CN114916142B - Manufacturing method of multi-press-fit stepped golden finger circuit board - Google Patents
Manufacturing method of multi-press-fit stepped golden finger circuit board Download PDFInfo
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- CN114916142B CN114916142B CN202210617634.6A CN202210617634A CN114916142B CN 114916142 B CN114916142 B CN 114916142B CN 202210617634 A CN202210617634 A CN 202210617634A CN 114916142 B CN114916142 B CN 114916142B
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- adhesive tape
- circuit board
- golden finger
- press
- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000002390 adhesive tape Substances 0.000 claims abstract description 78
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052737 gold Inorganic materials 0.000 claims abstract description 28
- 239000010931 gold Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000003825 pressing Methods 0.000 claims abstract description 14
- 238000007747 plating Methods 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 238000005553 drilling Methods 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- 238000005530 etching Methods 0.000 claims abstract description 9
- 238000006243 chemical reaction Methods 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims abstract description 4
- 238000001179 sorption measurement Methods 0.000 claims description 36
- 230000007246 mechanism Effects 0.000 claims description 17
- 238000006073 displacement reaction Methods 0.000 claims description 13
- 238000003801 milling Methods 0.000 claims description 9
- 238000007790 scraping Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000007306 turnover Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a manufacturing method of a multi-press-fit stepped golden finger circuit board, relates to the technical field of stepped golden finger circuit boards, and aims to solve the problems that an existing stepped golden finger circuit board is generally directly stuck on a golden finger by using an adhesive tape to press, and after the multi-press-fit of high temperature and high pressure, the adhesive on the adhesive tape falls off and remains on the golden finger and is difficult to remove. The method comprises the following steps: step one: firstly, pressing a plurality of circuit boards for the first time through prepregs in a high-temperature and high-pressure environment, drilling the pre-drilling point position by using drilling equipment after pressing, electroplating a layer of plating layer reaching the required thickness on the exposed copper sheet and the hole wall of the circuit pattern, and transferring the required pattern onto a board body; step two: etching the copper layer of the non-circuit part by an etching machine and a chemical reaction method, forming the circuit part according to a circuit pattern, printing anti-electric gold ink on the PCB, exposing and developing, and forming a gold finger PAD pattern needing electric gold.
Description
Technical Field
The invention relates to the technical field of stepped golden finger circuit boards, in particular to a manufacturing method of a stepped golden finger circuit board which is pressed repeatedly.
Background
The conductive pattern formed by forming a printed wiring, a printed element, or a combination of both on an insulating material according to a predetermined design is generally called a printed circuit. And conductive patterns, called printed wiring, on the insulating substrate that provide electrical connection between components. The printed circuit or finished board of printed wiring is thus called a printed wiring board, also called a printed board or printed circuit board.
However, the conventional ladder golden finger circuit board is generally pressed by directly sticking an adhesive tape on a golden finger, and after being pressed at high temperature and high pressure for many times, the adhesive on the adhesive tape falls off and remains on the golden finger, so that the adhesive tape is difficult to remove; therefore, the existing requirements are not met, and a manufacturing method of the stepped golden finger circuit board which is pressed for multiple times is provided.
Disclosure of Invention
The invention aims to provide a manufacturing method of a multi-press-fit stepped golden finger circuit board, which aims to solve the problems that the conventional stepped golden finger circuit board provided in the background art is generally pressed by directly sticking an adhesive tape on a golden finger, and the adhesive tape falls off and remains on the golden finger after being pressed at high temperature and high pressure for many times, so that the adhesive tape is difficult to remove.
