JPH0416438Y2 - - Google Patents

Description

[Detailed explanation of the idea] [Industrial application field]

This invention relates to an electronic device configured to automate the process of sorting the front and back sides of packages.

[Prior art and its problems]

Among electronic devices, for example, a transistor has a collector terminal on one side and a base terminal and an emitter terminal on the other side, and the arrangement positions of the collector terminal and emitter terminal are relative to each other depending on their front and back orientation. It has two different directions. Transistors with such directional properties must be mounted with their directional properties changed depending on the circuit pattern of the circuit board on which they are mounted, so two types of packages can be used to mount transistors with different directional properties. By packaging each transistor and distinguishing the transistor type, it is possible to identify the difference in directionality. Specifically, different markings such as model names are attached to the surface of each package so that the difference in directionality of the transistors can be identified. However, the above-mentioned method of sorting transistor types using markings on the surface of the package as a guide is not suitable for automatic sorting using an identification device during transportation by a transportation device such as a parts feeder, so it is difficult to carry out work. The premise was that the selection was carried out by human visual inspection. For this reason, there has conventionally been a problem that selecting transistors is extremely time-consuming, and providing two types of package types has not been desirable from the standpoint of reducing manufacturing costs. On the other hand, in order to solve this problem, by cutting out a corner on either the front or back side of the package, it is possible to distinguish between the front and back sides of the transistor, making it possible to identify the difference in directionality. Transistors made using this technology are also becoming popular. However, in the case of this transistor, because of the notches formed at the corners, there is a difference in the contact area with the circuit board between the front and back sides, so the circuit board is placed with the notches on the bottom. When mounting, there is a disadvantage that the adhesive strength with the circuit board is lower than when mounting it the other way. The present invention was devised under the above-mentioned circumstances, and uses a detection device to detect the directionality of an electronic device that has directionality while packaging it in one type of package. To provide an electronic device that can be automatically identified and is configured so that it can be mounted on a circuit board without causing inconveniences such as differences in adhesive strength to the circuit board depending on the orientation of the front and back surfaces of the package at the time of mounting. Its purpose is to

[Means to solve the problem]

In order to solve the above problem, the present invention takes the following technical measures. That is, in the electronic device of the present invention, in an electronic device in which the terminal is exposed on the side of the package, at least one side of the package where the terminal is not exposed is shifted from the center position in the vertical direction or the horizontal direction. The invention is characterized in that an identification portion that is detected by transmitting or blocking the optical axis of the optical detection device is provided in the portion where the ends in the above direction or the left and right directions are left. .

[Effect]

The identification part provided on the side of the package cage is located off the center in the vertical or horizontal direction, so the relative position of the identification part will differ depending on the orientation of the front and back sides of the package cage. . For example, from the center position in the vertical direction,
In other words, if the identification part is formed at a position shifted from the center position between the front and back surfaces of the package cage to the back side, when the front surface of the package cage is facing upward (face-up state), the identification part will be located between the front and back surfaces. The identification part is located at a position shifted downward from the center position between the front and back surfaces, and when the back surface of the package is facing upward (inside-out state), the identification section is located at a position shifted upward from the center position between the front and back surfaces. In this case, for example, if the optical detection device is configured to detect the identification part when the identification part is located at a position shifted downward from the center position between the front and back surfaces, the The identification part is detected by the optical detection device when the device is face up, but when the electronic device is upside down with the back side of the package facing upwards.
The identification portion is not detected by the optical detection device because it is located above the center position between the front and back surfaces. That is, depending on the orientation of the front and back surfaces of the package, the identification portion may or may not be detected by the optical detection device. This means that even if the identification part is formed at a position shifted from the center position in the left-right direction, the front side of the package case faces upward and the back side faces upward.
Since the relative positions of the identification parts are different, the same can be said by configuring the detection device to detect the identification part only when the identification part is located at a predetermined position.

