CN111867261A - Manufacturing process of FPC and FPC to be exposed - Google Patents
Manufacturing process of FPC and FPC to be exposed Download PDFInfo
- Publication number
- CN111867261A CN111867261A CN202010653700.6A CN202010653700A CN111867261A CN 111867261 A CN111867261 A CN 111867261A CN 202010653700 A CN202010653700 A CN 202010653700A CN 111867261 A CN111867261 A CN 111867261A
- Authority
- CN
- China
- Prior art keywords
- fpc
- exposed
- film
- positioning
- films
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention provides a manufacturing process of an FPC (flexible printed circuit) and the FPC to be exposed, wherein the FPC is exposed after being manually attached by a film, and the manufacturing process of the FPC comprises the following steps: processing a first pair of sites for positioning a film on the FPC to be exposed, wherein all the first pair of sites divide the FPC to be exposed into at least two positioning areas, and each positioning area can position one film; manufacturing a corresponding number of films according to the number of positioning areas on the FPC to be exposed, and processing a second pair of points on the films in a one-to-one correspondence manner; and (3) adhering the films to each positioning area of the FPC to be exposed one by one, adjusting the position of the films, covering the black film on the positioning area, which is not adhered by the films, of the FPC to be exposed after each film is adhered, and completing the exposure of the positioning area adhered by the films until the whole FPC to be exposed is completely manufactured to obtain the FPC. The FPC manufacturing process can reduce the sensitivity to product expansion and shrinkage, reduce the proofing period and reduce the alignment deviation.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the field of flexible circuit board manufacturing, in particular to a manufacturing process of an FPC (flexible printed circuit).
[ background of the invention ]
In the FPC (flexible circuit board) manufacturing process, the FPC and the film need to be aligned before exposure, and then the aligned FPC and film are placed into an exposure machine for exposure. In general, the exposure of the sample mainly adopts LDI (for wiring) or DI (for solder resist), which has higher exposure precision but higher equipment cost; and the film is exposed after being manually laminated, although the equipment cost is greatly reduced, the precision mainly depends on the manual laminating precision and can only be used for scenes with relatively low precision requirements.
Referring to fig. 1, when the film is manually exposed, the film and the FPC to be exposed are attached by aligning the alignment point 10 'on the FPC 100' to be exposed with the alignment point on the film. The alignment points on the FPC100 'to be exposed are arranged at four corners of the FPC 100' to be exposed, and the whole board exposure is completed once after the whole board is aligned and corresponds.
Generally, when an FPC sample is manufactured, manufacturing parameters are not systematically optimized, the expansion and contraction fluctuation is large, and the expansion and contraction of a batch of boards are different, and if the same film is used for manually exposing the boards with different expansion and contraction, exposure offset may occur, so that poor circuit or poor solder resistance is caused. In addition, the film is usually manufactured after the harmomegathus of the FPC to be exposed is obtained, namely the harmomegathus of the FPC to be exposed is measured before the manual exposure of the film, and the exposure film is manufactured according to the harmomegathus of the FPC to be exposed, so that the film can be manufactured only after the harmomegathus before the exposure of the FPC to be exposed is obtained, the situation that the product waits for the film is caused, and the proofing period is delayed.
Therefore, it is necessary to provide a process for manufacturing an FPC that reduces the proofing cycle, reduces the alignment deviation, and avoids the poor exposure caused by the irregular expansion and shrinkage of the product.
[ summary of the invention ]
The invention aims to provide a manufacturing process of an FPC, which reduces a proofing period, reduces alignment deviation and avoids poor exposure caused by irregular expansion and shrinkage of a product.
The technical scheme of the invention is as follows:
a manufacturing process of an FPC is characterized in that exposure is carried out after film manual lamination, and the manufacturing process of the FPC comprises the following steps:
processing a first pair of sites for positioning the film on the FPC to be exposed, wherein the FPC to be exposed is divided into at least two positioning areas by all the first pair of sites, and each positioning area can position one film;
manufacturing a corresponding number of films according to the number of the positioning areas on the FPC to be exposed, and processing a second pair of positioning points on the films in positions corresponding to the first pair of positioning points one by one;
and attaching the films to the positioning areas of the FPC to be exposed one by one, adjusting the positions of the films, covering a black film on the positioning area, which is not attached by the films, of the FPC to be exposed when one film is attached, and completing exposure of the positioning area attached by the films until the whole FPC to be exposed is completely manufactured to obtain the FPC.
