CN104768332B - Printed wiring board with long and short golden finger and preparation method thereof - Google Patents
Printed wiring board with long and short golden finger and preparation method thereof Download PDFInfo
- Publication number
- CN104768332B CN104768332B CN201410008621.4A CN201410008621A CN104768332B CN 104768332 B CN104768332 B CN 104768332B CN 201410008621 A CN201410008621 A CN 201410008621A CN 104768332 B CN104768332 B CN 104768332B
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- internal layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The present invention is applied to the technical field of printed wiring board, there is provided a kind of preparation method of the printed wiring board with long and short golden finger, it is intended to solve the problem of golden finger is arranged at printed wiring board outer layer and causes assembling space excessive and be difficult to ensure that reliability in the prior art.There is the preparation method of the printed wiring board of long and short golden finger to include internal layer golden finger for this, it is cut by laser internal substrate, milling prepreg, the step of pressing and outer layer golden finger, by making internal layer golden finger on interior sandwich circuit board, internal substrate after being cut through using laser cutting internal substrate but reservation, after pressing outer layer golden finger is made on the first outermost layer substrate surface, and cut off the second outermost layer substrate above internal layer golden finger and internal substrate by way of gong platform to form the step-like printed wiring board with embedded internal layer golden finger, it is effectively protected the quality of the embedded internal layer golden finger, and efficiently reduce the assembling space of printed wiring board, and ensure that and use reliability.
Description
Technical field
The invention belongs to the technical field of printed wiring board, more particularly to a kind of printed wiring board with long and short golden finger
Preparation method and using the preparation method formation printed wiring board.
Background technology
In printed wiring board, golden finger is conventional connected mode.Common golden finger has common golden finger, disconnected section of gold
Finger, long and short golden finger etc., moreover, these golden fingers are generally arranged at the outer layer of printed wiring board, so, golden finger position
The overall thickness of slab of thickness and printed wiring board is same or similar, in order to process.However, during actual assembled, having
The printed wiring board of this golden finger but increases assembling space, and product reliability is difficult to ensure that.
At present, the flow that golden finger is made on printed wiring board is as follows：Preceding process → heavy copper → plate electricity → outer graphics turn
Shifting → graphic plating → alkali etching → AOI detections → silk-screen welding resistance protection gold finger lead → golden finger windowing figure (is used for
Dry film protects the circuit in the golden region of non-electrical, exposes golden finger) → electric golden finger (simply being made of golden finger line) → moving back film (will be dry
Film and solder mask move back wash clean) → silk-screen welding resistance → gold finger lead windowing figure (protects the line in the golden region of non-electrical with dry film
Road, exposes gold finger lead) → etching gold finger lead → move back film → process adhesive tape (protection golden finger position) → surface treatment →
Process afterwards.The preparation method is only applicable to outer-layer circuit golden finger, i.e., golden finger is made on outer circuit.However, with
Complicated various and electronic product golden finger pulling/inserting structure difficulty increase of printed wiring board kind of design, to golden hand on wiring board
The position of finger has also been deducted a percentage higher requirement, and the outer layer of assist side, which makes golden finger, can not meet current circuit board development
Demand.
The content of the invention
It is an object of the invention to provide a kind of preparation method of the printed wiring board with long and short golden finger, by by gold
Finger, which is embedded in, is arranged at the internal layer of printed wiring board, it is intended to solve golden finger in the prior art be arranged at printed wiring board outer layer and
The problem of causing assembling space excessive and be difficult to ensure that reliability.
The present invention is achieved in that a kind of preparation method of the printed wiring board with long and short golden finger, and its feature exists
In comprising the following steps：
Internal layer golden finger, the step of making internal layer golden finger includes：Internal layer circuit plate is provided, the internal layer circuit plate is at least
The first metal layer and second metal layer including facing setting, the first metal layer include the interior layer line with line pattern
Road region, internal layer gold finger lead area and internal layer golden finger area, the internal layer gold finger lead area are arranged at the interior layer line
Between road region and the internal layer golden finger area；Internal layer ink for screen printing, in the internal layer circuit region and the golden hand of the internal layer
The anti-electric bronze ink of silk-screen printing and anti-electric polishes layer of ink is formed on index wire region；First outer graphics, by dry film be attached at through
Internal layer ink for screen printing processing after the anti-electric polishes layer of ink on and the exposed internal layer golden finger area；Electrical inner layer golden finger,
Plating gold is carried out to the internal layer golden finger area to handle and form the internal layer golden finger with Gold plated Layer；Internal layer moves back film, removes
The dry film on the first metal layer surface；First silk-screen welding resistance, is scraped using scraper and smears solder mask, and the solder mask is saturating
Cross the surface that screen cloth forms positive pattern and is imprinted on the part internal layer gold finger lead region and part the internal layer golden finger
On；Paste in finished products of adhesive tapes, the Gold plated Layer that finished products of adhesive tapes is fitted in the internal layer golden finger；
Be cut by laser internal substrate, the internal substrate include the Part I facing with the internal layer golden finger and
With the facing Part II of the internal layer gold finger lead and internal layer circuit region, using laser along the Part I and institute
The junction for stating Part II is cut by laser, and is cut through the internal substrate and is retained the Part I after cut-out and institute
State Part II；
Milling prepreg, the prepreg includes the be arranged between the internal layer circuit plate and the internal substrate
One prepreg, Milling Process is carried out to first prepreg；
Pressing is there is provided the first outermost layer substrate and the second outermost layer substrate and the prepreg, and the prepreg also includes
Second prepreg and the 3rd prepreg, press second outermost layer substrate, second semi-solid preparation being cascading
Piece, the internal substrate, first prepreg, the internal layer circuit plate, outside the 3rd prepreg and described first
Laminar substrate simultaneously obtains the printed wiring board；
Outer layer golden finger, the first outermost layer substrate surface includes the outer-layer circuit region with line pattern, outer layer gold
Finger lead areas and outer layer golden finger area, the outer layer gold finger lead region be arranged at the outer-layer circuit region with it is upper
State between outer layer golden finger area, the step of making outer layer golden finger includes：Outer layer ink for screen printing, the printed wiring after pressing
The anti-electric bronze ink of the first outermost layer substrate surface screen-printed of plate and in the outer layer gold finger lead region and described outer
Anti- electric polishes layer of ink is formed on sandwich circuit region；Second outer graphics, the anti-electric bronze ink layer surface is attached at simultaneously by dry film
The exposed outer layer golden finger area；Electric outer layer golden finger, plating gold is carried out to the outer layer golden finger area and handles and is formed
Outer layer golden finger with Gold plated Layer；First outer layer moves back film, removes the dry film on the first outermost layer substrate surface；Gong is put down
Platform, using the cutting position in the deep step along laser cutting of gong machine control by second outermost layer substrate and second prepreg
Gong is worn.
