CN102438399A - Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof - Google Patents
Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof Download PDFInfo
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- CN102438399A CN102438399A CN2011102931663A CN201110293166A CN102438399A CN 102438399 A CN102438399 A CN 102438399A CN 2011102931663 A CN2011102931663 A CN 2011102931663A CN 201110293166 A CN201110293166 A CN 201110293166A CN 102438399 A CN102438399 A CN 102438399A
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Abstract
The invention discloses a metal PCB (Printed Circuit Board) space-free jointed board and a cutting method thereof. The metal PCB space-free jointed board comprises a metal PCB and a plurality of finished product units which are formed on the metal PCB, the upper surface of the metal PCB is a circuit surface, the lower surface of the metal PCB is a metal base surface, and the connection positions of the finished product units have no spaces. According to the invention, by adopting the method that the metal PCB is cut simultaneously through an upper V-cut cutter and a lower V-cut cutter, the undesirable phenomena that during the board punching and shaping production processes, when the spaces among the units are reduced, the flashing, the board breaking and the like are produced can be avoided, the scrap edges produced in the production process are reduced, the cost of the board is reduced, and the utilization rate of the board is improved.
Description
Technical field
The present invention relates to Metal Substrate pcb board field, relate in particular to a kind of Metal Substrate pcb board continuously apart from jigsaw and cutting method thereof.
Background technology
Metal current base PCB jigsaw in process of production is as shown in Figure 1, need give certain unit interval 110 between the adjacent twenty percent article unit 100, as becoming the buffer area of article unit 100 when molding procedure is divided plate.This unit interval 110 is indispensable when the punching moulding, lacks this unit interval 110 and in punching moulding production process, will produce bad phenomenon such as burr, sheet material crackle.
In Metal Substrate PCB produced, along with constantly riseing of Metal Substrate sheet material price, the proportion that board cost accounts for total cost was more and more big.Unit interval 110 has caused great waste for Metal Substrate PCB manufacturer as the production technology side crops that still can't avoid at present removing.
In view of this, how to improve the sheet material utilance, saving board cost becomes present problem demanding prompt solution.
Summary of the invention
Deficiency in view of above-mentioned prior art the object of the present invention is to provide a kind of Metal Substrate pcb board continuously apart from jigsaw and cutting method thereof, is intended to solve the problem that waste of material is big, cost is high in the present pcb board production process.
Technical scheme of the present invention is following:
A kind of Metal Substrate pcb board is continuously apart from jigsaw, a plurality of one-tenth article units that comprise the Metal Substrate pcb board and take shape in the Metal Substrate pcb board, and said Metal Substrate pcb board upper surface is a circuit surface, and lower surface is the metal basal plane, and wherein, said one-tenth article unit junction is distance continuously.
A kind of Metal Substrate pcb board is continuously apart from the jigsaw cutting method, and wherein, said cutting method is for adopting upper and lower V-cut cutting knife associating cutting mode, and it may further comprise the steps:
The upper surface of V-cut cutting knife cutting metal base pcb board in S01, the use;
S02, use be the lower surface of V-cut cutting knife cutting metal base pcb board down.
Described Metal Substrate pcb board is continuously apart from the jigsaw cutting method, and wherein, said upper and lower V-cut cutting knife angle is 30 degree.
Described Metal Substrate pcb board is continuously apart from the jigsaw cutting method, and wherein, the upper and lower side-play amount of said upper and lower V-cut cutting knife is less than 0.005mm.
Described Metal Substrate pcb board is continuously apart from the jigsaw cutting method, and wherein, said cutting step S02 also comprises afterwards:
S03, use V-cut cutting knife down repeatedly the lower surface of cutting metal base pcb board to cutting into article unit.
Described Metal Substrate pcb board is continuously apart from the jigsaw cutting method, and wherein, depth of cut is 0.1mm-0.2mm among the said cutting step S01.
Described Metal Substrate pcb board is continuously apart from the jigsaw cutting method, wherein, among the said cutting step S03 for the first time depth of cut be 0.3mm, back time depth of cut is deepened 0.3mm than depth of cut last time.
Beneficial effect: the invention provides a kind of Metal Substrate pcb board continuously apart from jigsaw and cutting method thereof, make between the one-tenth article unit on the pcb board and closely arrange, stock utilization improves 20-30%, has reduced material cost.Than common jigsaw punching molding technology thereof, need not out the punching mould apart from board-splicing process by using continuously, practiced thrift die cost.And can not produce as bad phenomenon such as the aluminium bits in the common jigsaw technology, burrs apart from board-splicing process by using continuously.
