WO2023236484A1 - Method for manufacturing printed integrated circuit - Google Patents

Method for manufacturing printed integrated circuit Download PDF

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Publication number
WO2023236484A1
WO2023236484A1 PCT/CN2022/138623 CN2022138623W WO2023236484A1 WO 2023236484 A1 WO2023236484 A1 WO 2023236484A1 CN 2022138623 W CN2022138623 W CN 2022138623W WO 2023236484 A1 WO2023236484 A1 WO 2023236484A1
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WO
WIPO (PCT)
Prior art keywords
type
lamination
conduction
production
manufacturing process
Prior art date
Application number
PCT/CN2022/138623
Other languages
French (fr)
Chinese (zh)
Inventor
杨贵
武守坤
陈春
樊廷慧
黄双双
杨长坤
唐文亮
Original Assignee
惠州市金百泽电路科技有限公司
深圳市金百泽电子科技股份有限公司
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Application filed by 惠州市金百泽电路科技有限公司, 深圳市金百泽电子科技股份有限公司 filed Critical 惠州市金百泽电路科技有限公司
Publication of WO2023236484A1 publication Critical patent/WO2023236484A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Definitions

  • the invention belongs to the technical field of integrated circuits, and specifically relates to a method for manufacturing printed integrated circuits.
  • the conventional integrated circuit production process is: drilling - electroplating - pattern transfer - circuit production - lamination - solder mask ink - surface treatment - appearance.
  • the production process is long and repeated production is selected according to the product level.
  • the existing technology requires To achieve the electrical conduction performance of the product through metalized holes (conventional electroplated copper plated holes) and metal wiring (etched copper wiring), a large amount of chemicals are required to achieve metallized holes and metal wiring, which is very unenvironmental.
  • the existing technology also uses 3D printing production technology, but the materials used in 3D printing equipment are very expensive.
  • the production of a single product requires at least one hour or more, and the printing efficiency is very low.
  • a method for manufacturing printed integrated circuits including a core board manufacturing process and a coreless board manufacturing process, including the following processes:
  • the insulating substrates include copper-containing boards and copper-free boards;
  • the first type of pattern transfer includes lamination, exposure, and development processes.
  • the lamination uses a photosensitive material film; in the present invention, the photosensitive material produces a polymerization reaction under exposure to complete the pattern transfer.
  • the cost is relatively low, and the thickness is based on Design circuit height selection;
  • the second type of graphics transfer including lamination, laser ablation/plasma ablation process, the lamination uses a non-photosensitive material film; the non-photosensitive material film needs to use laser ablation to complete the pattern transfer, and the processing capacity is higher.
  • the thickness is selected based on the design line height.
  • the laser processing of the present invention includes UV laser or CO2 laser.
  • Advantages of UV laser High-performance UV laser has the characteristics of short wavelength, high beam quality, and high peak power. It reduces the size of the focused spot and ensures processing accuracy. It can cut different thicknesses, different materials, and different graphics;
  • Advantages of CO 2 laser There are relatively abundant spectral lines, with laser output of dozens of spectral lines near 10 microns. The output beam has high optical quality, good coherence, narrow line width and stable operation. It has relatively large power and relatively high energy conversion efficiency, and the energy conversion efficiency can reach 30 to 40%, which also exceeds ordinary gas lasers. Plasma drilling is an unconventional hole processing technology.
  • circuits including the use of conductive paste printing and spraying processes.
  • the circuit width and height are based on the design value requirements.
  • the materials used include conductive pastes such as copper paste and silver paste;
  • printing refers to using a vacuum printer with a precision screen (the screen has a pattern corresponding to the board) to pour the conductive slurry onto the screen, and using a scraper to transfer the conductive slurry to the board through the screen through pressure.
  • Spraying refers to adjusting the viscosity of conductive paste, placing it in a corresponding container, and using a nozzle to spray it onto the board surface through air pressure
  • conductive paste refers to coatings such as copper paste and silver paste that can achieve conductive functions.
  • Peeling including chemical decomposition or physical peeling process
  • lamination is to cover the circuit surface with insulating materials such as resin and polyimide through lamination or printing to achieve the insulation effect.
  • Lamination is the most commonly used processing method, and the working conditions of lamination include temperature. , pressure, time, temperature control at 80-180°C, pressure 3-100kg, time 10-300s. Curing conditions include temperature and time. The temperature is controlled at 100-180°C and the time is 20-100 minutes.
  • Interlayer conduction including the first type of interlayer conduction and the second type of interlayer conduction.
  • the first type of inter-layer conduction including the lamination, drilling, and printing conduction processes arranged in sequence; the first type of inter-layer conduction of the present invention uses laser to first complete the hole production, and then fills the copper paste to achieve hole conduction. Yes, the process is relatively simple, and the principle of laser is the same as that of the above laser.
  • the conduction adopts electroplating or conductive plasma plugging process.
  • Conventional technical means are used to channel copper sulfate electrolysis reaction to deposit copper ions into the holes to achieve the hole filling effect.
  • There are various operating conditions requirements such as current and chemical solution; the method of plugging conductive plasma is Same as above for printed graphics.
  • the lamination needs to be completed first and then the first type of inter-layer conduction is performed; if the second type of inter-layer conduction is selected, the conduction needs to be completed first.
  • the through-column is made and then laminated.
  • the core board manufacturing process includes the following steps: cutting - drilling - first type pattern transfer - making circuits - peeling off - lamination - first type interlayer conduction - insulating protective layer production - surface treatment - flying Needle test - profile.
  • the core board manufacturing process of the present invention uses printed conductive paste instead of electroplating to achieve the effects of wiring and interlayer conduction; the production of insulating protective layers replaces solder resist ink to achieve effects such as circuit protection, insulation, and anti-oxidation.
  • the insulation protection The layers contain insulating materials such as solder mask ink, resin, and polyimide.
  • the core board manufacturing process includes the following steps: material cutting - drilling - second type pattern transfer - circuit production - film stripping - lamination - first type interlayer conduction - insulating protective layer production - surface treatment - flying Needle test - profile.
  • the coreless board manufacturing process includes the following steps: material cutting - second type pattern transfer - circuit production - film stripping - second type interlayer conduction - lamination - insulating protective layer production - substrate removal - surface treatment - flying Needle test - profile.
  • Cost reduction Mainly reflected in equipment and chemicals. Using this solution can eliminate a large number of processing equipment and corresponding chemicals such as etching lines and hole filling lines;
  • the key point of the circuit board is to realize wiring and inter-layer conduction.
  • the conventional circuit board processing process requires etching, electroplating and other processes to realize the function. Many chemicals are used in the process, such as electroplating solution, copper immersion solution, etching solution and other chemicals.
  • the present invention can directly choose to use printed conductive paste instead of conventional processes such as etching and electroplating to achieve the effects of wiring and inter-layer conduction. Abandon most of the chemicals used in conventional processes, greatly reducing environmental pollution and further achieving the goal of green and environmentally friendly production.
  • the present invention can not only improve processing capabilities, but also shorten the processing process, eliminate a large number of chemicals used in conventional manufacturing methods, and is more in line with the manufacturing concept of environmentally friendly processing. Compared with 3D printing, the efficiency is greatly improved and the cost is greatly reduced. And has strong general capabilities in the field of integrated circuits (including but not limited to printed circuit boards, chips, packaging carrier boards, etc.).
