CN102781171A - Method for manufacturing multilayer leadless golden-finger circuit boards - Google Patents
Method for manufacturing multilayer leadless golden-finger circuit boards Download PDFInfo
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- CN102781171A CN102781171A CN2012102566109A CN201210256610A CN102781171A CN 102781171 A CN102781171 A CN 102781171A CN 2012102566109 A CN2012102566109 A CN 2012102566109A CN 201210256610 A CN201210256610 A CN 201210256610A CN 102781171 A CN102781171 A CN 102781171A
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Abstract
The invention discloses a method for manufacturing multilayer leadless golden-finger circuit boards. The method is characterized by including the following steps of cutting, film coating, inside-pattern transferring, inside-pattern etching, dry film removing, pattern checking, browning, pressing and laminating, pressing, mechanical drilling, PTH (plating through hole), plate electroplating, outer dried film coating, outside-pattern transferring, pattern electroplating, outside-pattern etching, gold plating, outside-pattern checking, green oil coating, character printing, forming, electric logging, surface treating, final checking and packaging. In order to overcome the defects of the prior art, the method for manufacturing multilayer leadless golden-finger circuit boards, simple in process and lower in production cost, is provided.
Description
Technical field
The present invention relates to a kind of multilayer does not have the manufacture method of lead-in wire golden finger circuit board.
Background technology
Existing golden finger circuit board, in process of production, during the etching lead-in wire; Dry film is difficult to cover fully conplane circuit and circuit gap; Liquid medicine infiltrates in the dry film from the conductor spacing stings the corrosion line road, and this can cause the product rejection problem, and existing golden finger circuit board need pass through subsides dry film and etching lead-in wire flow process; Its production procedure is longer relatively, and production cost is higher relatively.
Summary of the invention
The objective of the invention is provides a kind of technology simple in order to overcome weak point of the prior art, and the relatively low multilayer of production cost does not have the manufacture method of lead-in wire golden finger circuit board.
In order to achieve the above object, the present invention adopts following scheme:
A kind of multilayer does not have the manufacture method of lead-in wire golden finger circuit board, it is characterized in that may further comprise the steps:
A, open material: sheet material is cut out out the size that adheres to specification;
B, pad pasting: on the plate face of sheet material as internal layer of steps A, stick photosensitive dry film;
C, internal layer figure transfer: the circuit diagram on the film is transferred on the plate face that posts photosensitive dry film;
D, interior layer pattern etching: with etching liquid medicine the plate face is removed without the copper layer exposed part of photosensitive dry film protection, kept copper layer as circuit;
E, move back dry film: the photosensitive dry film on the plate face among the step D is all returned, will be exposed as the copper layer of circuit;
F, figure inspection: adopt scanner that circuit on the plate face in the step e opened short circuit phenomenon inspection;
G, brown: alligatoring is as the copper face and the line face of internal layer;
H, pressing lamination: each layer all stacked;
I, pressing: each lamination of step H is lumped together;
J, machine drilling: get out the through hole of each layer and beat component hole;
K, PTH:, make it become via with copper on the logical inner hole deposition among the step J;
L, plate: the sheet material in the step K is electroplated, the copper on the thickening via machine plate face;
M, paste outer dry film: stick photosensitive dry film on the sheet material skin after the pressing;
N, outer image transfer: the circuit diagram on the film is transferred on the lamina rara externa face that posts photosensitive dry film;
O, graphic plating: the sheet material to step N is electroplated, and thickening via and figure copper are thick;
P, outer graphics etching: with etching liquid medicine plate face skin is removed without the copper layer exposed part of photosensitive dry film protection, kept copper layer as circuit;
Q, gold-plated: carry out gold-plated to the position of golden finger on the sheet material through electric plating method;
R, outer graphics inspection: adopt scanner that circuit on the plate face skin among the step Q opened short circuit phenomenon inspection;
S, green oil: silk-screen one deck plays the green ink of insulating effect on the sheet material skin of above-mentioned steps Q;
T, literal: the literal of identification usefulness when element is played in the silk-screen conduct on the sheet material plate face of step R;
U, moulding: the sheet material gong of step S is gone out the finished product profile;
V, electrical measurement: each layer of sheet material to step T opened, short-circuit test;
W, surface treatment: on the sheet material of step U, paste one deck oxidation-resistant film;
X, final inspection: finished product inspection, confirm whether to have function and problem of appearance;
Y, packing: with the plate packing of passed examination.
