CN111031682B - Manufacturing method of 5G signal shielding PCB module with latch - Google Patents
Manufacturing method of 5G signal shielding PCB module with latch Download PDFInfo
- Publication number
- CN111031682B CN111031682B CN201911310606.4A CN201911310606A CN111031682B CN 111031682 B CN111031682 B CN 111031682B CN 201911310606 A CN201911310606 A CN 201911310606A CN 111031682 B CN111031682 B CN 111031682B
- Authority
- CN
- China
- Prior art keywords
- latch
- product
- processing
- appearance
- pcb module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Automatic Assembly (AREA)
Abstract
The invention belongs to the technical field of PCB processing, and provides a manufacturing method of a 5G signal shielding PCB module with latch, which comprises the following steps: s1, main flow; s2, forming and processing a sub-process; s3, machining the size of the latch; s4, processing the forming size; and S5, detecting the size and the appearance quality. The invention ensures the shielding effect of 5G signals, controls the size of the latch within +/-0.05 mm, ensures that no gap exists after the latch and the clamping groove are welded in a highly matched manner, and meets the shielding effect of 100% on the signals.
Description
Technical Field
The invention belongs to the technical field of PCB processing, and particularly relates to a manufacturing method of a 5G signal shielding PCB module with latch.
Background
In the 5G network, network base stations are preferentially arranged, core products related to the PCB are the processing of MIMO array antenna products, and the number and the units have independent transceiving capacity. In order to prevent signals from being mutually crossed and warped, a PCB product is required to be manufactured between each unit and connected with a main PCB to isolate the signals, and the PCB material of the type of the product is required to have rigidity and flexibility, the whole board has no positioning holes, the dimensional accuracy of the clamping teeth at the periphery is less than or equal to 0.05mm, and the PCB material has the characteristics of super-length (the length-width ratio is greater than 20: 1), super-thinness (the board thickness is less than 0.5 mm) and the like. The requirement of the index is difficult to realize by the conventional method at present.
In the prior art, external positioning or internal positioning is adopted during forming, the forming precision of a conventional product is controlled to be less than or equal to 0.1mm, and the dimension of the finished product is over-long (the length-width ratio is more than 20: 1) and ultra-thin (the thickness of the plate is less than 0.5 mm), so that the stress in the horizontal direction is small when the plate is subjected to routing, and the plate can bend and deform to cause dimension deviation when a routing knife moves. Because of no internal positioning, the product with the reduced size after forming can only be scrapped, the product with the larger size can not be subjected to milling treatment again, and the cost is high, so that a PCB processing method needs to be developed, the size of the disposable milling plate is ensured to meet the customer requirement, the scrapping is avoided, and the manufacturing cost is reduced.
The main factors influencing the product forming precision are as follows: the hardness of the material, the thickness of the board, the length-width dimension ratio of the finished product, the width of a routing groove and the like, wherein the hardness of the material is mainly determined by the performance of the board, and the length-width dimension ratio, the thickness of the board and the design without internal positioning of the finished product directly influence the processing precision of PCB processing. In order to meet the requirement that the tolerance of a finished product is less than or equal to 0.05mm, the conventional process is difficult to meet at present, and particularly the mass production quality is difficult to guarantee. Therefore, how to stably and efficiently ensure the qualified machining dimension and realize mass production is a technical problem to be solved in the PCB industry.
Disclosure of Invention
In view of the above, the invention provides a method for manufacturing a 5G signal shielding PCB module with a latch, which ensures the 5G signal shielding effect, and controls the size of the latch within ± 0.05mm, thereby ensuring that no gap exists after the latch and the slot are welded in a highly matched manner, and satisfying the shielding effect of 100% on the signal.
The technical scheme of the application is as follows:
a manufacturing method of a 5G signal shielding PCB module with latch comprises the following steps:
s1 main process: in the main process, when AOI inspection is carried out on the circuit after outer layer etching, the inspection of copper particles and pinholes on a copper sheet is added besides conventional inspection, so that no pinholes or holes exist in the product, and the product has a good signal shielding function;
s2, forming and processing sub-flow: when milling grooves in the half-edge holes and milling grooves in a metallization mode, the shape and the precision of the groove positions are ensured according to expansion and contraction processing of drilling files; the special production flow designed in the forming procedure is a necessary condition for ensuring that the final machining precision of the product is qualified due to overlength, ultrathin and no internal positioning;
s3, machining the size of the latch: the diameter of the half-hole at the root part at the two sides of the latch is 0.1-1mm, the product expansion and shrinkage are tested by using a quadratic element, and the drilling belt data are modified according to the expansion and shrinkage data; selecting a drilling machine to call out a drilling strip of the second drill according to the flow of the second drill, and producing by adopting a drill bit with the diameter of 0.1-1 mm;
s4, forming size processing: designing a sectional processing scheme according to the characteristics of the strip-shaped ultrathin product without internal positioning;
and S5, detecting the size and appearance quality.
