CN107241875A - A kind of manufacture method of two-sided printed board of sunkening cord - Google Patents
A kind of manufacture method of two-sided printed board of sunkening cord Download PDFInfo
- Publication number
- CN107241875A CN107241875A CN201610181691.9A CN201610181691A CN107241875A CN 107241875 A CN107241875 A CN 107241875A CN 201610181691 A CN201610181691 A CN 201610181691A CN 107241875 A CN107241875 A CN 107241875A
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- China
- Prior art keywords
- plate
- support plate
- printed board
- processing
- copper foil
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Abstract
A kind of manufacture method of two-sided printed board of sunkening cord, comprises the following steps：Two extra thin copper foils are attached to the first support plate two sides and obtain the first processing plate；The extra thin copper foil of two coated with resins layers is attached to the second support plate two sides and obtains the second processing plate；First line figure is made on the first processing plate copper foil, the second line pattern is made on the second processing plate resin bed；Then it is superimposed by being laminated to interlock multiple plates for having made line pattern between pressing, two plates using PP as insulating barrier, obtains the first printed board, then remove the second support plate；By laser drilling blind hole, plating filling perforation etc. turns on first, second line pattern, then electro-coppering is etched away, and now being sunken cord due to the second line pattern outside layer has resin bed that layer of sunkening cord can be protected to be not etched by；The first support plate is removed again, the copper foil and resin bed on surface is etched away, obtains two-sided printed board of sunkening cord.The present invention efficiently solves the problem of two-sided layer conducting of sunkening cord, and sunken cord layer planarization and reliability is substantially improved.
Description
Technical field
The present invention relates to the manufacture method of printed circuit board, and in particular to a kind of two-sided printed board of sunkening cord
Manufacture method.
Background technology
With flourishing for electronic industry, electronic product comes into functionalization, intelligentized research and development
In the stage, to meet electronic product high integration, miniaturization, the development need being miniaturized, meeting electricity
On the premise of the good electricity of sub- product, hot property, printed circuit board or semiconductor integrated circuit package base
Plate also develops towards light, thin, short, small designer trends.Design simultaneously for electronic system is needed
Ask and also become increasingly complex, and develop towards different directions.Electronic product of new generation is with design size
Progressively diminish, interconnection density of all products on design level is also continuously increased.That is,
, it is necessary to design more input/output signal circuits in more and more limited surface area.
Based on above demand, current industry is continued to develop on the thinner thinner route of printed circuit board,
And the design and processing of printed circuit panel products are carried out by the mode of sunkening cord, it can not only be buried by circuit
Entering the mode of base material reduces thickness of slab, simultaneously as the mode of sunkening cord is that circuit is directly embedded into base material, no
There is conventional line and make necessary etchant flow, therefore, it can substantially reduce circuit line width and
Away from.Although environment and process operation be very to external world in process after reducing due to line width, spacing
Sensitivity, is easily scraped off and comes off, but the fine rule road for product of sunkening cord is constantly in the state being embedded in resin,
Protected well in being made after, the more conventional production procedure of yield has greatly improved.
Current one side product of sunkening cord has been used widely, but two-sided sunken cord is not promoted also, mainly
Reason is that the two-sided layer conduction mode of sunkening cord after processing is not well solved.Current double-side conduction
Main method be process two-sided layer of sunkening cord, then led by way of drilling, plating, etching
It is logical, but because the copper electroplating layer needed for double-side conduction is thicker, etching is difficult to ensure that uniformity, can damage
Sunken cord layer, cause a layer out-of-flatness of sunkening cord, lose the meaning for processing of sunkening cord.
The content of the invention
It is an object of the invention to provide a kind of manufacture method of two-sided printed board of sunkening cord, overcome above-mentioned existing
There is shortcoming and defect present in technology, it is to avoid layer of sunkening cord passes through etchant flow, lift layer of sunkening cord smooth
Property and reliability, and do not need special equipment or machining tool, when can be greatly reduced production
Cost and risk, improves product quality and yield.