In order to achieve the above purpose, the present invention provides the following technical solutions: a manufacturing method of a multi-press-fit stepped golden finger circuit board comprises the following steps:
step one: firstly, pressing a plurality of circuit boards for the first time through prepregs in a high-temperature and high-pressure environment, drilling the pre-drilling point position by using drilling equipment after pressing, electroplating a layer of plating layer reaching the required thickness on the exposed copper sheet and the hole wall of the circuit pattern, and transferring the required pattern onto a board body;
step two: etching the copper layer of the non-circuit part by an etching machine and a chemical reaction method, forming a circuit part according to a circuit pattern, printing anti-electrogilding ink on a PCB, exposing and developing, and forming a golden finger PAD pattern needing electrogilding;
step three: plating a thick gold layer on the PAD graph of the golden finger, and then stripping the anti-electric gold ink, printing the stripping ink on the golden finger area to prevent the adhesive on the adhesive tape from remaining on the PAD after multiple pressing;
step four: sticking a high-temperature and high-pressure resistant adhesive tape on the golden finger area by using an adhesive tape sticking machine, and preventing the PP adhesive tape after lamination from overflowing to the washable ink on the golden finger PAD;
step five: after the adhesive tape is attached, performing repeated pressing operation on the PCB again, and repeating the subsequent operation to press the golden finger circuit board into a stepped shape;
step six: transferring the green oil film pattern onto the PCB board to protect the PCB board from green oil, protecting the circuit and preventing tin on the circuit during welding parts, and printing characters on the board to recognize marks;
step seven: depositing a thin nickel-gold layer on the surface of copper by utilizing chemical reaction, wherein the gold layer has the characteristics of stable chemistry and electrical appliance, the plating layer has the characteristics of excellent weldability and corrosion resistance, then carrying out blind milling and uncovering on the plating layer, tearing off the high-temperature and high-pressure resistant adhesive tape, washing off the printing ink on the gold finger area, and finally punching out the printing ink through a die or milling out the required shape through a numerical control milling machine;
the adhesive tape sticking machine comprises an adhesive tape sticking mechanism body, an adhesive tape sticking box is arranged at one end of the adhesive tape sticking mechanism body, a lifting frame is arranged above the inside of the adhesive tape sticking box, an adhesive tape positioning roller is arranged at one end of the lifting frame, an electric rotating shaft is arranged on one side of the upper side of the adhesive tape positioning roller, a positioning cutting plate is arranged at one end of the electric rotating shaft, an adsorption positioning plate is arranged at one end of the lifting frame, a rubber scraping block is arranged above the adsorption positioning plate, adsorption mechanisms are arranged on two sides of the rubber scraping block, and a turnover manipulator is arranged at the position, close to the adsorption positioning plate, of the outer walls of two sides of the lifting frame.
Preferably, the lower extreme of adsorption equipment is provided with the negative pressure adsorption end, adsorption equipment's top is provided with negative pressure piston spare, and the negative pressure piston spare runs through to adsorption equipment's inside, the top of negative pressure piston spare is provided with the cylinder, the output of cylinder is provided with the pneumatic rod, and the cylinder passes through the pneumatic rod and is connected with the negative pressure piston spare transmission.
Preferably, an infrared displacement detector is arranged in the adsorption positioning plate.
Preferably, the outer walls of both sides of the lifting frame are provided with first lifters, a first guide rail group is arranged above the first lifters, a second lifter is arranged above the adsorption mechanism, and a second guide rail group is arranged above the second lifters.
Preferably, the lower part inside the rubberizing tape box is provided with bottom feeding guide rail, the top of bottom feeding guide rail is provided with the pay-off slider, the top of pay-off slider is provided with the rack, and the rack passes through pay-off slider and bottom feeding guide rail sliding connection, the both sides of rack outer wall all are provided with positioning fixture.
Preferably, a supporting frame is arranged on one side of the adhesive tape sticking box, an adhesive tape inlet is arranged on the outer wall of one side of the adhesive tape sticking box, which is close to the supporting frame, and a circuit board inlet is arranged below the adhesive tape inlet.
Preferably, a movable plate is arranged on the inner wall of the supporting frame, and a limiting roller is arranged between the adjacent movable plates.
Preferably, one side of the support frame away from the rubberizing tape box is provided with a mounting frame, the unreeling rollers are arranged between the adjacent mounting frames, one ends of the unreeling rollers are provided with unreeling motor sets, the outer wall of the mounting frame is provided with mounting screws, and the mounting screws are provided with a plurality of mounting screws.
Preferably, displacement sensors are arranged at two ends below the unreeling roller.