Further, the main process includes: cutting, inner layer circuit, laminating, drilling, metallization groove milling, copper deposition, outer layer circuit, pattern tin, secondary drilling, half-edge hole groove milling, alkaline etching, AOI inspection, solder resist printing, characters, sand blasting, surface treatment, testing, molding, finished product inspection and packaging.
Further, the forming dimension processing flow comprises: the method comprises the following steps of secondary drilling, processing of a tooth clamping hole, design of a 1 st appearance milling belt, 1 st appearance, first piece detection, batch production, plate washing, film sticking, 2 nd appearance, first piece detection, batch production, film tearing, cleaning of finished products and shipment.
Further, the 1 st appearance is processed aiming at the two side areas of the PCB module.
Further, the 2 nd contour is processed aiming at two end areas and a middle area of the PCB module.
Furthermore, the 1 st appearance is processed the inside groove of PCB module both ends 1/3 position, and the part at middle and both ends that the 2 nd appearance was not gong and is fallen supports at this moment, can ensure that the product does not warp when the 1 st appearance is produced, and the gong sword can accurately rough milling and finish milling, ensures that the size here satisfies the design requirement completely. And so on, when the length-width ratio of the product is less than 30: 1, 4 equal parts of gong and bands can be designed according to the method. And the equal parts of the gong belt are designed according to the length-width ratio of the product.
The design method and the process for designing the gong according to the length-width ratio of the product solve the problem of high-precision forming processing under the conditions of super-long and ultra-thin length and no positioning in the board, ensure that the quality of the processed PCB product of the 5G signal shielding PCB module is qualified, and ensure that no gap meets the necessary condition of 100% shielding effect on the signal after the height of the latch and the clamping groove are matched and welded.
Further, when the aspect ratio of the product is less than 10: and 1, designing a processing scheme for routing the appearance twice.
Furthermore, in the size processing of the latch, the size precision of the latch is ensured to be less than or equal to 0.05 mm.
Furthermore, in the size and appearance quality detection, the requirement that the appearance size is qualified and the latch size is qualified meets the design requirement is met, and the whole plate does not have a pinhole and meets the appearance requirement of a 5G product.
The main innovation points of the invention are as follows:
1. the invention designs the routing of designing the gong according to the length-width ratio of the product according to the technical characteristic that the overlong and ultrathin forming processing of the product is not easy to deform under stress, solves the technical problem of carrying out high-precision forming processing under the conditions of overlong and ultrathin length and no positioning in a plate, is also suitable for processing other similar products, and meets the requirement of batch production.
2. The technical scheme of the invention also designs a pinhole backlight detection and AOI processing scheme, ensures the shielding effect of 5G signals, controls the size of the latch within +/-0.05 mm, ensures that no gap exists after the latch and the clamping groove are welded in a highly matched manner, and meets the shielding effect of 100% on the signals.
The invention has the beneficial effects that:
1. the special inspection, routing and secondary drilling processes of development and design solve the quality problems of no internal positioning long slat forming size precision, routing burr and the like, technically meet the processing requirements of products, improve the production efficiency and meet the requirements of large-scale production of enterprises.
2. The scrap rate is reduced and the cost is reduced: one-time processing is used for avoiding rework scrapping, so that the cost can be reduced, and the delivery cycle can be prolonged to meet the requirement of quick delivery of customers. The product has high added value, and the new technology is adopted to realize autonomous production, so that the production cost can be reduced, and high processing profit is obtained for companies.
3. The development of the manufacturing process of the 5G signal shielding PCB module saves the processing cost of time, labor and the like for enterprises, and the quality is qualified. On the premise that the technology is not limited by people, enterprises must use the high, fine and sharp technology as the latest profit increasing point to obtain more orders of 5G products and higher profit return.
