CN113687576A - Exposure process and exposure machine - Google Patents
Exposure process and exposure machine Download PDFInfo
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- CN113687576A CN113687576A CN202110972435.2A CN202110972435A CN113687576A CN 113687576 A CN113687576 A CN 113687576A CN 202110972435 A CN202110972435 A CN 202110972435A CN 113687576 A CN113687576 A CN 113687576A
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- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000005192 partition Methods 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000638 solvent extraction Methods 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The application discloses an exposure process and an exposure machine. When the size deviation value between the flexible circuit board and the film is larger than the alignment precision tolerance, the flexible circuit board can be subjected to partition exposure, the size deviation value between the area and the corresponding part of the film is reduced in the same proportion by a partition exposure method, the size deviation value between the area and the corresponding part of the film can be smaller than or equal to the alignment precision tolerance, the area can be exposed, then the flexible circuit board which cannot be exposed originally can be exposed through multiple times of exposure, and the production rate of products is improved.
Description
Technical Field
The application relates to the technical field of flexible circuit board production, in particular to an exposure process and an exposure machine.
Background
In the manufacturing process of the flexible circuit board, the flexible circuit board needs to be exposed through an exposure machine and a film. In the correlation technique, can input a counterpoint precision tolerance in the exposure machine, the flexible line way board can lead to the uniformity of product size to have the difference because of production technology when doing the circuit, when the size deviation value between film and the flexible line way board is greater than counterpoint precision tolerance, the exposure machine will be unable to expose, and need make corresponding film again and expose the flexible line way board that can't expose, very influence production efficiency.
Disclosure of Invention
The present application is directed to solving at least one of the problems in the prior art. Therefore, the exposure process is provided, the passing rate of the flexible circuit board can be improved, and the production efficiency of the flexible circuit board is further improved.
The application also provides an exposure machine capable of realizing the exposure process.
An exposure process according to an embodiment of the first aspect of the present application includes the steps of:
inputting a contraposition precision tolerance;
acquiring a first size deviation value between the flexible circuit board and the film;
comparing the first dimension deviation value with the alignment precision tolerance;
if the first size deviation value is not larger than the alignment precision tolerance, exposing the flexible circuit board;
and if the first size deviation value is larger than the alignment precision tolerance, carrying out subarea exposure on the flexible circuit board.
The exposure process according to the embodiment of the application has at least the following beneficial effects: when the size deviation value between the flexible circuit board and the film is larger than the alignment precision tolerance, the flexible circuit board can be subjected to partition exposure, the size deviation value between the area and the corresponding part of the film is reduced in the same proportion by a partition exposure method, the size deviation value between the area and the corresponding part of the film can be smaller than or equal to the alignment precision tolerance, the area can be exposed, then the flexible circuit board which cannot be exposed originally can be exposed through multiple times of exposure, and the production rate of products is improved.
According to some embodiments of the present application, the exposing the flexible circuit board in a partitioned manner includes the following steps:
dividing the flexible circuit board into a plurality of areas with the same size;
acquiring a second size deviation value between any one region and a part corresponding to the film;
if the second size deviation value is less than or equal to the alignment precision tolerance, exposing the areas one by one;
if the second size deviation value is larger than the alignment precision tolerance, the flexible circuit board is divided into a plurality of regions with the same size again, wherein the number of the newly divided regions is larger than that of the original regions until the second size deviation value is smaller than or equal to the alignment precision tolerance.
According to some embodiments of the present application, the obtaining the first dimension deviation value between the flexible printed circuit board and the film sheet includes:
adjusting the relative position of the flexible circuit board and the film in an alignment manner;
acquiring the position deviation between the identification point on the flexible circuit board and the positioning point on the film sheet;
calculating the first size deviation value between the flexible circuit board and the film.