Description of drawings
Fig. 1 is a Metal Substrate pcb board jigsaw structural representation in the prior art.
Fig. 2 for Metal Substrate pcb board of the present invention continuously apart from the structural representation of jigsaw.
Fig. 3 for Metal Substrate pcb board of the present invention continuously apart from the schematic cross-section of jigsaw.
Fig. 4 is the schematic cross-section on line of cut road surface in the embodiment of the invention.
Fig. 5 is the schematic cross-section of cutting metal basal plane for the first time in the another embodiment of the present invention.
Fig. 6 is the schematic cross-section of cutting metal basal plane for the second time in the another embodiment of the present invention.
Fig. 7 is the schematic cross-section of last cutting metal basal plane in the another embodiment of the present invention.
Embodiment
The present invention provides a kind of Metal Substrate pcb board continuously apart from jigsaw and cutting method thereof, and is clearer, clear and definite for making the object of the invention, technical scheme and effect, below to further explain of the present invention.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Metal Substrate pcb board of the present invention is continuously apart from the embodiment of jigsaw, as shown in Figures 2 and 3, and a plurality of one-tenth article units 100 that comprise the Metal Substrate pcb board and take shape in the Metal Substrate pcb board; Said Metal Substrate pcb board upper surface is a circuit surface 120, and lower surface is a metal basal plane 130, wherein; Said one-tenth article unit 100 junctions are distance continuously, promptly closely arranges between the two adjacent one-tenth article units 100, removes the unit interval 110 between the adjacent one-tenth article unit 100; This structure decrease the technology side crops, the sheet material utilance has improved 20-30%, thereby has reduced the cost of Metal Substrate sheet material; And with respect to common jigsaw punching molding technology thereof, need not out the punching mould apart from the jigsaw moulding process continuously, practiced thrift die cost; Metal Substrate pcb board of the present invention apart from simple in structure, the low processing cost of jigsaw, is applicable to large-scale industrial application continuously.
Metal Substrate pcb board of the present invention passes through the V-cut cutting mode apart from jigsaw continuously; The cut-out of one block of metal base pcb board is divided into the single one-tenth article unit that can directly be used for the paster assembling one by one; Wherein, V-cut claims that also V cuts, and is to use the V-cut cutting knife sheet material to be cut a kind of cutting mode that forms V-notch.The concrete technological process of production of the present invention is: open material → pasting protective film → boring → dry film → etching → erosion inspection → resistance weldering → character → V-cut → on off test → Hi-pot test (power panel) → OSP → FQC → FQA → packing.
Metal Substrate pcb board of the present invention is continuously apart from the jigsaw cutting method; As shown in Figure 3, said cutting method is for adopting upper and lower V-cut cutting knife associating cutting mode, obtains complete one-tenth article unit thereby the associating cuts promptly through upper and lower V-cut cutting knife is broken into the article unit junction; Wherein, The upper surface that last V-cut cutting knife is used for cutting metal base pcb board is a circuit surface, and circuit surface promptly forms a v-notch 140, and the lower surface that following V-cut cutting knife is used for cutting metal base pcb board is the metal basal plane; The metal basal plane promptly forms a v-notch 150; Adopt above-mentioned upper and lower V-cut cutting knife associating cutting mode can not produce the problem that when lacking the finished product unit interval, occurs in the similar common jigsaw punching moulding production process,, thereby improved the quality that becomes article unit like bad phenomenon such as burr, sheet material crackles.
From the consideration of user to Metal Substrate pcb board V-cut angle Selection and sheet material utilance aspect; Upper and lower V-cut cutting knife angle in the embodiment of the invention is preferably 30 degree; V-cut cutting knife angle is more little, and the cutting output of using the V-cut cutting knife to produce is just more little, therefore; Under the thick situation of same metal base pcb board, to obtain identical surplus thick V-cut; Use 30 degree V-cut cutting knife cutting outputs much littler, therefore, select the upper and lower V-cut cutting knife of 30 degree can better control the PCS size apart from jigsaw continuously than 60 degree V-cut cuttves.
The Metal Substrate pcb board has residual limit after using the V-cut cutting knife to fracture; Residual limit generally is controlled at ± 0.2mm about, some precision are higher is controlled at ± 0.15mm about, if residual limit is too big; Become article unit to have problem when mounted; And use upper and lower V-cut cutting knife to unite cutting the time to have the off normal problem of upper and lower cutter, so require residual limit generally be controlled at ± 0.1mm in, be better to guarantee the required precision of PCS overall dimension; The upper and lower V-cut cutter of embodiments of the invention side-play amount is less than 0.005mm, thereby reaches the high-precision requirement of residual limit less than 0.1mm.
