CN209949550U - Conductive bonding assembly for circuit board of tablet computer - Google Patents
Conductive bonding assembly for circuit board of tablet computer Download PDFInfo
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- CN209949550U CN209949550U CN201920565220.7U CN201920565220U CN209949550U CN 209949550 U CN209949550 U CN 209949550U CN 201920565220 U CN201920565220 U CN 201920565220U CN 209949550 U CN209949550 U CN 209949550U
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- sided adhesive
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- adhesive tape
- release film
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Abstract
The utility model relates to a panel computer circuit board conductive bonding assembly, which comprises a single-sided adhesive protective bottom film, wherein a first conductive single-sided adhesive tape and a second conductive single-sided adhesive tape which are rectangular are respectively compounded on the adhesive surface of the single-sided adhesive protective bottom film and along two edges of the adhesive surface, and the first conductive single-sided adhesive tape and the second conductive single-sided adhesive tape are arranged in an L shape; two main positioning holes are also formed in the single-sided adhesive protective base film; the adhesive surfaces of the first conductive single-sided adhesive tape and the second conductive single-sided adhesive tape are respectively compounded with a first release film and a second release film, and the first release film and the second release film are respectively provided with a first handle part and a second handle part which protrude out of the edge of the single-sided adhesive protective base film. The utility model discloses the electrically conductive bonding subassembly of panel computer circuit board simple structure, convenient to use through main locating hole, supplementary locating hole dual positioning, makes its location more accurate, makes from the handle portion of type membrane to peel off the convenience from the type membrane, is favorable to circuit board packaging efficiency's improvement.
Description
The technical field is as follows:
the utility model relates to a cross cutting product technical field, concretely relates to bonding subassembly that electronic product used refers in particular to a panel computer circuit board electrically conducts bonding subassembly.
Background art:
the circuit boards in electronic products such as mobile phones and tablet computers are more and more precise and thinner, conductive cloth or non-conductive cloth is needed to be adopted to conduct connection or isolation on electronic elements on a plurality of circuit boards, and the existing conductive or non-conductive bonding assemblies have the defects of inconvenient bonding construction, difficult positioning of bonding positions and the like, so that the circuit board assembling efficiency is lower and the bonding quality is influenced.
The utility model has the following contents:
the utility model aims at overcoming the above-mentioned weak point of prior art, provide a panel computer circuit board electrically conducts bonding subassembly.
The utility model adopts the technical proposal that: a conductive bonding assembly of a panel computer circuit board comprises a single-sided adhesive protective base film, wherein a first conductive single-sided adhesive tape and a second conductive single-sided adhesive tape which are rectangular are respectively compounded on the adhesive surface of the single-sided adhesive protective base film along two edges of the adhesive surface, one corner of the first conductive single-sided adhesive tape and one corner of the second conductive single-sided adhesive tape are respectively superposed with one corner of the single-sided adhesive protective base film, the non-adhesive surfaces of the first conductive single-sided adhesive tape and the second conductive single-sided adhesive tape are compounded with the adhesive surface of the single-sided adhesive protective base film, and the first conductive single-sided adhesive tape and the second conductive single-sided adhesive tape are arranged in an L shape; two main positioning holes are also formed in the single-sided adhesive protective base film; the adhesive surfaces of the first conductive single-sided adhesive tape and the second conductive single-sided adhesive tape are respectively compounded with a first release film and a second release film, the first release film and the second release film respectively and completely cover the first conductive single-sided adhesive tape and the second conductive single-sided adhesive tape, the first release film and the second release film respectively have a first handle part and a second handle part protruding out of the edge of the single-sided adhesive protective base film, and the first handle part and the second handle part are respectively provided with auxiliary positioning holes.
The single-sided adhesive protective basement membrane is formed by compounding two layers of thinner single-sided adhesive protective membranes.
The utility model discloses the electrically conductive bonding subassembly of panel computer circuit board simple structure, convenient to use through main locating hole, supplementary locating hole dual positioning, makes its location more accurate, makes from the handle portion of type membrane to peel off the convenience from the type membrane, is favorable to circuit board packaging efficiency's improvement.
Description of the drawings:
FIG. 1 is a schematic view of the present invention in combination;
fig. 2 is an exploded schematic view of the present invention.
The specific implementation mode is as follows:
as shown in fig. 1 and 2, the present invention relates to a conductive bonding assembly for a flat computer circuit board, which comprises a single-sided adhesive protective bottom film 1, wherein a first conductive single-sided adhesive tape 2 and a second conductive single-sided adhesive tape 3 are respectively compounded on the adhesive surface of the single-sided adhesive protective bottom film 1 and along two edges of the single-sided adhesive protective bottom film, one corner of each of the first conductive single-sided adhesive tape 2 and the second conductive single-sided adhesive tape 3 coincides with one corner of the single-sided adhesive protective bottom film 1, the non-adhesive surfaces of the first conductive single-sided adhesive tape 2 and the second conductive single-sided adhesive tape 3 are compounded with the adhesive surface of the single-sided adhesive protective bottom film 1, and the first conductive single-sided adhesive tape 2 and the second conductive single-sided adhesive tape 3 are arranged in an "L" shape; two main positioning holes 11 are also formed in the single-sided adhesive protective base film 1; the first conductive single-sided tape 2 and the second conductive single-sided tape 3 are respectively compounded with a first release film 4 and a second release film 5 on the adhesive surfaces thereof, the first release film 4 and the second release film 5 respectively and completely cover the first conductive single-sided tape 2 and the second conductive single-sided tape 3, the first release film 4 and the second release film 5 respectively have a first handle part 41 and a second handle part 51 protruding from the edge of the single-sided adhesive protective film 1, and the first handle part 41 and the second handle part 51 are respectively provided with an auxiliary positioning hole 40.