Further, in the step of milling prepreg, to the institute between the internal substrate and the internal layer circuit plate
State the first prepreg and carry out windowing processing, the position of first prepreg windowing processing be located at the internal layer golden finger with
The junction of the solder mask；First prepreg includes the first sub- prepreg and positioned at the described first sub- semi-solid preparation
The second sub- prepreg between piece and the internal substrate, the first sub- prepreg forms the first window after being handled through windowing
Mouthful and the first window size be 1.2 millimeters, the second sub- prepreg formed after being handled through windowing the second window and
The size of second window is 0.2 millimeter.
Further, in the step of making internal layer golden finger, the step of the first local electricity gold is included, to through electrical inner layer
Gold plated Layer after golden finger processing carries out second time electroplating gold processing.
Further, in the step of making outer layer golden finger, the step of the second local electricity gold is included, to through electric outer layer
Gold plated Layer after golden finger processing carries out second time electroplating gold processing.
Further, the internal layer circuit plate is multilayer circuit board structure and covers copper foil core plate including multiple, it is each described in cover
Copper foil core plate include copper foil layer, the step of internal layer ink for screen printing before it is further comprising the steps of：Inner figure, using anti-etching
Mask and negative egative film, will form positive figure in pattern transfer to each copper foil layer；Internal layer is etched, will using acid etching
Positive figure on each copper foil layer is etched to form corresponding line pattern；Brown, to the line pattern
Copper foil layer carries out oxidation processes and forms oxide layer on the copper foil layer；Pressing, each copper foil core plate that covers is stacked,
Bonded between each layer core plate using prepreg, and to being stacked after described in cover copper foil core plate carry out pressing processing shape
Into the internal layer circuit plate；Except gummosis, the resin gummosis of the internal layer circuit plate surface residual after pressing processing is removed；Internal layer is bored
Hole, the first via hole of each copper-clad plate core plate of Drilling operation formation connection is carried out to the internal layer circuit plate；Heavy copper, to institute
The hole wall for stating the first via hole carries out copper-coating and forms the first layers of copper on the hole wall of first via hole；Resin plug
Hole, first via hole is filled using resin ink；Abrasive belt grinding, the internal layer circuit plate surface of polishing, remove it is viscous stay in
Impurity in the internal layer circuit plate surface.
Preferably, the step of making internal layer golden finger also include being arranged at internal layer move back film step and patch finished products of adhesive tapes step it
Between the step of：3rd outer graphics, the first metal layer surface is attached at by dry film, by exposed and developed turn of film figure
The internal layer circuit region and internal layer gold finger lead region on the first metal layer surface is moved to form line pattern；Outside first
Layer etching, is etched away unexposed dew copper during the 3rd outer graphics using alkali etching；Second outer layer moves back film, and dissolving is simultaneously
Clean the film.
Further, be cut by laser the internal substrate the step of in, the internal substrate include core material and
First layers of copper and second layers of copper of the core material with respect to two surfaces are arranged at, is carried out before being cut by laser the internal substrate
Inner figure and internal layer etching, during inner figure, first layers of copper and described the are transferred to by film figure respectively
In two layers of copper, in internal layer etching process, first layers of copper and second layers of copper are etched to form internal layer
Line pattern；Brown processing is carried out again after the internal substrate is cut by laser, the institute to forming the inner line figure
State the first layers of copper and second layers of copper carries out oxidation processes and formed respectively in first layers of copper and second layers of copper
Oxide layer.
Further, the step of making outer layer golden finger also include being arranged at pressing step and outer layer ink for screen printing step it
Between the step of：Outer layer drills, and the printed wiring board after handling pressing carries out Drilling operation and respectively outside described first
The second conducting being mutually communicated with first via hole is formed on laminar substrate, the internal substrate and second outermost layer substrate
Hole；Heavy copper, carries out copper-coating to the hole wall of second via hole and forms second on the hole wall of second via hole
Layers of copper；Fourth external layer figure, the second outermost layer substrate surface is attached at by dry film, by the exposed and developed transfer of film figure
To the second outermost layer substrate surface to form line pattern；Second outer layer is etched, using alkali etching by fourth external layer figure
During it is unexposed dew copper etch away；Second silk-screen welding resistance, is scraped using scraper and smears solder mask, and the solder mask passes through net
Cloth formation conformality pattern is simultaneously imprinted on the second outermost layer substrate surface.