【effect】

In this way, in the electronic device of the present invention, identification can be detected by the optical detection device when the front surface (and back surface) of the package faces a predetermined direction, either upward or downward. , the orientation of the front and back surfaces of the package can be automatically identified by detecting the identification part using an optical detection device. In other words, the optical detection device can automatically sort out electronic devices that are face up and electronic devices that are face down. Therefore, by configuring an electronic device with so-called directionality, in which the arrangement position of the terminals is relatively different depending on the orientation of the front and back surfaces of the package, the present invention reduces the operator's burden as in the conventional case. Frees you from the troublesome visual sorting work. Further, according to the present invention, there is no need to prepare two types of packages to distinguish between so-called electronic devices having different orientations, so that costs can be reduced. In addition, the identification portion is not only shifted from the center position in the vertical direction or the horizontal direction on a predetermined side portion of the package cage, but also
The identification portion is provided in a portion that leaves the end portions in the vertical direction or the left and right directions, so that the area of either the front side or the back side of the package is not reduced by the identification portion. Therefore, when the electronic device is mounted on the circuit board, there is no problem in that the bonding strength between the electronic device and the circuit board differs depending on the orientation of the front and back surfaces of the package.

[Description of Embodiment] An embodiment of the present invention will be specifically described below with reference to the drawings. In this example, a case will be shown in which a transistor, which is one type of electronic device with directionality, is configured according to the present invention. In addition, the transistor of this example has a unique structure in its package, and the other configurations are basically the same as those of general transistors, and the fabrication process is basically the same as that of conventional transistors. The manufacturing process for common transistors is followed. That is, by performing a series of processes such as chip bonding, wire bonding, resin mounting, and tie bar cutting on a lead frame (not shown), a base terminal 3 and an emitter terminal 4 are formed on one side as shown in FIG.
A transistor 1 having a collector terminal 5 on the other side is fabricated. Furthermore, in this example, each of the terminals 3, 4, and 5 is routed from the back surface 2b of the package 2 to the surface 2a along the side surface of the package so that they are exposed on the front and back sides of the package 2. is formed. This allows the package 2 to be mounted on a circuit board with either of its front and back surfaces 2a and 2b facing toward the circuit board. Now, as shown in FIG. 1, the transistor 1 of this example has one side surface of the package 2 where the terminals 3, 4, and 5 are not provided.
As an identification part, a grooved part 6 having a cylindrical inner surface shape is formed along the entire length of the package 2 in a direction along the front and back surfaces 2a and 2b (longitudinal direction of the side surface). Further, the formation position of the grooved portion 6 is set at a position shifted toward the back surface from the center position between the front and back surfaces 2a and 2b of the package 2. However, the grooved portion 6 is
This is just a concave groove on the inner surface of the cylinder, and this is the groove on the front side 2a or the back side 2 of the package 2.
This does not even include the case where part of the surface of b is deleted. Therefore, the concave portion 6 is
When the surface 2a of the package 2 faces upward as shown in FIG.
When the back surface 2b of the package 2 is facing upward, it is located at a position shifted upward from the center position between the front and back surfaces 2a and 2b. Transistor 1 of this example configured as above
For example, in the following manner, the orientations of the front and back surfaces 2a and 2b of the package 2 are identified, and the transistor 1 and the transistor 1 in the front-facing state in which the base terminal 3 and the emitter terminal 4 are arranged in relatively different positions are identified. It is possible to automate the selection work of the transistors 1 which are turned over. That is, as shown in FIG. 2, there is a sorting area A in the middle of the transport path R of the parts feeder that transports the transistor 1 with the side where the terminals 3, 4, and 5 are not formed facing the transport direction. Set. In this sorting area A, a pair of optical sensors S1 and S2 consisting of a light-emitting element and a light-receiving element facing each other across the transport path R are provided as detection devices at two locations in the front and back in the transport direction. . The upper and lower positions of the optical sensors S1 and S2 correspond to the state where the transistor 1 is facing upward, that is, the surface 2a of the package 2.