  • a method for making a double-sided coreless board including the following steps: cutting (0.2mm pure copper substrate) - laminating (selecting 25 ⁇ m photosensitive dry film according to design value, resolution capacity 8/8 ⁇ m, temperature 110 ⁇ 5°C, speed 0.8 m/min, pressure 5-6kg) - exposure (LDI, line width/line spacing according to the design value ⁇ 10%, exposure energy 45-55MJ/cm2) - development - single-sided printing copper paste (copper paste viscosity 25°C 400-800dPa .s, use vacuum printing machine to print, scraper angle 60°, vacuum degree 30 ⁇ 5Pa, speed 1m/min)-curing (pre-curing 130 ⁇ 10°C/30 minutes + curing 160 ⁇ 10°C/60 minutes)-grinding ( Use an abrasive belt to grind.
  • the copper slurry is flush with the dry film and the height is less than 25 ⁇ m.
  • the line height is controlled according to the design value) - peeling film (line width/line spacing is ⁇ 10% according to the design value) - lamination of insulating adhesive film (insulating adhesive film)
  • the film thickness is controlled according to the design value, and is processed using a vacuum laminating and leveling machine.
  • the temperature is 100 ⁇ 10°C, the pressure is 0.7 ⁇ 0.1MPa, the vacuum degree is 1.2 ⁇ 0.1Pa, and the time is 50-100s) - curing (pre-curing 150 ⁇ 10°C/ 30 minutes + curing 190 ⁇ 10°C/60 minutes) - Laser drilling (processed using a CO 2 laser drilling machine, the aperture is controlled according to the design value ⁇ 10%) - Lamination (25 ⁇ m photosensitive dry film resolution ability 8/8 ⁇ m, Temperature 110 ⁇ 5°C, speed 0.8m/min, pressure 5-6kg)-exposure (LDI, line width/line spacing according to the design value ⁇ 10%, exposure energy 45-55MJ/cm2)-development-single-sided printing copper paste- (Copper slurry viscosity 25°C 400-800dPa.s, printed using a vacuum printer, scraper angle 60°, vacuum degree 30 ⁇ 5Pa, speed 1m/min) - Grinding (grinding using an abrasive belt, after grinding the copper slurry
  • a method for making a double-sided core board including the following steps: cutting (0.2mm insulating substrate without copper) - drilling (mechanical drilling of through holes, drill tip 0.11mm, drilling speed 170krpm, feed speed 0.8m/min , retraction speed 15m/min, hole limit 1000) - film (roller lamination, film thickness 30 ⁇ m, pressure 0.5kg, temperature 50 ⁇ 5°C, speed 0.5-0.8m/min according to the design value) - laser graphics ( Produced using a UV laser machine, line width/line spacing is ⁇ 10% of the design value) - double-sided printing silver paste (copper paste viscosity 25°C 400-800dPa.s, printed using a vacuum printer, scraper angle 60°, vacuum degree 30 ⁇ 5Pa, speed 1m/min) - curing (pre-curing 130 ⁇ 10°C/30 minutes + curing 160 ⁇ 10°C/60 minutes) - grinding (use ceramic grinding, the height of the copper paste and the film after grinding is less than 30 ⁇ m
  • a four-layer core board manufacturing method includes the following steps: cutting (0.2mm insulating substrate without copper) - drilling (mechanical drilling of through holes, drill tip 0.11mm, drilling speed 170krpm, feed speed 0.8m/ min, retraction speed 15m/min, hole limit 1000) - film lamination (roller lamination, film thickness 30 ⁇ m selected according to design values, pressure 0.5kg, temperature 50 ⁇ 5°C, speed 0.5-0.8m/min) - laser graphics (Produced using a UV laser machine, line width/line spacing is ⁇ 10% of the design value) - Double-sided printing silver paste (copper paste viscosity 25°C 400-800dPa.s, printed using a vacuum printer, scraper angle 60°, vacuum degree 30 ⁇ 5Pa, speed 1m/min) - curing (pre-curing 100 ⁇ 10°C/30 minutes + curing 160 ⁇ 10°C/60 minutes) - grinding (use ceramic grinding, the height of the copper paste and the adhesive film after grinding is ⁇ 30 ⁇ m ,
  • a method for making a three-layer coreless board including the following steps: cutting (0.2mm pure copper substrate) - laminating (selecting 25 ⁇ m photosensitive dry film according to the design value, resolution capacity 8/8 ⁇ m, temperature 110 ⁇ 5°C, speed 0.8m/min, pressure 5-6kg) - exposure (LDI, line width/line spacing according to the design value ⁇ 10%, exposure energy 45-55MJ/cm2) - development - single-sided printing copper paste (copper paste viscosity 25°C 400- 800dPa.s, printing using a vacuum printer, squeegee angle 60°, vacuum degree 30 ⁇ 5Pa, speed 1m/min) - curing (pre-curing 130 ⁇ 10°C/30 minutes + curing 160 ⁇ 10°C/60 minutes) - grinding (Use an abrasive belt to grind.
  • the height of the copper slurry and the dry film is less than 25 ⁇ m, and the line height is controlled according to the design value) - Peeling film (line width/line spacing is ⁇ 10% according to the design value) - Lamination of insulating film (insulation The thickness of the adhesive film is controlled according to the design value and processed using a vacuum laminating and leveling machine.
  • the temperature is 100 ⁇ 10°C, the pressure is 0.7 ⁇ 0.1MPa, the vacuum degree is 1.2 ⁇ 0.1Pa, and the time is 50-100s) - curing (pre-curing 150 ⁇ 10°C) /30 minutes + curing 190 ⁇ 10°C/60 minutes) - Laser drilling (processed using a CO 2 laser drilling machine, the aperture is controlled according to the design value ⁇ 10%) - Lamination (select 25 ⁇ m photosensitive dry film for clearing according to the design value) Capacity 8/8 ⁇ m, temperature 110 ⁇ 5°C, speed 0.8m/min, pressure 5-6kg)-exposure (LDI, line width/line spacing is ⁇ 10% of the design value, exposure energy 45-55MJ/cm2)-development-single Surface printing copper paste - (Copper paste viscosity 25°C 400-800dPa.s, printed using a vacuum printer, scraper angle 60°, vacuum degree 30 ⁇ 5Pa, speed 1m/min) - Grinding (grinding using an abra
  • Embodiments 1-4 Compared with the existing conventional technology, Embodiments 1-4 mainly have the following advantages:
  • the processing capability is improved, the minimum line width/line spacing of copper paste wiring can reach 10/10 ⁇ m, and the aperture diameter is 25 ⁇ m;

Abstract

The present invention relates to the technical field of integrated circuits. Provided is a method for manufacturing a printed integrated circuit, comprising a manufacturing process in which a core board is included and a core board-free manufacturing process. The method comprises the following procedures: material cutting; pattern transfer; manufacturing of a circuit; film stripping; lamination; interlayer conduction; manufacturing of an insulating protective layer; removal of a substrate; surface treatment; and appearance forming. Compared with a conventional integrated circuit manufacturing method, the present invention can not only improve the processing capacity, but also shorten the processing work flow. Moreover, a large number of chemical agents used in the conventional manufacturing method are abandoned, and the manufacturing concept of environmental-friendly machining is better met. Compared with a 3D printing method, the efficiency is greatly improved and the costs are greatly reduced. In addition, the present invention has high universality in the field of integrated circuits.