Further, a first pair of sites is etched on the FPC to be exposed or drilled out.
Further, the first pair of sites is a copper disk or a substrate disk exposed after etching a copper layer.
Further, the first docking point is a drilled through hole.
Further, the radius of the first pair of points is 0.5-3 mm.
Further, the radius of the second docking point is 0.1-0.3 mm larger than the radius of the first docking point.
And further, manufacturing the film according to the pre-expansion and expansion of the FPC to be exposed.
Further, all the first docking points divide the FPC to be exposed into an even number of positioning regions.
A first pair of points is arranged on the FPC to be exposed, and the FPC to be exposed is divided into at least two positioning areas by the first pair of points, so that each positioning area can be positioned by one film.
The invention has the beneficial effects that: this application exposes through the manual laminating back of film, according to the product size, will wait to expose FPC and divide into two or more locating areas, adopts the mode that the first counterpoint is placed to the piecemeal. During manual exposure, alignment and lamination are respectively carried out in each positioning area, the black film covers the rest positioning areas, and exposure of each positioning area is completed in sequence, so that more accurate manual exposure is realized. The alignment attaching mode has great superiority, and under the condition that the film expansion and shrinkage are certain, the influence of the product expansion and shrinkage on the alignment precision is greatly reduced, and the alignment precision and the yield of manual film exposure are obviously improved. Because the sensitivity of the alignment precision to the expansion and shrinkage of the product is reduced, the production of the film can be completed in advance, and the proofing period is reduced; the adoption of positioning region-divided alignment reduces the sensitivity to the expansion and shrinkage of the product compared with the traditional alignment mode, thereby reducing the alignment deviation and reducing the defects of the same batch of products caused by the expansion and shrinkage difference; and the manual partition exposure also avoids poor exposure caused by irregular expansion and shrinkage of products.
[ description of the drawings ]
FIG. 1 is a schematic diagram of a prior art FPC to be exposed;
fig. 2 is a flowchart of a FPC manufacturing process according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an FPC to be exposed in a manufacturing process of the FPC according to an embodiment of the present invention;
fig. 4 is a schematic view of a film in a manufacturing process of an FPC according to an embodiment of the present invention;
fig. 5, 6, 7, and 8 are schematic diagrams illustrating films attached to FPCs to be exposed one by one in a process for manufacturing FPCs according to an embodiment of the present invention.
In the figure:
100', FPC to be exposed; 10', aligning points on the FPC to be exposed; 100. FPC to be exposed; 10. a first pair of sites; 20. a positioning area; 21. a first positioning area; 22. a second positioning region; 23. a third positioning area; 24. a fourth positioning area; 30. film; 301. a second pair of sites.
[ detailed description ] embodiments
The invention is further described with reference to the following figures and embodiments.
Referring to fig. 2-8, a process for manufacturing an FPC by exposing 30 films after manual bonding comprises:
s1, processing a first pair of sites 10 for positioning the film 30 on the FPC100 to be exposed, wherein the FPC100 to be exposed is divided into at least two positioning areas 20 by all the first pair of sites 10, and each positioning area 20 can position one film 30;
S2, manufacturing a corresponding number of films 30 according to the number of the positioning areas 20 on the FPC100 to be exposed, and processing second contraposition points 301 on the films 30 in positions corresponding to the first contraposition points 10 one by one;
and S3, attaching the films 30 to the positioning areas 20 of the FPC100 to be exposed one by one, adjusting the positions of the films 30, attaching a film 30 to each positioning area 20, which is not attached by the film 30, on the FPC100 to be exposed, covering a black film on the positioning area 20, which is not attached by the film 30, of the FPC100 to be exposed, and completing exposure of the positioning area 20 attached by the film 30 until the whole FPC100 to be exposed is completely manufactured to obtain the FPC.
This application exposes through film 30 manual laminating back, according to the product size, will wait to expose FPC100 and divide into two or more locating areas 20, adopts the mode that the first counterpoint 10 is placed to the piecemeal. During manual exposure, alignment and lamination are respectively carried out in each positioning area 20, the black film covers the rest positioning areas 20, and exposure of each positioning area 20 is completed in sequence, so that more accurate manual exposure is realized. The alignment attaching mode has great superiority, and under the condition that the expansion and the contraction of the FPC100 are fixed, the influence of the expansion and the contraction of the product on the alignment precision is greatly reduced, and the alignment precision and the yield of the manual film 30 exposure are obviously improved. Because the sensitivity of the alignment precision to the expansion and shrinkage of the product is reduced, the production of the film 30 can be completed in advance, and the proofing period is reduced; the sub-positioning area 20 is adopted for alignment, and compared with the traditional alignment mode, the sensitivity to expansion and shrinkage of products is reduced, so that the alignment deviation is reduced, and the defects of the same batch of products caused by expansion and shrinkage differences are reduced; and the manual partition exposure also avoids poor exposure caused by irregular expansion and shrinkage of products.
