand. When does not come into contact with the contact pattern portion 32, the conditions of the resonance frequency and / or the communicable distance are not satisfied, and information cannot be transmitted / received.

In the present invention, the external conductor is preferably, for example, a part of the human body, more specifically a human finger (thumb, index finger, middle finger, etc.). In this case, when the user touches the contact pattern portion 32 by holding the non-contact communication medium with the finger, the resonance frequency and / or the communicable distance changes, and the signal with the reader / writer is changed. It is possible to set a communicable state in which transmission and reception are possible, and to immediately set the communicable state when the finger is released from the contact pattern unit 32 after use. As a result, easy and reliable prevention of unauthorized access can be realized. Therefore, in this case, the contact pattern portion 32 is provided at a position where a finger such as the thumb can easily touch when the user holds the non-contact communication medium, and the finger sets the resonance frequency and / or the communicable distance. It is preferable that the shape or shape is such that the contact is sufficient so that it can be effectively changed.

An example of the method for manufacturing the non-contact communication medium described above will be described.
First, the circuit device 2 is arranged in the space 11 of the support board 1 provided with the through-hole-shaped or recessed space 11 for arranging the circuit device 2, and the antenna pattern portion is placed on the surface of the support board 1. The conductive pattern 3 having the 31 and the contact pattern portion 32 is wired. Here, preferably, the wires are arranged in a predetermined shape in a manner of being embedded in the surface of the support substrate 1 by utilizing the principle of ultrasonic fusion. In this case, the surface of the support substrate 1 is melted by ultrasonic fusion, and the wire is embedded in the surface of the support substrate 1. In ultrasonic fusion, it is preferable to use a wiring drawing device capable of embedding the wire in the surface of the support substrate 1 while feeding out the wire.

Next, the wire end of the conductive pattern 3 and the circuit device 2 are electrically connected in the space 11. Here, the wire end portion and the connection terminal portion of the circuit device 2 can be short-circuited via solder, which is a typical example of a conductive material.

Then, if necessary, an insulating layer 6 that covers the contact pattern portion 32 is formed. The insulating layer 6 may be formed by a printing method such as screen printing of an insulating resin, but a laminated film made of a thermoplastic resin material may be brought into close contact with the heat press.

After that, the back surface exterior body 52 and the front surface exterior body 51 are laminated on each of the front and back surfaces of the support substrate 1. When the back surface exterior body 52 and the front surface exterior body 51 are made of a thermoplastic resin material, they can be sufficiently adhered to the support substrate 1 by a heating press. A cutting means such as punching with a die or a laser device can be used to form the through hole 4 of the surface exterior body 51 for exposing the contact pattern portion 32. A laser cutter, a milling device, or the like can be used. The timing of providing the through hole 4 may be not only before the surface exterior body 51 is attached to the support substrate 1, but also after the surface exterior body 51 is attached to the support substrate 1, but in this case, by cutting with a milling device or the like. It is preferable to form the through hole 4.

Each of the above steps can be performed on a sheet-like material capable of collectively manufacturing a plurality of non-contact communication media, and after each step, the sheet is cut into an arbitrary shape to form a non-IC card or the like. A plurality of contact communication media can be produced. The specific method for cutting the sheet is arbitrary, but for example, punching with a die, a rotary blade, a cut wire, a laser, or the like can be used.

(Example 1)
Next, the non-contact communication medium of the present invention was prototyped and its performance was confirmed, which will be described below. However, the description here is for the purpose of mere illustration, and is not intended to be limited thereto.

A space for storing the circuit device is provided in a plastic resin sheet (Mitsubishi Resin Diafix PG-WHI-FG thickness 0.15 mm) as a support substrate, and the circuit device (MOA4 manufactured by NXP) is stored there. A conductive pattern as shown in FIG. 1 was formed while embedding a wire (self-bonding film conducting wire AB15 φ0.10 mm manufactured by ELEKTRISOLA) with an ultrasonic head. The wire was embedded in the support substrate using an ultrasonic head. The end of the wire was connected to the connection terminal of the circuit device by soldering.

Regarding the conductive pattern, the length of the antenna pattern portion is 1270 mm, the contact pattern portion has a straight portion of 17 mm, and the folded portion (pitch) of 0.3 mm is changed in the number of folds of the meander-shaped portion, and the length of the contact pattern portion is different. IC cards as a plurality of non-contact communication media were produced.

The plurality of IC cards produced as described above were evaluated by measuring the resonance frequency and the communicable distance when the finger as an external conductor was brought into contact with the contact pattern portion and when the IC card was not brought into contact with the contact pattern portion. The details of the measurement of the resonance frequency and the communicable distance are as follows.