Aforesaid a kind of manufacture method of not having the lead-in wire gold finger plate is characterized in that the etching liquid medicine described in the step D is acid CuCl
2
Aforesaid a kind of manufacture method of not having the lead-in wire gold finger plate is characterized in that the etching liquid medicine described in the step P is acid CuCl
2
The preparation method of aforesaid a kind of specular aluminium base circuit board is characterized in that adopting in the step e NaOH stripping soup to move back film.
In sum, beneficial effect of the present invention:
Preparation method of the present invention is simple, and is convenient for production, and production cost is relatively low; Thoroughly solved and do not had the lead-in wire gold finger plate; When etching went between, dry film was difficult to cover fully conplane circuit and circuit gap, and liquid medicine infiltrates in the dry film from the conductor spacing stings the problem of scrapping that the corrosion line road causes.
Flow process of the present invention is shorter, need not pass through and paste dry film and etching lead-in wire flow process, has shortened the production cycle, has reduced production cost.
Embodiment
Below in conjunction with embodiment the present invention is done and to further describe:
Embodiment 1
A kind of multilayer of the present invention does not have the manufacture method of lead-in wire golden finger circuit board, may further comprise the steps:
A, open material: sheet material is cut out out the size that adheres to specification;
B, pad pasting: on the plate face of sheet material as internal layer of steps A, stick photosensitive dry film;
C, internal layer figure transfer: the circuit diagram on the film is transferred on the plate face that posts photosensitive dry film;
D, interior layer pattern etching: with etching liquid medicine the plate face is removed without the copper layer exposed part of photosensitive dry film protection, kept copper layer as circuit;
E, move back dry film: the photosensitive dry film on the plate face among the step D is all returned, will be exposed as the copper layer of circuit;
F, figure inspection: adopt scanner that circuit on the plate face in the step e opened short circuit phenomenon inspection;
G, brown: alligatoring is as the copper face and the line face of internal layer;
H, pressing lamination: each layer all stacked;
I, pressing: each lamination of step H is lumped together;
J, machine drilling: get out the through hole of each layer and beat component hole;
K, PTH:, make it become via with copper on the logical inner hole deposition among the step J;
L, plate: the sheet material in the step K is electroplated, the copper on the thickening via machine plate face;
M, paste outer dry film: stick photosensitive dry film on the sheet material skin after the pressing;
N, outer image transfer: the circuit diagram on the film is transferred on the lamina rara externa face that posts photosensitive dry film;
O, graphic plating: the sheet material to step N is electroplated, and thickening via and figure copper are thick;
P, outer graphics etching: with etching liquid medicine plate face skin is removed without the copper layer exposed part of photosensitive dry film protection, kept copper layer as circuit;
Q, gold-plated: carry out gold-plated to the position of golden finger on the sheet material through electric plating method;
R, outer graphics inspection: adopt scanner that circuit on the plate face skin among the step Q opened short circuit phenomenon inspection;
S, green oil: silk-screen one deck plays the green ink of insulating effect on the sheet material skin of above-mentioned steps Q;
T, literal: the literal of identification usefulness when element is played in the silk-screen conduct on the sheet material plate face of step R;
U, moulding: the sheet material gong of step S is gone out the finished product profile;
V, electrical measurement: each layer of sheet material to step T opened, short-circuit test;
W, surface treatment: on the sheet material of step U, paste one deck oxidation-resistant film;
X, final inspection: finished product inspection, confirm whether to have function and problem of appearance;
Y, packing: with the plate packing of passed examination.
Embodiment 2
A kind of multilayer of the present invention does not have the manufacture method of lead-in wire golden finger circuit board, may further comprise the steps:
A, open material: sheet material is cut out out the size that adheres to specification;
B, pad pasting: on the plate face of sheet material as internal layer of steps A, stick photosensitive dry film;
C, internal layer figure transfer: the circuit diagram on the film is transferred on the plate face that posts photosensitive dry film;
D, interior layer pattern etching: use acid CuCl
2The plate face is removed without the copper layer exposed part of photosensitive dry film protection, kept copper layer as circuit;
E, move back dry film: adopt NaOH stripping soup that the photosensitive dry film on the plate face among the step D is all returned, will expose as the copper layer of circuit;
F, figure inspection: adopt scanner that circuit on the plate face in the step e opened short circuit phenomenon inspection;
G, brown: alligatoring is as the copper face and the line face of internal layer;
H, pressing lamination: each layer all stacked;
I, pressing: each lamination of step H is lumped together;
J, machine drilling: get out the through hole of each layer and beat component hole;
K, PTH:, make it become via with copper on the logical inner hole deposition among the step J;
L, plate: the sheet material in the step K is electroplated, the copper on the thickening via machine plate face;
M, paste outer dry film: stick photosensitive dry film on the sheet material skin after the pressing;
N, outer image transfer: the circuit diagram on the film is transferred on the lamina rara externa face that posts photosensitive dry film;
O, graphic plating: the sheet material to step N is electroplated, and thickening via and figure copper are thick;
P, outer graphics etching: use acid CuCl
2Plate face skin is removed without the copper layer exposed part of photosensitive dry film protection, kept copper layer as circuit;
Q, gold-plated: carry out gold-plated to the position of golden finger on the sheet material through electric plating method;
R, outer graphics inspection: adopt scanner that circuit on the plate face skin among the step Q opened short circuit phenomenon inspection;
S, green oil: silk-screen one deck plays the green ink of insulating effect on the sheet material skin of above-mentioned steps Q;
T, literal: the literal of identification usefulness when element is played in the silk-screen conduct on the sheet material plate face of step R;
U, moulding: the sheet material gong of step S is gone out the finished product profile;
V, electrical measurement: each layer of sheet material to step T opened, short-circuit test;
W, surface treatment: on the sheet material of step U, paste one deck oxidation-resistant film;
X, final inspection: finished product inspection, confirm whether to have function and problem of appearance;
Y, packing: with the plate packing of passed examination.