According to some embodiments of the application, the obtaining a second size deviation value between the region and the portion corresponding to the film comprises:
acquiring the position deviation between the identification point of the area and the positioning point of the part corresponding to the film;
and calculating a second size deviation value between the area and the part corresponding to the film.
According to some embodiments of the present application, the identified points required to obtain the second size deviation value at least partially overlap the identified points required to obtain the first size deviation value.
According to some embodiments of the application, said individually exposing said regions further comprises the steps of:
and leaking one unexposed area one by one, shielding other areas, and carrying out counterpoint exposure on the leaked areas until all the areas are exposed.
According to some embodiments of the application, the exposure process further comprises the steps of:
acquiring a third size deviation value between the flexible circuit board and another film;
comparing the third dimension deviation value with the alignment precision tolerance;
and if the third size deviation value is less than or equal to the alignment precision tolerance, exposing the flexible circuit board through another film.
According to some embodiments of the application, the obtaining a third dimension deviation value between the flexible circuit board and another film includes:
inputting the size data of the film and the size data of the other film;
and calculating the third size deviation value according to the size data of the film and the size of the other film.
According to the exposure machine of the embodiment of the second aspect of the present application, the flexible circuit board is exposed by using the exposure process.
According to the exposure machine of the embodiment of the application, at least the following beneficial effects are achieved: including all the benefits of the exposure process described above, are not described in detail here.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The present application is further described with reference to the following figures and examples, in which:
FIG. 1 is a flow chart of an exposure process as embodied in a first aspect of the present application;
FIG. 2 is a flowchart of a sectional exposure of a flexible printed circuit board according to an embodiment of the first aspect of the present application;
fig. 3 is a flowchart of acquiring a first dimension deviation value between a flexible printed circuit board and a film according to an embodiment of the first aspect of the present application;
fig. 4 is a flowchart of acquiring a second dimension deviation value between any one of the regions and a corresponding portion of the film according to the embodiment of the first aspect of the present application;
FIG. 5 is a flow chart of exposing regions one by one in an embodiment of the first aspect of the present application;
FIG. 6 is a partial flow chart of an exposure process of an embodiment of the first aspect of the present application;
fig. 7 is a flowchart of acquiring a third dimension deviation value between the flexible printed circuit board and another film according to the embodiment of the first aspect of the present application;
FIG. 8 is a schematic diagram of a flexible wiring board according to an embodiment of the first aspect of the present application;
fig. 9 is a schematic diagram of a flexible printed circuit board according to an embodiment of the first aspect of the present application when two regions are divided;
fig. 10 is a schematic diagram of a flexible printed circuit board according to an embodiment of the first aspect of the present application when four regions are divided.
Reference numerals:
the flexible printed circuit board comprises a flexible printed circuit board 100, a first identification point 101, a second identification point 102, a third identification point 103, a first area 110 and a second area 120.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the positional descriptions, such as the directions of up, down, front, rear, left, right, etc., referred to herein are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present application.
In the description of the present application, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and the above, below, exceeding, etc. are understood as excluding the present number, and the above, below, within, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present application, unless otherwise expressly limited, terms such as set, mounted, connected and the like should be construed broadly, and those skilled in the art can reasonably determine the specific meaning of the terms in the present application by combining the detailed contents of the technical solutions.
In the description of the present application, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
As shown in fig. 1, an exposure process according to an embodiment of the first aspect of the present application includes the steps of:
and S100, inputting a position alignment precision tolerance.
It will be appreciated that the alignment accuracy tolerance is entered into the exposure machine.
S200, acquiring a first size deviation value between the flexible circuit board 100 and the film.
It can be understood that, in the production process of the flexible printed circuit board 100, the flexible printed circuit board 100 with a certain deviation in size is produced, so that the first deviation value in size is generated between the flexible printed circuit board 100 and the film sheet.
And S300, comparing the first dimension deviation value with the alignment precision tolerance.
S300a, if the first dimension deviation value is less than or equal to the alignment precision tolerance, exposing the flexible circuit board 100.