Metal Substrate pcb board of the present invention is continuously apart from an embodiment of jigsaw cutting method; As shown in Figure 3, adopt upper and lower V-cut cutting knife associating cutting mode, comprise that promptly the upper surface that uses last V-cut cutting knife only to cut a Metal Substrate pcb board is a circuit surface 120; Obtain a v-notch 140 in circuit surface 120 incision; As shown in Figure 4, because of circuit surface 120 is generally thinner, depth of cut is preferably 0.1-0.2mm; Be as the criterion to be slightly larger than the circuit surface degree of depth, reach the purpose of disposable cut-out Metal Substrate pcb board circuit surface; Using following V-cut cutting knife can select disposable cut-out Metal Substrate pcb board lower surface is metal basal plane 130; Obtain a v-notch 150 in metal basal plane incision, promptly depth of cut is darker, and the degree of depth that select the degree of depth of following V-cut cutting knife to be slightly larger than Metal Substrate pcb board lower surface this moment is as the criterion; To reach the purpose of cutting off Metal Substrate pcb board lower surface; When adopting this disposable cut-out Metal Substrate pcb board lower surface, cutting speed is fast, and technical process is simple.
Apart from another preferred embodiment of jigsaw cutting method in, select with the upper surface of above-mentioned embodiment same mode cutting metal base pcb board be circuit surface 120, as shown in Figure 4 continuously by last V-cut cutting knife for above-mentioned Metal Substrate pcb board; It is that the metal basal plane obtains into article unit that following V-cut cutting knife is selected the final lower surface that cuts off the Metal Substrate pcb board of repeatedly cutting; When adopting this mode to cut; Depth of cut is preferably 0.3mm for the first time, and each then depth of cut adds 0.3mm, and depth of cut is as the criterion to reach the lower surface that cuts off the Metal Substrate pcb board when cutting the last time; Depth of cut is slightly larger than the Metal Substrate lower surface degree of depth during promptly last the cutting; Adopt this repeatedly cutting mode to cut off the lower surface of Metal Substrate pcb board, can more accurate cutting metal base pcb board, to reach the purpose of controlling the PCS size better.Metal Substrate pcb board of the present invention is concrete in the embodiment of jigsaw cutting method continuously selects to use V-cut cutting knife down that the lower surface of Metal Substrate pcb board is carried out 3 cuttings; Shown in Fig. 5-7; Depth of cut is 0.3mm for the first time; For the second time on a preceding depth of cut, to add 0.3mm be that depth of cut is 0.6mm to depth of cut, and depth of cut is as the criterion with the lower surface that cuts off the Metal Substrate pcb board for the third time, and promptly depth of cut is slightly larger than the metal lower surface degree of depth.
Bad phenomenon such as the burr that the method for above-mentioned upper and lower V-cut cutting knife associating cutting metal base pcb board has been avoided when lacking unit interval, producing in the production process of punching moulding in the past, sheet material crackle; Not only reduced the production technology side crops; Reduce the cost of sheet material, also improved the utilance of sheet material.
In sum, Metal Substrate pcb board provided by the invention has adopted continuously apart from the jigsaw structure, and each becomes between the article unit distance continuously; This structure makes the sheet material utilance improve 20-30%; And need not out the punching mould, practiced thrift die cost, the cutting method of upper and lower V-cut cutting knife associating cutting metal base pcb board provided by the invention; Bad phenomenon such as the burr of having avoided when lacking unit interval, producing in the production process of punching moulding in the past, sheet material crackle, thus the quality that becomes article unit improved.
Should be understood that application of the present invention is not limited to above-mentioned giving an example, concerning those of ordinary skills, can improve or conversion that all these improvement and conversion all should belong to the protection range of accompanying claims of the present invention according to above-mentioned explanation.
Claims (7)
1. a Metal Substrate pcb board is continuously apart from jigsaw; The a plurality of one-tenth article units that comprise the Metal Substrate pcb board and take shape in the Metal Substrate pcb board, said Metal Substrate pcb board upper surface is a circuit surface, lower surface is the metal basal plane; It is characterized in that said one-tenth article unit junction is distance continuously.
2. a Metal Substrate pcb board is characterized in that continuously apart from the jigsaw cutting method, and said cutting method is for adopting upper and lower V-cut cutting knife associating cutting mode, and it may further comprise the steps:
The upper surface of V-cut cutting knife cutting metal base pcb board in S01, the use;
S02, use be the lower surface of V-cut cutting knife cutting metal base pcb board down.