Description

一种印刷集成电路的制作方法A method for manufacturing printed integrated circuits 技术领域Technical field
本发明属于集成电路技术领域，具体涉及一种印刷集成电路的制作方法。The invention belongs to the technical field of integrated circuits, and specifically relates to a method for manufacturing printed integrated circuits.
背景技术Background technique
现有技术中，常规集成电路制作工艺：钻孔-电镀-图形转移-线路制作-叠层-阻焊油墨-表面处理-外形，制作流程较长，根据产品层次选择重复制作，现有技术要通过金属化孔(常规电镀铜镀孔)，金属布线(蚀刻铜布线)来实现产品的电气导通的性能，需要使用大量化学药剂来实现金属化孔和金属布线，非常不环保。In the existing technology, the conventional integrated circuit production process is: drilling - electroplating - pattern transfer - circuit production - lamination - solder mask ink - surface treatment - appearance. The production process is long and repeated production is selected according to the product level. The existing technology requires To achieve the electrical conduction performance of the product through metalized holes (conventional electroplated copper plated holes) and metal wiring (etched copper wiring), a large amount of chemicals are required to achieve metallized holes and metal wiring, which is very unenvironmental.
至于3D打印技术，一方面对材料选择特别严格，导通和绝缘材料都要满足打印喷头对粘稠度、温度、喷出量等控制要求，其次3D打印出来的产品的可靠性还待验证，最后通过喷头一层一层的打印，制作效率也是目前3D打印瓶颈点。As for 3D printing technology, on the one hand, the material selection is particularly strict. The conductive and insulating materials must meet the printing nozzle’s control requirements for viscosity, temperature, ejection volume, etc. Secondly, the reliability of 3D printed products has yet to be verified. Finally, the nozzle is used to print layer by layer, and the production efficiency is also the current bottleneck of 3D printing.
另外，现有技术也有采用3D打印制作工艺，但是3D打印设备采用的材料价格都很高，单个产品生产需要至少1个小时甚至更多，打印效率非常低。In addition, the existing technology also uses 3D printing production technology, but the materials used in 3D printing equipment are very expensive. The production of a single product requires at least one hour or more, and the printing efficiency is very low.
发明内容Contents of the invention
有鉴于此，本发明提供一种印刷集成电路的制作方法。本发明能够基于现有技术的设备和物料的基础上，明显提高生产效率。In view of this, the present invention provides a method for manufacturing a printed integrated circuit. The invention can significantly improve production efficiency based on the equipment and materials of the existing technology.
本发明的技术方案在于：The technical solution of the present invention is:
一种印刷集成电路的制作方法，包括有芯板制作工艺、无芯板制作工艺，包含以下工序：A method for manufacturing printed integrated circuits, including a core board manufacturing process and a coreless board manufacturing process, including the following processes:
开料：根据不同方案选择不同的基板包含金属基板和绝缘基板，所述绝缘基板包括含铜板、不含铜板；Material development: Select different substrates according to different plans, including metal substrates and insulating substrates. The insulating substrates include copper-containing boards and copper-free boards;
孔形成：通过使用机械、激光、等离子中的任一种方式完成孔形成；Hole formation: Hole formation is completed by using any method such as machinery, laser, or plasma;
图形转移：包括第一类图形转移、第二类图形转移。Graphics transfer: including the first type of graphics transfer and the second type of graphics transfer.
其中，第一类图形转移：包括压膜、曝光、显影工艺，所述压膜采用感光材料膜；本发明中，感光材料在曝光下产生聚合反应，完成图形转移，成本相对较低，厚度根据设计线路高度选择；第二类图形转移：包括贴膜、激光烧蚀/等离子烧蚀工艺，所述贴膜采用非感光材料膜；非感光材料膜需要使用激光烧蚀完成图形转移，加工能力更高，厚度根据设计线路高度选择。Among them, the first type of pattern transfer includes lamination, exposure, and development processes. The lamination uses a photosensitive material film; in the present invention, the photosensitive material produces a polymerization reaction under exposure to complete the pattern transfer. The cost is relatively low, and the thickness is based on Design circuit height selection; the second type of graphics transfer: including lamination, laser ablation/plasma ablation process, the lamination uses a non-photosensitive material film; the non-photosensitive material film needs to use laser ablation to complete the pattern transfer, and the processing capacity is higher. The thickness is selected based on the design line height.
所述压膜或贴膜的工艺包括平面压合或滚压，具体加工条件为：温度控制在80℃-180℃，压力3kg-20kg，时间10s-300s。曝光的条件为：采用UV光或汞灯光，能量控制在10MJ-500MJ。显影液采用NaCO 3溶液，温度控制在30±1℃，显影时间再10-100s。 The lamination or lamination process includes flat lamination or rolling. The specific processing conditions are: temperature control at 80°C-180°C, pressure 3kg-20kg, and time 10s-300s. The exposure conditions are: using UV light or mercury light, and the energy is controlled at 10MJ-500MJ. The developer uses NaCO 3 solution, the temperature is controlled at 30±1℃, and the development time is 10-100s.
本发明的激光加工，包括UV激光或CO 2激光。UV激光的优点：高性能紫外激光具有波长短、光束质量高、峰值功率高等特性，减小聚焦光斑大小，确保加工精度，不同厚度、不同材料、不同图形皆可切割；CO 2激光的优点：有比较丰富的谱线，在10微米附近有几十条谱线的激光输出。输出光束的光学质量高、相干性好、线宽窄、工作稳定。有比较大的功率和比较高的能量转换效率，能量转换效率可达30～40％，这也超过了一般的气体激光器。等离子蚀孔则为非常规的孔加工技术手段。 The laser processing of the present invention includes UV laser or CO2 laser. Advantages of UV laser: High-performance UV laser has the characteristics of short wavelength, high beam quality, and high peak power. It reduces the size of the focused spot and ensures processing accuracy. It can cut different thicknesses, different materials, and different graphics; Advantages of CO 2 laser: There are relatively abundant spectral lines, with laser output of dozens of spectral lines near 10 microns. The output beam has high optical quality, good coherence, narrow line width and stable operation. It has relatively large power and relatively high energy conversion efficiency, and the energy conversion efficiency can reach 30 to 40%, which also exceeds ordinary gas lasers. Plasma drilling is an unconventional hole processing technology.
制作线路：包括使用导电浆印刷、喷涂工艺，线路宽度、高度根据设计值要求，使用物料包括铜浆、银浆等导电浆；Production of circuits: including the use of conductive paste printing and spraying processes. The circuit width and height are based on the design value requirements. The materials used include conductive pastes such as copper paste and silver paste;
本发明中，印刷是指使用真空印刷机配合精密网板(网板有对应板面的图形)，将导电浆倾倒到网板上，使用刮刀通过压力使导电浆透过网板转移到板面上；喷涂是指将导电浆的粘稠度进行调整，放置在相应容器里，使用喷嘴通过气压喷洒到板面；导电浆是指铜浆、银浆等可实现导电功能的涂料。In the present invention, printing refers to using a vacuum printer with a precision screen (the screen has a pattern corresponding to the board) to pour the conductive slurry onto the screen, and using a scraper to transfer the conductive slurry to the board through the screen through pressure. Above; Spraying refers to adjusting the viscosity of conductive paste, placing it in a corresponding container, and using a nozzle to spray it onto the board surface through air pressure; conductive paste refers to coatings such as copper paste and silver paste that can achieve conductive functions.