It can be understood that, when the first dimension deviation value is less than or equal to the alignment precision tolerance, the exposure operation can be directly performed on the flexible circuit board 100.
And S300b, if the first dimension deviation value is larger than the alignment precision tolerance, carrying out partition exposure on the flexible circuit board 100.
When the first dimension deviation value is greater than the alignment precision tolerance, the exposure machine cannot expose the flexible circuit board 100. It can be understood that the flexible circuit board 100 can be exposed in a partitioned manner, and the size deviation value between the region and the corresponding portion of the film is reduced in the same proportion by the partitioned exposure method, so that the size deviation value between the region and the corresponding portion of the film can be smaller than or equal to the alignment precision tolerance, the region can be exposed, and then the flexible circuit board 100 which cannot be exposed originally can be exposed by multiple exposures, so that the production rate of products is improved.
As shown in fig. 2, according to some embodiments of the present application, the zoned exposure of the flexible wiring board 100 includes the steps of:
and S310, dividing the flexible circuit board 100 into a plurality of areas with the same size.
It is understood that the flexible printed circuit board 100 is divided into several regions with the same size, i.e. the flexible printed circuit board 100 is divided into several regions with smaller size.
It can be understood that dividing the flexible printed circuit board 100 into a plurality of areas with the same size enables the first size deviation value to be equally divided into a plurality of equal second size deviation values, so that only the second size deviation value between one area and the corresponding portion of the film needs to be obtained, and the production efficiency is improved.
And S320, acquiring a second size deviation value between any one region and the part corresponding to the film.
It is understood that the size of each region of the flexible wiring board 100 will be smaller than the size of the flexible wiring board 100, the first size deviation value will be dispersed for each region, and the second size deviation value between the region and the corresponding portion of the film will be smaller than the first size deviation value. That is, the original first dimension deviation value is dispersed into a plurality of identical second dimension deviation values by dividing the flexible printed circuit 100 forming region.
And S320a, if the second dimension deviation value is less than or equal to the alignment precision tolerance, exposing the areas one by one.
It can be understood that, when the second dimension deviation value is less than or equal to the alignment precision tolerance, the exposure machine can perform the exposure operation on the flexible circuit board 100. Specifically, one of the regions is exposed one by one, the regions are exposed one by one to an exposure light source of an exposure machine, and the exposed regions are exposed one by one.
And S320b, if the second dimension deviation value is larger than the alignment precision tolerance, re-dividing the flexible circuit board 100 into a plurality of regions with the same dimension, wherein the number of the re-divided regions is larger than that of the original regions until the second dimension deviation value is smaller than or equal to the alignment precision tolerance.
If the second dimension deviation value is still larger than the alignment precision tolerance, the exposure machine cannot expose the region. It can be understood that the flexible printed circuit board 100 needs to be divided into regions again, and the number of the divided regions is larger than that of the original regions, even if the size and area of the divided regions are smaller than those of the original regions, until the deviation value of the second size is smaller than or equal to the alignment precision tolerance, so that the exposure machine can expose the regions.
As shown in fig. 3, according to some embodiments of the present application, the step S200 of obtaining the first dimension deviation value between the flexible circuit board 100 and the film sheet includes the following steps:
s210, aligning and adjusting the relative position of the flexible circuit board 100 and the film.
S220, acquiring the position deviation between the identification point on the flexible circuit board 100 and the positioning point on the film.
And S230, calculating a first size deviation value between the flexible circuit board 100 and the film.
It can be understood that the flexible circuit board 100 is formed with the identification points, the film sheet is formed with the corresponding positioning points, and the exposure machine can obtain the position deviation between the identification points and the positioning points, and calculate the first dimension deviation value between the circuit board and the film sheet.
As shown in fig. 4, according to some embodiments of the present application, the step of acquiring the second size deviation value between the region and the portion corresponding to the film at S320 includes the steps of:
s321, acquiring the position deviation between the identification point of the area and the positioning point of the part corresponding to the film.
