CN107241875B - A kind of manufacturing method of two-sided printed board of sunkening cord - Google Patents
A kind of manufacturing method of two-sided printed board of sunkening cord Download PDFInfo
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- CN107241875B CN107241875B CN201610181691.9A CN201610181691A CN107241875B CN 107241875 B CN107241875 B CN 107241875B CN 201610181691 A CN201610181691 A CN 201610181691A CN 107241875 B CN107241875 B CN 107241875B
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- plate
- support plate
- printed board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Abstract
A kind of manufacturing method of two-sided printed board of sunkening cord includes the following steps: that two extra thin copper foils, which are attached to the first support plate two sides, obtains the first processing plate；The extra thin copper foil of two coated with resins layers is attached to the second support plate two sides and obtains the second processing plate；First line figure is made on the first processing plate copper foil, makes the second line pattern on the second processing plate resin layer；Then multiple plates for having made line pattern are staggeredly superimposed by lamination and are pressed, the first printed board is obtained as insulating layer using PP between two plates, then removes the second support plate；By laser drilling blind hole, filling perforation etc. is electroplated, the first, second line pattern is connected, then electro-coppering is etched away, there is resin layer to can protect layer of sunkening cord not to be etched since the second line pattern is sunken cord outside layer at this time；The first support plate is removed again, the copper foil and resin layer on surface is etched away, obtains two-sided printed board of sunkening cord.The present invention solves the problems, such as two-sided layer conducting of sunkening cord, and sunken cord layer planarization and reliability is substantially improved.
Description
Technical field
The present invention relates to the manufacturing methods of printed circuit board, and in particular to a kind of manufacturing method of two-sided printed board of sunkening cord.
Background technique
With flourishing for electronic industry, electronic product comes into functionalization, intelligentized development phase, to meet
Electronic product high integration, the development need of miniaturization, micromation, in the premise for meeting the good electricity of electronic product, hot property
Under, printed circuit board or semiconductor integrated circuit package substrate also develop towards light, thin, short, small designer trends.Meanwhile it is right
It also becomes increasingly complex in the design requirement of electronic system, and develops towards different directions.Electronic product of new generation is with design ruler
Very little gradually becomes smaller, and interconnection density of all products on design level is also continuously increased.That is, more and more limited
In surface area, need to design more input/output signal routes.
Based on the above demand, industry continues to develop on the thinner thinner route of printed circuit board at present, and by sunkening cord
Mode carries out the design and processing of printed circuit panel products, not only can reduce plate thickness in such a way that route is embedded to substrate, together
When, since the mode of sunkening cord is that route is directly embedded to substrate, there is no the necessary etchant flows of conventional line production therefore can
To substantially reduce the line width and spacing of route.Although due to line width, spacing reduce after in process to external environment and add
Work operation is very sensitive, is easily scraped off and falls off, but the fine rule road for product of sunkening cord is constantly in the state in embedment resin, rear
It is protected well in being made, yield has greatly improved compared with conventional manufacturing procedures.
Single side product of sunkening cord has been used widely at present, but two-sided sunken cord is promoted not yet, and main cause is processing
A two-sided layer conduction mode of sunkening cord afterwards is not well solved.The main method of current double-side conduction is by two-sided layer of sunkening cord
It processes, then be connected by way of drilling, plating, etching, but the copper electroplating layer as needed for double-side conduction is thicker, etching
It is difficult to ensure uniformity, layer of sunkening cord can be damaged, lead to a layer out-of-flatness of sunkening cord, lose the meaning for processing of sunkening cord.
Summary of the invention
The purpose of the present invention is to provide a kind of manufacturing method of two-sided printed board of sunkening cord, overcomes and above-mentioned deposit in the prior art
The shortcomings that and deficiency, the layer that avoids sunkening cord by etchant flow, sunken cord layer planarization and reliability by promotion, and do not need it is special
Cost and risk when production can be greatly reduced in equipment or machining tool, improve product quality and yield.