褪膜：包括化学分解或物理剥离工艺；Peeling: including chemical decomposition or physical peeling process;
叠层：选用压合或印刷、固化工艺；Lamination: Use lamination or printing and curing processes;
本发明中，叠层是将树脂、聚酰亚胺等绝缘材料通过压合或者印刷等方式覆盖在线路表面，实现绝缘的效果，压合是最常用的加工方式，压合的作业条件包括温度、压力、时间，温度控制在80-180℃，压力3-100kg，时间10-300s。固化条件包括温度、时间，温度控制100-180℃，时间20-100min。In the present invention, lamination is to cover the circuit surface with insulating materials such as resin and polyimide through lamination or printing to achieve the insulation effect. Lamination is the most commonly used processing method, and the working conditions of lamination include temperature. , pressure, time, temperature control at 80-180°C, pressure 3-100kg, time 10-300s. Curing conditions include temperature and time. The temperature is controlled at 100-180°C and the time is 20-100 minutes.
层间导通：包括第一类层间导通、第二类层间导通。Interlayer conduction: including the first type of interlayer conduction and the second type of interlayer conduction.
其中，第一类层间导通：包括依次设置的叠层、钻孔、印刷导通工艺；本发明的第一类层间导通是使用激光先完成孔制作，再塞铜浆实现孔导通，流程相对简便，激光与上述激光原理相同。Among them, the first type of inter-layer conduction: including the lamination, drilling, and printing conduction processes arranged in sequence; the first type of inter-layer conduction of the present invention uses laser to first complete the hole production, and then fills the copper paste to achieve hole conduction. Yes, the process is relatively simple, and the principle of laser is the same as that of the above laser.
导通采用电镀或塞导电浆工艺，使用常规技术手段通道硫酸铜电解反应使铜离子沉积到孔内实现填孔的效果，有电流、化学药水等多种作业条件要求；塞导电浆的方式就与上述印刷图形的方式一致。The conduction adopts electroplating or conductive plasma plugging process. Conventional technical means are used to channel copper sulfate electrolysis reaction to deposit copper ions into the holes to achieve the hole filling effect. There are various operating conditions requirements such as current and chemical solution; the method of plugging conductive plasma is Same as above for printed graphics.
第二类层间导通：包括依次设置的导电柱制备、叠层、研磨、导通工艺；The second type of interlayer conduction: including the sequential preparation, lamination, grinding, and conduction processes of conductive pillars;
本发明中，第二类层间导通实现导通的效果的研磨方式包括陶瓷研磨、砂带研磨技术手段，作业条件包括速度、压力、砂轮等要素。In the present invention, the second type of grinding method to achieve the effect of conduction between layers includes ceramic grinding and abrasive belt grinding technical means, and the operating conditions include factors such as speed, pressure, and grinding wheels.
特别的，本发明中，若选择第一类层间导通，需要先完成叠层再进行第一类层间导通的作业方式；若选择第二类层间导通，则需要先完成导通柱制作再进行叠层制作。In particular, in the present invention, if the first type of inter-layer conduction is selected, the lamination needs to be completed first and then the first type of inter-layer conduction is performed; if the second type of inter-layer conduction is selected, the conduction needs to be completed first. The through-column is made and then laminated.
绝缘保护层制作；Production of insulation protective layer;
去除基板：包括化学分解或物理物料去除工艺；Substrate removal: including chemical decomposition or physical material removal processes;
表面处理：根据应用领域选用沉金、沉锡、沉银、喷锡、电镀金、OSP工艺；Surface treatment: choose immersion gold, immersion tin, immersion silver, spray tin, electroplating gold, OSP process according to the application field;
外形：选用激光、冲切、锣形中任一种工艺完成外形加工。Appearance: Use any one of laser, punching, and gong-shaping processes to complete the appearance processing.
所述有芯板制作工艺，包括以下步骤：开料-钻孔-第一类图形转移-制作线路-褪膜-叠层-第一类层间导通-绝缘保护层制作-表面处理-飞针测试-外形。The core board manufacturing process includes the following steps: cutting - drilling - first type pattern transfer - making circuits - peeling off - lamination - first type interlayer conduction - insulating protective layer production - surface treatment - flying Needle test - profile.
本发明的所述有芯板制作工艺，采用印刷导电浆代替电镀实现布线及层间导通的效果；绝缘保护层制作代替阻焊油墨实现保护线路、绝缘、抗氧化等效果，所述绝缘保护层包含阻焊油墨、树脂、聚酰亚胺等绝缘材料。The core board manufacturing process of the present invention uses printed conductive paste instead of electroplating to achieve the effects of wiring and interlayer conduction; the production of insulating protective layers replaces solder resist ink to achieve effects such as circuit protection, insulation, and anti-oxidation. The insulation protection The layers contain insulating materials such as solder mask ink, resin, and polyimide.
所述有芯板制作工艺，包括以下步骤：开料-钻孔-第二类图形转移-制作线路-褪膜-叠层-第一类层间导通-绝缘保护层制作-表面处理-飞针测试-外形。The core board manufacturing process includes the following steps: material cutting - drilling - second type pattern transfer - circuit production - film stripping - lamination - first type interlayer conduction - insulating protective layer production - surface treatment - flying Needle test - profile.
所述有芯板制作工艺，包括以下步骤：开料-钻孔-第二类图形转移-制作线路-褪膜-第二类层间导通-叠层-绝缘保护层制作-表面处理-飞针测试-外形。The core board manufacturing process includes the following steps: cutting - drilling - second type pattern transfer - making circuits - peeling film - second type interlayer conduction - lamination - insulating protective layer production - surface treatment - flying Needle test - profile.
所述有芯板制作工艺，包括以下步骤：开料-钻孔-第一类图形转移-制作线路-褪膜-第二类层间导通-叠层-绝缘保护层制作-表面处理-飞针测试-外形。The core board manufacturing process includes the following steps: cutting - drilling - first type of pattern transfer - production of circuits - film stripping - second type of interlayer conduction - lamination - production of insulating protective layer - surface treatment - flying Needle test - profile.
所述无芯板制作工艺，包括以下步骤：开料-第一类图形转移-制作线路-褪膜-叠层-第一类层间导通--绝缘保护层制作-去除基板-表面处理-飞针测试-外形。The coreless board manufacturing process includes the following steps: material cutting - first type pattern transfer - circuit production - film stripping - lamination - first type interlayer conduction - insulating protective layer production - substrate removal - surface treatment - Flying Probe Test - Shape.
所述无芯板制作工艺，包括以下步骤：开料-第二类图形转移-制作线路-褪膜-叠层-第一类层间导通--绝缘保护层制作-去除基板-表面处理-飞针测试-外形。The coreless board manufacturing process includes the following steps: material cutting - second type pattern transfer - circuit production - film stripping - lamination - first type interlayer conduction - insulating protective layer production - substrate removal - surface treatment - Flying Probe Test - Shape.
所述无芯板制作工艺，包括以下步骤：开料-第二类图形转移-制作线路-褪膜-第二类层间导通-叠层-绝缘保护层制作-去除基板-表面处理-飞针测试-外形。The coreless board manufacturing process includes the following steps: material cutting - second type pattern transfer - circuit production - film stripping - second type interlayer conduction - lamination - insulating protective layer production - substrate removal - surface treatment - flying Needle test - profile.
