CN113939107B - Blind slot plate solder mask pattern transfer method - Google Patents
Blind slot plate solder mask pattern transfer method Download PDFInfo
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- CN113939107B CN113939107B CN202111169344.1A CN202111169344A CN113939107B CN 113939107 B CN113939107 B CN 113939107B CN 202111169344 A CN202111169344 A CN 202111169344A CN 113939107 B CN113939107 B CN 113939107B
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- blind groove
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a method for transferring a solder mask pattern at the bottom of a blind slot plate, which comprises the following steps: s1, milling an alignment PAD, and milling the alignment PAD at the edge of a blind groove plate simultaneously when milling a blind groove, wherein the depth of the blind groove is not more than 5mm; s2, transferring an outer layer solder mask pattern of the blind groove by using a direct imaging machine, and blocking light at the bottom of the blind groove; and S3, transferring the solder mask pattern at the bottom of the blind groove by using a direct imaging machine, and blocking light of the outer solder mask pattern of the blind groove. According to the scheme, the solder mask graph of the blind slot plate is divided into the solder mask graph of the outer layer of the blind slot and the solder mask graph of the bottom of the blind slot, the solder mask graph of the outer layer of the blind slot and the solder mask graph of the bottom of the blind slot are separately manufactured, the counterpoint PAD is used as a counterpoint point, the solder mask graph which cannot be manufactured due to the height difference generated between the surface of the blind slot plate and the bottom of the blind slot is prevented from being transferred, and the solder mask graph transfer can be completed.
Description
Technical Field
The invention belongs to the technical field of circuit boards, and particularly relates to a blind slot plate solder mask pattern transfer method.
Background
In recent decades, the Printed Circuit Board (PCB) manufacturing industry in China has been developed rapidly, and the Printed Circuit Board has been developed from a single layer to a double-sided Board, a multi-layer Board and a flexible Board, and has been developed to high precision, high density and high reliability. The size is continuously reduced, the cost is reduced, and the performance is improved, so that the printed circuit board still keeps strong vitality in the development process of future electronic products. The development trend of the production and manufacturing technology of the future printed circuit board is to develop the printed circuit board in the directions of high density, high precision, fine aperture, fine lead, small spacing, high reliability, multilayering, high-speed transmission, light weight and thin type.
When a blind slot plate in the existing printed circuit board needs to be manufactured with a solder resist pattern in the blind slot after the cover of the blind slot is opened, due to the height difference between the surface of the blind slot plate and the bottom of the blind slot, according to the existing exposure processing method, when the depth of the blind slot is less than or equal to 5mm, a virtual light problem can be generated, so that a solder resist pattern image cannot be displayed, and solder resist pattern transfer cannot be completed.
Disclosure of Invention
The invention mainly aims to provide a solder mask pattern transfer method for the bottom of a blind slot plate, which can complete solder mask pattern transfer.
In order to achieve the above main object, the method for transferring a solder resist pattern at the bottom of a blind via provided by the present invention comprises: s1, milling an alignment PAD, and milling the alignment PAD at the edge of a blind groove plate simultaneously when milling a blind groove, wherein the depth of the blind groove is not more than 5mm;
s2, transferring an outer layer solder mask pattern of the blind groove by using a direct imaging machine, and blocking light at the bottom of the blind groove;
and S3, transferring the solder mask pattern at the bottom of the blind groove by using a direct imaging machine, and blocking light of the solder mask pattern on the outer layer of the blind groove.
According to the scheme, the blind slot plate solder mask graph is divided into the blind slot outer layer solder mask graph and the blind slot bottom solder mask graph, the blind slot outer layer solder mask graph and the blind slot bottom solder mask graph are separately manufactured, the counterpoint PAD is used as the counterpoint point, the solder mask graph transfer which cannot be manufactured due to the height difference generated by the surface of the blind slot plate and the bottom of the blind slot is prevented, and the solder mask graph transfer can be completed.
In step S2, the plate thickness is preferably set to the plate thickness of the blind groove plate.
Preferably, in step S3, the plate thickness is set to the excess thickness of the bottom of the blind groove.
In a preferred embodiment, the para-PAD is the inner para-PAD.
In a preferred embodiment, the number of para-PADs is not less than four.
In a preferred embodiment, the number of para-PADs is four.
Preferably, the depth of the counterpoint PAD is the same as that of the blind groove.
In a preferred embodiment, the milled diameter for para-PAD is 5mm.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
The method for transferring the solder resist pattern at the bottom of the blind slot plate comprises the following steps: s1, milling an alignment PAD, and milling the alignment PAD at the edge of a blind groove plate simultaneously when milling a blind groove, wherein the depth of the blind groove is not more than 5mm;
s2, transferring an outer layer solder mask pattern of the blind groove by using a direct imaging machine, and blocking light at the bottom of the blind groove;
and S3, transferring the solder mask pattern at the bottom of the blind groove by using a direct imaging machine, and blocking light of the solder mask pattern on the outer layer of the blind groove.