Regarding the resonance frequency, a network analyzer R3753 manufactured by Advantest Co., Ltd. was used, and the IC card was placed on the measurement pedestal so as to be parallel to the antenna surface on the network analyzer side, and the resonance frequency at a measurement distance of 25 mm (finger's). (At the time of contact and at the time of non-contact) were measured.
For the communicable distance, use a reader / writer manufactured by GL Sciences Co., Ltd. to hold each antenna surface in parallel so that the center of the antenna of the IC card is located at the center of the antenna of the reader / writer. The distance between the writer and each antenna of the IC card was changed, and the distance at which reading and writing operations were possible was measured.

The results of the above evaluation are shown in Table 1. In Table 1, the numerical value in the item of "contact portion" means the length of the contact pattern portion in each IC card. Further, FIG. 5 shows the evaluation results as a graph showing changes in the resonance frequency and the communicable distance with respect to the length of the contact pattern portion.

From the points shown in Table 1 and FIG. 5, the one provided with the contact pattern portion is compared with the one without the contact pattern portion (that is, the one having the length of the contact pattern portion of 0 mm) at the time of finger contact. It can be seen that at least the resonance frequency changes with and without contact. In particular, when the length of the contact pattern portion is 250 mm or more, it is found that there is a large change of about 1 MHz in resonance frequency and about 5 mm in communication distance between non-contact and contact. ..

(Example 2)
An IC card as a non-contact communication medium was produced in the same manner as in Example 1. In the second embodiment, regarding the conductive pattern, the length of the antenna pattern portion is 1270 mm, and the contact pattern portion changes the number of folds (pitch) of the meander-shaped portion within a ^{flat area of 204 mm 2 (17 × 12 mm) to change the meander-shaped portion.} A plurality of IC cards having different linear densities and area ratios of the above patterns were produced.

The plurality of IC cards produced as described above were evaluated by measuring the resonance frequency and the communicable distance when the finger as an external conductor was brought into contact with the contact pattern portion and when the IC card was not brought into contact with the contact pattern portion.
The results of the above evaluation are shown in Table 2. Further, FIG. 6 shows a graph showing changes in the resonance frequency and communicable distance with respect to the linear density of the meander-shaped portion, and FIG. 7 shows changes in the resonance frequency and communicable distance with respect to the area ratio of the meander-shaped portion. Each is shown as a graph.

From the points shown in Table 2, FIG. 6 and FIG. 7, by increasing the linear density and the area ratio of the meander-shaped portion, the change in the resonance frequency and the communication distance between the time of finger contact and the time of non-contact can be increased. I understand. In particular, when the linear density of the pattern of the meander-shaped part is 2 lines / mm or more and the area ratio is 15% or more, the change in resonance frequency is 6% or more and the change in communicable distance between non-contact and contact. It was found that there was a big change of 10% or more.

From the above, it is suggested that according to the present invention, there is a possibility that the state of communication with an external device can be effectively controlled by providing the contact pattern portion.

1 Support board 11 Vacancy 2 Circuit device 3 Conductive pattern 31 Antenna pattern part 32 Contact pattern part 4 Through hole 51 Front surface exterior body 52 Back surface exterior body 6 Coating layer (insulation layer)

Claims (8)

A non-contact communication medium in which at least one or more circuit devices and a conductive pattern electrically connected to the circuit devices are provided on a support substrate.
The conductive pattern forms a non-linear linear shape as a whole connected to the antenna pattern portion with an antenna pattern portion that functions as an antenna, and also with an external device via the antenna pattern portion due to contact with an external conductor. possess a contact pattern portion that enables communication,
A non-contact communication medium in which the contact pattern portion includes a meander-shaped portion that bends and meanders at a plurality of locations, and the length of the contact pattern portion is 250 mm or more with respect to the length of the antenna pattern portion of 1270 mm. The contact pattern portion changes the resonance frequency and / or the communicable distance of the antenna pattern portion by the contact of the external conductor with the contact pattern portion, and the change causes the antenna pattern portion to change. The non-contact communication medium according to claim 1, which enables communication with an external device via the device. The non-contact communication medium according to claim 1 or 2, wherein the contact pattern portion is brought into contact with a human finger as an external conductor. The non-contact communication according to any one of claims 1 to 3, wherein the meander-shaped portion includes two or more folded lines per unit length of folded lines that bend and meander at a plurality of points. Medium. The non-contact communication medium according to any one of claims 1 to 4 , wherein the area ratio represented by the area of the pattern of the meander-shaped portion to the area surrounded by the outer edge of the meander-shaped portion is 15% or more. The non-contact communication medium according to any one of claims 1 to 5 , wherein the conductive wire constituting the conductive pattern is covered with a self-bonding insulating film. An insulating layer covering at least a part of the contact pattern portion of the conductive pattern is further provided on the support substrate, and the contact pattern portion is brought into contact with an external conductor via the insulating layer. The non-contact communication medium according to any one of claims 1 to 6 , which enables communication with an external device. Penetration of the support substrate on the surface side provided with the circuit device and the conductive pattern, covering at least a part of the circuit device and the conductive pattern and exposing at least a part of the contact pattern portion to the outside. The non-contact communication medium according to any one of claims 1 to 7 , further comprising an exterior body having holes.

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