所述无芯板制作工艺，包括以下步骤：开料-第一类图形转移-制作线路-褪膜-第二类层间导通-叠层-绝缘保护层制作-去除基板-表面处理-飞针测试-外形。The coreless board manufacturing process includes the following steps: material cutting - first type pattern transfer - circuit production - film stripping - second type interlayer conduction - lamination - insulating protective layer production - substrate removal - surface treatment - flying Needle test - profile.
本发明的有益效果在于：The beneficial effects of the present invention are:
1、降低成本：主要体现在设备、化学药水的方面，使用本方案可舍弃蚀刻线、填孔线等大量加工设备及对应的化学药剂；1. Cost reduction: Mainly reflected in equipment and chemicals. Using this solution can eliminate a large number of processing equipment and corresponding chemicals such as etching lines and hole filling lines;
2、提升加工能力：使用印刷导电浆布线的方式，无需在图形转移时考虑蚀刻补偿和蚀刻因子，提升线路精度加工能力，使用激光钻孔的方式提升微型导通孔的加工能力，通过使用真空压合整平或真空印刷的方式，有效提升绝缘层均匀性；2. Improve processing capabilities: Using printed conductive paste wiring method, there is no need to consider etching compensation and etching factors during pattern transfer, improving line precision processing capabilities, using laser drilling to improve micro via hole processing capabilities, and using vacuum Pressing and leveling or vacuum printing can effectively improve the uniformity of the insulation layer;
3、缩减制作流程，线路制作与层间导通均可以选择使用印刷导电浆的方式实现，无需常规蚀刻及电镀等线路板的相关流程，提高效率；3. Reduce the production process. Both circuit production and inter-layer conduction can be achieved by printing conductive paste. There is no need for conventional etching and electroplating and other circuit board-related processes to improve efficiency;
4、摒弃大部分化学药剂，更加环保，使用导电浆印刷的方式实现线路布线和层间导通，无需 使用蚀刻药液、电镀药液等化学药剂；4. Abandon most chemicals and be more environmentally friendly. Use conductive paste printing to achieve circuit wiring and inter-layer conduction. There is no need to use etching solutions, electroplating solutions and other chemicals;
线路板关键点就是实现布线和层间导通，常规线路板加工流程需要蚀刻、电镀等流程实现功能，过程中需要使用到许多化学药剂，如电镀药水、沉铜药水、蚀刻药水等化学药剂。本发明直接可以选择使用印刷导电浆的方式替代蚀刻、电镀等常规流程实现布线及层间导通的效果。摒弃常规流程中所使用的大部分化学药剂，大大减少环境污染，进一步实现绿色环保生产的目标。The key point of the circuit board is to realize wiring and inter-layer conduction. The conventional circuit board processing process requires etching, electroplating and other processes to realize the function. Many chemicals are used in the process, such as electroplating solution, copper immersion solution, etching solution and other chemicals. The present invention can directly choose to use printed conductive paste instead of conventional processes such as etching and electroplating to achieve the effects of wiring and inter-layer conduction. Abandon most of the chemicals used in conventional processes, greatly reducing environmental pollution and further achieving the goal of green and environmentally friendly production.
5、在集成电路(包含但不限于印制电路板、芯片、封装载板等)领域通用能力强。5. Strong general ability in the field of integrated circuits (including but not limited to printed circuit boards, chips, packaging carrier boards, etc.).
本发明对比常规集成电路制作方法不仅可以提升加工能力，而且可以缩短加工流程，大量摒弃常规制作方法使用的化学药剂，更符合环保加工的制造理念。相对于3D打印方式效率大幅度提升，成本大幅度降低。并且在集成电路(包含但不限于印制电路板、芯片、封装载板等)领域通用能力强。Compared with conventional integrated circuit manufacturing methods, the present invention can not only improve processing capabilities, but also shorten the processing process, eliminate a large number of chemicals used in conventional manufacturing methods, and is more in line with the manufacturing concept of environmentally friendly processing. Compared with 3D printing, the efficiency is greatly improved and the cost is greatly reduced. And has strong general capabilities in the field of integrated circuits (including but not limited to printed circuit boards, chips, packaging carrier boards, etc.).
具体实施方式Detailed ways
下面将结合本发明实施例对本发明的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solution of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.
实施例1Example 1
一种双面无芯板制作方法，包括以下步骤：开料(0.2mm纯铜基板)-压膜(根据设计值选择25μm感光干膜解晰能力8/8μm，温度110±5℃，速度0.8m/min，压力5-6kg)-曝光(LDI，线宽/线距按设计值±10％曝光能量45-55MJ/cm2)-显影-单面印刷铜浆(铜浆粘度25℃400-800dPa.s，使用真空印刷机印刷、刮刀角度60°、真空度30±5Pa、速度1m/min)-固化(预固化130±10℃/30分钟+固化160±10℃/60分钟)-研磨(使用砂带研磨，研磨后铜浆与干膜平齐高度＜25μm，线路高度按照设计值管控)-褪膜(线宽/线距按设计值±10％)-压合绝缘胶膜(绝缘胶膜厚度按照设计值管控，使用真空贴合整平机加工，温度100±10℃、压力0.7±0.1MPa、真空度1.2±0.1Pa、时间50-100s)-固化(预固化150±10℃/30分钟+固化190±10℃/60分钟)-激光钻孔(使用CO 2激光钻孔机加工，孔径按照设计值±10％管控)-压膜(25μm感光干膜解晰能力8/8μm，温度110±5℃，速度0.8m/min，压力5-6kg)-曝光(LDI，线宽/线距按设计值±10％曝光能量45-55MJ/cm2)-显影-单面印刷铜浆-(铜浆粘度25℃400-800dPa.s，使用真空印刷机印刷、刮刀角度60°、真空度30±5Pa、速度1m/min)-研磨(使用砂带研磨，研磨后铜浆与干膜平齐高度＜25μm，线路高度按照设计值管控)-褪膜(线宽/线距按设计值±10％)-蚀刻基板-阻焊油墨印刷-曝光-显影-固化-镍钯金-飞针测试 -外形。 A method for making a double-sided coreless board, including the following steps: cutting (0.2mm pure copper substrate) - laminating (selecting 25μm photosensitive dry film according to design value, resolution capacity 8/8μm, temperature 110±5℃, speed 0.8 m/min, pressure 5-6kg) - exposure (LDI, line width/line spacing according to the design value ±10%, exposure energy 45-55MJ/cm2) - development - single-sided printing copper paste (copper paste viscosity 25℃ 400-800dPa .s, use vacuum printing machine to print, scraper angle 60°, vacuum degree 30±5Pa, speed 1m/min)-curing (pre-curing 130±10℃/30 minutes + curing 160±10℃/60 minutes)-grinding ( Use an abrasive belt to grind. After grinding, the copper slurry is flush with the dry film and the height is less than 25 μm. The line height is controlled according to the design value) - peeling film (line width/line spacing is ±10% according to the design value) - lamination of insulating adhesive film (insulating adhesive film) The film thickness is controlled according to the design value, and is processed using a vacuum laminating and leveling machine. The temperature is 100±10℃, the pressure is 0.7±0.1MPa, the vacuum degree is 1.2±0.1Pa, and the time is 50-100s) - curing (pre-curing 150±10℃/ 30 minutes + curing 190±10℃/60 minutes) - Laser drilling (processed using a CO 2 laser drilling machine, the aperture is controlled according to the design value ±10%) - Lamination (25μm photosensitive dry film resolution ability 8/8μm, Temperature 110±5℃, speed 0.8m/min, pressure 5-6kg)-exposure (LDI, line width/line spacing according to the design value ±10%, exposure energy 45-55MJ/cm2)-development-single-sided printing copper paste- (Copper slurry viscosity 25℃ 400-800dPa.s, printed using a vacuum printer, scraper angle 60°, vacuum degree 30±5Pa, speed 1m/min) - Grinding (grinding using an abrasive belt, after grinding the copper slurry is level with the dry film All heights <25μm, line height is controlled according to the design value) - peeling film (line width/line spacing according to the design value ±10%) - etching substrate - solder resist ink printing - exposure - development - curing - nickel-palladium gold - flying probe test -shape.