In step S2, the plate thickness is set to the plate thickness of the blind plate.
In step S3, the plate thickness is set to the excess thickness of the bottom of the blind groove, and the excess thickness is the height obtained by subtracting the blind groove depth from the plate thickness of the blind groove plate.
The contraposition PAD is the inner layer contraposition PAD.
The number of para-PADs is not less than four.
The number of para-PADs is four.
The depth of the counterpoint PAD is the same as that of the blind groove.
The milled diameter of the para-PAD is 5mm.
Resistance welding patterns of the blind groove plate are divided into blind groove outer layer resistance welding patterns and blind groove bottom resistance welding patterns, the patterns are separately manufactured, the transfer of the blind groove outer layer resistance welding patterns and the blind groove bottom resistance welding patterns, contraposition PAD is used as a contraposition point, the thickness of a plate is set to be the residual thickness of the blind groove bottom when the blind groove bottom resistance welding patterns are transferred, the resistance welding patterns which cannot be manufactured due to the height difference generated by the surface of the blind groove plate and the blind groove bottom are prevented from being transferred, the resistance welding patterns can be transferred, resistance welding processing blind groove bottom pattern transfer is achieved, the quality is stable, and the operability is high.
A Printed Circuit Board (PCB) comprises a blind slot and a step line layer, so that the PCB is three-dimensional, the optimized assembly space is realized, the performance is stronger, and the PCB is widely applied to many fields. For blind groove type plates with higher service environment temperature, blind grooves with larger contact surfaces can be designed to ensure heat dissipation, or a copper-buried mode is adopted to ensure heat dissipation.
The copper block embedded type circuit board and the blind slot circuit board belong to different manufacturing processes in the PCB industry, actual methods of the structures are greatly different from each other, and key procedures are different in pressing modes and different in copper embedding modes.
The copper embedding process is divided into a through copper block and a semi-embedded copper block according to the position of the copper block on the PCB, and can be divided into three conditions according to the combination with the blind slot: a through type and blind slot structure; semi-buried and blind groove structures; the blind groove and the copper block are in a crossed semi-buried type and blind groove structure.
The manufacturing method of the penetrating type and blind groove structure comprises the following steps:
a first core plate: cutting material → internal light imaging → punching → internal layer etching inspection → hole milling (milling blind slot position) → one time of hole milling (milling copper block position) → matching center → blackening;
a second core board: cutting material → inner light imaging → punching → inner layer etching inspection → outer light imaging → gold plating (carrying out the plating of a thick gold protective pattern on the bottom of a blind groove) → alkaline etching → one time of hole milling (copper block milling position) → matching center → blackening;
prepreg preparation: cutting → hole milling (the glue is required to be ensured to be capable of filling the copper block nesting requirement and is determined according to the size of the copper block) → matching center;
outer layer: lamination → ceramic grinding plate → … … → external light imaging → copper tin plating → alkaline etching → subsequent process.
Note: and (3) milling the hole corresponding to the copper block once, wherein the size of the milled hole is 0.1mm (4 mil) larger than the single side of the copper block.
The specific process explanation is as follows:
laminating: the laminated plate adopts a glue blocking material (plasticity, low expansion coefficient and high temperature resistance) to block the glue flowing of the prepreg in the blind groove, so that the glue overflowing is prevented from being applied to the bottom of the blind groove; and the pressing needs to adopt a double-sided aluminum sheet for covering. Because the structure simultaneously presses the blind groove and the copper block, the copper block can be ensured to be consistent with the thickness of the plate after being pressed, and simultaneously, the plastic material in the blind groove can not cause the plate surface to bulge due to thermal expansion and not cause pressure loss; and (3) adopting a plastic and rigid aluminum sheet as a covering material for covering.
Grinding a plate by using ceramic: the copper pressing block needs to ensure that the P sheet can be well filled with the copper block required by nesting, the excessive glue is slightly overflowed, and the copper block is glued and polished in position after being pressed, so that the pressing is ensured to be firm.
The manufacturing method of the semi-buried and blind groove structure comprises the following steps:
outer core board: cutting → pasting the adhesive tape → milling the hole → browning;
an inner side core plate: laminating → tearing tape → ceramic grinding plate → tool matching → internal light imaging → punching → internal layer etching inspection → hole milling (milling blind groove position) → one time of hole milling (milling copper block position) → matching center → blackening.