To reach above-mentioned purpose, the technical scheme is that：
A kind of manufacture method of two-sided printed board of sunkening cord, it comprises the following steps：
1) two 5 μm of thickness ＜ copper foil is attached to the two sides of the first support plate, a thickness is obtained and firm
Degree can meet the first processing plate of conventional equipment processing request, wherein, two copper foils are carried towards first
The one side of plate is smooth surface, and the one side back to the first support plate is hair side；
2) two 5 μm of thickness ＜ copper foil is attached to the two sides of the second support plate, a thickness is obtained and firm
Degree can meet the second processing plate of conventional equipment processing request, wherein, two copper foils are carried towards second
The one side of plate is smooth surface, and the one side back to the second support plate is hair side, the hair side of two copper foils
It has been coated with 2 μm of a layer thickness ＜ resin bed；
3) conventional drilling is carried out to the first processing plate, dry film makes, film is moved back in plating, in the first processing
First line figure is made on the copper foil hair side on plate two sides；
4) conventional laser drilling is carried out to the second processing plate, heavy copper, dry film is made, and film is moved back in plating,
The second line pattern is made on the resin surface on the second processing plate two sides, laser drilling porose area during being somebody's turn to do
Domain is etched, and forms windowed regions；
5) by an above step 3) the first processing plate of the obtained figure containing first line, one with
Upper step 4) superposition that interlocks of the obtained processing plate of second containing the second line pattern is laminated, and the
One processing plate and the insulating layer material of the second processing plate intermediate laminate one, obtain the first printing of sandwich construction
Plate；Wherein, first printed board has at least two by first line figure, the second line pattern
And its two-sided buried cable architecture of middle insulating layer material formation, and described two two-sided buried cable architectures are attached
On the first processing plate two sides；
6) the second support plate is removed from the first printed board, obtains multiple by two pieces of two-sided plate attachments of sunkening cord
The second printed board formed on the first processing plate；
7) conventional laser drilling is carried out to the second printed board, heavy copper electroplates filling perforation, etchant flow makes
First line figure and the second line pattern are turned on, and wherein laser drill position is step 4) formed
Windowed regions, and etching degree is just to expose the resin bed in the second printed board；Again by the first processing
The first support plate in plate is removed, and obtains two by two-sided plate and its copper foil and resin of upper and lower surface of sunkening cord
3rd printed board of layer composition；
8) copper foil and resin bed in the 3rd printed board upper and lower surface are etched away respectively, obtains two-sided buried
Line printed board.
Further, step 1) in, two copper foils are covered in the first support plate respectively using adhesive,
And in step 7) in, the first support plate is torn in the joint place of the first support plate and two copper foils, removed
First support plate.
Step 2) in, two copper foils are covered on the second support plate respectively using adhesive；In step
6) in, the second support plate is torn in the joint place of the second support plate and two copper foils, the second support plate is removed.
It is preferred that, first support plate includes two copper foils and a core plate, and two copper foils are pasted
In the core plate two sides.
It is preferred that, second support plate includes two copper foils and a core plate, and two copper foils are pasted
In the core plate two sides.
Again, step 3) in, layer of sunkening cord is carried out on the copper foil hair side of the first processing plate by addition process
Circuit makes.
Step 4) in, layer line of sunkening cord is carried out on the resin layer surface of the second processing plate by addition process
Road makes.
It is preferred that, step 5) in, the insulating layer material is polypropylene (PP) resin material.
Resin bed used of the invention is the conventional resin material in this areas such as ink, epoxy resin, at this
Heavy copper plating can be carried out on resin bed, and ensures that it has good combination power between layers of copper.
In the present invention, in step 7) in carry out heavy copper to splitting obtained the second printed board for the first time,
Filling perforation is electroplated, etchant flow all etches away the copper of resin layer surface, and due to the guarantor of resin bed
Shield, the layer of sunkening cord of the second printed board do not destroy, and because laser hole is by complete filling perforation, in laser hole
Layers of copper is not also destroyed, and realizes the conducting of two-sided layer of sunkening cord.
In step 7) in, by the second printed board by laser drill and plating burying two plates of sunkening cord
Line layer T faces/B faces conducting, realize the interconnection of two-sided layer of sunkening cord；To having been carried out layer drilling interconnection of sunkening cord
The second printed board split again along two extra thin copper foils and first vector joint place, first vector is removed,
Obtain the 3rd printed board.
In step 8) in, the extra thin copper foil on the surface of the 3rd printed board one is led into overetched mode
Remove, the resin bed on another side is removed by way of resin is etched, the mode of resin etching includes mill
Brush, alkalinity potassium permanganate desmearing mode or plasma desmearing mode.