实施例2Example 2
一种双面有芯板制作方法，包括以下步骤：开料(0.2mm绝缘基板不含铜)-钻孔(机械钻通孔，钻咀0.11mm，钻速170krpm、进刀速0.8m/min、退刀速15m/min、孔限1000)-贴膜(滚轮贴合，根据设计值选择胶膜厚度30μm，压力0.5kg、温度50±5℃、速度0.5-0.8m/min)-激光图形(使用UV激光机制作，线宽/线距按设计值±10％)-双面印刷银浆(铜浆粘度25℃400-800dPa.s，使用真空印刷机印刷、刮刀角度60°、真空度30±5Pa、速度1m/min)-固化(预固化130±10℃/30分钟+固化160±10℃/60分钟)-研磨(使用陶瓷研磨，研磨后铜浆与胶膜平齐高度＜30μm，线路高度按照设计值管控)-撕膜(线宽/线距按设计值±10％)-阻焊油墨印刷-曝光-显影-固化-化金-飞针-外形。A method for making a double-sided core board, including the following steps: cutting (0.2mm insulating substrate without copper) - drilling (mechanical drilling of through holes, drill tip 0.11mm, drilling speed 170krpm, feed speed 0.8m/min , retraction speed 15m/min, hole limit 1000) - film (roller lamination, film thickness 30μm, pressure 0.5kg, temperature 50±5℃, speed 0.5-0.8m/min according to the design value) - laser graphics ( Produced using a UV laser machine, line width/line spacing is ±10% of the design value) - double-sided printing silver paste (copper paste viscosity 25°C 400-800dPa.s, printed using a vacuum printer, scraper angle 60°, vacuum degree 30 ±5Pa, speed 1m/min) - curing (pre-curing 130±10℃/30 minutes + curing 160±10℃/60 minutes) - grinding (use ceramic grinding, the height of the copper paste and the film after grinding is less than 30μm, The line height is controlled according to the design value) - film tearing (line width/line spacing is ±10% according to the design value) - solder resist ink printing - exposure - development - curing - gold melting - flying needle - appearance.
实施例3Example 3
一种四层带有芯板制作方法，包括以下步骤：开料(0.2mm绝缘基板不含铜)-钻孔(机械钻通孔，钻咀0.11mm，钻速170krpm、进刀速0.8m/min、退刀速15m/min、孔限1000)-贴膜(滚轮贴合，根据设计值选择胶膜厚度30μm，压力0.5kg、温度50±5℃、速度0.5-0.8m/min)-激光图形(使用UV激光机制作，线宽/线距按设计值±10％)-双面印刷银浆(铜浆粘度25℃400-800dPa.s，使用真空印刷机印刷、刮刀角度60°、真空度30±5Pa、速度1m/min)-固化(预固化100±10℃/30分钟+固化160±10℃/60分钟)-研磨(使用陶瓷研磨，研磨后铜浆与胶膜平齐高度＜30μm，线路高度按照设计值管控)-撕膜(线宽/线距按设计值±10％)-压合绝缘胶膜(绝缘胶膜厚度按照设计值管控，使用真空贴合整平机加工，温度100±10℃、压力0.7±0.1MPa、真空度1.2±0.1Pa、时间50-100s)-固化(预固化150±10℃/30分钟+固化190±10℃/60分钟)-激光钻孔(使用CO2激光钻盲孔，根据设计值管控孔径±10％)-压膜(跟进设计要求线路高度选择25μm感光干膜解晰能力8/8μm，温度110±5℃，速度0.8m/min，压力5-6kg)-曝光(LDI，线宽/线距按设计值±10％曝光能量45-55MJ/cm2)-显影-双面印刷银浆(铜浆粘度25℃400-800dPa.s，使用真空印刷机印刷、刮刀角度60°、真空度30±5Pa、速度1m/min)-固化(预固化100±10℃/30分钟+固化160±10℃/60分钟)-研磨(使用陶瓷研磨研磨后铜浆与干膜平齐高度＜25μm，线路高度按照设计值管控)-褪膜(线宽/线距按设计值±10％)-阻焊油墨印刷-曝光-显影-固化-化金-飞针-外形。A four-layer core board manufacturing method includes the following steps: cutting (0.2mm insulating substrate without copper) - drilling (mechanical drilling of through holes, drill tip 0.11mm, drilling speed 170krpm, feed speed 0.8m/ min, retraction speed 15m/min, hole limit 1000) - film lamination (roller lamination, film thickness 30μm selected according to design values, pressure 0.5kg, temperature 50±5℃, speed 0.5-0.8m/min) - laser graphics (Produced using a UV laser machine, line width/line spacing is ±10% of the design value) - Double-sided printing silver paste (copper paste viscosity 25℃ 400-800dPa.s, printed using a vacuum printer, scraper angle 60°, vacuum degree 30±5Pa, speed 1m/min) - curing (pre-curing 100±10℃/30 minutes + curing 160±10℃/60 minutes) - grinding (use ceramic grinding, the height of the copper paste and the adhesive film after grinding is <30μm , the line height is controlled according to the design value) - film tearing (line width/line spacing is according to the design value ±10%) - laminating insulating film (the thickness of the insulating film is controlled according to the design value, processed using a vacuum laminating and leveling machine, temperature 100±10℃, pressure 0.7±0.1MPa, vacuum degree 1.2±0.1Pa, time 50-100s) - curing (pre-curing 150±10℃/30 minutes + curing 190±10℃/60 minutes) - laser drilling ( Use CO2 laser to drill blind holes, and control the aperture diameter ±10% according to the design value) - Lamination (following the design requirements, select a line height of 25μm photosensitive dry film with a resolution of 8/8μm, temperature 110±5℃, speed 0.8m/min, Pressure 5-6kg) - exposure (LDI, line width/line spacing according to the design value ±10%, exposure energy 45-55MJ/cm2) - development - double-sided printing silver paste (copper paste viscosity 25℃ 400-800dPa.s, use Printing with a vacuum printer, squeegee angle 60°, vacuum degree 30±5Pa, speed 1m/min) - curing (pre-curing 100±10℃/30 minutes + curing 160±10℃/60 minutes) - grinding (grinding using ceramic grinding The height of the final copper paste and the dry film is less than 25 μm, and the line height is controlled according to the design value) - Film fade (line width/line spacing is ±10% according to the design value) - Solder resist ink printing - Exposure - Development - Curing - Gold - Flying Needle - Profile.