Note: and (4) milling the hole corresponding to the copper block once, wherein the size of the milled hole is 0.1mm larger than the single side of the copper block.
The specific process explanation is as follows:
pasting an adhesive tape: adhering PI high-temperature-resistant adhesive tapes to two sides of the core plate, and then milling holes to reduce burrs;
laminating: the pressing needs to adopt a double-sided aluminum sheet for cladding, (because the copper block is embedded into the core plate by the pressing of the structure, the copper block can be ensured to be consistent with the thickness of the plate as far as possible after the pressing, and the cladding material aluminum sheet with plasticity and rigidity is adopted for cladding), the pressing is to adopt an outer core plate double-sided pressed copper foil for manufacturing an inner core plate;
tearing the adhesive tape: the double-sided adhesive tape needs to be torn off, and the copper foil is removed together;
grinding a plate by using ceramic: the double-sided prepreg is not windowed, the copper block is pressed, the excessive glue is applied to the upper surface of the prepreg, and the position of the copper block is polished after pressing, so that firm pressing is ensured;
the method comprises the steps of firstly manufacturing the copper-embedded core plate, then realizing the blind groove method, and referring to the normal blind groove method in the subsequent method. The method can be used for manufacturing multilayer blind grooves and copper embedding, has wide application range, but is long in process consumption and not suitable for batch production, so that the method can be improved as follows:
and (4) milling holes on the core plate pressed with the copper blocks, wherein the positions of the milled holes (milled blind grooves) and the positions of the milled edges close to the copper blocks are required to be changed into small knife milling, and the moving speed of a milling cutter is reduced.
Plating thick gold on the bottom of the blind groove of the second core plate to protect the pattern; PP hole milling needs to ensure that glue can be filled into the copper block required by nesting, and hole milling is not carried out on the position, corresponding to the P piece, of the copper block according to the size of the copper block so as to ensure that the glue filled under the copper block is sufficient. During lamination, the laminated plate is made of glue-blocking materials, needs to be different from the conventional blind groove manufacturing, needs to be as close to the depth of the blind groove as possible, and is not suitable to be too thick; the blind groove surface is coated by single-side large silica gel.
The method for simultaneously laminating the copper block and the blind groove plate comprises the following steps:
and respectively manufacturing a first core board and a second core board, and pressing after blackening is completed. Cutting the prepreg, and milling holes to ensure that the glue can be used for filling the copper block nesting; and (4) milling the hole corresponding to the copper block once, wherein the size of the milled hole is 0.1mm larger than the single side of the copper block.
The specific process explanation is as follows:
laminating: the laminated plate adopts glue blocking materials (plasticity, low expansion coefficient and high temperature resistance) to block PP glue flowing in the blind groove, so that glue overflowing is prevented from being applied to the bottom of the blind groove. Because the structure simultaneously presses the blind groove and the copper block, the copper block can be ensured to be consistent with the thickness of the plate after being pressed, and simultaneously, the plastic material in the blind groove can not cause the plate surface to bulge due to thermal expansion and not cause pressure loss; and (3) adopting a plastic and rigid aluminum sheet as a covering material for covering. If the blind groove and the copper block are different in surface, the blind groove surface is large in silica gel coverage and the copper block surface is aluminum sheet coverage during lamination;
grinding a plate by using ceramic: the copper pressing block needs to ensure that the P sheet can be well filled with the copper block required by nesting, the excessive glue is slightly overflowed, and the position of the copper block is glued and polished after pressing, so that the pressing is firm;
aiming at the requirement of non-metallization of a blind groove, external light imaging and alkaline etching are required to be carried out once, and external light imaging is carried out twice: only the position of the window blind slot is opened, and the other positions are not opened; alkaline etching once: removing tin only without etching, and removing tin in the blind groove; if the blind slot is a metallized blind slot, the film is removed and etched normally and directly;
the method is realized by simultaneously embedding the semi-buried copper block and the blind groove, can be used for manufacturing batch plates, is short in time consumption in one-step pressing process, cannot be used for multi-layer plates with the blind groove adjacent to the copper block, and needs to be combined with actual design for use in a combining process.
The manufacturing method for the intersection of the blind groove and the copper block comprises the following steps:
a first core plate: cutting material → internal light imaging → punching → internal layer etching inspection → hole milling once (copper block milling position) → matching center → blackening;
a second core board: cutting → internal light imaging → punching → internal layer etching inspection → matching center → blackening;
prepreg preparation: cutting → milling hole (the glue is required to be ensured to be capable of filling the copper block nesting requirement, and is determined according to the size of the copper block) → matching center;
outer layer: laminating → ceramic grinding plate → internal light imaging → … → external light imaging → copper tin plating → blind groove milling → alkaline etching → AOI → blind groove milling → subsequent process.