Claims (4)
1. a multilayer does not have the manufacture method of lead-in wire golden finger circuit board, it is characterized in that may further comprise the steps:
A, open material: sheet material is cut out out the size that adheres to specification;
B, pad pasting: on the plate face of sheet material as internal layer of steps A, stick photosensitive dry film;
C, internal layer figure transfer: the circuit diagram on the film is transferred on the plate face that posts photosensitive dry film;
D, interior layer pattern etching: with etching liquid medicine the plate face is removed without the copper layer exposed part of photosensitive dry film protection, kept copper layer as circuit;
E, move back dry film: the photosensitive dry film on the plate face among the step D is all returned, will be exposed as the copper layer of circuit;
F, figure inspection: adopt scanner opening to circuit on the plate face in the step e
Short circuit phenomenon is checked;
G, brown: alligatoring is as the copper face and the line face of internal layer;
H, pressing lamination: each layer all stacked;
I, pressing: each lamination of step H is lumped together;
J, machine drilling: get out the through hole of each layer and beat component hole;
K, PTH:, make it become via with copper on the logical inner hole deposition among the step J;
L, plate: the sheet material in the step K is electroplated, the copper on the thickening via machine plate face;
M, paste outer dry film: stick photosensitive dry film on the sheet material skin after the pressing;
N, outer image transfer: the circuit diagram on the film is transferred on the lamina rara externa face that posts photosensitive dry film;
O, graphic plating: the sheet material to step N is electroplated, and thickening via and figure copper are thick;
P, outer graphics etching: with etching liquid medicine plate face skin is removed without the copper layer exposed part of photosensitive dry film protection, kept copper layer as circuit;
Q, gold-plated: carry out gold-plated to the position of golden finger on the sheet material through electric plating method;
R, outer graphics inspection: adopt scanner that circuit on the plate face skin among the step Q opened short circuit phenomenon inspection;
S, green oil: silk-screen one deck plays the green ink of insulating effect on the sheet material skin of above-mentioned steps Q;
T, literal: the literal of identification usefulness when element is played in the silk-screen conduct on the sheet material plate face of step R;
U, moulding: the sheet material gong of step S is gone out the finished product profile;
V, electrical measurement: each layer of sheet material to step T opened, short-circuit test;
W, surface treatment: on the sheet material of step U, paste one deck oxidation-resistant film;
X, final inspection: finished product inspection, confirm whether to have function and problem of appearance;
Y, packing: with the plate packing of passed examination.