实施例4Example 4
一种三层带无芯板制作方法，包括以下步骤：开料(0.2mm纯铜基板)-压膜(根据设计值选择25μm感光干膜解晰能力8/8μm，温度110±5℃，速度0.8m/min，压力5-6kg)-曝光(LDI，线宽/线距按设计值±10％曝光能量45-55MJ/cm2)-显影-单面印刷铜浆(铜浆粘度25℃ 400-800dPa.s，使用真空印刷机印刷、刮刀角度60°、真空度30±5Pa、速度1m/min)-固化(预固化130±10℃/30分钟+固化160±10℃/60分钟)-研磨(使用砂带研磨，研磨后铜浆与干膜平齐高度＜25μm，线路高度按照设计值管控)-褪膜(线宽/线距按设计值±10％)-压合绝缘胶膜(绝缘胶膜厚度按照设计值管控，使用真空贴合整平机加工，温度100±10℃、压力0.7±0.1MPa、真空度1.2±0.1Pa、时间50-100s)-固化(预固化150±10℃/30分钟+固化190±10℃/60分钟)-激光钻孔(使用CO 2激光钻孔机加工，孔径按照设计值±10％管控)-压膜(根据设计值选择25μm感光干膜解晰能力8/8μm，温度110±5℃，速度0.8m/min，压力5-6kg)-曝光(LDI，线宽/线距按设计值±10％曝光能量45-55MJ/cm2)-显影-单面印刷铜浆-(铜浆粘度25℃400-800dPa.s，使用真空印刷机印刷、刮刀角度60°、真空度30±5Pa、速度1m/min)-研磨(使用砂带研磨，研磨后铜浆与干膜平齐高度＜25μm，线路高度按照设计值管控)-褪膜(线宽/线距按设计值±10％)-压合绝缘胶膜(绝缘胶膜厚度按照设计值管控，使用真空贴合整平机加工，温度100±10℃、压力0.7±0.1MPa、真空度1.2±0.1Pa、时间50-100s)-固化(预固化150±10℃/30分钟+固化190±10℃/60分钟)-激光钻孔(使用CO 2激光钻孔机加工，孔径按照设计值±10％管控)-贴膜-(滚轮贴合，根据设计值选择胶膜厚度30μm，压力0.5kg、温度50±5℃、速度0.5-0.8m/min)-激光图形(使用UV激光机制作，线宽/线距按设计值±10％)-单面印刷铜浆-(铜浆粘度25℃400-800dPa.s，使用真空印刷机印刷、刮刀角度60°、真空度30±5Pa、速度1m/min)-研磨(使用砂带研磨，研磨后铜浆与胶膜平齐高度＜30μm，线路高度按照设计值管控)-褪膜(线宽/线距按设计值±10％)-蚀刻基板-阻焊油墨印刷-曝光-显影-固化-镍钯金-飞针测试-外形。 A method for making a three-layer coreless board, including the following steps: cutting (0.2mm pure copper substrate) - laminating (selecting 25μm photosensitive dry film according to the design value, resolution capacity 8/8μm, temperature 110±5℃, speed 0.8m/min, pressure 5-6kg) - exposure (LDI, line width/line spacing according to the design value ±10%, exposure energy 45-55MJ/cm2) - development - single-sided printing copper paste (copper paste viscosity 25℃ 400- 800dPa.s, printing using a vacuum printer, squeegee angle 60°, vacuum degree 30±5Pa, speed 1m/min) - curing (pre-curing 130±10℃/30 minutes + curing 160±10℃/60 minutes) - grinding (Use an abrasive belt to grind. After grinding, the height of the copper slurry and the dry film is less than 25 μm, and the line height is controlled according to the design value) - Peeling film (line width/line spacing is ±10% according to the design value) - Lamination of insulating film (insulation The thickness of the adhesive film is controlled according to the design value and processed using a vacuum laminating and leveling machine. The temperature is 100±10°C, the pressure is 0.7±0.1MPa, the vacuum degree is 1.2±0.1Pa, and the time is 50-100s) - curing (pre-curing 150±10°C) /30 minutes + curing 190±10℃/60 minutes) - Laser drilling (processed using a CO 2 laser drilling machine, the aperture is controlled according to the design value ±10%) - Lamination (select 25μm photosensitive dry film for clearing according to the design value) Capacity 8/8μm, temperature 110±5℃, speed 0.8m/min, pressure 5-6kg)-exposure (LDI, line width/line spacing is ±10% of the design value, exposure energy 45-55MJ/cm2)-development-single Surface printing copper paste - (Copper paste viscosity 25℃ 400-800dPa.s, printed using a vacuum printer, scraper angle 60°, vacuum degree 30±5Pa, speed 1m/min) - Grinding (grinding using an abrasive belt, after grinding the copper The flush height between the slurry and the dry film is less than 25 μm, and the line height is controlled according to the design value) - peeling film (line width/line spacing is based on the design value ±10%) - lamination of the insulating film (the thickness of the insulating film is controlled according to the design value, use Vacuum laminating and leveling machine processing, temperature 100±10℃, pressure 0.7±0.1MPa, vacuum degree 1.2±0.1Pa, time 50-100s) - curing (pre-curing 150±10℃/30 minutes + curing 190±10℃ /60 minutes) - Laser drilling (processed using a CO 2 laser drilling machine, the hole diameter is controlled according to the design value ±10%) - Film lamination - (Roller lamination, select the film thickness 30μm according to the design value, pressure 0.5kg, temperature 50 ±5℃, speed 0.5-0.8m/min) - Laser graphics (made using UV laser machine, line width/line spacing are ±10% of the design value) - single-sided printing copper paste - (copper paste viscosity 25℃ 400-800dPa .s, use a vacuum printer to print, scraper angle 60°, vacuum degree 30±5Pa, speed 1m/min) - grinding (use an abrasive belt to grind, the height of the copper paste and the film after grinding is less than 30μm, and the line height is as designed value control) - fade film (line width/line spacing according to the design value ±10%) - etching substrate - solder resist ink printing - exposure - development - curing - nickel palladium - flying probe test - appearance.
实施例1-4与现有常规技术相比，主要有以下优点：Compared with the existing conventional technology, Embodiments 1-4 mainly have the following advantages:
1、加工能力提升，铜浆布线线宽/线距最小可以达到10/10μm、孔径25μm；1. The processing capability is improved, the minimum line width/line spacing of copper paste wiring can reach 10/10μm, and the aperture diameter is 25μm;
2、生产流程无需使用蚀刻、沉镀铜流程，避免使用蚀刻液、硫酸、高锰酸钾等化学药剂，加工流程更加环保；2. The production process does not require the use of etching and copper plating processes, and avoids the use of etching liquids, sulfuric acid, potassium permanganate and other chemicals, making the processing process more environmentally friendly;
3、重复使用印刷布线+印刷导通的方式完成产品制作，需要加工设备较少，加工场地面积小，总体投资成本低。3. Reusing printed wiring + printed conduction to complete product production requires less processing equipment, a small processing site area, and low overall investment cost.
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。It is obvious to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be regarded as illustrative and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is therefore intended that all claims falling within the claims All changes within the meaning and scope of equivalent elements are included in the present invention.
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含 一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。需注意的是，本发明中所未详细描述的技术特征，均可以通过任一现有技术实现。In addition, it should be understood that although this specification is described in terms of implementations, not each implementation only contains an independent technical solution. This description of the specification is only for the sake of clarity, and those skilled in the art should take the specification as a whole. , the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be realized by any existing technology.

Claims (9)

  1. 一种印刷集成电路的制作方法，其特征在于，包括有芯板制作工艺、无芯板制作工艺，包含以下工序：A method for manufacturing printed integrated circuits, which is characterized in that it includes a core board manufacturing process and a coreless board manufacturing process, and includes the following processes:
    开料：根据不同方案选择不同的基板包含金属基板和绝缘基板；孔形成：通过使用机械、激光、等离子中的任一种方式完成孔形成；Material cutting: Choose different substrates according to different plans, including metal substrates and insulating substrates; Hole formation: Hole formation is completed by using any method such as machinery, laser, or plasma;
    图形转移：包括第一类图形转移、第二类图形转移，其中，第一类图形转移：包括压膜、曝光、显影工艺，所述压膜采用感光材料膜；第二类图形转移：包括贴膜、激光加工工艺，所述贴膜采用非感光材料膜；Graphic transfer: includes the first type of graphics transfer and the second type of graphics transfer. The first type of graphics transfer: includes lamination, exposure, and development processes. The lamination uses photosensitive material film; the second type of graphics transfer: includes lamination. , Laser processing technology, the film is made of non-photosensitive material film;
    制作线路：包括印刷或喷涂、研磨工艺，线路宽度、高度根据设计值要求，使用物料为导电浆；Production of circuits: including printing or spraying and grinding processes. The circuit width and height are based on the design value requirements, and the material used is conductive paste;
    褪膜：包括化学分解或物理剥离工艺；Peeling: including chemical decomposition or physical peeling process;
    叠层：包括压合或印刷、固化工艺，使用物料为绝缘材料，包括环氧树脂、聚酰亚胺；Lamination: including lamination or printing and curing processes, the materials used are insulating materials, including epoxy resin and polyimide;
    层间导通：包括第一类层间导通、第二类层间导通，其中，第一类层间导通：包括依次设置的叠层、钻孔、印刷导电浆导通工艺；第二类层间导通：包括依次设置的导电柱制备、叠层、研磨、导通工艺；Inter-layer conduction: includes the first type of inter-layer conduction and the second type of inter-layer conduction. Among them, the first type of inter-layer conduction: includes the lamination, drilling, and printed conductive paste conduction processes set in sequence; Type II interlayer conduction: including the sequential preparation, lamination, grinding, and conduction processes of conductive pillars;
    绝缘保护层制作；Production of insulation protective layer;
    去除基板：包括化学分离或物理剥离去除工艺；Substrate removal: including chemical separation or physical stripping removal processes;
    表面处理：包括沉金、沉锡、沉银、喷锡、电镀金、OSP工艺；Surface treatment: including immersion gold, immersion tin, immersion silver, spray tin, electroplating gold, OSP process;
    外形：选用激光、冲切、锣形中任一种工艺完成外形加工。Appearance: Use any one of laser, punching, and gong-shaping processes to complete the appearance processing.
  2. 根据权利要求1所述的印刷集成电路的制作方法，其特征在于，所述有芯板制作工艺，包括以下步骤：开料-钻孔-第一类图形转移-制作线路-褪膜-叠层-第一类层间导通-绝缘保护层制作-表面处理-飞针测试-外形。The manufacturing method of printed integrated circuits according to claim 1, characterized in that the core board manufacturing process includes the following steps: cutting - drilling - first type pattern transfer - making circuits - peeling off - lamination -The first type of interlayer conduction-insulating protective layer production-surface treatment-flying probe test-shape.
  3. 根据权利要求1所述的印刷集成电路的制作方法，其特征在于，所述有芯板制作工艺，包括以下步骤：开料-钻孔-第二类图形转移-制作线路-褪膜-叠层-第一类层间导通-绝缘保护层制作-表面处理-飞针测试-外形。The manufacturing method of printed integrated circuits according to claim 1, characterized in that the core board manufacturing process includes the following steps: cutting - drilling - second type pattern transfer - making circuits - peeling off - lamination -The first type of interlayer conduction-insulating protective layer production-surface treatment-flying probe test-shape.
  4. 根据权利要求1所述的印刷集成电路的制作方法，其特征在于，所述有芯板制作工艺，包括以下步骤：开料-钻孔-第二类图形转移-制作线路-褪膜-第二类层间导通-叠层-绝缘保护层制作-表面处理-飞针测试-外形。The manufacturing method of printed integrated circuits according to claim 1, characterized in that the core board manufacturing process includes the following steps: cutting - drilling - second type of pattern transfer - making circuit - peeling off - second Inter-layer conduction - lamination - insulation protective layer production - surface treatment - flying probe test - appearance.
  5. 根据权利要求1所述的印刷集成电路的制作方法，其特征在于，所述有芯板制作工艺，包括以下步骤：开料-钻孔-第一类图形转移-制作线路-褪膜-第二类层间导通-叠层-绝缘保护层制作-表面处理-飞针测试-外形。The manufacturing method of printed integrated circuits according to claim 1, characterized in that the core board manufacturing process includes the following steps: cutting - drilling - first type of pattern transfer - making circuits - peeling off - second Inter-layer conduction - lamination - insulation protective layer production - surface treatment - flying probe test - appearance.
  6. 根据权利要求1所述的印刷集成电路的制作方法，其特征在于，所述无芯板制作工艺，包 括以下步骤：开料-第一类图形转移-制作线路-褪膜-叠层-第一类层间导通--绝缘保护层制作-去除基板-表面处理-飞针测试-外形。The manufacturing method of printed integrated circuits according to claim 1, characterized in that the coreless board manufacturing process includes the following steps: material cutting - first type pattern transfer - circuit production - film removal - lamination - first Interlayer conduction-insulating protective layer production-removal of substrate-surface treatment-flying probe test-shape.
  7. 根据权利要求1所述的印刷集成电路的制作方法，其特征在于，所述无芯板制作工艺，包括以下步骤：开料-第二类图形转移-制作线路-褪膜-叠层-第一类层间导通--绝缘保护层制作-去除基板-表面处理-飞针测试-外形。The manufacturing method of printed integrated circuits according to claim 1, characterized in that the coreless board manufacturing process includes the following steps: material cutting - second type pattern transfer - circuit production - film removal - lamination - first Interlayer conduction-insulating protective layer production-removal of substrate-surface treatment-flying probe test-shape.
  8. 根据权利要求1所述的印刷集成电路的制作方法，其特征在于，所述无芯板制作工艺，包括以下步骤：开料-第二类图形转移-制作线路-褪膜-第二类层间导通-叠层-绝缘保护层制作-去除基板-表面处理-飞针测试-外形。The manufacturing method of printed integrated circuits according to claim 1, characterized in that the coreless board manufacturing process includes the following steps: material opening - second type pattern transfer - circuit production - film removal - second type interlayer Conducting - stacking - insulating protective layer production - substrate removal - surface treatment - flying probe test - appearance.
  9. 根据权利要求1所述的印刷集成电路的制作方法，其特征在于，所述无芯板制作工艺，包括以下步骤：开料-第一类图形转移-制作线路-褪膜-第二类层间导通-叠层-绝缘保护层制作-去除基板-表面处理-飞针测试-外形。The manufacturing method of printed integrated circuits according to claim 1, characterized in that the coreless board manufacturing process includes the following steps: material opening - first type of pattern transfer - production of circuits - film removal - second type of interlayer Conducting - stacking - insulating protective layer production - substrate removal - surface treatment - flying probe test - appearance.
PCT/CN2022/138623 2022-06-09 2022-12-13 Method for manufacturing printed integrated circuit WO2023236484A1 (en)

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