And S322, calculating a second size deviation value between the corresponding parts of the area and the film.
It can be understood that, corresponding identification points are formed on each region of the flexible printed circuit board 100, corresponding positioning points are also formed on corresponding portions of the film, and when the second dimensional deviation value is obtained, the exposure machine can obtain the positional deviation between the identification points corresponding to the region and the positioning points corresponding to the portions of the film, so as to calculate the second dimensional deviation between the region and the corresponding portions.
According to some embodiments of the present application, the identified points required to obtain the second size deviation value at least partially overlap the identified points required to obtain the first size deviation value.
It will be appreciated that in order to reduce the number of identification points that need to be formed on the flexible wiring board 100, the identification points required to obtain the second dimensional deviation value at least partially overlap the identification points required to obtain the first dimensional deviation value.
As shown in fig. 5, according to some embodiments of the present application, the exposing the regions one by one S320a further includes the following steps:
s321a, leaking one of the unexposed regions one by one, blocking the other region, and performing alignment exposure on the leaked region until all regions are exposed.
And when the second deviation value is smaller than or equal to the alignment precision tolerance, blocking part of the area, enabling the flexible circuit board 100 to only leak out of one area, and exposing the area. It is understood that one of the unexposed areas is leaked out one by one, and the leaked areas are exposed one by one until all the areas are exposed, that is, until the entire flexible wiring board 100 is exposed.
As shown in fig. 6, according to some embodiments of the present application, the exposure process further includes the steps of:
s400, acquiring a third size deviation value between the flexible circuit board 100 and another film.
And S500, comparing the third dimension deviation value with the alignment precision tolerance.
S600, if the deviation value of the third dimension is less than or equal to the alignment precision tolerance, exposing the flexible circuit board 100 through another film.
It can be understood that, be provided with two piece at least different film sheets of size in the exposure machine, when the first size deviation value between first film sheet and flexible line way board 100 is greater than counterpoint precision tolerance, can acquire the third size deviation value between another film sheet and flexible line way board 100. If the third dimension deviation value is less than or equal to the alignment precision tolerance in the obtained third dimension deviation value, the film sheet corresponding to the third dimension deviation value is switched to one side of the flexible circuit board 100, and the film sheet is used for exposing the flexible circuit board 100. And if the third size deviation value is larger than the alignment precision tolerance, the first film is used for carrying out subarea exposure on the flexible circuit board 100. By adding films with different sizes, the passing rate of the flexible circuit board 100 is improved, and the production efficiency is further improved.
As shown in fig. 7, according to some embodiments of the present application, obtaining a third dimensional deviation value between the flexible wiring board 100 and another film includes:
and S410, inputting size data of the film and size data of another film.
And S420, calculating a third size deviation value through the size data of the film and the size data of another film.
It can be understood that the size data of the first film and the size data of the other film are input, the size difference between the two films can be obtained through the size data of the two films, and after the first size deviation value is obtained, the third size deviation value can be calculated by combining the size difference values.
As shown in fig. 1 to 7, the exposure process according to the embodiment of the first aspect of the present application is described below as a specific example. It is to be understood that the following description is illustrative only and is not intended to be in any way limiting.
And S100, inputting a position alignment precision tolerance.
As shown in fig. 3, a first dimension deviation value between the flexible wiring board 100 and the film is obtained through steps S210 to S230, for example:
s210, aligning and adjusting the relative position of the flexible circuit board 100 and the film.
S220, acquiring the position deviation between the identification point on the flexible circuit board 100 and the positioning point on the film.
And S230, calculating a first size deviation value between the flexible circuit board 100 and the film.
It can be understood that, as shown in fig. 8, the four corner ends of the flexible wiring board 100 are formed with first identification points 101, and positioning points (not shown) are formed on the film sheet at corresponding positions. The position deviation between the first identification point 101 and the corresponding positioning point is obtained by the vision system, and a first size deviation value is obtained.