Preferably, the step of making outer layer golden finger is additionally included in the step of the first outer layer is moved back after film：5th outer layer figure
Shape, the first outermost layer substrate surface is attached at by dry film, is transferred to first outer layer by film figure is exposed and developed
The outer-layer circuit region of substrate surface and the outer layer golden finger area；3rd outer layer is etched, using alkali etching by the
Unexposed dew copper is etched away during five outer graphics；Silk-screen character, is scraped using scraper and smears legend ink and by the character
Ink print writes on the first outermost layer substrate surface；Shaping, processing and forming is carried out to the printed wiring board；Hypotenuse, to described
Internal layer golden finger and the outer layer golden finger carry out hypotenuse processing.
Present invention also offers a kind of printed wiring board with long and short golden finger, the printed wiring board uses above-mentioned tool
The preparation method for having the printed wiring board of long and short golden finger is processed.
The preparation method for the printed wiring board with long and short golden finger that the present invention is provided is first by interior sandwich circuit board
Upper making internal layer golden finger, and be attached on the internal layer golden finger to prevent prepreg in bonding processes with finished products of adhesive tapes
Dust falls on the internal layer golden finger, the internal substrate after being cut through using the laser cutting internal substrate but reservation, to prevent
The problem of printed wiring plate surface occurs uneven after only pressing；To be adhered between internal layer circuit plate and internal substrate half
Cured sheets carry out Milling Process to prevent the prepreg to be adhered on the internal layer golden finger；After pressing outside described first
Laminar substrate surface makes outer layer golden finger, and cuts off by way of gong platform the second outer layer base above the internal layer golden finger
Plate and internal substrate simultaneously remove the finished products of adhesive tapes attached on the internal layer golden finger surface, have the golden hand of embedded internal layer to be formed
The step-like printed wiring board referred to, is effectively protected the quality of the embedded internal layer golden finger, and efficiently reduce print
The assembling space of wiring board processed, and ensure that and use reliability.
Brief description of the drawings
Fig. 1 is the completion electrical inner layer golden finger step provided in an embodiment of the present invention on the first metal layer of interior sandwich circuit board
Structural representation afterwards.
Fig. 2 is provided in an embodiment of the present invention completed on the first metal layer of interior sandwich circuit board after patch finished products of adhesive tapes step
Structural representation.
Fig. 3 is the structural representation provided in an embodiment of the present invention that internal layer golden finger is made on interior sandwich circuit board.
Fig. 4 is the structural representation of laser cutting internal substrate provided in an embodiment of the present invention.
Fig. 5 is the structural representation provided in an embodiment of the present invention that outer layer golden finger is made on the first outermost layer substrate.
Fig. 6 is the structure provided in an embodiment of the present invention that internal layer golden finger and outer layer golden finger are made on printed wiring board
Schematic diagram.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It refer to Fig. 1 to Fig. 6, the preparation method of the printed wiring board provided in an embodiment of the present invention with long and short golden finger
Comprise the following steps：
Internal layer golden finger, the step of making internal layer golden finger includes：Internal layer circuit plate 10, the internal layer circuit plate 10 are provided
The first metal layer 11 and second metal layer 12 at least including facing setting, the first metal layer 11 include having line map
Internal layer circuit region 111, internal layer gold finger lead area 112 and the internal layer golden finger area 113 of shape, the internal layer gold finger lead
Area 112 is arranged between the internal layer circuit region 111 and the internal layer golden finger area 113；Internal layer ink for screen printing, described
The anti-electric bronze ink of silk-screen printing and anti-electric polishes is formed on internal layer circuit region 111 and the internal layer gold finger lead region 112
Layer of ink 114；First outer graphics, dry film is attached in the anti-electric polishes layer of ink 114 after being handled through internal layer ink for screen printing
And the exposed internal layer golden finger area 113；Electrical inner layer golden finger, plating Jin Chu is carried out to the internal layer golden finger area 113
Manage and form the internal layer golden finger 13 with Gold plated Layer；Internal layer moves back film, removes the dry film on the surface of the first metal layer 11；
First silk-screen welding resistance, is scraped using scraper and smears solder mask 14, and the solder mask 14 forms positive pattern and be imprinted on through screen cloth
On the surface of the part internal layer gold finger lead region 112 and part the internal layer golden finger 13；Finished products of adhesive tapes 15 is pasted, will be into
Product adhesive tape 15 is fitted in the Gold plated Layer of the internal layer golden finger 13；It is to be appreciated that by the first outer graphics to protect
The internal layer circuit region 111 and internal layer gold finger lead region 112 on the surface of the first metal layer 11 are stated, and passes through the golden hand of electrical inner layer
The step of finger, to form internal layer golden finger 13 in internal layer golden finger area 113, makes internal layer golden finger 13 and the first metal layer 11
The line pattern electrical connection of upper formation, and fitted in using finished products of adhesive tapes 15 in the Gold plated Layer of the internal layer golden finger 13 to protect
Internal layer golden finger 13 is stated, prevents that dust falls on the internal layer golden finger 13 during following process.Preferably, in the internal layer
It is printed with solder mask 14 on the surface of golden finger 13, the solder mask 14 is along the internal layer golden finger 13 to the golden hand of the internal layer
Extend in index wire region 112, that is, the solder mask 14 formed is arranged at the internal layer golden finger 13 and the golden hand of the internal layer
The junction on the surface of index wire region 112 and respectively to the surface of the first metal layer 11 and the internal layer gold finger lead region 112
Upper extension certain distance, alternatively, respectively into the surface of internal layer gold finger lead region 112 and the internal layer golden finger 13
Upper 1.0 millimeters of extension.