Note: and (4) milling the hole corresponding to the copper block once, wherein the size of the milled hole needs to be 4 mils larger than the single side of the copper block.
The specific process explanation is as follows:
laminating: pressing needs to adopt aluminum sheets for covering and pressing copper blocks;
grinding a plate by using ceramic: copper block pressing needs to be guaranteed, the prepreg can be well filled with the copper block nesting need, glue overflowing is slightly excessive, and after pressing, copper block position glue polishing is carried out, so that firm pressing is guaranteed;
milling blind grooves: manufacturing a blind groove according to depth control milling, strictly controlling tolerance, and milling the blind groove for the copper block; and milling blind grooves after the circuit is manufactured, and ensuring the depth.
The types of the copper-buried and blind groove structure plates are complex, different process manufacturing methods are adopted for copper-buried blind groove plates with different structures, and the different process methods can be optimized and combined according to the implementation structures to realize the copper-buried and blind groove structure plates. For the manufacture of the copper-embedded and blind groove structure type plate, the realization of the product structure as a base point needs to respectively set two special structures of the copper-embedded structure and the blind groove structure and then combine the two special structures.
Finally, it should be emphasized that the present invention is not limited to the above-described embodiments, but only the preferred embodiments of the invention have been described above, and the present invention is not limited to the above-described embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A blind slot plate solder resistance pattern transfer method is characterized by comprising the following steps:
s1, milling an alignment PAD, and milling the alignment PAD at the edge of a blind groove plate simultaneously when milling a blind groove, wherein the depth of the blind groove is not more than 5mm;
s2, transferring an outer layer solder mask pattern of the blind groove by using a direct imaging machine, and blocking light at the bottom of the blind groove, wherein the plate thickness is set as the plate thickness of the blind groove plate;
and S3, transferring the solder mask pattern at the bottom of the blind groove by using a direct imaging machine, and blocking the outer layer solder mask pattern of the blind groove, wherein the plate thickness is set as the residual thickness at the bottom of the blind groove.
2. The blind slot plate solder mask pattern transfer method according to claim 1, wherein: and the contraposition PAD is an inner layer contraposition PAD.
3. The blind slot plate solder mask pattern transfer method according to claim 2, wherein: the number of the para-PADs is not less than four.
4. The blind slot plate solder mask pattern transfer method according to claim 3, wherein: the number of the para-PADs is four.
5. The blind slot plate solder mask pattern transfer method according to claim 4, wherein: and the depth of the para-position PAD is the same as that of the blind groove.
6. The blind via solder resist pattern transfer method according to any one of claims 1 to 5, wherein: the milled diameter of the para-position PAD is 5mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111169344.1A CN113939107B (en) | 2021-09-30 | 2021-09-30 | Blind slot plate solder mask pattern transfer method |
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| CN202111169344.1A CN113939107B (en) | 2021-09-30 | 2021-09-30 | Blind slot plate solder mask pattern transfer method |
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| CN113939107B true CN113939107B (en) | 2023-03-21 |
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| CN115643673B (en) * | 2022-12-23 | 2023-06-13 | 惠州市金百泽电路科技有限公司 | PCB glue blocking structure and accurate glue blocking control method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0377872A2 (en) * | 1989-01-09 | 1990-07-18 | Siemens Aktiengesellschaft | Method of applying a solder resist covering to a circuit board |
| CN102378494A (en) * | 2011-10-31 | 2012-03-14 | 深南电路有限公司 | Resistance welding processing method for circuit board |
| CN106531643A (en) * | 2016-12-08 | 2017-03-22 | 广州兴森快捷电路科技有限公司 | Manufacturing method of fan-out packaging structure |
| CN212463661U (en) * | 2020-07-29 | 2021-02-02 | 广东依顿电子科技股份有限公司 | Step-by-step exposure structure for large-size circuit board solder-resisting area |
-
2021
- 2021-09-30 CN CN202111169344.1A patent/CN113939107B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0377872A2 (en) * | 1989-01-09 | 1990-07-18 | Siemens Aktiengesellschaft | Method of applying a solder resist covering to a circuit board |
| CN102378494A (en) * | 2011-10-31 | 2012-03-14 | 深南电路有限公司 | Resistance welding processing method for circuit board |
| CN106531643A (en) * | 2016-12-08 | 2017-03-22 | 广州兴森快捷电路科技有限公司 | Manufacturing method of fan-out packaging structure |
| CN212463661U (en) * | 2020-07-29 | 2021-02-02 | 广东依顿电子科技股份有限公司 | Step-by-step exposure structure for large-size circuit board solder-resisting area |
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