It will be appreciated that the boundaries of adjacent localisation regions 20 may share a first docking site 10.
Preferably, the first docking point 10 is etched on the FPC100 to be exposed or the first docking point 10 is drilled on the FPC100 to be exposed, so that fool-proofing can be achieved.
Preferably, a first pair of sites 10 is etched on the FPC100 to be exposed, where the first pair of sites 10 are copper discs or exposed substrate discs after removing copper foils.
Preferably, a first pair of sites 10 is drilled on the FPC100 to be exposed, and the first pair of sites 10 are drilled through holes.
Preferably, the radius of the through hole is 0.5-3 mm.
Preferably, the radius of the second docking point 301 is 0.1-0.3 mm larger than the radius of the first docking point.
Preferably, the film 30 is manufactured according to the pre-magnification expansion and contraction of the FPC100 to be exposed, that is, the expansion and contraction of the FPC100 to be exposed is calculated according to empirical data to manufacture the film 30. The time waiting for calculation of the harmomegathus of the FPC100 is saved.
Preferably, all the first docking points 10 divide the FPC100 to be exposed into an even number of the positioning regions 20.
Preferably, all of the positioning regions 20 are identical in shape and size. The first docking site 10 may be shared between adjacent positioning regions 20.
Fig. 5, 6, 7 and 8 illustrate an embodiment in which 9 first docking points 10 are processed on the FPC100 to be exposed, and all the first docking points 10 divide the FPC100 to be exposed into four positioning regions 20. Fig. 5, 6, 7, and 8 illustrate the process of attaching films 30 one by one to the FPC100 to be exposed and sequentially completing the exposure of each positioning area 20, in which the film 30 is manually attached in the first positioning area 21 shown in fig. 5 and then exposed (the process of attaching the film 30 and exposing is not illustrated), the film 30 is manually attached in the second positioning area 22 shown in fig. 5 and then exposed, the film 30 is manually attached in the third positioning area 23 shown in fig. 6 and then exposed, and finally, the film 30 is manually attached in the fourth positioning area 24 shown in fig. 7 and then exposed, and the whole FPC100 to be exposed is completely manufactured. The traditional contraposition mode that the first contraposition point 10 is arranged on the periphery has the contraposition precision of +/-0.2 mm, and the contraposition deviation exceeds 0.2mm when the expansion and contraction difference of the FPC100 to be exposed reaches 0.08 percent by calculating the length of a board to be exposed is 250 mm; after block exposure is adopted, the length of the board is calculated to be 250mm, the length of the board of the small positioning area 20 is about 125mm, and the expansion and contraction difference of the FPC100 to be exposed can be kept to be 0.16 percent according to the contraposition deviation of 0.2 mm.
The invention further provides an FPC100 to be exposed, wherein a first pair of sites 10 is arranged on the FPC100 to be exposed, and the FPC100 to be exposed is divided into at least two positioning areas 20 by all the first pair of sites 10, so that each positioning area 20 can be used for positioning a film 30. According to the size of a product, the FPC100 to be exposed is divided into four or more positioning areas 20, the sensitivity of the alignment deviation in each positioning area to the expansion and shrinkage of the product is reduced, and the alignment precision and yield of the manual film 30 exposure are obviously improved. Because the sensitivity of the alignment precision to the expansion and shrinkage of the product is reduced, the production of the film 30 can be completed in advance, and the proofing period is reduced; and the sub-positioning area 20 is adopted for alignment, so that the sensitivity to expansion and shrinkage of products is reduced compared with the traditional alignment mode, the alignment deviation is reduced, and the defects of the same batch of products caused by expansion and shrinkage differences are reduced.
While the foregoing is directed to embodiments of the present invention, it will be understood by those skilled in the art that various changes may be made without departing from the spirit and scope of the invention.