In order to achieve the above objectives, the technical scheme is that
A kind of manufacturing method of two-sided printed board of sunkening cord comprising following steps:
1) two 5 μm of thickness < of copper foil is attached to the two sides of the first support plate, obtaining a thickness and rigidity can meet
First processing plate of conventional equipment processing request, wherein two copper foils are smooth surface towards the first support plate on one side, back to first
Support plate is hair side on one side；
2) two 5 μm of thickness < of copper foil is attached to the two sides of the second support plate, obtaining a thickness and rigidity can meet
Second processing plate of conventional equipment processing request, wherein two copper foils are smooth surface towards the second support plate on one side, back to second
Support plate is hair side on one side, and the hair side of two copper foils has been coated with 2 μm of a layer thickness < of resin layer；
3) conventional drilling, dry film production are carried out to the first processing plate, film is moved back in plating, the copper foil on the first processing plate two sides
First line figure is made on hair side；
4) conventional laser drilling, heavy copper are carried out to the second processing plate, dry film production is electroplated, moves back film, processes plate two second
The second line pattern is made on the resin surface in face, laser drill region is etched during being somebody's turn to do, and forms windowed regions；
5) by an above step 3) the first processing plate, an above step 4 of the obtained figure containing first line) it obtains
Containing the second line pattern second processing plate staggeredly be superimposed be laminated, and first processing plate and second processing plate intermediate laminate
One insulating layer material obtains the first printed board of multilayered structure；Wherein, first printed board is at least two by First Line
The two-sided buried cable architecture that road figure, the second line pattern and in-between insulating layer material are formed, and described two two-sided sunken cord
Structure is attached to the first processing plate two sides；
6) the second support plate is removed from the first printed board, obtains multiple by two blocks of two-sided plates of sunkening cord and is attached to the first processing
The second printed board formed on plate；
7) conventional laser drilling is carried out to the second printed board, filling perforation is electroplated in heavy copper, and etchant flow makes first line figure
It is connected with the second line pattern, wherein laser drill position is the windowed regions that step 4) is formed, and etching degree is just to reveal
Resin layer in second printed board out；Again by first process plate in the first support plate remove, obtain two by it is two-sided sunken cord plate and
The third printed board of copper foil and the resin layer composition of its upper and lower surface；
8) respectively by third printed board upper and lower surface copper foil and resin layer etch away, obtain two-sided printed board of sunkening cord.
Further, in step 1), two copper foils are covered in the first support plate respectively using adhesive, and in step 7),
The first support plate is torn in the joint place of the first support plate and two copper foils, removes the first support plate.
In step 2), two copper foils are covered in respectively on the second support plate using adhesive；In step 6), carried second
The second support plate is torn in the joint place of plate and two copper foils, removes the second support plate.
Preferably, first support plate includes two copper foils and a core plate, and two copper foils are covered on the core plate
Two sides.
Preferably, second support plate includes two copper foils and a core plate, and two copper foils are covered on the core plate
Two sides.
Again, in step 3), sandwich circuit production of sunkening cord is carried out on the copper foil hair side of the first processing plate by addition process.
In step 4), sandwich circuit production of sunkening cord is carried out on the resin layer surface of the second processing plate by addition process.
Preferably, in step 5), the insulating layer material is polypropylene (PP) resin material.
Resin layer used in the present invention is the resin material of this fields such as ink, epoxy resin routine, on the resin layer may be used
Heavy copper plating is carried out, and guarantees that it has good combination power between layers of copper.
In the present invention, heavy copper is carried out to splitting the second obtained printed board for the first time in step 7), filling perforation, etching is electroplated
Process all etches away the copper of resin layer surface, and due to the protection of resin layer, the layer of sunkening cord of the second printed board is not broken
It is bad, and since laser hole is by complete filling perforation, layers of copper is not also destroyed in laser hole, realizes the conducting of two-sided layer of sunkening cord.
In step 7), the second printed board by laser drill and is electroplated layer face the T/face B of sunkening cord of two plates of sunkening cord
The interconnection of two-sided layer of sunkening cord is realized in conducting；The second printed board interconnected is drilled again along two extra thin copper foils to layer of sunkening cord is had been carried out
It is split with first vector joint place, first vector is removed, third printed board is obtained.