Internal substrate 20 is cut by laser, the internal substrate 20 includes first facing with the internal layer golden finger 13
Divide 201 and the Part II 202 facing with the internal layer gold finger lead 112 and internal layer circuit region 111, utilize laser
It is cut by laser along the junction of the Part I 201 and the Part II 202, cuts through the internal substrate 20 and protect
Stay the Part I 201 and Part II 202 after cut-out；It is to be appreciated that being entered using laser to the internal substrate 20
Row is cut and cut through to cut off the Part I 201 and the Part II 202, but retains the Part I after cut-out
201 and Part II 202, it is preferable that be filled processing in the position that cuts through of the internal substrate 20, with prevent after pressing
The problem of printed wiring plate surface occurs uneven.
Milling prepreg 30, the prepreg 30 includes being arranged at the internal layer circuit plate 10 and the internal substrate 20
Between the first prepreg 31, to first prepreg 31 carry out Milling Process；It is to be appreciated that passing through described in milling
One prepreg 31 is to carry out windowing processing to first prepreg 31, and the first prepreg 31 after windowing processing is set
It is placed between the internal layer circuit plate 10 and the internal substrate 20, and windowing position and the position phase of the internal layer golden finger 13
Correspondence, influences circuit to make to prevent from abrupt slope occur in bonding processes.
There is provided the first outermost layer substrate 40, the second outermost layer substrate 60 and the prepreg 30, the prepreg 30 for pressing
Also include the second prepreg 32 and the 3rd prepreg 33, press second outermost layer substrate 60 being cascading, institute
State the second prepreg 32, the internal substrate 20, first prepreg 31, the internal layer circuit plate 10, the described 3rd
Prepreg 33 and first outermost layer substrate 40 simultaneously obtain the printed wiring board；It is to be appreciated that by by described second
Outermost layer substrate 60, second prepreg 32, the internal substrate 20, first prepreg 31, the internal layer circuit
Plate 10, the 3rd prepreg 33 and first outermost layer substrate 40 are laminated and pressed successively processing and form printed wiring
Plate, in order to which follow-up outer layer golden finger makes.
Outer layer golden finger, the surface of the first outermost layer substrate 40 includes the outer-layer circuit region 41 with line pattern, outer
Layer gold finger lead region 42 and outer layer golden finger area 43, the outer layer gold finger lead region 42 is arranged at the outer layer line
Between road region 41 and the outer layer golden finger area 43, the step of making outer layer golden finger includes：Outer layer ink for screen printing, in pressure
The anti-electric bronze ink of the surface screen-printed of the first outermost layer substrate 40 of printed wiring board after conjunction and in the outer layer golden finger
Anti- electric polishes layer of ink 44 is formed in lead areas 42 and the outer-layer circuit region 41；Second outer graphics, dry film is attached at
The anti-electric surface of polishes layer of ink 44 and the exposed outer layer golden finger area 43；Electric outer layer golden finger, to the golden hand of the outer layer
Refer to region 43 to carry out the processing of plating gold and form the outer layer golden finger 50 with Gold plated Layer；First outer layer moves back film, removes described the
The dry film on the surface of one outermost layer substrate 40；Gong platform, using the cutting position in the deep step along laser cutting of gong machine control by institute
State the second outermost layer substrate 60 and the gong of the second prepreg 32 is worn.It is to be appreciated that being incited somebody to action using the step of the second outer graphics
Dry film is attached at outer-layer circuit region 41 and outer layer gold finger lead region 42 to protect this two region, utilizes electric outer layer golden finger
The step of to form outer layer golden finger 50 in the outer layer golden finger area 43, and by gong platform with by the He of the second outermost layer substrate 60
The gong of second prepreg 32 is worn, so that gong falls the second outermost layer substrate 60, is connected to the second outermost layer substrate 60 and the internal substrate
The second prepreg 32 and the internal substrate 20 between 20, remove the second outermost layer substrate 60, described the second half that gong falls
Cured sheets 32 and the Part I 201 are so that the internal layer golden finger 13 exposes, after also making the printed wiring board processed
As stepped wiring board.
The preparation method of printed wiring board provided in an embodiment of the present invention with long and short golden finger is first by internal layer
Internal layer golden finger 13 is made on wiring board 10, and is attached on the internal layer golden finger 13 to prevent from pressing with finished products of adhesive tapes 15
The dust of prepreg 30 falls on the internal layer golden finger 13 in journey, is cut using being cut by laser the internal substrate 20 but retaining
The Part I 201 having no progeny, to prevent the problem of printed wiring plate surface occurs uneven after pressing；To being adhered to interior layer line
The first prepreg 31 between road plate 10 and internal substrate 20 carries out Milling Process to prevent first prepreg 31 from gluing
It is connected on the internal layer golden finger 13；Outer layer golden finger 50 is made on the surface of the first outermost layer substrate 40 after pressing, and is passed through
The mode of gong platform cuts off the second outermost layer substrate 60 and internal substrate 20 of the top of internal layer golden finger 13 and removed in described
The finished products of adhesive tapes 15 attached on layer golden finger 13 surface, to form the step-like printed wiring with embedded internal layer golden finger 13
Plate, is effectively protected the quality of the embedded internal layer golden finger 13, and it is empty to efficiently reduce the assembling of printed wiring board
Between, and ensure that and use reliability.