As shown in fig. 2, the single-sided adhesive protective film 1 is formed by combining two thin single-sided adhesive protective films. Because the single-layer single-sided adhesive protective film is thin, the thickness and size requirements can not be met in use, a thicker single-sided adhesive protective film needs to be adopted, and the reason that the thicker protective film is not directly used is due to cost.
When the bonding tool is used, firstly, the conductive assembly is integrally placed into the tool with the non-adhesive surface of the single-sided adhesive protective base film 1 facing downwards, the positioning columns on the tool are used for respectively positioning the conductive assembly with the main positioning hole 11 and the auxiliary positioning hole 40 of the conductive bonding assembly, then the first release film 4 and the second release film 5 are respectively peeled off to expose the conductive adhesive surfaces of the first conductive single-sided adhesive tape 2 and the second conductive single-sided adhesive tape 3, and then the circuit board to be bonded is aligned downwards from the top and bonded with the conductive bonding assembly through the manipulator.
The utility model discloses the electrically conductive bonding subassembly of panel computer circuit board simple structure, convenient to use through main locating hole, supplementary locating hole dual positioning, makes its location more accurate, makes from the handle portion of type membrane to peel off the convenience from the type membrane, is favorable to circuit board packaging efficiency's improvement.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (2)
1. The utility model provides a conductive bonding subassembly of panel computer circuit board which characterized in that: the conductive bonding component comprises a single-sided adhesive protective base film, a first conductive single-sided adhesive tape and a second conductive single-sided adhesive tape which are rectangular are respectively compounded on the adhesive surface of the single-sided adhesive protective base film and along two edges of the adhesive surface, one corner of the first conductive single-sided adhesive tape and one corner of the second conductive single-sided adhesive tape are respectively superposed with one corner of the single-sided adhesive protective base film, the non-adhesive surfaces of the first conductive single-sided adhesive tape and the second conductive single-sided adhesive tape are compounded with the adhesive surface of the single-sided adhesive protective base film, and the first conductive single-sided adhesive tape and the second conductive single-sided adhesive tape are arranged in an L shape; two main positioning holes are also formed in the single-sided adhesive protective base film; the adhesive surfaces of the first conductive single-sided adhesive tape and the second conductive single-sided adhesive tape are respectively compounded with a first release film and a second release film, the first release film and the second release film respectively and completely cover the first conductive single-sided adhesive tape and the second conductive single-sided adhesive tape, the first release film and the second release film respectively have a first handle part and a second handle part protruding out of the edge of the single-sided adhesive protective base film, and the first handle part and the second handle part are respectively provided with auxiliary positioning holes.
2. The conductive adhesive assembly for the flat computer circuit board according to claim 1, wherein: the single-sided adhesive protective basement membrane is formed by compounding two layers of thinner single-sided adhesive protective membranes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920565220.7U CN209949550U (en) | 2019-04-23 | 2019-04-23 | Conductive bonding assembly for circuit board of tablet computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920565220.7U CN209949550U (en) | 2019-04-23 | 2019-04-23 | Conductive bonding assembly for circuit board of tablet computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209949550U true CN209949550U (en) | 2020-01-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920565220.7U Active CN209949550U (en) | 2019-04-23 | 2019-04-23 | Conductive bonding assembly for circuit board of tablet computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209949550U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112992523A (en) * | 2021-04-23 | 2021-06-18 | 昆山联滔电子有限公司 | Coil assembling process |
| CN113583578A (en) * | 2020-04-30 | 2021-11-02 | 昊佰电子科技（上海）有限公司 | Conductive cloth die-cutting piece with handle film and manufacturing method thereof |
-
2019
- 2019-04-23 CN CN201920565220.7U patent/CN209949550U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113583578A (en) * | 2020-04-30 | 2021-11-02 | 昊佰电子科技（上海）有限公司 | Conductive cloth die-cutting piece with handle film and manufacturing method thereof |
| CN112992523A (en) * | 2021-04-23 | 2021-06-18 | 昆山联滔电子有限公司 | Coil assembling process |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | "change of name, title or address" | ||
| CP03 | "change of name, title or address" |
Address after: Room 201, building 1, No.1, RD 1st Road, Songshan Lake Park, Dongguan City, Guangdong Province 523000 Patentee after: Jiebang Precision Technology Co.,Ltd. Address before: 523000 Dalang Town, Dongguan, Guangdong, No. 71, Ju Xiang Road, Patentee before: DONGGUAN JPOND INDUSTRIAL Co.,Ltd. |