3. Metal Substrate pcb board according to claim 2 is characterized in that continuously apart from the jigsaw cutting method said upper and lower V-cut cutting knife angle is 30 degree.
4. Metal Substrate pcb board according to claim 2 is characterized in that continuously apart from the jigsaw cutting method the upper and lower side-play amount of said upper and lower V-cut cutting knife is less than 0.005mm.
5. Metal Substrate pcb board according to claim 2 is characterized in that continuously apart from the jigsaw cutting method said cutting step S02 also comprises afterwards:
S03, use V-cut cutting knife down repeatedly the lower surface of cutting metal base pcb board to cutting into article unit.
6. Metal Substrate pcb board according to claim 2 is characterized in that continuously apart from the jigsaw cutting method depth of cut is 0.1mm-0.2mm among the said cutting step S01.
7. Metal Substrate pcb board according to claim 5 is characterized in that continuously apart from the jigsaw cutting method, among the said cutting step S03 for the first time depth of cut be 0.3mm, back time depth of cut is deepened 0.3mm than depth of cut last time.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110293166.3A CN102438399B (en) | 2011-09-30 | 2011-09-30 | Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110293166.3A CN102438399B (en) | 2011-09-30 | 2011-09-30 | Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof |
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| CN102438399A true CN102438399A (en) | 2012-05-02 |
| CN102438399B CN102438399B (en) | 2014-08-06 |
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| CN201110293166.3A Active CN102438399B (en) | 2011-09-30 | 2011-09-30 | Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103009432A (en) * | 2012-12-11 | 2013-04-03 | 四川海英电子科技有限公司 | PCB (printed circuit board) stamping and V-cutting production method |
| CN103687309A (en) * | 2012-09-24 | 2014-03-26 | 广东兴达鸿业电子有限公司 | Production process for high-frequency circuit board |
| CN104625584A (en) * | 2013-11-11 | 2015-05-20 | 江苏苏杭电子有限公司 | Printed circuit board appearance machining method |
| CN104708670A (en) * | 2013-12-27 | 2015-06-17 | 周明 | Dislocation punching technology suitable for back glue product made of electronic materials |
| CN105338746A (en) * | 2015-11-03 | 2016-02-17 | 胜宏科技（惠州）股份有限公司 | Method for forming circuit board without location holes |
| CN105792520A (en) * | 2016-03-25 | 2016-07-20 | 江门崇达电路技术有限公司 | Method for preparing V-shaped slot line in PCB |
| WO2016149902A1 (en) * | 2015-03-24 | 2016-09-29 | 华为技术有限公司 | Pcb board splitting method and related equipment thereof |
| TWI565377B (en) * | 2015-11-06 | 2017-01-01 | You-Long Weng | Surface metal layer cutting processing equipment for circuit boards |
| CN106714456A (en) * | 2016-12-06 | 2017-05-24 | 深圳市深联电路有限公司 | Method of high-precision numerical control V-CUT de-capping on metal copper substrate |
| CN107592740A (en) * | 2017-09-18 | 2018-01-16 | 景旺电子科技(龙川)有限公司 | A kind of preparation method for improving Metal Substrate lamp bar plate utilization rate |
| CN107613646A (en) * | 2017-07-24 | 2018-01-19 | 惠州市星之光科技有限公司 | A kind of wiring board V cut processing methods |
| CN108012419A (en) * | 2017-10-31 | 2018-05-08 | 广德博亚新星电子科技有限公司 | A kind of pcb board zero distance V-CUT processing methods |
| CN108668445A (en) * | 2018-06-29 | 2018-10-16 | 奥士康精密电路（惠州）有限公司 | A kind of PCB production sawing sheet techniques improving availability ratio of the armor plate |
| CN109561592A (en) * | 2018-12-24 | 2019-04-02 | 江苏弘信华印电路科技有限公司 | A kind of zero clearance jigsaw manufacture craft |
| CN110022651A (en) * | 2019-05-21 | 2019-07-16 | 安捷利（番禺）电子实业有限公司 | A kind of processing method and equipment of multiple-plate internal layer golden finger |
| CN110126104A (en) * | 2019-03-25 | 2019-08-16 | 苏州芯海半导体科技有限公司 | A kind of gallium arsenide wafer cutting method |