Claims (9)
1. The FPC manufacturing process is characterized by comprising the following steps of:
Processing a first pair of sites for positioning the film on the FPC to be exposed, wherein the FPC to be exposed is divided into at least two positioning areas by all the first pair of sites, and each positioning area can position one film;
manufacturing a corresponding number of films according to the number of the positioning areas on the FPC to be exposed, and processing a second pair of positioning points on the films in positions corresponding to the first pair of positioning points one by one;
and attaching the films to the positioning areas of the FPC to be exposed one by one, adjusting the positions of the films, covering a black film on the positioning area, which is not attached by the films, of the FPC to be exposed when one film is attached, and completing exposure of the positioning area attached by the films until the whole FPC to be exposed is completely manufactured to obtain the FPC.
2. The FPC manufacturing process according to claim 1, wherein: and etching a first pair of sites on the FPC to be exposed or drilling a first pair of sites on the FPC to be exposed.
3. The FPC manufacturing process according to claim 2, wherein: the first contraposition point is a copper disc or a substrate disc exposed after a copper layer is etched.
4. The FPC manufacturing process according to claim 2, wherein: the first docking point is a drilled through hole.
5. The FPC manufacturing process according to claim 2, wherein: the radius of the first pair of points is 0.5-3 mm.
6. The FPC manufacturing process according to claim 2, wherein: the radius of the second contraposition point is 0.1-0.3 mm larger than that of the first contraposition point.
7. The FPC manufacturing process according to claim 1, wherein: and manufacturing the film according to the pre-expansion and expansion of the FPC to be exposed.
8. The FPC manufacturing process according to claim 1, wherein: all the first alignment points divide the FPC to be exposed into even number of positioning areas.
9. A FPC to be exposed is characterized in that: the FPC to be exposed is provided with first alignment points, and the FPC to be exposed is divided into at least two positioning areas by the first alignment points, so that each positioning area can be positioned by one film.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010653700.6A CN111867261A (en) | 2020-07-08 | 2020-07-08 | Manufacturing process of FPC and FPC to be exposed |
| PCT/CN2020/102723 WO2022006982A1 (en) | 2020-07-08 | 2020-07-17 | Manufacturing process for fpc, and fpc to be exposed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010653700.6A CN111867261A (en) | 2020-07-08 | 2020-07-08 | Manufacturing process of FPC and FPC to be exposed |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111867261A true CN111867261A (en) | 2020-10-30 |
Family
ID=73153141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010653700.6A Pending CN111867261A (en) | 2020-07-08 | 2020-07-08 | Manufacturing process of FPC and FPC to be exposed |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111867261A (en) |
| WO (1) | WO2022006982A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113687576A (en) * | 2021-08-24 | 2021-11-23 | 广东华恒智能科技有限公司 | Exposure process and exposure machine |
| CN116419491A (en) * | 2023-04-17 | 2023-07-11 | 柏承(南通)微电子科技有限公司 | Anti-soldering area exposure cost-saving processing method for PCB semi-finished product |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101448366A (en) * | 2007-11-26 | 2009-06-03 | 比亚迪股份有限公司 | Anti-welding processing method of printed circuit board |
| CN102378494A (en) * | 2011-10-31 | 2012-03-14 | 深南电路有限公司 | Resistance welding processing method for circuit board |
| CN104869764A (en) * | 2015-05-15 | 2015-08-26 | 江门崇达电路技术有限公司 | Method for manufacturing large-size precise circuit board |
| CN105307388A (en) * | 2015-10-14 | 2016-02-03 | 苏州福莱盈电子有限公司 | Operation method of FPC (flexible circuit board) line PIN alignment |
| CN105376950A (en) * | 2015-12-14 | 2016-03-02 | 谢兴龙 | Improved manual alignment method for solder-mask exposure of circuit board |
| CN106604554A (en) * | 2016-12-29 | 2017-04-26 | 深圳市鑫达辉软性电路科技有限公司 | Flexible circuit board covering film deviation detection method |
| CN108513461A (en) * | 2018-04-28 | 2018-09-07 | 珠海智锐科技有限公司 | A kind of FPC plates manufacture craft |
| CN108520403A (en) * | 2018-04-12 | 2018-09-11 | 江苏博敏电子有限公司 | A kind of anti-welding preceding harmomegathus management method of printed wiring board |