The vertical position of the concave portion 6 is determined to correspond to the vertical position of the concave portion 6 when the concave portion 6 faces upward. Further, the positions of the front optical sensors S1 and S2 in the transport path direction are such that the transistor 1 is transported to a predetermined inspection position in the sorting area A with the grooved portion 6 facing forward in the transport path direction. Sometimes, the optical sensor S on the rear side
The position of transistor 1 and S2 in the transport path direction is
When the grooved line 6 is conveyed to the predetermined inspection position with the grooved line 6 facing toward the rear side in the direction of the conveyance path, the grooved line 6
The position is specified to match the position in the transport path direction. Then, the transistors 1, which are successively transported, are temporarily stopped at a predetermined inspection position in the sorting area A, and the optical sensors S1 and S2 perform detection. At this time, the surface 2 of the package 2
When the transistor 1 with a facing upward is facing up, the vertical positions of the optical sensors S1 and S2 and the grooved portion 6 match, so that the transmitting side optical sensor S1
The light passes through the concave portion 6 and is received by the receiving optical sensor S2. On the other hand, when the transistor 1 is turned upside down with the back surface 2b of the package 2 facing upward, the vertical positions of the optical sensors S1 and S2 and the grooved portion 6 do not match, so the light from the transmitting side optical sensor S1 is The light is blocked by the wall surface of the package 2 and is not received by the receiving optical sensor S2. Then, a control device (not shown) that receives a signal indicating whether or not the light is received from the receiving optical sensor S2 controls the transistor 1 from the receiving optical sensor S2.
If the optical sensor S2 on the receiving side receives light, it goes to one conveyance path R1 branching from the sorting area A, and when the receiving side optical sensor S2 does not receive light, it goes to the other conveyance path R1.
Transport to 2. That is, when the transistor 1 is in the face-up state, it is transferred to the one transport path R1,
When the state is upside down, the other conveyance path R2 is
They are automatically sorted and transported to Moreover, in the case of this example, optical sensors S1 and S2 are provided at two locations, front and rear, in the direction of the conveyance path. Therefore, regardless of whether the transistor 1 is transported with the concave portion 6 facing forward or backward,
The concave portion 6 is detected by one of the optical sensors S1 and S2.
Since the orientation of the front and back surfaces can be sorted by performing predetermined detection of is very high. Furthermore, depending on which side of the front and rear optical sensors S1 and S2 performs the detection, the front and rear orientation of the electronic device 1 in the transport direction can also be identified. Note that the scope of the present invention is not limited to the embodiments described above. For example, as shown in FIG. 3, the identification section is configured by forming a convex strip 7 on the side surface of the package 2, which is detected by blocking the optical axes of the optical sensors S1 and S2. Moreover, as shown in FIG. 4, a grooved portion 8 in the vertical direction is formed on the side surface of the package cage 2 so as to penetrate between the front and back surfaces of the package cage 2, and is offset from the center position in the left-right direction. It is also possible to form and configure it so that it is located at a certain position. Further, the number of identification parts is also an arbitrary design matter. Furthermore, it goes without saying that the present invention can also be applied to electronic devices with other orientations, such as diodes.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a transistor according to an embodiment of the present invention, FIG. 2 is a diagram illustrating the selection process when the transistor according to the embodiment is viewed from the plane, and FIG.
4 and 4 are perspective views of transistors according to other embodiments. DESCRIPTION OF SYMBOLS 1...Electronic device (transistor), 2...Package, 2a...Surface (of the package), 2b...
... Back side (of the package), 3... Terminal (base terminal), 4... Terminal (emitter terminal), 5... Terminal (collector terminal), 6... Identification part (recessed line part), 7...
...Identification part (convex line part), 8...Identification part (concave line part).

Claims (1)

[Claims for Utility Model Registration] In an electronic device in which terminals are exposed on the sides of a package, at least one side of the package where the terminals are not exposed is deviated from the center position in the vertical or horizontal direction. and an identification portion that is detected by transmitting or blocking the optical axis of the optical detection device is provided in the portion where the end portions in the vertical direction or the left and right directions are left. electronic equipment.