In step 8), the extra thin copper foil on one surface of third printed board is led into overetched mode and is removed, on another side
Resin layer resin etch by way of remove, resin etching mode include polish-brush, alkalinity potassium permanganate desmearing mode
Or plasma desmearing mode.
Beneficial effects of the present invention:
The present invention realizes the high-volume processing of two-sided printed board product of sunkening cord, and two-sided plate of sunkening cord splits the second support plate
Afterwards by conventional drilling, heavy copper, plating, etchant flow realizes the conducting of two-sided layer of sunkening cord, and passes through the second processing plate surface
The protection of resin layer, layer of sunkening cord will not be etched liquid medicine destruction, avoid layer of sunkening cord by etchant flow, greatly promote layer of sunkening cord
Planarization and reliability, and do not need special equipment or machining tool, cost and risk when production be greatly reduced, mentions
High product quality and yield.
Detailed description of the invention
Fig. 1 is the schematic cross-section of the first processing plate in the embodiment of the present invention.
Fig. 2 is the schematic cross-section of the second processing plate in the embodiment of the present invention.
Fig. 3 is the schematic cross-section after first line figure processed on the first processing plate copper foil hair side of Fig. 1.
Fig. 4 is the schematic cross-section after making the second line pattern on the second processing plate resin layer surface of Fig. 2.
Fig. 5 is the schematic cross-section of the first printed board of step 5) preparation in the embodiment of the present invention.
Fig. 6 is the schematic cross-section of the second printed board of step 6) preparation in the embodiment of the present invention.
Fig. 7 is the schematic cross-section of the second printed board after step 7) laser drill, plating in the embodiment of the present invention.
Fig. 8 is the schematic cross-section that step 7) etching removes the second printed board after copper on resin layer in the embodiment of the present invention.
Fig. 9 be the embodiment of the present invention in step 8) remove the first support plate after obtain third printed board schematic cross-section it
One.
Figure 10 be the embodiment of the present invention in step 8) remove the first support plate after obtain third printed board schematic cross-section it
Two.
Figure 11 is one of the schematic cross-section of the two-sided printed board of sunkening cord of step 9) preparation in the embodiment of the present invention.
Figure 12 is two of the schematic cross-section of the two-sided printed board of sunkening cord of step 9) preparation in the embodiment of the present invention.
Specific embodiment
Below with reference to embodiment and attached drawing, the present invention will be further described.
Referring to Fig. 1-Figure 12, the manufacturing method of two-sided printed board of sunkening cord of the present invention, main manufacturing process is as follows:
1) two 5 μm of thickness < of extra thin copper foil 11,11 ' is covered on the first support plate 10 with smooth surface by adhesive,
The first processing plate of conventional equipment processing request can be met by obtaining a thickness and rigidity, the first processing plate schematic cross-section
As shown in Figure 1；Wherein, first support plate 10 is made of two copper foils 101,101 ' and a core plate 100.
2) hair side is coated to 5 μm of thickness < of extra thin copper foil 21, the hair side coating one of 2 μm of a layer thickness < of resin layer 22
5 μm of thickness < of extra thin copper foil 21 ' of layer resin layer 22 ' is covered on Second support 20 with smooth surface by adhesive, obtains one
A thickness and rigidity can meet the second processing plate of conventional equipment processing request, second processing plate schematic cross-section such as Fig. 2
It is shown；Wherein, the second support plate 20 is made of two copper foils 201,201 ' and a core plate 200.
3) copper foil 11 of the first processing plate formed in step 1), 11 ' hair sides are drilled by addition process, and pad pasting exposes, and shows
Shadow, plating, moves back film process first line figure 12,12 ', and the first processing plate schematic cross-section is as shown in Figure 3 after processing.
4) resin layer 22,22 ' surfaces pass through addition process (drilling, heavy copper, patch on the second processing plate that step 2) is formed
Film exposes, and develops, and film process is moved back in plating) the second line pattern 23,23 ' is made, need laser drill region to etch in process
Fall to do windowing processing, form windowed regions A, prepare for the first, second line pattern of subsequent conducting, the second processing plate is cut after processing
Face schematic diagram is as shown in Figure 4.
5) by multiple steps 3), step 4) treated first processing plate, second processing plate staggeredly be superimposed, centre use PP
The insulating layer 30 of (acrylic resin) as plate of sunkening cord is laminated to obtain the first printed board of multilayered structure, first printing
Plate schematic cross-section is as shown in Figure 5.
6) the first printed board is torn along copper foil 21,21 ' and 20 joint place of Second support, removes Second support 20, formed
The second printed board made of the first support plate 10 is opened as two two-sided plate midfeathers one of sunkening cord, the second printed board schematic cross-section
As shown in Figure 6.
7) by the second printed board by laser drill and plating by the second line pattern 23 of two plates of sunkening cord on support plate with
First line figure 12 ', the second line pattern 23 ' are connected with first line figure 12 by conductive material in through-hole B, are realized double
The interconnection that face is sunken cord, the windowed regions A that laser drill position is formed in step 4), by the region, copper etches away step 4)
, can directly drill, copper foil 21,21 ' is thickened during plating, and schematic cross-section is as shown in Figure 7；It is flowed by etching
Journey removes the copper foil 21,21 ' of thickening, i.e. copper on removal resin layer, due to having the protection of resin layer 22,22 ', the second route
Figure 23,23 ' is not destroyed, and the second printed board schematic cross-section is as shown in Figure 8 after etching.
8) the second printed board that step 7) obtains is torn along copper foil 11,11 ' and 10 joint place of first vector, and removal second carries
Body 10, obtains two mutually isostructural third printed boards, and schematic cross-section is as shown in Figure 9 and Figure 10.
9) copper foil 11,11 ' on third printed board first line figure 12,12 ' surfaces is etched into removal and the second route again
(polish-brush, permanganic acid desmearing or plasma desmearing can be used in the etching removal of resin layer 22,22 ' of figure 23,23 ' surfaces
The methods of), two-sided printed board of sunkening cord is obtained, schematic cross-section is as is illustrated by figs. 11 and 12.
Claims (7)
1. a kind of manufacturing method of two-sided printed board of sunkening cord, which is characterized in that it includes the following steps:
1) two 5 μm of thickness < of copper foil is attached to the two sides of the first support plate, obtaining a thickness and rigidity can meet commonly
First processing plate of equipment processing request, wherein two copper foils are smooth surface towards the first support plate on one side, back to the first support plate
Be on one side hair side；
2) two 5 μm of thickness < of copper foil is attached to the two sides of the second support plate, obtaining a thickness and rigidity can meet commonly
Second processing plate of equipment processing request, wherein two copper foils are smooth surface towards the second support plate on one side, back to the second support plate
Be on one side hair side, the hair side of two copper foils is coated with 2 μm of a layer thickness < of resin layer；
3) conventional drilling, dry film production are carried out to the first processing plate, film is moved back in plating, the copper foil hair side on the first processing plate two sides
Upper formation first line figure；
4) conventional laser drilling is carried out to the second processing plate, heavy copper, dry film production, film is moved back in plating, on the second processing plate two sides
The second line pattern is formed on resin layer, laser drill region is etched during forming the second line pattern, is formed
Windowed regions；
5) by an above step 3) the first processing plate, an above step 4 of the obtained figure containing first line) containing of obtaining
Second processing plate of the second line pattern, which is staggeredly superimposed, to be laminated, and the first processing plate and the second processing plate intermediate laminate one are exhausted
Edge layer material obtains the first printed board of multilayered structure；Wherein, first printed board is at least two by first line figure
The two-sided buried cable architecture that shape, the second line pattern and in-between insulating layer material are formed, and described two two-sided buried cable architectures
It is attached to the first processing plate two sides；
6) the second support plate that second processes in plate is removed from the first printed board, it is attached by two two-sided buried cable architectures obtains multiple
The second printed board for being formed on the first processing plate；
7) conventional laser drilling is carried out to the second printed board, sinks copper, be electroplated filling perforation, etchant flow makes in two-sided buried cable architecture the
One line pattern is connected with the second line pattern, and wherein laser drill position is the windowed regions that step 4) is formed, and etches journey
Degree is the resin layer just exposed in the second printed board；The first support plate that first processes in plate is removed again, obtains two Zhang Youshuan
Face sunken cord structure and its upper and lower surface copper foil and resin layer composition third printed board；
8) copper foil of third printed board upper and lower surface and resin layer are etched away respectively, obtains two-sided printed board of sunkening cord.