And S300, comparing the first dimension deviation value with the alignment precision tolerance.
S300a, if the first dimension deviation value is less than or equal to the alignment precision tolerance, exposing the flexible circuit board 100.
It can be understood that, when the first dimension deviation value is less than or equal to the alignment precision tolerance, the exposure operation can be directly performed on the flexible circuit board 100.
If the first dimension deviation value is greater than the alignment accuracy tolerance, the comparison between the exposure conditions of the other film can be performed through steps S400 to S600, for example:
s400, acquiring a third size deviation value between the flexible circuit board 100 and another film.
It is understood that the first recognition point 101 is also formed on the other film sheet as in the film sheet shown in fig. 8, and since the other film sheet is not the same size as the first film sheet, a different size deviation value, i.e., a third size deviation value, can be obtained.
And S500, comparing the third dimension deviation value with the alignment precision tolerance.
S600, if the deviation value of the third dimension is less than or equal to the alignment precision tolerance, exposing the flexible circuit board 100.
In addition, if the third dimension deviation value > the alignment precision tolerance, the flexible circuit board 100 is subjected to divisional exposure through steps 310 to 320, for example:
and S310, dividing the flexible circuit board 100 into a plurality of areas with the same size.
As shown in fig. 9, the flexible wiring board 100 is divided into two first regions 110 having the same size.
And S320, acquiring a second size deviation value between any one region and the part corresponding to the film.
As shown in fig. 9, the second identification point 102 is formed at the corner end of the first region 110, and it can be understood that a positioning point is formed at a corresponding position on the film sheet. The position deviation between the second identification point 102 and the corresponding positioning point is obtained through the vision system, and a second size deviation value is obtained. In addition, the second recognition point 102 partially overlaps the first recognition point 101.
It can be appreciated that by dividing the flexible circuit board 100 into two first areas 110 having the same size, the first dimension deviation value is also divided into two portions of the second dimension deviation value, i.e. the first dimension deviation value is approximately equal to twice the second dimension deviation value.
If the second dimension deviation value is less than or equal to the alignment accuracy tolerance, the regions are exposed one by one in step S321 a.
S321a, leaking one of the unexposed regions one by one, blocking the other region, and performing alignment exposure on the leaked region until all regions are exposed.
It can be understood that, when the second dimension deviation value is less than or equal to the alignment precision tolerance, the exposure machine can perform exposure operation on the region. The original size deviation value is reduced in a partitioning mode, so that the exposure operation can be carried out on the area.
It can be stated that, only one of the regions on the flexible printed circuit 100 is exposed by shielding, and since the sizes of the regions are the same, it is not necessary to compare the second size deviation and the alignment precision tolerance of other regions again, and one of the regions on the flexible printed circuit 100 can be directly exposed one by one, and the regions are exposed one by one until the exposure of the whole flexible printed circuit 100 is completed.
In addition, S320b, if the second dimension deviation value is greater than the alignment precision tolerance, re-dividing the flexible printed circuit board 100 into a plurality of regions with the same dimension, wherein the number of the re-divided regions is greater than the number of the original regions until the second dimension deviation value is less than or equal to the alignment precision tolerance.
If the second dimension deviation value is still larger than the alignment precision tolerance, the exposure machine cannot expose the region. It can be understood that the flexible printed circuit board 100 needs to be divided into regions again, as shown in fig. 10, the flexible printed circuit board 100 is divided into four second regions 120 with the same size, the corner ends of the second regions 120 are formed with the third identification points 103, and it can be understood that the film sheet is formed with positioning points at corresponding positions. The position deviation between the third identified point 103 and the corresponding anchor point is obtained by the vision system and a new set of second dimension deviation values is derived. In addition, the third recognition point 103 partially overlaps the first recognition point 101.