Drawings
FIG. 1 is a process flow diagram of a main process of the present invention;
FIG. 2 is a sub-flow diagram of the forming process of the present invention;
FIG. 3 is a flow chart of the forming dimension process of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Examples
A manufacturing method of a 5G signal shielding PCB module with latch comprises the following steps:
s1 main process: in the main process, when AOI inspection is carried out on the circuit after outer layer etching, the inspection of copper particles and pinholes on a copper sheet is added besides conventional inspection, so that no pinholes or holes exist in the product, and the product has a good signal shielding function;
s2, forming and processing sub-flow: when milling grooves in the half-edge holes and milling grooves in a metallization mode, the shape and the precision of the groove positions are ensured according to expansion and contraction processing of drilling files; the special production flow designed in the forming procedure is a necessary condition for ensuring that the final machining precision of the product is qualified due to overlength, ultrathin and no internal positioning;
s3, machining the size of the latch: the diameter of the half-hole at the root part at the two sides of the latch is 0.1-1mm, the product expansion and shrinkage are tested by using a quadratic element, and the drilling belt data are modified according to the expansion and shrinkage data; selecting a drilling machine to call out a drilling strip of the second drill according to the flow of the second drill, and producing by adopting a drill bit with the diameter of 0.1-1 mm;
s4, forming size processing: designing a sectional processing scheme according to the characteristics of the strip-shaped ultrathin product without internal positioning;
and S5, detecting the size and appearance quality.
Further, the main process includes: cutting, inner layer circuit, laminating, drilling, metallization groove milling, copper deposition, outer layer circuit, pattern tin, secondary drilling, half-edge hole groove milling, alkaline etching, AOI inspection, solder resist printing, characters, sand blasting, surface treatment, testing, molding, finished product inspection and packaging.
Further, the forming dimension processing flow comprises: the method comprises the following steps of secondary drilling, processing of a tooth clamping hole, design of a 1 st appearance milling belt, 1 st appearance, first piece detection, batch production, plate washing, film sticking, 2 nd appearance, first piece detection, batch production, film tearing, cleaning of finished products and shipment.
Further, the 1 st appearance is processed aiming at the two side areas of the PCB module.
Further, the 2 nd contour is processed aiming at two end areas and a middle area of the PCB module.
Furthermore, the 1 st appearance is processed the inside groove of PCB module both ends 1/3 position, and the part at middle and both ends that the 2 nd appearance was not gong and is fallen supports at this moment, can ensure that the product does not warp when the 1 st appearance is produced, and the gong sword can accurately rough milling and finish milling, ensures that the size here satisfies the design requirement completely. And so on, when the length-width ratio of the product is less than 30: 1, 4 equal parts of gong and bands can be designed according to the method. And the equal parts of the gong belt are designed according to the length-width ratio of the product.
The design method and the process for designing the gong according to the length-width ratio of the product solve the problem of high-precision forming processing under the conditions of super-long and ultra-thin length and no positioning in the board, ensure that the quality of the processed PCB product of the 5G signal shielding PCB module is qualified, and ensure that no gap meets the necessary condition of 100% shielding effect on the signal after the height of the latch and the clamping groove are matched and welded.
Further, when the aspect ratio of the product is less than 10: and 1, designing a processing scheme for routing the appearance twice.
Furthermore, in the size processing of the latch, the size precision of the latch is ensured to be less than or equal to 0.05 mm.
Furthermore, in the size and appearance quality detection, the requirement that the appearance size is qualified and the latch size is qualified meets the design requirement is met, and the whole plate does not have a pinhole and meets the appearance requirement of a 5G product.
The invention also provides a specific embodiment of the following table processing parameter setting.
The invention develops and designs a technical scheme for rapidly and automatically processing the overlong, ultrathin and no-inner-positioning 5G signal shielding PCB by taking the numerical control forming machine as a tool, and improves the production efficiency to meet the requirement of large-scale production of enterprises. By designing a secondary routing process, the quality problems of no inner positioning long slat forming size precision, routing board burr and the like are solved in film pasting production, the size precision of the appearance and the latch is less than or equal to 0.05mm, and the requirements of installation and welding of the clamping groove are met.