Beneficial effects of the present invention：
The present invention realizes the high-volume processing of two-sided printed board product of sunkening cord, and two-sided plate fractionation of sunkening cord
Open by conventional drilling after the second support plate, heavy copper, plating, etchant flow realizes two-sided layer of sunkening cord
Conducting, and by the protection of the second processing plate surface resin bed, layer of sunkening cord will not be etched liquid medicine destruction,
Avoid layer of sunkening cord and pass through etchant flow, greatly promote the planarization and reliability of layer of sunkening cord, and be not required to
Special equipment or machining tool are wanted, cost and risk during production is greatly reduced, product product are improved
Matter and yield.
Brief description of the drawings
Fig. 1 is the schematic cross-section of the first processing plate in the embodiment of the present invention.
Fig. 2 is the schematic cross-section of the second processing plate in the embodiment of the present invention.
Fig. 3 is the section signal after first line figure processed on Fig. 1 the first processing plate copper foil hair side
Figure.
Fig. 4 is that the section made on Fig. 2 the second processing plate resin layer surface after the second line pattern shows
It is intended to.
Fig. 5 be the embodiment of the present invention in step 5) prepare the first printed board schematic cross-section.
Fig. 6 be the embodiment of the present invention in step 6) prepare the second printed board schematic cross-section.
Fig. 7 be the embodiment of the present invention in step 7) laser drill, plating after the second printed board section
Schematic diagram.
Fig. 8 is step 7 in the embodiment of the present invention) etch the second printed board after copper on removal resin bed
Schematic cross-section.
Fig. 9 is step 8 in the embodiment of the present invention) remove section that the 3rd printed board is obtained after the first support plate
One of face schematic diagram.
Figure 10 is step 8 in the embodiment of the present invention) remove section that the 3rd printed board is obtained after the first support plate
The two of face schematic diagram.
Figure 11 be the embodiment of the present invention in step 9) prepare two-sided printed board of sunkening cord schematic cross-section
One of.
Figure 12 be the embodiment of the present invention in step 9) prepare two-sided printed board of sunkening cord schematic cross-section
Two.
Embodiment
With reference to embodiment and accompanying drawing, the present invention will be further described.
Referring to Fig. 1-Figure 12, the manufacture method of two-sided printed board of sunkening cord of the present invention mainly made
Journey is as follows：
1) two 5 μm of thickness ＜ extra thin copper foil 11,11 ' is pasted with smooth surface by adhesive
On the first support plate 10, conventional equipment processing request can be met by obtaining a thickness and rigidity
First processing plate, the first processing plate schematic cross-section is as shown in Figure 1；Wherein, described first
Support plate 10 is made up of two copper foils 101,101 ' and a core plate 100.
2) hair side is coated to 5 μm of the thickness ＜ of 2 μm of a layer thickness ＜ resin bed 22 ultra-thin copper
Paper tinsel 21, hair side coat 5 μm of the thickness ＜ of one layer of resin bed 22 ' extra thin copper foil 21 ' with smooth surface
It is covered in by adhesive on Second support 20, obtaining a thickness and rigidity can meet commonly
Second processing plate of equipment processing request, the second processing plate schematic cross-section is as shown in Figure 2；
Wherein, the second support plate 20 is made up of two copper foils 201,201 ' and a core plate 200.
3) in step 1) formed first processing plate copper foil 11,11 ' hair sides pass through addition process
Drilling, pad pasting is exposed, and develops, and film flow first line figure 12,12 ' is moved back in plating,
The first processing plate schematic cross-section is as shown in Figure 3 after processing.
4) in step 2) resin bed 22,22 ' surfaces pass through addition on the second processing plate for being formed
Method (drilling, heavy copper, pad pasting is exposed, and develops, and film flow is moved back in plating) second circuit of system
Need laser drill etching away regions to do windowing processing in figure 23,23 ', process, formed
Windowed regions A, is that first, second line pattern of follow-up conducting prepares, the second processing after processing
Plate schematic cross-section is as shown in Figure 4.
5) by multiple steps 3), step 4) processing after first processing plate, second processing plate hand over
Mistake superposition, centre is using insulating barriers 30 of the PP (acrylic resin) as plate of sunkening cord, by its layer
Pressure obtains the first printed board of sandwich construction, and the first printed board schematic cross-section is as shown in Figure 5.
6) the first printed board is torn along copper foil 21,21 ' with the joint place of Second support 20, removed
Second support 20, is formed by two two-sided one the first support plates 10 of plate midfeather of sunkening cord
Second printed board, the second printed board schematic cross-section is as shown in Figure 6.