Preferably, a conveying table is arranged below the displacement sensor, and a conveying channel is arranged in the middle of the conveying table.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, a copper layer of a non-circuit part is corroded through an etching machine and a chemical reaction method, the circuit part is made according to a circuit pattern, then an anti-electric gold ink is printed on a PCB board and exposed and developed, a golden finger PAD pattern needing electric gold is made, the made golden finger PAD pattern is plated with a thick gold layer, the anti-electric gold ink is removed by stripping, a washable ink is printed on a golden finger area, the adhesive tape is prevented from remaining on the golden finger PAD after multiple times of lamination, a high-temperature high-pressure adhesive tape is stuck on the golden finger area, the PP adhesive tape is prevented from overflowing to the washable ink on the golden finger PAD after lamination, after the adhesive tape is stuck, the PCB board is laminated for multiple times, and subsequent operations are repeated, so that the golden finger circuit board is laminated in a step shape, finally, the high-temperature high-pressure-resistant adhesive tape is torn off, the ink on the golden finger area is removed, the problem that the adhesive tape on the adhesive tape is easy to drop and remain on the golden finger PAD can be effectively solved through the structure, the high-temperature high-pressure-resistant adhesive tape is removed, the adhesive tape can be removed after the adhesive tape is removed by the step, and the adhesive tape is removed after the adhesive tape is removed, and the ink is removed after the adhesive tape is removed.
2. Utilize the sticky tape positioning roller to fix a position the sticky tape, after the sticky tape surpasses required length, it decides the board to drive the location with electric spindle and decide the sticky tape, the sticky tape after deciding is fixed by upset manipulator centre gripping, scrape the sticky tape piece and scrape the sticky tape surface and rely on the upset manipulator to overturn, make the adhesion face down, utilize adsorption equipment to be stained with the face and adsorb, put down it on the circuit board through going up and down, lay down with the mode of controlling the removal, make the perfect laminating of sticky tape on the circuit board, through above-mentioned structure, can make sticky tape and circuit board laminate convenience more, overall degree of automation is higher, more be fit for the user and use.
Drawings
FIG. 1 is a schematic diagram of key steps of a ladder golden finger circuit board of the present invention;
FIG. 2 is a flow chart of the step golden finger circuit board of the present invention;
FIG. 3 is a schematic view of a part of the taping mechanism of the present invention;
FIG. 4 is a schematic view of a partial construction of the taping case of the present invention;
FIG. 5 is a schematic view of a part of the adsorption mechanism according to the present invention;
in the figure: 1. a tape-sticking mechanism body; 2. a conveying table; 3. a conveying channel; 4. a mounting frame; 5. an unreeling roller; 6. unreeling the electric machine set; 7. a displacement sensor; 8. installing a screw; 9. a support frame; 10. a moving plate; 11. a limit roller; 12. a tape sticking box; 13. an adhesive tape inlet; 14. a circuit board inlet port; 15. a bottom feed rail; 16. a feeding slide block; 17. a placing rack; 18. positioning a clamp; 19. a first guide rail group; 20. a first lifter; 21. a lifting frame; 22. a tape positioning roller; 23. an electric rotating shaft; 24. positioning a cutting plate; 25. adsorbing and positioning plates; 26. an infrared displacement detector; 27. a second guide rail group; 28. a second lifter; 29. scraping a glue block; 30. an adsorption mechanism; 31. a negative pressure adsorption end; 32. a cylinder; 33. a pneumatic lever; 34. a negative pressure piston member; 35. and (5) turning over the manipulator.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-5, an embodiment of the present invention is provided: a manufacturing method of a multi-press-fit stepped golden finger circuit board comprises the following steps:
step one: firstly, pressing a plurality of circuit boards for the first time through prepregs in a high-temperature and high-pressure environment, drilling the pre-drilling point position by using drilling equipment after pressing, electroplating a layer of plating layer reaching the required thickness on the exposed copper sheet and the hole wall of the circuit pattern, and transferring the required pattern onto a board body;
step two: etching the copper layer of the non-circuit part by an etching machine and a chemical reaction method, forming a circuit part according to a circuit pattern, printing anti-electrogilding ink on a PCB, exposing and developing, and forming a golden finger PAD pattern needing electrogilding;
step three: plating a thick gold layer on the PAD graph of the golden finger, and then stripping the anti-electric gold ink, printing the stripping ink on the golden finger area to prevent the adhesive on the adhesive tape from remaining on the PAD after multiple pressing;
step four: sticking a high-temperature and high-pressure resistant adhesive tape on the golden finger area by using an adhesive tape sticking machine, and preventing the PP adhesive tape after lamination from overflowing to the washable ink on the golden finger PAD;
step five: after the adhesive tape is attached, performing repeated pressing operation on the PCB again, and repeating the subsequent operation to press the golden finger circuit board into a stepped shape;
step six: transferring the green oil film pattern onto the PCB board to protect the PCB board from green oil, protecting the circuit and preventing tin on the circuit during welding parts, and printing characters on the board to recognize marks;
step seven: depositing a thin nickel-gold layer on the surface of copper by utilizing chemical reaction, wherein the gold layer has the characteristics of stable chemistry and electrical appliance, the plating layer has the characteristics of excellent weldability and corrosion resistance, then carrying out blind milling and uncovering on the plating layer, tearing off the high-temperature and high-pressure resistant adhesive tape, washing off the printing ink on the gold finger area, and finally punching out the printing ink through a die or milling out the required shape through a numerical control milling machine;
the adhesive tape sticking machine comprises an adhesive tape sticking mechanism body 1, an adhesive tape sticking box 12 is arranged at one end of the adhesive tape sticking mechanism body 1, a lifting frame 21 is arranged above the inside of the adhesive tape sticking box 12, an adhesive tape positioning roller 22 is arranged at one end of the lifting frame 21, an electric rotating shaft 23 is arranged on one side of the upper side of the adhesive tape positioning roller 22, a positioning cutting plate 24 is arranged at one end of the electric rotating shaft 23, an adsorption positioning plate 25 is arranged at one end of the lifting frame 21, a scraping adhesive block 29 is arranged above the adsorption positioning plate 25, an adsorption mechanism 30 is arranged on two sides of the scraping adhesive block 29, overturning manipulators 35 are arranged at positions, close to the adsorption positioning plate 25, of the outer walls of two sides of the lifting frame 21, adhesive tapes are positioned by the adhesive tape positioning roller 22, after the adhesive tapes exceed a required length, the electric rotating shaft 23 drives the positioning cutting plate 24 to cut the adhesive tapes, the cut adhesive tapes are clamped and fixed by the overturning manipulators 35, the adhesive tape surface is scraped off by the adhesive tape block 29 and overturned by the aid of the manipulators 35, the adhesion face is downwards, the adhesive tape is adsorbed by the adsorption mechanism 30, the line is not sticky surface, the adhesive tape is laid on the left and the line is moved to the left and right of the scraper plate, and the adhesive tape is perfectly paved on the line.
Further, the lower extreme of adsorption equipment 30 is provided with negative pressure adsorption end 31, and adsorption equipment 30's top is provided with negative pressure piston spare 34, and negative pressure piston spare 34 runs through to adsorption equipment 30's inside, and negative pressure piston spare 34's top is provided with cylinder 32, and cylinder 32's output is provided with pneumatic rod 33, and cylinder 32 passes through pneumatic rod 33 and negative pressure piston spare 34 transmission to be connected, utilizes cylinder 32 to drive pneumatic rod 33 and carries out lift removal with negative pressure piston spare 34, makes inside can inhale gas, reaches the effect of negative pressure, adsorbs fixedly with the sticky tape through negative pressure adsorption end 31.
Further, an infrared displacement detector 26 is arranged in the adsorption positioning plate 25, the infrared displacement detector 26 detects the length of the exceeding adhesive tape, and when the length exceeds a set value, data can be transmitted to a corresponding control mechanism to realize subsequent linkage operation.
Further, the outer walls of both sides of the lifting frame 21 are provided with first lifters 20, a first guide rail group 19 is arranged above the first lifters 20, a second lifter 28 is arranged above the adsorption mechanism 30, a second guide rail group 27 is arranged above the second lifter 28, the first lifters 20 and the first guide rail group 19 are used for driving the lifting frame 21 to move up and down and left and right, and the second lifters 28 and the second guide rail group 27 are used for driving the glue scraping block 29 to move up and down and left and right.
Further, the bottom feeding guide rail 15 is arranged below the inside of the tape sticking box 12, the feeding slide block 16 is arranged above the bottom feeding guide rail 15, the placing rack 17 is arranged above the feeding slide block 16, the placing rack 17 is in sliding connection with the bottom feeding guide rail 15 through the feeding slide block 16, positioning clamps 18 are arranged on two sides of the outer wall of the placing rack 17, the bottom feeding guide rail 15 and the feeding slide block 16 are used for driving the placing rack 17 to move, the placing rack 17 is used for placing a circuit board, and the circuit board is fixed through the positioning clamps 18.
Further, a supporting frame 9 is arranged on one side of the tape sticking box 12, a tape inlet 13 is arranged on the outer wall of one side, close to the supporting frame 9, of the tape sticking box 12, a circuit board inlet 14 is arranged below the tape inlet 13, the tape inlet 13 is used for entering the tape, and the circuit board inlet 14 is used for entering the circuit board.
Further, the inner wall of the supporting frame 9 is provided with a movable plate 10, a limit roller 11 is arranged between adjacent movable plates 10, and the limit roller 11 is used for achieving the effect of height adjustment through the movable plate 10, so that the position of the adhesive tape can be limited.
Further, one side of the support frame 9 away from the taping box 12 is provided with the mounting bracket 4, is provided with the unreeling roller 5 between the adjacent mounting bracket 4, and the one end of unreeling roller 5 is provided with unreels the motor group 6, and the outer wall of mounting bracket 4 is provided with mounting screw 8, and mounting screw 8 is provided with a plurality ofly, unreels roller 5 and unreels motor group 6 and be used for carrying out unreeling operation.
Further, displacement sensors 7 are provided at both ends below the unreeling roller 5, and the displacement sensors 7 are used for detecting whether the circuit board reaches the detection position.
Further, a conveying table 2 is arranged below the displacement sensor 7, a conveying channel 3 is arranged in the middle of the conveying table 2, and the conveying table 2 and the conveying channel 3 are used for conveying.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. The manufacturing method of the stepped golden finger circuit board capable of being pressed repeatedly is characterized by comprising the following steps of:
step one: firstly, pressing a plurality of circuit boards for the first time through prepregs in a high-temperature and high-pressure environment, drilling the pre-drilling point position by using drilling equipment after pressing, electroplating a layer of plating layer reaching the required thickness on the exposed copper sheet and the hole wall of the circuit pattern, and transferring the required pattern onto a board body;
step two: etching the copper layer of the non-circuit part by an etching machine and a chemical reaction method, forming a circuit part according to a circuit pattern, printing anti-electrogilding ink on a PCB, exposing and developing, and forming a golden finger PAD pattern needing electrogilding;
step three: plating a thick gold layer on the PAD graph of the golden finger, and then stripping the anti-electric gold ink, printing the stripping ink on the golden finger area to prevent the adhesive on the adhesive tape from remaining on the PAD after multiple pressing;
step four: sticking a high-temperature and high-pressure resistant adhesive tape on the golden finger area by using an adhesive tape sticking machine, and preventing the PP adhesive tape after lamination from overflowing to the washable ink on the golden finger PAD;
step five: after the adhesive tape is attached, performing repeated pressing operation on the PCB again, and repeating the subsequent operation to press the golden finger circuit board into a stepped shape;
step six: transferring the green oil film pattern onto the PCB board to protect the PCB board from green oil, protecting the circuit and preventing tin on the circuit during welding parts, and printing characters on the board to recognize marks;
step seven: depositing a thin nickel-gold layer on the surface of copper by utilizing chemical reaction, wherein the gold layer has the characteristics of stable chemistry and electrical appliance, the plating layer has the characteristics of excellent weldability and corrosion resistance, then carrying out blind milling and uncovering on the plating layer, tearing off the high-temperature and high-pressure resistant adhesive tape, washing off the printing ink on the gold finger area, and finally punching out the printing ink through a die or milling out the required shape through a numerical control milling machine;
the adhesive tape sticking machine comprises an adhesive tape sticking mechanism body (1), one end of the adhesive tape sticking mechanism body (1) is provided with an adhesive tape sticking box (12), a lifting frame (21) is arranged above the adhesive tape sticking box (12), one end of the lifting frame (21) is provided with an adhesive tape positioning roller (22), one side of the upper side of the adhesive tape positioning roller (22) is provided with an electric rotating shaft (23), one end of the electric rotating shaft (23) is provided with a positioning cutting plate (24), one end of the lifting frame (21) is provided with an adsorption positioning plate (25), the upper side of the adsorption positioning plate (25) is provided with adhesive scraping blocks (29), two sides of each adhesive scraping block (29) are provided with adsorption mechanisms (30), and a position, close to the adsorption positioning plate (25), of the outer walls of two sides of the lifting frame (21), is provided with a turnover manipulator (35).
2. The method for manufacturing the multi-press-fit stepped gold finger circuit board according to claim 1, wherein the method comprises the following steps: the lower extreme of adsorption equipment (30) is provided with negative pressure adsorption end (31), the top of adsorption equipment (30) is provided with negative pressure piston spare (34), and negative pressure piston spare (34) run through to the inside of adsorption equipment (30), the top of negative pressure piston spare (34) is provided with cylinder (32), the output of cylinder (32) is provided with pneumatic rod (33), and cylinder (32) are connected with negative pressure piston spare (34) transmission through pneumatic rod (33).
3. The method for manufacturing the multi-press-fit stepped gold finger circuit board according to claim 1, wherein the method comprises the following steps: an infrared displacement detector (26) is arranged in the adsorption positioning plate (25).
4. The method for manufacturing the multi-press-fit stepped gold finger circuit board according to claim 1, wherein the method comprises the following steps: the outer wall of crane (21) both sides all is provided with first riser (20), the top of first riser (20) is provided with first guide rail group (19), the top of adsorption equipment (30) is provided with second riser (28), the top of second riser (28) is provided with second guide rail group (27).
5. The method for manufacturing the multi-press-fit stepped gold finger circuit board according to claim 1, wherein the method comprises the following steps: the automatic feeding device is characterized in that a bottom feeding guide rail (15) is arranged below the inside of the adhesive tape sticking box (12), a feeding sliding block (16) is arranged above the bottom feeding guide rail (15), a placing rack (17) is arranged above the feeding sliding block (16), the placing rack (17) is in sliding connection with the bottom feeding guide rail (15) through the feeding sliding block (16), and positioning clamps (18) are arranged on two sides of the outer wall of the placing rack (17).
6. The method for manufacturing the multi-press-fit stepped gold finger circuit board according to claim 1, wherein the method comprises the following steps: one side of rubberizing tape box (12) is provided with support frame (9), the one side outer wall that rubberizing tape box (12) is close to support frame (9) is provided with sticky tape access port (13), the below of sticky tape access port (13) is provided with circuit board access port (14).
7. The method for manufacturing the multi-press-fit stepped gold finger circuit board according to claim 6, wherein the method comprises the following steps: the inner wall of the supporting frame (9) is provided with a movable plate (10), and a limiting roller (11) is arranged between adjacent movable plates (10).
8. The method for manufacturing the multi-press-fit stepped gold finger circuit board according to claim 6, wherein the method comprises the following steps: one side that rubberizing case (12) was kept away from to support frame (9) is provided with mounting bracket (4), and is adjacent be provided with between mounting bracket (4) unreel roller (5), the one end of unreeling roller (5) is provided with unreel motor group (6), the outer wall of mounting bracket (4) is provided with mounting screw (8), and mounting screw (8) are provided with a plurality of.
9. The method for manufacturing the multi-press-fit stepped gold finger circuit board according to claim 8, wherein the method comprises the following steps: displacement sensors (7) are arranged at two ends below the unreeling roller (5).
10. The method for manufacturing the multi-press-fit stepped gold finger circuit board according to claim 9, wherein the method comprises the following steps: a conveying table (2) is arranged below the displacement sensor (7), and a conveying channel (3) is arranged at the middle position of the conveying table (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210617634.6A CN114916142B (en) | 2022-06-01 | 2022-06-01 | Manufacturing method of multi-press-fit stepped golden finger circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210617634.6A CN114916142B (en) | 2022-06-01 | 2022-06-01 | Manufacturing method of multi-press-fit stepped golden finger circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN114916142A CN114916142A (en) | 2022-08-16 |
| CN114916142B true CN114916142B (en) | 2024-04-12 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009132581A1 (en) * | 2008-04-30 | 2009-11-05 | Chen Guofu | Method for manufacturing an electro nickel and gold printed circuit board |
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| CN114916142A (en) | 2022-08-16 |
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