The invention can ensure that the cost is reduced by avoiding rework and scrap in one-time processing, the added value of the products is high, the production cost can be reduced by adopting the new technology to realize autonomous production, and high processing profit is obtained for companies. The novel process reduces the production difficulty of products from the technical aspect, has strong operability, can meet the requirements of mass production and safe production of printed board manufacturers, and can become a profit increasing point for enterprises to produce lean products and improve efficiency.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (5)
1. A manufacturing method of a 5G signal shielding PCB module with latch is characterized by comprising the following steps:
s1 main process: in the main process, when AOI inspection is carried out on the circuit after outer layer etching, the inspection of copper particles and pinholes on the copper skin is added besides conventional inspection, so that the product is ensured to have no pinholes or cavities; the product has good signal shielding function;
s2, forming and processing sub-flow: when milling grooves in the half-edge holes and milling grooves in a metallization mode, the shape and the precision of the groove positions are ensured according to expansion and contraction processing of drilling files; the molding process is designed with a proprietary production flow that ensures "aspect ratio less than 30: 1 to aspect ratio less than 10: 1', the plate thickness is less than 0.5mm, and the requirement that the final machining precision of an internal positioning product is qualified is avoided;
s3, machining the size of the latch: the diameter of the half-hole at the root part at the two sides of the latch is 0.1-1mm, the product expansion and shrinkage are tested by using a quadratic element, and the drilling belt data are modified according to the expansion and shrinkage data; selecting a drilling machine to call out a drilling strip of the second drill according to the flow of the second drill, and producing by adopting a drill bit with the diameter of 0.1-1 mm;
s4, forming size processing: designing a sectional processing scheme according to the characteristic that no inner positioning product exists when the thickness of the strip is less than 0.5 mm; the method comprises the following steps: drilling a clamping tooth hole, designing a shape milling belt for the 1 st time, detecting the shape for the 1 st time, carrying out first piece detection for the 1 st time, carrying out batch production for the 1 st time, washing a plate, pasting a film, carrying out the 2 nd time of shape, carrying out first piece detection for the 2 nd time of shape, carrying out batch production for the 2 nd time of shape, tearing the film, cleaning a finished product, and discharging; the 1 st appearance is processed aiming at the two side areas of the PCB module, the 2 nd appearance is processed aiming at the two end areas and the middle area of the PCB module, and the 1 st appearance is used for processing inner grooves at 1/3 positions at the two ends of the PCB module, so that the middle and the two ends of the PCB module are supported by components which are not milled off from the 2 nd appearance;
and S5, detecting the size and appearance quality.
2. The method of fabricating a 5G signal shielded PCB module with latch according to claim 1, wherein the main process includes: cutting, inner layer circuit, laminating, drilling, metallization groove milling, copper deposition, outer layer circuit, pattern tin, secondary drilling, half-edge hole groove milling, alkaline etching, AOI inspection, solder resist printing, characters, sand blasting, surface treatment, testing, molding, finished product inspection and packaging.
3. The method of manufacturing a 5G signal shielded PCB module with latch according to claim 1, wherein when the product aspect ratio is less than 10: and 1, designing a processing scheme for routing the appearance twice.
4. The method for manufacturing a 5G signal shielding PCB module with latch according to claim 1, wherein in the latch dimension processing, the latch dimension precision is ensured to be less than or equal to 0.05 mm.
5. The manufacturing method of the 5G signal shielding PCB module with the latch according to claim 1, wherein in the dimension and appearance quality detection, the requirement that the outline dimension is qualified and the latch dimension is qualified meets the design requirement is met, and the whole board does not have a pinhole to meet the appearance requirement of a 5G product.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911310606.4A CN111031682B (en) | 2019-12-18 | 2019-12-18 | Manufacturing method of 5G signal shielding PCB module with latch |
| PCT/CN2020/107000 WO2021120640A1 (en) | 2019-12-18 | 2020-08-05 | Method of manufacturing 5g signal shielding pcb module having engagement teeth |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911310606.4A CN111031682B (en) | 2019-12-18 | 2019-12-18 | Manufacturing method of 5G signal shielding PCB module with latch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111031682A CN111031682A (en) | 2020-04-17 |