2. a kind of manufacture method of not having the lead-in wire gold finger plate according to claim 1 is characterized in that the etching liquid medicine described in the step D is acid CuCl
2
3. a kind of manufacture method of not having the lead-in wire gold finger plate according to claim 1 is characterized in that the etching liquid medicine described in the step P is acid CuCl
2
4. the preparation method of a kind of specular aluminium base circuit board according to claim 1 is characterized in that adopting in the step e NaOH stripping soup to move back film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210256610.9A CN102781171B (en) | 2012-07-24 | 2012-07-24 | A kind of multilayer is without the manufacture method of lead-in wire golden finger circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210256610.9A CN102781171B (en) | 2012-07-24 | 2012-07-24 | A kind of multilayer is without the manufacture method of lead-in wire golden finger circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102781171A true CN102781171A (en) | 2012-11-14 |
| CN102781171B CN102781171B (en) | 2015-08-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210256610.9A Expired - Fee Related CN102781171B (en) | 2012-07-24 | 2012-07-24 | A kind of multilayer is without the manufacture method of lead-in wire golden finger circuit board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103397359A (en) * | 2013-08-02 | 2013-11-20 | 高德（无锡）电子有限公司 | Manufacturing method of electroplated connecting fingers free of lead wire residual |
| CN104768332A (en) * | 2014-01-08 | 2015-07-08 | 深圳崇达多层线路板有限公司 | Printed circuit board with long and short metal pins, and manufacture method of printed circuit board |
| CN105960113A (en) * | 2016-05-27 | 2016-09-21 | 东莞联桥电子有限公司 | Golden finger plate processing technology |
| CN109219253A (en) * | 2018-09-26 | 2019-01-15 | 东莞美维电路有限公司 | A kind of nothing hangs nickel without lead PCB manufacture craft |
| CN113543520A (en) * | 2020-04-21 | 2021-10-22 | 竞华电子(深圳)有限公司 | Electroplating processing method for removing gold finger lead of circuit board |
| CN114269071A (en) * | 2021-12-08 | 2022-04-01 | 江苏普诺威电子股份有限公司 | Through hole filling manufacturing process of multilayer board |
| WO2023236484A1 (en) * | 2022-06-09 | 2023-12-14 | 惠州市金百泽电路科技有限公司 | Method for manufacturing printed integrated circuit |
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| KR20030073919A (en) * | 2002-03-14 | 2003-09-19 | 주식회사 심텍 | The fabrication method of multi-layer printed circuit board using single etching semi-additive process |
| CN101119614A (en) * | 2006-07-31 | 2008-02-06 | 比亚迪股份有限公司 | Pattern electroplating method for two-sided and multi-layer flexible printed circuit board |
| CN101699940A (en) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
| CN101820728A (en) * | 2010-04-08 | 2010-09-01 | 深南电路有限公司 | Technological method for processing printed circuit board (PCB) with stepped groove |
| CN102307431A (en) * | 2011-07-16 | 2012-01-04 | 中山市达进电子有限公司 | Typesetting method of rotary circuit board |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20030073919A (en) * | 2002-03-14 | 2003-09-19 | 주식회사 심텍 | The fabrication method of multi-layer printed circuit board using single etching semi-additive process |
| CN101119614A (en) * | 2006-07-31 | 2008-02-06 | 比亚迪股份有限公司 | Pattern electroplating method for two-sided and multi-layer flexible printed circuit board |
| CN101699940A (en) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
| CN101820728A (en) * | 2010-04-08 | 2010-09-01 | 深南电路有限公司 | Technological method for processing printed circuit board (PCB) with stepped groove |
| CN102307431A (en) * | 2011-07-16 | 2012-01-04 | 中山市达进电子有限公司 | Typesetting method of rotary circuit board |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103397359A (en) * | 2013-08-02 | 2013-11-20 | 高德（无锡）电子有限公司 | Manufacturing method of electroplated connecting fingers free of lead wire residual |
| CN104768332A (en) * | 2014-01-08 | 2015-07-08 | 深圳崇达多层线路板有限公司 | Printed circuit board with long and short metal pins, and manufacture method of printed circuit board |
| CN104768332B (en) * | 2014-01-08 | 2017-10-10 | 深圳崇达多层线路板有限公司 | Printed wiring board with long and short golden finger and preparation method thereof |
| CN105960113A (en) * | 2016-05-27 | 2016-09-21 | 东莞联桥电子有限公司 | Golden finger plate processing technology |
| CN105960113B (en) * | 2016-05-27 | 2019-01-01 | 东莞联桥电子有限公司 | A kind of gold finger plate processing technology |
| CN109219253A (en) * | 2018-09-26 | 2019-01-15 | 东莞美维电路有限公司 | A kind of nothing hangs nickel without lead PCB manufacture craft |
| CN113543520A (en) * | 2020-04-21 | 2021-10-22 | 竞华电子(深圳)有限公司 | Electroplating processing method for removing gold finger lead of circuit board |
| CN113543520B (en) * | 2020-04-21 | 2022-10-21 | 竞华电子(深圳)有限公司 | Electroplating processing method for removing gold finger lead of circuit board |
| CN114269071A (en) * | 2021-12-08 | 2022-04-01 | 江苏普诺威电子股份有限公司 | Through hole filling manufacturing process of multilayer board |
| CN114269071B (en) * | 2021-12-08 | 2024-04-26 | 江苏普诺威电子股份有限公司 | Through hole filling manufacturing process of multilayer board |
| WO2023236484A1 (en) * | 2022-06-09 | 2023-12-14 | 惠州市金百泽电路科技有限公司 | Method for manufacturing printed integrated circuit |
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| CN102781171B (en) | 2015-08-12 |
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