| CN111432563A (en) * | 2020-05-28 | 2020-07-17 | 遂宁市广天电子有限公司 | Method for reducing dimension tolerance of PCB V-cut board |
| AT522987A3 (en) * | 2019-09-20 | 2021-04-15 | KSG GmbH | Method for producing a metallic insert and an arrangement for a printed circuit board, metallic insert and printed circuit board |
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Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687309A (en) * | 2012-09-24 | 2014-03-26 | 广东兴达鸿业电子有限公司 | Production process for high-frequency circuit board |
| CN103687309B (en) * | 2012-09-24 | 2016-12-21 | 广东兴达鸿业电子有限公司 | A kind of production technology of high-frequency circuit board |
| CN103009432B (en) * | 2012-12-11 | 2015-07-01 | 四川海英电子科技有限公司 | PCB (printed circuit board) stamping and V-cutting production method |
| CN103009432A (en) * | 2012-12-11 | 2013-04-03 | 四川海英电子科技有限公司 | PCB (printed circuit board) stamping and V-cutting production method |
| CN104625584A (en) * | 2013-11-11 | 2015-05-20 | 江苏苏杭电子有限公司 | Printed circuit board appearance machining method |
| CN104708670A (en) * | 2013-12-27 | 2015-06-17 | 周明 | Dislocation punching technology suitable for back glue product made of electronic materials |
| WO2016149902A1 (en) * | 2015-03-24 | 2016-09-29 | 华为技术有限公司 | Pcb board splitting method and related equipment thereof |
| CN105338746B (en) * | 2015-11-03 | 2018-01-12 | 胜宏科技（惠州）股份有限公司 | A kind of circuit panel forming method of no positioning hole |
| CN105338746A (en) * | 2015-11-03 | 2016-02-17 | 胜宏科技（惠州）股份有限公司 | Method for forming circuit board without location holes |
| TWI565377B (en) * | 2015-11-06 | 2017-01-01 | You-Long Weng | Surface metal layer cutting processing equipment for circuit boards |
| CN105792520A (en) * | 2016-03-25 | 2016-07-20 | 江门崇达电路技术有限公司 | Method for preparing V-shaped slot line in PCB |
| CN106714456A (en) * | 2016-12-06 | 2017-05-24 | 深圳市深联电路有限公司 | Method of high-precision numerical control V-CUT de-capping on metal copper substrate |
| CN106714456B (en) * | 2016-12-06 | 2019-04-12 | 深圳市深联电路有限公司 | A kind of method that high-precision numerical control V-CUT takes off lid on metal copper base |
| CN107613646A (en) * | 2017-07-24 | 2018-01-19 | 惠州市星之光科技有限公司 | A kind of wiring board V cut processing methods |
| CN107592740A (en) * | 2017-09-18 | 2018-01-16 | 景旺电子科技(龙川)有限公司 | A kind of preparation method for improving Metal Substrate lamp bar plate utilization rate |
| CN108012419A (en) * | 2017-10-31 | 2018-05-08 | 广德博亚新星电子科技有限公司 | A kind of pcb board zero distance V-CUT processing methods |
| CN108012419B (en) * | 2017-10-31 | 2020-04-03 | 广德博亚新星电子科技有限公司 | Zero-distance V-CUT processing method for PCB |
| CN108668445A (en) * | 2018-06-29 | 2018-10-16 | 奥士康精密电路（惠州）有限公司 | A kind of PCB production sawing sheet techniques improving availability ratio of the armor plate |
| CN109561592A (en) * | 2018-12-24 | 2019-04-02 | 江苏弘信华印电路科技有限公司 | A kind of zero clearance jigsaw manufacture craft |
| CN109561592B (en) * | 2018-12-24 | 2021-04-27 | 江苏弘信华印电路科技有限公司 | Zero-clearance jointed board manufacturing process |
| CN110126104A (en) * | 2019-03-25 | 2019-08-16 | 苏州芯海半导体科技有限公司 | A kind of gallium arsenide wafer cutting method |
| CN110022651A (en) * | 2019-05-21 | 2019-07-16 | 安捷利（番禺）电子实业有限公司 | A kind of processing method and equipment of multiple-plate internal layer golden finger |
| AT522987A3 (en) * | 2019-09-20 | 2021-04-15 | KSG GmbH | Method for producing a metallic insert and an arrangement for a printed circuit board, metallic insert and printed circuit board |
| AT522987B1 (en) * | 2019-09-20 | 2021-12-15 | KSG GmbH | Process for producing a metallic insert and an arrangement for a printed circuit board, metallic insert and printed circuit board |
| CN111432563A (en) * | 2020-05-28 | 2020-07-17 | 遂宁市广天电子有限公司 | Method for reducing dimension tolerance of PCB V-cut board |
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