| CN111031682B true CN111031682B (en) | 2022-05-10 |
Family
ID=70210702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911310606.4A Active CN111031682B (en) | 2019-12-18 | 2019-12-18 | Manufacturing method of 5G signal shielding PCB module with latch |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111031682B (en) |
| WO (1) | WO2021120640A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111031682B (en) * | 2019-12-18 | 2022-05-10 | 惠州市金百泽电路科技有限公司 | Manufacturing method of 5G signal shielding PCB module with latch |
| CN112752405B (en) * | 2020-11-12 | 2023-07-25 | 惠州市金百泽电路科技有限公司 | Processing method of PCB connecting sheet of 5G base station calibration network board |
| CN112654153B (en) * | 2020-11-12 | 2023-07-25 | 惠州市金百泽电路科技有限公司 | Processing method of high-precision optical wave scale PCB of measurement and control equipment |
| CN112533376B (en) * | 2020-11-12 | 2023-01-31 | 惠州市金百泽电路科技有限公司 | High-precision processing method for local area size of PCB |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009224393A (en) * | 2008-03-13 | 2009-10-01 | Mitsubishi Electric Corp | Shield structure |
| CN203193699U (en) * | 2013-04-26 | 2013-09-11 | 东莞华贝电子科技有限公司 | Shield cover, display screen, and mobile terminal |
| CN205847843U (en) * | 2016-06-03 | 2016-12-28 | 上海与德通讯技术有限公司 | Mainboard structure and mobile terminal with radome |
| CN205847873U (en) * | 2016-06-07 | 2017-01-04 | 颍上县田之都农业科技发展有限公司 | A kind of bidirectional electric rotary cultivator |
| CN207321774U (en) * | 2017-09-21 | 2018-05-04 | 上海创功通讯技术有限公司 | Shielding case and the electronic product for including it |
| CN108513458A (en) * | 2018-03-30 | 2018-09-07 | 惠州市金百泽电路科技有限公司 | A kind of super thick 5G antennas PCB module processing methods |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111031682B (en) * | 2019-12-18 | 2022-05-10 | 惠州市金百泽电路科技有限公司 | Manufacturing method of 5G signal shielding PCB module with latch |
-
2019
- 2019-12-18 CN CN201911310606.4A patent/CN111031682B/en active Active
-
2020
- 2020-08-05 WO PCT/CN2020/107000 patent/WO2021120640A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009224393A (en) * | 2008-03-13 | 2009-10-01 | Mitsubishi Electric Corp | Shield structure |
| CN203193699U (en) * | 2013-04-26 | 2013-09-11 | 东莞华贝电子科技有限公司 | Shield cover, display screen, and mobile terminal |
| CN205847843U (en) * | 2016-06-03 | 2016-12-28 | 上海与德通讯技术有限公司 | Mainboard structure and mobile terminal with radome |
| CN205847873U (en) * | 2016-06-07 | 2017-01-04 | 颍上县田之都农业科技发展有限公司 | A kind of bidirectional electric rotary cultivator |
| CN207321774U (en) * | 2017-09-21 | 2018-05-04 | 上海创功通讯技术有限公司 | Shielding case and the electronic product for including it |
| CN108513458A (en) * | 2018-03-30 | 2018-09-07 | 惠州市金百泽电路科技有限公司 | A kind of super thick 5G antennas PCB module processing methods |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111031682A (en) | 2020-04-17 |
| WO2021120640A1 (en) | 2021-06-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111031682B (en) | Manufacturing method of 5G signal shielding PCB module with latch | |
| CN107708305B (en) | Routing process for precisely controlling appearance of substrate | |
| CN101902883A (en) | Method for manufacturing microwave high-frequency ceramic circuit board | |
| CN108907197A (en) | A kind of metal parts grafting Method of printing | |
| CN106211541A (en) | A kind of positioning datum point improving circuit board cutting accuracy and method | |
| CN110785011A (en) | Forming processing method of PCB with ultra-long clamping groove | |
| CN109168265A (en) | A kind of high-frequency microwave plate high density interconnection board manufacturing method | |
| CN106034380A (en) | Manufacturing method of printed circuit board | |
| CN105345987B (en) | A kind of manufacture method of mobile phone center and a kind of mobile phone center | |
| CN108289375A (en) | High-pixel camera module Rigid Flex processing method | |
| CN103874331A (en) | Manufacturing method of teflon high-frequency circuit board | |
| CN110446348A (en) | A kind of half hole forming production technology of metal | |
| CN109905980A (en) | A kind of small copper facing hole side reservation half bore design technology | |
| CN112752405A (en) | Processing method of PCB connecting sheet of 5G base station calibration network board | |
| CN115835505A (en) | Routing process for processing new and old cutters of printed circuit board | |
| CN108834330B (en) | Processing method of PCB D-shaped special-shaped bonding pad | |
| CN112533376B (en) | High-precision processing method for local area size of PCB | |
| CN112654153B (en) | Processing method of high-precision optical wave scale PCB of measurement and control equipment | |
| CN112672511B (en) | Circuit board without positioning hole and forming method thereof | |
| CN114029703A (en) | Complementary shape processing technology of microwave board | |
| CN106998623A (en) | The making excision forming method of printed wiring board lamp plate | |
| CN104427772B (en) | Circuit board molding method | |
| CN115811838B (en) | Forming method and forming die of PCB | |
| CN100505982C (en) | Method for controlling cutting tools of forming / drilling machine for printing circuit board | |
| CN217693831U (en) | Circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |