CN212463661U - Step-by-step exposure structure for large-size circuit board solder-resisting area - Google Patents
Step-by-step exposure structure for large-size circuit board solder-resisting area Download PDFInfo
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- CN212463661U CN212463661U CN202021536856.8U CN202021536856U CN212463661U CN 212463661 U CN212463661 U CN 212463661U CN 202021536856 U CN202021536856 U CN 202021536856U CN 212463661 U CN212463661 U CN 212463661U
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Abstract
The invention discloses a step-by-step exposure structure of a large-size circuit board solder mask area, which comprises a solder mask exposure film, wherein the solder mask exposure film is provided with exposure units with the area larger than or equal to the area of a graphic circuit unit on a circuit board, the exposure units are provided with exposure patterns matched with a solder mask layer pattern to be exposed on the graphic circuit unit, and at least two exposure contraposition targets are arranged around the periphery of the exposure units. The exposure structure divides the solder mask on the graphic circuit unit of the large-size circuit board into a plurality of small areas for step-by-step exposure through the exposure unit corresponding to the graphic circuit unit on the solder mask exposure film, so that the elongation of the circuit board in the small area is obviously reduced relative to the elongation of the whole circuit board, the exposure machine exposes the solder mask on the graphic circuit unit to be exposed through the exposure structure, and the problem that the solder mask quality is poor or even exposure is refused due to the fact that the whole large-size circuit board cannot be automatically aligned during exposure of the exposure machine is avoided.
Description
[ technical field ] A method for producing a semiconductor device
The utility model belongs to the technical field of the circuit board technique and specifically relates to a jumbo size circuit board hinders regional substep exposure structure.
[ background of the invention ]
The rapid development of the electronic industry promotes the diversification of the demand types of the circuit board, and the solder mask process is an important link in the production flow of the circuit board. With diversification and complication of circuit board manufacturing processes, the circuit board with large length and width dimensions is subjected to processes of brushing, electroplating, etching and the like in the previous process, the dimension of the circuit board becomes unstable, and each circuit board can generate extension deformation with different degrees. The circuit board size is big more, and the circuit board elongation degree is more serious, and the solder mask can produce the circuit board after the exposure and hinder quality problems such as solder mask exposure off normal or solder mask goes up the pad or hinder and weld the hand hole, serious can lead to CCD exposure machine can't carry out automatic alignment even, appears refusing to expose the phenomenon, can lead to the circuit board to have the possibility of scrapping even, not only influences the normal production of circuit board, still can improve the manufacturing cost of circuit board.
[ Utility model ] content
An object of the utility model is to provide a jumbo size circuit board hinders regional substep exposure structure solves current jumbo size circuit board because the poor quality of the circuit board that the process elongation difference leads to perhaps exposes and refuse the problem of exposing, makes the circuit board can normally expose when hindering and exposing.
In order to solve the above problem, the utility model provides a technical scheme as follows: a step-by-step exposure structure of a large-size circuit board solder mask area comprises a solder mask exposure film, wherein an exposure unit with the area larger than or equal to the area of a graphic circuit unit on a circuit board is arranged on the solder mask exposure film, an exposure graph matched with the size and the shape of a solder mask graph to be exposed on the graphic circuit unit is arranged on the exposure unit, and at least two exposure alignment targets used for aligning the exposure unit with the graphic circuit unit on the circuit board are arranged around the periphery of the exposure unit.
The exposure unit is rectangular, and one side of any two adjacent sides of the rectangle, which are positioned outside the exposure unit, is provided with the exposure alignment target.
Four exposure alignment targets are arranged on the periphery of the exposure unit.
The extension lines of the exposure alignment targets passing through one set of two opposite side edges of the exposure unit are perpendicular to the extension lines of the exposure alignment targets passing through the other set of two opposite side edges.
And an extension line which passes through the exposure alignment target and is perpendicular to the corresponding exposure unit side passes through the midpoint of the corresponding side.
And the area outside the exposure pattern is a light blocking area.
The light blocking area is made of opaque film.
The light blocking area is covered by a shielding member.
Compared with the prior art, the utility model has the advantages of it is following:
1. the utility model discloses a jumbo size circuit board hinders regional step-by-step exposure structure, through hinder the exposure unit that sets up on the exposure film and correspond with graphic line unit, graphic line unit can be single great graphic line unit or a plurality of less graphic line units, divide into a plurality of small regions to the soldermask on jumbo size circuit board graphic line unit and carry out the step-by-step exposure, because jumbo size circuit board is cut apart into a plurality of small regions and exposes respectively, the area of every small region that contains graphic line unit diminishes, make the extension of the circuit board in this region obviously diminish for the extension of whole circuit board, the influence when the extension of circuit board exposes graphic line unit in the small region also diminishes, the exposure machine can realize accurate counterpoint and expose the soldermask on the graphic line unit that will need expose through this exposure structure, the problem of poor solder mask quality and even exposure refusal caused by incapability of automatically aligning the whole large-size circuit board during exposure of the exposure machine is avoided;
2. the utility model discloses a jumbo size circuit board hinders and welds regional substep exposure structure can not only carry out effective accurate exposure to the solder mask on the circuit board graphic lines unit, can also save the preparation series and hinder the film that exposes usefulness, effectively sparingly makes what the circuit board was used hinders the cost of welding the exposure film.