| CN111031685A (en) * | 2019-12-25 | 2020-04-17 | 深圳市景旺电子股份有限公司 | Manufacturing method of high-frequency antenna PCB |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013143462A (en) * | 2012-01-11 | 2013-07-22 | Sumitomo Heavy Ind Ltd | Thin film forming device and thin film forming method |
| CN103152983B (en) * | 2012-12-21 | 2015-05-20 | 景旺电子科技(龙川)有限公司 | Aluminum substrate film splicing manufacture method |
-
2020
- 2020-07-08 CN CN202010653700.6A patent/CN111867261A/en active Pending
- 2020-07-17 WO PCT/CN2020/102723 patent/WO2022006982A1/en active Application Filing
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101448366A (en) * | 2007-11-26 | 2009-06-03 | 比亚迪股份有限公司 | Anti-welding processing method of printed circuit board |
| CN102378494A (en) * | 2011-10-31 | 2012-03-14 | 深南电路有限公司 | Resistance welding processing method for circuit board |
| CN104869764A (en) * | 2015-05-15 | 2015-08-26 | 江门崇达电路技术有限公司 | Method for manufacturing large-size precise circuit board |
| CN105307388A (en) * | 2015-10-14 | 2016-02-03 | 苏州福莱盈电子有限公司 | Operation method of FPC (flexible circuit board) line PIN alignment |
| CN105376950A (en) * | 2015-12-14 | 2016-03-02 | 谢兴龙 | Improved manual alignment method for solder-mask exposure of circuit board |
| CN106604554A (en) * | 2016-12-29 | 2017-04-26 | 深圳市鑫达辉软性电路科技有限公司 | Flexible circuit board covering film deviation detection method |
| CN108520403A (en) * | 2018-04-12 | 2018-09-11 | 江苏博敏电子有限公司 | A kind of anti-welding preceding harmomegathus management method of printed wiring board |
| CN108513461A (en) * | 2018-04-28 | 2018-09-07 | 珠海智锐科技有限公司 | A kind of FPC plates manufacture craft |
| CN111031685A (en) * | 2019-12-25 | 2020-04-17 | 深圳市景旺电子股份有限公司 | Manufacturing method of high-frequency antenna PCB |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113687576A (en) * | 2021-08-24 | 2021-11-23 | 广东华恒智能科技有限公司 | Exposure process and exposure machine |
| CN116419491A (en) * | 2023-04-17 | 2023-07-11 | 柏承(南通)微电子科技有限公司 | Anti-soldering area exposure cost-saving processing method for PCB semi-finished product |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022006982A1 (en) | 2022-01-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102291949B (en) | Manufacturing method of multi-layer circuit board | |
| CN113891557B (en) | Printed circuit board manufacturing method | |
| CN111867261A (en) | Manufacturing process of FPC and FPC to be exposed | |
| JPH1041634A (en) | Multilayer pattern forming method and electronic component | |
| JPH10163630A (en) | Multi-layer printed circuit board and its manufacturing method | |
| CN114760778A (en) | Partition alignment method based on multilayer PCB and partition alignment device for multilayer PCB | |
| CN107592757B (en) | High-precision interlayer alignment manufacturing method of multilayer circuit board | |
| US5528826A (en) | Method of constructing high yield, fine line, multilayer printed wiring board panel | |
| CN112601387B (en) | Manufacturing method of large-size printed multilayer board | |
| CN116095988A (en) | Manufacturing process of multi-stage HDI printed circuit board and printed circuit board | |
| KR101206289B1 (en) | Method of processing holes for printed circuit board embedded with components | |
| CN111885828A (en) | Method for manufacturing PCB circuit with through holes and blind holes | |
| CN113795082B (en) | Preparation method of 5G ultra-thin rigid-flex printed circuit board | |
| JP3572271B2 (en) | Method for manufacturing multilayer printed wiring board | |
| CN117320330B (en) | Manufacturing method of inner layer of multilayer PCB | |
| CN114945248B (en) | Processing technology of precise circuit board | |
| CN115811838B (en) | Forming method and forming die of PCB | |
| CN111225496B (en) | Manufacturing process of metal semi-clad structure | |
| TWI391069B (en) | Method for manufacturing muti-layer printed circuit board | |
| GB2307352A (en) | Manufacture of multi-layer printed circuit boards | |
| JP3572272B2 (en) | Method for manufacturing multilayer printed wiring board | |
| JP2002198661A (en) | Multilayer printed wiring board | |
| CN117715311A (en) | Manufacturing method of earphone circuit board and earphone circuit board | |
| CN105792524A (en) | Method of preparing outer circuit layer of backplane with warped surface | |
| JP2002016358A (en) | Method of manufacturing multilayer printed wiring board and double side exposing tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201030 |
|
| RJ01 | Rejection of invention patent application after publication |