Preferably, the outer layer golden finger 50 and internal layer golden finger 13 formed is respectively corresponding length on the printed wiring board
Short golden finger, the i.e. long golden finger position in the surface of the first outermost layer substrate 40, the short golden finger position in the internal layer circuit plate 10
The surface of one metal level 11, alternatively, if the printed wiring board is 16 layers of printed wiring board, the internal layer golden finger 13 is located at
L13 layers and the outer layer golden finger position are in L1 layers, and the whole plate thickness of the printed wiring board is 1.9 millimeters, and L1 to L13 thickness
It is 1.4mm for the thickness between 1.4mm, i.e. outer layer golden finger and internal layer golden finger 13, it is seen then that thickness difference therebetween is
0.5mm, that is, the printed wiring board formed is step-like printed wiring board.
Refer to Fig. 6, further, the step of milling prepreg in, to the internal substrate 20 and the interior layer line
The first prepreg 31 between road plate 10 carries out windowing processing, and the position of the windowing of the first prepreg 31 processing is located at institute
State the junction of internal layer golden finger 13 and the solder mask 14；First prepreg 31 includes the first sub- prepreg
311 and the second sub- prepreg 312 between the described first sub- prepreg 311 and the internal substrate 20, described
First window is formed after being handled through windowing for one sub- prepreg 311 and the size of the first window (not shown) is 1.2 millimeters,
The second window is formed after being handled through windowing for the second sub- prepreg 312 and the size of second window is 0.2 millimeter.Can
To understand ground, by the described first sub- prepreg 311 and the second sub- prepreg 312 are carried out respectively windowing processing with
The first opening and the second opening (not shown) are formed, to buffer the thickness of solder mask 14 on the internal layer golden finger 13, is prevented
Occur in bonding processes stepped and influence processing quality, in addition, by solid to the first sub- of prepreg 311 and second half
Change piece 312 to carry out windowing processing to prevent that phenomenon of osmosis from occurring in the solder mask 14 and influences the quality of printed wiring board.
Fig. 6 is refer to, further, in the step of making internal layer golden finger 13, includes the step of the first local electricity gold
Suddenly, second time electroplating gold is carried out to the Gold plated Layer after the processing of electrical inner layer golden finger to handle.It is to be appreciated that passing through the first local electricity
The step of gold is so that the plated thickness of the internal layer golden finger 13 meets thickness requirement.
Fig. 6 is refer to, further, in the step of making outer layer golden finger, includes the step of the second local electricity gold,
Gold plated Layer after to being handled through electric outer layer golden finger carries out second time electroplating gold and handled.It is to be appreciated that passing through the second local electricity gold
The step of so that the plated thickness of the outer layer golden finger 50 meets thickness requirement.
Fig. 3 and Fig. 6 are refer to, further, the internal layer circuit plate 10 is multilayer circuit board structure and covered including multiple
Copper foil core plate (not shown), each copper foil core plate that covers includes copper foil layer, the step of internal layer ink for screen printing before also include with
Lower step：Inner figure, using anti-etching mask and negative egative film, will form positive figure in pattern transfer to each copper foil layer
Shape；Internal layer is etched, and is etched to form corresponding circuit by the positive figure on each copper foil layer using acid etching
Figure；Brown, carries out oxidation processes to the copper foil layer of the line pattern and forms oxide layer on the copper foil layer；Pressing,
Each copper foil core plate that covers is stacked, bonded between each layer core plate using prepreg, and to being stacked after
It is described cover copper foil core plate carry out pressing processing form the internal layer circuit plate 10；Except gummosis, the internal layer after pressing processing is removed
The resin gummosis of the remained on surface of wiring board 10；Internal layer drills, and Drilling operation formation connection is carried out to the internal layer circuit plate 10 each
First via hole 15 of the copper-clad plate core plate；Heavy copper, copper-coating is carried out and in institute to the hole wall of first via hole 15
The first layers of copper is formed on the hole wall for stating the first via hole 15；Filling holes with resin, first via hole 15 is filled using resin ink；
Abrasive belt grinding, viscous stay in the impurity on the surface of internal layer circuit plate 10 is removed on the surface of internal layer circuit plate 10 of polishing.Can be with
Understand ground, the first metal layer 11 and the two facing outer layers that second metal layer 12 is the internal layer circuit plate 10, and be copper foil
Layer；By inner figure and internal layer etching step to form corresponding line on copper foil core plate in respectively covering for the internal layer circuit plate 10
Road figure, and by pressing to form the internal layer circuit plate 10, by follow-up except gummosis, heavy copper, filling holes with resin and sand
Band nog plate step is electrically connected with to ensure in the internal layer circuit plate 10 each sandwich circuit and is the internal layer circuit plate 10 follow-up
It is ready in process.
It refer to Fig. 3 and Fig. 6, it is preferable that the step of making internal layer golden finger 13 also moves back film step including being arranged at internal layer
The step of between patch finished products of adhesive tapes step：3rd outer graphics, are attached at the surface of the first metal layer 11, by phenanthrene by dry film
The exposed and developed internal layer circuit region and internal layer gold finger lead area for being transferred to the surface of the first metal layer 11 of woods figure
Domain is to form line pattern；First outer layer is etched, and is lost unexposed dew copper during the 3rd outer graphics using alkali etching
Quarter is fallen；Second outer layer moves back film, dissolves and cleans the film.It is to be appreciated that being etched using the 3rd outer graphics, the first outer layer
Film is moved back with the second outer layer with the surface of the first metal layer 11 in the internal layer circuit plate 10 and forms corresponding line pattern, is formed
Line pattern be electrically connected with internal layer golden finger 13.