And comparing the new second dimension deviation value with the alignment precision tolerance, and judging whether the exposure condition is met.
If not, the flexible circuit board 100 is divided into areas again until the second dimension deviation value is smaller than or equal to the alignment precision tolerance, so that the exposure machine can expose the areas.
In order to improve the production efficiency, in general, the flexible wiring board 100 is divided into four regions as shown in fig. 10 at most.
According to the exposure machine of the embodiment of the second aspect of the present application, the flexible circuit board is exposed by using the exposure process.
According to the exposure machine of the embodiment of the second aspect of the application, at least the following beneficial effects are achieved: including all the benefits of the exposure process described above, are not described in detail here.
The embodiments of the present application have been described in detail with reference to the drawings, but the present application is not limited to the embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present application. Furthermore, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
Claims (9)
1. The exposure process is characterized by comprising the following steps:
inputting a contraposition precision tolerance;
acquiring a first size deviation value between the flexible circuit board and the film;
comparing the first dimension deviation value with the alignment precision tolerance;
if the first size deviation value is not larger than the alignment precision tolerance, exposing the flexible circuit board;
and if the first size deviation value is larger than the alignment precision tolerance, carrying out subarea exposure on the flexible circuit board.
2. The exposure process according to claim 1,
the method for carrying out subarea exposure on the flexible circuit board comprises the following steps:
dividing the flexible circuit board into a plurality of areas with the same size;
acquiring a second size deviation value between any one region and a part corresponding to the film;
if the second size deviation value is less than or equal to the alignment precision tolerance, exposing the areas one by one;
if the second size deviation value is larger than the alignment precision tolerance, the flexible circuit board is divided into a plurality of regions with the same size again, wherein the number of the newly divided regions is larger than that of the original regions until the second size deviation value is smaller than or equal to the alignment precision tolerance.
3. The exposure process according to claim 1,
the method for acquiring the first size deviation value between the flexible circuit board and the film comprises the following steps:
adjusting the relative position of the flexible circuit board and the film in an alignment manner;
acquiring the position deviation between the identification point on the flexible circuit board and the positioning point on the film sheet;
calculating the first size deviation value between the flexible circuit board and the film.
4. The exposure process according to claim 3,
the step of obtaining a second size deviation value between the area and the part corresponding to the film comprises the following steps:
acquiring the position deviation between the identification point of the area and the positioning point of the part corresponding to the film;
and calculating a second size deviation value between the area and the part corresponding to the film.
5. The exposure process of claim 4, wherein the identified points required to obtain the second dimension offset value at least partially overlap the identified points required to obtain the first dimension offset value.
6. The exposure process according to claim 2,
the exposing the regions one by one further comprises the steps of:
and leaking one unexposed area one by one, shielding other areas, and carrying out counterpoint exposure on the leaked areas until all the areas are exposed.
7. The exposure process according to claim 1, further comprising the steps of:
acquiring a third size deviation value between the flexible circuit board and another film;
comparing the third dimension deviation value with the alignment precision tolerance;
and if the third size deviation value is less than or equal to the alignment precision tolerance, exposing the flexible circuit board through another film.
8. The exposure process according to claim 7,
the obtaining of a third size deviation value between the flexible circuit board and another film includes:
inputting the size data of the film and the size data of the other film;
and calculating the third size deviation value according to the size data of the film and the size of the other film.
9. The exposure machine, its characterized in that: exposing the flexible wiring board by the exposure process according to any one of claims 1 to 8.
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| CN202110972435.2A CN113687576A (en) | 2021-08-24 | 2021-08-24 | Exposure process and exposure machine |
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| CN202110972435.2A CN113687576A (en) | 2021-08-24 | 2021-08-24 | Exposure process and exposure machine |
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| CN212463661U (en) * | 2020-07-29 | 2021-02-02 | 广东依顿电子科技股份有限公司 | Step-by-step exposure structure for large-size circuit board solder-resisting area |
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