[ description of the drawings ]
FIG. 1 is the structure diagram of the step-by-step exposure of the solder mask area of the large-size circuit board.
Fig. 2 is a layout structure diagram of the graphic circuit unit of the large-sized circuit board according to embodiment 1 of the present invention.
Fig. 3 is a layout structure diagram of the graphic circuit unit of the large-sized circuit board according to embodiment 2 of the present invention.
[ detailed description ] embodiments
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1: as shown in the attached figure 1, the embodiment provides a step exposure structure for a solder mask area of a large-size circuit board, which comprises a solder mask exposure film 11, wherein an exposure unit 8 with an area equal to that of a graphic circuit unit on the circuit board is arranged on the solder mask exposure film 11, an exposure pattern 81 matched with the size and shape of a solder mask pattern to be exposed on the graphic circuit unit is arranged on the exposure unit 8, so that the exposure unit 8 can expose the solder mask area to be exposed on the circuit board, and ensure that the areas except the solder mask to be exposed corresponding to the exposure pattern 81 are not exposed, the solder mask on the graphic circuit unit on the large-size circuit board is divided into a plurality of small areas for step exposure through the exposure unit corresponding to a single graphic circuit unit of the solder mask exposure film, and the large-size circuit board is divided into a plurality of small areas for respective exposure, the area of each small area containing the graphic circuit unit is reduced, so that the extension of the circuit board in the area is obviously reduced relative to the extension of the whole circuit board, the influence of the extension of the circuit board on the exposure of the graphic circuit unit in the small area is also reduced, the exposure machine can realize accurate alignment through the exposure structure, a solder mask layer on the graphic circuit unit to be exposed is exposed, and the problem that the solder mask quality is poor or even exposure is rejected due to the fact that the whole large-size circuit board cannot be automatically aligned in the exposure process of the exposure machine is solved.
In this embodiment, the exposure pattern 81 is matched with the pattern solder mask layer which is in a shape of 'regular' and needs to be exposed on the pattern circuit unit, at least two exposure alignment targets 9 which are used for aligning the exposure unit 8 with the pattern circuit unit on the circuit board are arranged around the periphery of the exposure unit 8, so that the automatic exposure machine can align the exposure alignment holes 7 on the periphery of the pattern circuit unit on the circuit board through the exposure alignment targets 9, and then expose the solder mask layer on the pattern circuit unit. In the present embodiment, as shown in fig. 1, there are two exposure alignment targets 9, and an extension line passing through the exposure alignment targets 9 is perpendicular to the left side and the upper side of the exposure unit and passes through the midpoint of the sides. As shown in fig. 2, eight exposure alignment holes 7 are correspondingly formed in the circuit board, and one exposure alignment hole 7 is formed in each of the extension lines perpendicular to the two sides of the graphic circuit unit and passing through the midpoint of the side.
The exposure unit 8 is rectangular, square in this embodiment, one side of any two adjacent sides of the rectangle outside the exposure unit is provided with one exposure alignment target 9, so that the solder resist exposure film is positioned 7 in alignment through the two exposure alignment targets 9 and the exposure alignment holes on two sides of the graphic circuit unit on the circuit board, and the exposure unit 8 is aligned with the graphic circuit unit on the circuit board.
In this embodiment, as shown in fig. 1, the extension lines of the exposure alignment targets 9 passing through one set of two opposite sides of the exposure unit 8 are perpendicular to the extension lines of the exposure alignment targets 9 passing through the other set of two opposite sides, and the extension lines passing through the exposure alignment targets 9 and perpendicular to the corresponding side of the exposure unit 8 pass through the middle point of the corresponding side. In this embodiment, the extension lines passing through two adjacent exposure alignment targets 9 are perpendicular to each other and the intersection point is located at the geometric center of the square exposure unit 8, so that the automatic exposure machine can accurately position the exposure positioning target 9 on the solder resist exposure film 11 and the exposure positioning holes 7 on two sides of the graphic circuit unit on the large-size circuit board, and the solder resist exposure film is aligned with the graphic circuit unit, so that the solder resist layer on the exposed graphic circuit unit can be accurately exposed.
Of course, the extension lines of the exposure alignment targets 9 passing through one set of the two opposite sides of the exposure unit 8 and the extension lines of the exposure alignment targets 9 passing through the other set of the two opposite sides can also intersect, and it is only necessary to move the exposure alignment targets 9 on one of the two opposite sides to a position where they are not located on the extension lines perpendicular to the sides and not passing through the middle points of the sides, that is, the connection lines between the exposure alignment targets outside the two adjacent sides intersect with the two adjacent sides, so that the exposure alignment holes on the circuit board are aligned with the exposure alignment holes on the exposure alignment targets outside the two adjacent sides, and the exposure areas are aligned with the areas of the solder resist layer on the circuit board and then exposed by the automatic exposure machine.
The area outside the exposure pattern 81 is a light blocking area 10, and the light blocking area 10 is used for preventing the solder resist area on the graphic circuit unit which does not need to be exposed from being exposed. Specifically, in the present embodiment, the light blocking region 10 is made of opaque film.
Specifically, as shown in fig. 2, the large-size circuit board includes a board 1, a first graphic circuit unit 2, a second graphic circuit unit 3, a third graphic circuit unit 4, and a fourth graphic circuit unit 5 are sequentially disposed on the board 1, and the four graphic circuit units of the four graphic circuit units have the same area size and shape and are disposed in the middle of the board 1. The periphery of the four graphic line units is provided with a board edge 6, two sides of the board edge 6, which are close to any one of the graphic line units, are provided with two exposure alignment holes 7, each graphic line unit is square, extension lines of the two alignment exposure holes 7 penetrating through the periphery of each graphic line unit are mutually vertical and intersect at the geometric center of the graphic line unit, and each graphic line unit is internally provided with a graphic solder mask area which is in a shape of a Chinese character 'zheng' and needs exposure. When the solder mask exposure film 11 is used for exposing the solder mask on the first graphic circuit unit 2, firstly aligning and positioning the exposure alignment target 9 on the solder mask exposure film 11 and the exposure alignment hole 7 on the first graphic circuit unit 2 of the circuit board, then aligning and positioning the exposure pattern 81 on the solder mask exposure film 11 by the automatic exposure machine, exposing the solder mask area to be exposed on the graphic circuit in the shape of the positive shape of the first graphic circuit unit 2 of the circuit board, then clockwise rotating the solder mask exposure film 11 by 90 degrees by taking the center of the intersection point of the four graphic circuit units as the center of circle, then re-aligning the exposure alignment target 9 of the solder mask exposure film 11 and the exposure alignment hole 7 of the second graphic circuit unit 3, then starting the automatic exposure machine to expose the solder mask to be exposed on the second graphic circuit unit 3, and aligning and exposing the solder masks on the third and fourth graphic circuit units according to the steps, therefore, the solder mask layer to be exposed of each graphic circuit unit on the large-size circuit board is exposed in different areas step by step through one solder mask exposure film 11, and then the exposure of the solder mask layer of the whole large-size circuit board is completed, so that the problem of poor quality of the circuit board or exposure rejection caused by different process machining elongations of the existing large-size circuit board is solved, and the circuit board can be normally exposed during solder mask exposure. The quality problems of the solder mask exposure deviation, the solder mask upper bonding pad and the solder mask access hole of the circuit board are effectively improved.
The light blocking area 10 may also be covered by a shielding member, so as to prevent the solder mask area on the pattern circuit unit that does not need to be exposed from being exposed when the solder mask layer on the pattern circuit unit of the large-size circuit board is exposed. In this embodiment, there are four pattern circuit units on the circuit board, that is, the solder resist exposure film 11 needs to perform area four division and four-step exposure on the circuit board, and certainly, three or six pattern circuit units may also be provided on the circuit board, and the exposure of the solder resist layer of the circuit board can be completed by performing three-step or six-step exposure on the circuit board correspondingly to the solder resist exposure film 11. The solder mask exposure film exposes the solder mask layer on the circuit board in a clockwise rotation direction, and of course, the solder mask exposure film can also expose the solder mask layer on the circuit board in a counterclockwise rotation direction.
Example 2: the present embodiment also provides a step exposure structure for solder mask area of large-size circuit board, which is basically the same as the step exposure structure for solder mask area of large-size circuit board in embodiment 1, and the difference is that: the solder mask exposure film of the embodiment 1 exposes the solder mask layer on the graphic circuit unit on the circuit board by rotating with the center of the intersection point of the four graphic circuit units as the center of a circle; in the embodiment, the step-by-step exposure structure of the solder mask area of the large-size circuit board on the solder mask exposure film is horizontally moved to be aligned with the exposure positioning holes on the graphic circuit units of the circuit board for exposure, so that the exposure of the solder mask layer on each graphic circuit unit of the large-size circuit board is completed. The week side of exposure unit 8 is equipped with four expose counterpoint target 9, as shown in figure 1, on the exposure film 11 of hindering of this embodiment all be equipped with 1 exposure counterpoint target 9 on the midpoint and the perpendicular extension line of side of four sides that pass exposure unit 8 to upwards or down or left or right translation hinders and welds exposure film 11 back, hinder exposure counterpoint target 9 on the exposure film 11 and the circuit board figure circuit unit week side that shows in figure 3 and expose counterpoint hole 7 and carry out vertically and horizontal counterpoint respectively, make exposure unit and figure circuit unit align, and then expose the region that the soldermask on this figure circuit unit needs the exposure.
As shown in fig. 3, the circuit board includes a board 1, and a first graphic circuit unit 2, a second graphic circuit unit 3, a third graphic circuit unit 4, and a fourth graphic circuit unit 5 are also disposed on the board 1, and the four graphic circuit units have the same area size and shape. When the solder mask on each graphic circuit unit is exposed, the solder mask exposure film 11 is only required to be horizontally moved to the position mutually aligned with each graphic circuit unit of the circuit board respectively, so that the whole large-size circuit board is exposed step by step in a small area, the exposure of the solder mask on the graphic circuit unit of the large-size circuit board is completed, the problems of poor quality of the circuit board or exposure rejection caused by different working procedure processing elongation of the existing large-size circuit board are solved, and the circuit board can be normally exposed during the solder mask exposure.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. Large-size circuit board hinders regional step-by-step exposure structure, hinder including hindering exposure film (11), its characterized in that: hinder and be equipped with exposure unit (8) that the area is more than or equal to the area of the graphic circuit unit on the circuit board on exposure film (11), be equipped with on exposure unit (8) with the graphic circuit unit on the size and the shape assorted exposure figure (81) of the solder mask figure that need expose, encircle exposure unit (8) week side be equipped with at least two be used for with exposure counterpoint target (9) that graphic circuit unit on exposure unit (8) and the circuit board aligns.
2. The large-size circuit board solder mask area step exposure structure of claim 1, wherein: the exposure unit (8) is rectangular, and one side of any two adjacent sides of the rectangle, which are positioned outside the exposure unit (8), is provided with the exposure alignment target (9).
3. The large-size circuit board solder mask area step exposure structure of claim 2, wherein: four exposure alignment targets (9) are arranged on the periphery of the exposure unit (8).
4. The large-size circuit board solder mask area step exposure structure of claim 3, wherein: the extension lines of the exposure alignment targets (9) passing through one set of two opposite side edges of the exposure unit (8) are perpendicular to the extension lines of the exposure alignment targets (9) passing through the other set of two opposite side edges.
5. The large-size circuit board solder mask area step exposure structure of claim 4, wherein: and the extension line which passes through the exposure alignment target (9) and is perpendicular to the side edge of the corresponding exposure unit (8) passes through the midpoint of the corresponding side edge.
6. The large-size circuit board solder mask area step exposure structure of claim 1, wherein: the area outside the exposure pattern (81) is a light blocking area (10).
7. The large-size circuit board solder mask area step exposure structure of claim 6, wherein: the light blocking area (10) is made of a light-tight film.
8. The large-size circuit board solder mask area step exposure structure of claim 6, wherein: the light-blocking area (10) is covered by a shielding component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021536856.8U CN212463661U (en) | 2020-07-29 | 2020-07-29 | Step-by-step exposure structure for large-size circuit board solder-resisting area |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021536856.8U CN212463661U (en) | 2020-07-29 | 2020-07-29 | Step-by-step exposure structure for large-size circuit board solder-resisting area |
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| CN212463661U true CN212463661U (en) | 2021-02-02 |
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| CN202021536856.8U Active CN212463661U (en) | 2020-07-29 | 2020-07-29 | Step-by-step exposure structure for large-size circuit board solder-resisting area |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113687576A (en) * | 2021-08-24 | 2021-11-23 | 广东华恒智能科技有限公司 | Exposure process and exposure machine |
| CN113939107A (en) * | 2021-09-30 | 2022-01-14 | 珠海杰赛科技有限公司 | Blind slot plate solder mask pattern transfer method |
-
2020
- 2020-07-29 CN CN202021536856.8U patent/CN212463661U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113687576A (en) * | 2021-08-24 | 2021-11-23 | 广东华恒智能科技有限公司 | Exposure process and exposure machine |
| CN113939107A (en) * | 2021-09-30 | 2022-01-14 | 珠海杰赛科技有限公司 | Blind slot plate solder mask pattern transfer method |
| CN113939107B (en) * | 2021-09-30 | 2023-03-21 | 珠海杰赛科技有限公司 | Blind slot plate solder mask pattern transfer method |
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