Fig. 4 and Fig. 6 are refer to, further, in the step of being cut by laser internal substrate 20, the internal substrate
20 include core material 21 and are arranged at first layers of copper 22 and second layers of copper 23 of the core material 21 with respect to two surfaces, swash
Light carries out inner figure and internal layer etching before cutting the internal substrate 20, during inner figure, by film figure point
It is not transferred in first layers of copper 22 and second layers of copper 23, in internal layer etching process, to the He of the first layers of copper 22
Second layers of copper 23 is etched to form inner line figure；Enter again after the internal substrate 20 is cut by laser
The processing of row brown, oxidation processes are carried out to first layers of copper 22 and second layers of copper 23 for forming the inner line figure
And form oxide layer in first layers of copper 22 and second layers of copper 23 respectively.It is to be appreciated that by inner figure and
Internal layer etches to form corresponding inner line figure in the first layers of copper 22 and the second layers of copper 23 respectively, it is preferable that internal layer loses
Carving can be etched in step by the way of acid etching or alkali etching；The brown step is to complete laser
Carried out after cutting, to form oxide layer in the first layers of copper 22 and the second layers of copper 23 of the internal substrate 20, in order to
There is good bonding effect in follow-up bonding processes with prepreg.
Fig. 6 is refer to, further, the step of making outer layer golden finger also includes being arranged at pressing step and outer layer silk-screen
The step of between ink step：Outer layer drills, and the printed wiring board after handling pressing carries out Drilling operation and existed respectively
Formed and first via hole 15 on first outermost layer substrate 40, the internal substrate 20 and second outermost layer substrate 60
The second via hole 80 being mutually communicated；Heavy copper, copper-coating is carried out and described second to the hole wall of second via hole 80
The second layers of copper 23 is formed on the hole wall of via hole 80；Fourth external layer figure, the table of the second outermost layer substrate 60 is attached at by dry film
Face, is transferred to the surface of the second outermost layer substrate 60 to form line pattern by film figure is exposed and developed；Second outer layer
Etching, is etched away unexposed dew copper in fourth external layer graphic procedure using alkali etching；Second silk-screen welding resistance, utilizes scraper
Scrape and smear solder mask, the solder mask is through screen cloth formation conformality pattern and is imprinted on the surface of the second outermost layer substrate 60.
It is to be appreciated that drilled using outer layer and copper-coating so that on second via hole 80 and the internal layer circuit plate 10 the
One via hole 15 is mutually communicated, it is ensured that each sandwich circuit mutual conduction of the printed wiring board formed, and passes through fourth external layer figure
Shape and the etching of the second outer layer utilize the second silk-screen welding resistance to form corresponding line pattern on the surface of the second outermost layer substrate 60
Step forms route protection ink on the second outermost layer substrate 60.
It refer to Fig. 6, it is preferable that the step of making outer layer golden finger is additionally included in the step of the first outer layer is moved back after film：
5th outer graphics, the surface of the first outermost layer substrate 40 is attached at by dry film, is transferred to film figure is exposed and developed
The outer-layer circuit region on the surface of the first outermost layer substrate 40 and the outer layer golden finger area；3rd outer layer is etched, profit
Unexposed dew copper during the 5th outer graphics is etched away with alkali etching；Silk-screen character, is scraped using scraper and smears character oil
Legend ink print is simultaneously write on the surface of the first outermost layer substrate 40 by ink；Shaping, is molded to the printed wiring board
Processing；Hypotenuse, hypotenuse processing is carried out to the internal layer golden finger 13 and the outer layer golden finger.It is to be appreciated that utilizing the 5th
The circuit of outer graphics and the etching of the 3rd outer layer to be electrically connected in the surface of the first outermost layer substrate 40 formation with outer layer golden finger
Figure, and the printed wiring board is processed into by processing and forming needs the printed wiring board of size, at hypotenuse
Internal layer golden finger 13 and outer layer golden finger are managed, so that the internal layer golden finger 13 and the outer layer golden finger are easy to plug.
Printed wiring board provided in an embodiment of the present invention with long and short golden finger, using above-mentioned with long and short golden finger
Formed by the preparation method of printed wiring board, specific method step is repeated no more, the print with long and short golden finger formed
Wiring board processed overcomes the defect that larger space is taken because installing, and ensure that the reliability of product in itself.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Any modifications, equivalent substitutions and improvements made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. a kind of preparation method of the printed wiring board with long and short golden finger, it is characterised in that comprise the following steps：
Internal layer golden finger, the step of making internal layer golden finger includes：Internal layer circuit plate is provided, the internal layer circuit plate at least includes
The first metal layer and second metal layer of facing setting, the first metal layer include the internal layer circuit area with line pattern
Domain, internal layer gold finger lead area and internal layer golden finger area, the internal layer gold finger lead area are arranged at the internal layer circuit area
Between domain and the internal layer golden finger area；Internal layer ink for screen printing, draws in the internal layer circuit region and the internal layer golden finger
The anti-electric bronze ink of silk-screen printing and anti-electric polishes layer of ink is formed on line region；First outer graphics, dry film is attached at through internal layer
Ink for screen printing processing after the anti-electric polishes layer of ink on and the exposed internal layer golden finger area；Electrical inner layer golden finger, to institute
Internal layer golden finger area is stated to carry out the processing of plating gold and form the internal layer golden finger with Gold plated Layer；Internal layer moves back film, removes described
The dry film on the first metal layer surface；First silk-screen welding resistance, is scraped using scraper and smears solder mask, and the solder mask passes through net
Cloth forms positive pattern and is imprinted on the surface of the part internal layer gold finger lead region and part the internal layer golden finger；Patch
In finished products of adhesive tapes, the Gold plated Layer that finished products of adhesive tapes is fitted in the internal layer golden finger；
Be cut by laser internal substrate, the internal substrate include the Part I facing with the internal layer golden finger and with institute
The facing Part II of internal layer gold finger lead and internal layer circuit region is stated, using laser along the Part I and described the
The junction of two parts is cut by laser, and is cut through the internal substrate and is retained the Part I after cut-out and described the
Two parts；
Milling prepreg, the prepreg includes the first half be arranged between the internal layer circuit plate and the internal substrate
Cured sheets, Milling Process is carried out to first prepreg；
Pressing is there is provided the first outermost layer substrate and the second outermost layer substrate and the prepreg, and the prepreg also includes second
Prepreg and the 3rd prepreg, press second outermost layer substrate being cascading, second prepreg, institute
State internal substrate, first prepreg, the internal layer circuit plate, the 3rd prepreg and first outermost layer substrate
And obtain the printed wiring board；
Outer layer golden finger, the first outermost layer substrate surface includes the outer-layer circuit region with line pattern, outer layer golden finger
Lead areas and outer layer golden finger area, the outer layer gold finger lead region are arranged at the outer-layer circuit region and above-mentioned outer
Between layer golden finger area, the step of making outer layer golden finger includes：Outer layer ink for screen printing, printed wiring board after pressing
The anti-electric bronze ink of first outermost layer substrate surface screen-printed and in the outer layer gold finger lead region and the outer layer line
Anti- electric polishes layer of ink is formed on the region of road；Second outer graphics, the anti-electric bronze ink layer surface is attached at and exposed by dry film
The outer layer golden finger area；Electric outer layer golden finger, the processing of plating gold is carried out to the outer layer golden finger area and is formed to have
The outer layer golden finger of Gold plated Layer；First outer layer moves back film, removes the dry film on the first outermost layer substrate surface；Gong platform, profit
Second outermost layer substrate and the second prepreg gong are worn with the cutting position in the deep step along laser cutting of gong machine control.
2. there is the preparation method of the printed wiring board of long and short golden finger as claimed in claim 1, it is characterised in that in milling half
In the step of cured sheets, first prepreg between the internal substrate and the internal layer circuit plate is carried out at windowing
Reason, the position of the first prepreg windowing processing is located at the junction of the internal layer golden finger and the solder mask；Institute
The first prepreg is stated including the first sub- prepreg and between the described first sub- prepreg and the internal substrate
Second sub- prepreg, the first sub- prepreg forms the size of first window and the first window after being handled through windowing
For 1.2 millimeters, the second window is formed after being handled through windowing for the second sub- prepreg and the size of second window is 0.2
Millimeter.
3. there is the preparation method of the printed wiring board of long and short golden finger as claimed in claim 1, it is characterised in that making
In the step of internal layer golden finger, include the step of the first local electricity gold, the Gold plated Layer after being handled through electrical inner layer golden finger is entered
The gold processing of row second time electroplating.
4. there is the preparation method of the printed wiring board of long and short golden finger as claimed in claim 1, it is characterised in that making
In the step of outer layer golden finger, include the step of the second local electricity gold, the Gold plated Layer after being handled through electric outer layer golden finger is entered
The gold processing of row second time electroplating.
5. there is the preparation method of the printed wiring board of long and short golden finger as claimed in claim 1, it is characterised in that in described
Sandwich circuit board is multilayer circuit board structure and covers copper foil core plate including multiple, and each copper foil core plate that covers includes copper foil layer, inside
It is further comprising the steps of before the step of layer ink for screen printing：Inner figure, using anti-etching mask and negative egative film, figure is turned
Move on each copper foil layer and form positive figure；Internal layer is etched, and is schemed the forward direction on each copper foil layer using acid etching
Shape is etched to form corresponding line pattern；Brown, the copper foil layer of the line pattern is carried out oxidation processes and
Oxide layer is formed on the copper foil layer；Pressing, each copper foil core plate that covers is stacked, and semi-solid preparation is utilized between each layer core plate
Piece is bonded, and to being stacked after described in cover copper foil core plate carry out pressing processing form the internal layer circuit plate；Except stream
Glue, removes the resin gummosis of the internal layer circuit plate surface residual after pressing processing；Internal layer is drilled, and the internal layer circuit plate is entered
First via hole of each copper-clad plate core plate of row Drilling operation formation connection；Heavy copper, enters to the hole wall of first via hole
Row copper-coating simultaneously forms the first layers of copper on the hole wall of first via hole；Filling holes with resin, institute is filled using resin ink
State the first via hole；Abrasive belt grinding, the internal layer circuit plate surface of polishing removes viscous stay in the internal layer circuit plate surface
Impurity.
6. there is the preparation method of the printed wiring board of long and short golden finger as claimed in claim 5, it is characterised in that in making
The step of layer golden finger, also includes being arranged at the step of internal layer is moved back between film step and patch finished products of adhesive tapes step：3rd outer layer figure
Shape, the first metal layer surface is attached at by dry film, is transferred to the first metal layer by film figure is exposed and developed
The internal layer circuit region and internal layer gold finger lead region on surface are to form line pattern；First outer layer is etched, and utilizes alkalescence erosion
Carve and etch away unexposed dew copper during the 3rd outer graphics；Second outer layer moves back film, dissolves and cleans the film.
7. there is the preparation method of the printed wiring board of long and short golden finger as claimed in claim 1, it is characterised in that in laser
In the step of cutting the internal substrate, the internal substrate includes core material and is arranged at the core material with respect to two
First layers of copper and the second layers of copper on surface, carry out inner figure and internal layer etching, inside before being cut by laser the internal substrate
During layer pattern, film figure is transferred in first layers of copper and second layers of copper respectively, in internal layer etching process
In, first layers of copper and second layers of copper are etched to form inner line figure；It is described in laser cutting
Brown processing is carried out after internal substrate again, first layers of copper and second layers of copper to forming the inner line figure
Carry out oxidation processes and form oxide layer in first layers of copper and second layers of copper respectively.
8. there is the preparation method of the printed wiring board of long and short golden finger as claimed in claim 5, it is characterised in that make outer
The step of the step of layer golden finger, also includes being arranged between pressing step and outer layer ink for screen printing step：Outer layer drills, to pressure
The printed wiring board after conjunction processing carries out Drilling operation and respectively in first outermost layer substrate, the internal substrate and institute
State the second via hole for being formed and being mutually communicated with first via hole on the second outermost layer substrate；Heavy copper, is turned on to described second
The hole wall in hole carries out copper-coating and forms the second layers of copper on the hole wall of second via hole；Fourth external layer figure, will be dry
Film is attached at the second outermost layer substrate surface, is transferred to the second outermost layer substrate surface by film figure is exposed and developed
To form line pattern；Second outer layer is etched, and is etched unexposed dew copper in fourth external layer graphic procedure using alkali etching
Fall；Second silk-screen welding resistance, is scraped using scraper and smears solder mask, and the solder mask is through screen cloth formation conformality pattern and is imprinted on institute
State on the second outermost layer substrate surface.
9. there is the preparation method of the printed wiring board of long and short golden finger as claimed in claim 8, it is characterised in that make outer
The step of layer golden finger, is additionally included in the step of the first outer layer is moved back after film：5th outer graphics, described is attached at by dry film
One outermost layer substrate surface, by the exposed and developed outer-layer circuit for being transferred to the first outermost layer substrate surface of film figure
Region and the outer layer golden finger area；3rd outer layer is etched, will be unexposed during the 5th outer graphics using alkali etching
Dew copper etch away；Silk-screen character, is scraped using scraper and smears legend ink and legend ink print is write on into first outer layer
Substrate surface；Shaping, processing and forming is carried out to the printed wiring board；Hypotenuse, to the internal layer golden finger and outer layer gold
Finger carries out hypotenuse processing.
10. a kind of printed wiring board with long and short golden finger, it is characterised in that the printed wiring board uses such as claim
The preparation method of the printed wiring board with long and short golden finger described in 1 to 9 any one is processed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410008621.4A CN104768332B (en) | 2014-01-08 | 2014-01-08 | Printed wiring board with long and short golden finger and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410008621.4A CN104768332B (en) | 2014-01-08 | 2014-01-08 | Printed wiring board with long and short golden finger and preparation method thereof |
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| CN104768332B true CN104768332B (en) | 2017-10-10 |
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| CN105407658B (en) * | 2015-12-10 | 2018-04-03 | 深圳崇达多层线路板有限公司 | A kind of preparation method for the Rigid Flex for preventing soft board golden finger off normal |
| CN107205314A (en) * | 2016-03-17 | 2017-09-26 | 上海嘉捷通电路科技股份有限公司 | A kind of ladder golden finger PCB and preparation method thereof |
| CN105792538B (en) * | 2016-03-31 | 2019-01-15 | 胜宏科技（惠州）股份有限公司 | A kind of internal layer copper sheet dew copper production method of power battery wiring board |
| CN107318231A (en) * | 2017-07-20 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of golden finger, printed wiring board |
| CN108323037B (en) * | 2018-01-17 | 2020-07-24 | 深圳崇达多层线路板有限公司 | PCB processing technology of double-sided step position electro-gold |
| CN111292612B (en) * | 2018-12-10 | 2022-02-11 | 北京小米移动软件有限公司 | Display module and mobile terminal |
| CN110933872B (en) * | 2019-11-19 | 2021-09-21 | 广州广合科技股份有限公司 | Stepped gold-plated plug type PCB (printed circuit board) based sectional board manufacturing method |
| CN114080118B (en) * | 2020-08-12 | 2024-03-12 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of stepped golden finger circuit board and circuit board |
| CN112638043B (en) * | 2021-01-27 | 2022-04-01 | 东莞市若美电子科技有限公司 | Manufacturing method of rigid-flex printed circuit board with flying tail type structure |
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| CN113966102A (en) * | 2021-09-22 | 2022-01-21 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of stepped gold finger circuit board |
| CN113923898B (en) * | 2021-09-27 | 2024-02-06 | 深圳博海电子设计有限公司 | Manufacturing method and application of dual-channel memory bank |
| CN114025513B (en) * | 2022-01-05 | 2022-06-28 | 昆山龙雨智能科技有限公司 | PCB and preparation method thereof |
| CN115070869B (en) * | 2022-05-10 | 2023-09-12 | 盐城维信电子有限公司 | Flexible plate with golden finger pull ring and manufacturing method thereof |
| CN114916142B (en) * | 2022-06-01 | 2024-04-12 | 东莞森玛仕格里菲电路有限公司 | Manufacturing method of multi-press-fit stepped golden finger circuit board |
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