7) by the second printed board is by laser drill and electroplates second of two plates of sunkening cord on support plate
Line pattern 23 and first line figure 12 ', the second line pattern 23 ' and first line figure
Shape 12 is turned on by conductive material in through hole B, realizes the two-sided interconnection sunken cord, laser drilling hole position
Put in step 4) formed windowed regions A, step 4) the region copper is etched away, can
Directly drill, copper foil 21,21 ' is thickened during plating, its schematic cross-section is as schemed
Shown in 7；The copper foil 21,21 ' of thickening is removed by etchant flow, that is, removed on resin bed
Copper, due to there is a protection of resin bed 22,22 ', the second line pattern 23,23 ' not by
Destruction, the second printed board schematic cross-section is as shown in Figure 8 after etching.
8) step 7) obtained the second printed board fits along copper foil 11,11 ' with first vector 10
Place is torn, and is removed Second support 10, is obtained two mutually isostructural 3rd printed boards, its section
Schematic diagram is as shown in Figure 9 and Figure 10.
9) copper foil 11,11 ' on the 3rd printed board first line figure 12,12 ' surfaces is lost again
Carve and remove, and the second line pattern 23, the etching removal of resin bed 22,22 ' on 23 ' surfaces (can
To use the methods such as polish-brush, permanganic acid desmearing or plasma desmearing), obtain two-sided sunken cord
Printed board, its schematic cross-section is as is illustrated by figs. 11 and 12.
Claims (7)
1. a kind of manufacture method of two-sided printed board of sunkening cord, it is characterised in that it comprises the following steps：
1) two 5 μm of thickness ＜ copper foil is attached to the two sides of the first support plate, a thickness is obtained and firm
Degree can meet the first processing plate of conventional equipment processing request, wherein, two copper foil directions
The one side of first support plate is smooth surface, and the one side back to the first support plate is hair side；
2) two 5 μm of thickness ＜ copper foil is attached to the two sides of the second support plate, a thickness is obtained and firm
Degree can meet the second processing plate of conventional equipment processing request, wherein, two copper foil directions
The one side of second support plate is smooth surface, and the one side back to the second support plate is hair side, and described two
The hair side for opening copper foil is coated with 2 μm of a layer thickness ＜ resin bed；
3) conventional drilling is carried out to the first processing plate, dry film makes, film is moved back in plating, in the first processing
First line figure is formed on the copper foil hair side on plate two sides；
4) conventional laser drilling is carried out to the second processing plate, heavy copper, dry film is made, and film is moved back in plating,
The second line pattern is formed on the resin bed on the second processing plate two sides, laser drilling during being somebody's turn to do
Bore region is etched, and forms windowed regions；
5) by an above step 3) the first processing plate of the obtained figure containing first line, one with
Upper step 4) obtain containing the second line pattern second processing plate interlock superposition be laminated,
And first processing plate and the insulating layer material of the second processing plate intermediate laminate one, obtain sandwich construction
The first printed board；Wherein, first printed board has at least two by first line figure
The two-sided buried cable architecture of the insulating layer material formation of shape, the second line pattern and its centre, and
Described two two-sided buried cable architectures are attached to the first processing plate two sides；
6) the second the second support plate processed in plate is removed from the first printed board, obtains multiple by two
Two-sided buried cable architecture is attached to the second printed board formed on the first processing plate；
7) conventional laser drilling is carried out to the second printed board, heavy copper electroplates filling perforation, etchant flow makes
First line figure and the second line pattern are turned in two-sided buried cable architecture, wherein laser drill
Position is step 4) windowed regions that are formed, and etching degree is just exposes the second printing
Resin bed on plate；The first support plate that first is processed in plate again is removed, and obtains two by double
Face sunken cord structure and its upper and lower surface copper foil and resin bed composition the 3rd printed board；
8) copper foil and resin bed of the 3rd printed board upper and lower surface are etched away respectively, obtains two-sided sunken cord
Printed board.
2. manufacture method according to claim 1, it is characterised in that step 1) in, using cohering
Two copper foils are covered on the first support plate by agent respectively；And in step 7) in, the first support plate with
The first support plate is torn in the joint place of two copper foils, so as to remove the first support plate.
3. manufacture method according to claim 1, it is characterised in that step 2) in, using cohering
Two copper foils are covered on the second support plate by agent respectively；And in step 6) in, the second support plate with
The second support plate is torn in the joint place of two copper foils, so as to remove the second support plate.
4. manufacture method according to claim 1 or 2, it is characterised in that the first support plate bag
Two copper foils and a core plate are included, two copper foils are covered on the core plate two sides.