2. the manufacturing method according to claim 1, which is characterized in that in step 1), divided two copper foils using adhesive
It is not covered on the first support plate；And in step 7), the first support plate is torn in the joint place of the first support plate and two copper foils, from
And remove the first support plate.
3. the manufacturing method according to claim 1, which is characterized in that in step 2), divided two copper foils using adhesive
It is not covered on the second support plate；And in step 6), the second support plate is torn in the joint place of the second support plate and two copper foils, from
And remove the second support plate.
4. manufacturing method according to claim 1 or 2, which is characterized in that first support plate includes two copper foils and one
Core plate is opened, two copper foils are covered on the core plate two sides.
5. manufacturing method according to claim 1 or 3, which is characterized in that second support plate includes two copper foils and one
Core plate is opened, two copper foils are covered on the core plate two sides.
6. the manufacturing method according to claim 1, which is characterized in that in step 3), process plate first by addition process
Copper foil hair side on sunken cord sandwich circuit production.
7. the manufacturing method according to claim 1, which is characterized in that in step 4), process plate second by addition process
Resin layer surface on sunken cord sandwich circuit production.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610181691.9A CN107241875B (en) | 2016-03-28 | 2016-03-28 | A kind of manufacturing method of two-sided printed board of sunkening cord |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610181691.9A CN107241875B (en) | 2016-03-28 | 2016-03-28 | A kind of manufacturing method of two-sided printed board of sunkening cord |
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| Publication Number | Publication Date |
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| CN107241875A CN107241875A (en) | 2017-10-10 |
| CN107241875B true CN107241875B (en) | 2019-05-07 |
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| CN201610181691.9A Active CN107241875B (en) | 2016-03-28 | 2016-03-28 | A kind of manufacturing method of two-sided printed board of sunkening cord |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108112178A (en) * | 2017-12-25 | 2018-06-01 | 广州兴森快捷电路科技有限公司 | Circuit board fabrication method |
| CN108207082A (en) * | 2017-12-29 | 2018-06-26 | 上海美维科技有限公司 | A kind of method for laser machining line slot and making two-sided printed circuit board of sunkening cord |
| CN110650584B (en) * | 2018-06-26 | 2021-07-06 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN111405770B (en) * | 2020-03-19 | 2021-10-22 | 盐城维信电子有限公司 | Circuit board and manufacturing method thereof |
| CN111491459B (en) * | 2020-04-09 | 2022-06-21 | 江苏普诺威电子股份有限公司 | Manufacturing method of fine circuit substrate based on semi-additive method |
| CN112165773B (en) * | 2020-10-07 | 2022-10-11 | 广州添利电子科技有限公司 | Process for manufacturing graph in circuit burying mode |
| CN113365430A (en) * | 2021-06-15 | 2021-09-07 | 西安微电子技术研究所 | Processing method of circuit flush printed board |
| CN114137383A (en) * | 2022-02-08 | 2022-03-04 | 广东科翔电子科技股份有限公司 | High-precision Mini-LED board electric measurement method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102939803A (en) * | 2010-06-08 | 2013-02-20 | 松下电器产业株式会社 | Multilayer wiring substrate, and manufacturing method for multilayer wiring substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101222828B1 (en) * | 2011-06-24 | 2013-01-15 | 삼성전기주식회사 | Method of manufacturing coreless substrate |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102939803A (en) * | 2010-06-08 | 2013-02-20 | 松下电器产业株式会社 | Multilayer wiring substrate, and manufacturing method for multilayer wiring substrate |
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