5. the manufacture method according to claim 1 or 3, it is characterised in that the second support plate bag
Two copper foils and a core plate are included, two copper foils are covered on the core plate two sides.
6. manufacture method according to claim 1, it is characterised in that step 3) in, pass through addition
Method carries out sandwich circuit making of sunkening cord on the copper foil hair side of the first processing plate.
7. manufacture method according to claim 1, it is characterised in that step 4) in, pass through addition
Method carries out sandwich circuit making of sunkening cord on the resin layer surface of the second processing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610181691.9A CN107241875B (en) | 2016-03-28 | 2016-03-28 | A kind of manufacturing method of two-sided printed board of sunkening cord |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610181691.9A CN107241875B (en) | 2016-03-28 | 2016-03-28 | A kind of manufacturing method of two-sided printed board of sunkening cord |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107241875A true CN107241875A (en) | 2017-10-10 |
| CN107241875B CN107241875B (en) | 2019-05-07 |
Family
ID=59983836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610181691.9A Active CN107241875B (en) | 2016-03-28 | 2016-03-28 | A kind of manufacturing method of two-sided printed board of sunkening cord |
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| CN (1) | CN107241875B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108112178A (en) * | 2017-12-25 | 2018-06-01 | 广州兴森快捷电路科技有限公司 | Circuit board fabrication method |
| CN108207082A (en) * | 2017-12-29 | 2018-06-26 | 上海美维科技有限公司 | A kind of method for laser machining line slot and making two-sided printed circuit board of sunkening cord |
| CN110650584A (en) * | 2018-06-26 | 2020-01-03 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN111405770A (en) * | 2020-03-19 | 2020-07-10 | 盐城维信电子有限公司 | Circuit board and manufacturing method thereof |
| CN111491459A (en) * | 2020-04-09 | 2020-08-04 | 江苏普诺威电子股份有限公司 | Manufacturing method of fine circuit substrate based on semi-additive method |
| CN112165773A (en) * | 2020-10-07 | 2021-01-01 | 广州添利电子科技有限公司 | Process for manufacturing pattern in circuit burying mode |
| CN113365430A (en) * | 2021-06-15 | 2021-09-07 | 西安微电子技术研究所 | Processing method of circuit flush printed board |
| CN114137383A (en) * | 2022-02-08 | 2022-03-04 | 广东科翔电子科技股份有限公司 | High-precision Mini-LED board electric measurement method |
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| US20120324723A1 (en) * | 2011-06-24 | 2012-12-27 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing coreless substrate |
| CN102939803A (en) * | 2010-06-08 | 2013-02-20 | 松下电器产业株式会社 | Multilayer wiring substrate, and manufacturing method for multilayer wiring substrate |
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| CN102939803A (en) * | 2010-06-08 | 2013-02-20 | 松下电器产业株式会社 | Multilayer wiring substrate, and manufacturing method for multilayer wiring substrate |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108112178A (en) * | 2017-12-25 | 2018-06-01 | 广州兴森快捷电路科技有限公司 | Circuit board fabrication method |
| CN108207082A (en) * | 2017-12-29 | 2018-06-26 | 上海美维科技有限公司 | A kind of method for laser machining line slot and making two-sided printed circuit board of sunkening cord |
| CN110650584A (en) * | 2018-06-26 | 2020-01-03 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN110650584B (en) * | 2018-06-26 | 2021-07-06 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN111405770A (en) * | 2020-03-19 | 2020-07-10 | 盐城维信电子有限公司 | Circuit board and manufacturing method thereof |
| CN111405770B (en) * | 2020-03-19 | 2021-10-22 | 盐城维信电子有限公司 | Circuit board and manufacturing method thereof |
| CN111491459A (en) * | 2020-04-09 | 2020-08-04 | 江苏普诺威电子股份有限公司 | Manufacturing method of fine circuit substrate based on semi-additive method |
| CN112165773A (en) * | 2020-10-07 | 2021-01-01 | 广州添利电子科技有限公司 | Process for manufacturing pattern in circuit burying mode |
| CN112165773B (en) * | 2020-10-07 | 2022-10-11 | 广州添利电子科技有限公司 | Process for manufacturing graph in circuit burying mode |
| CN113365430A (en) * | 2021-06-15 | 2021-09-07 | 西安微电子技术研究所 | Processing method of circuit flush printed board |
| CN114137383A (en) * | 2022-02-08 | 2022-03-04 | 广东科翔电子科技股份有限公司 | High-precision Mini-LED board electric measurement method |
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