CN113490347A

CN113490347A - Manufacturing method of PCB with convex-shaped side surface

Info

Publication number: CN113490347A
Application number: CN202110614594.5A
Authority: CN
Inventors: 万应琪; 宋振武; 郭先锋
Original assignee: Q&d Circuits Co ltd
Current assignee: Q&d Circuits Co ltd
Priority date: 2021-06-02
Filing date: 2021-06-02
Publication date: 2021-10-08

Abstract

The invention provides a method for manufacturing a metal-based PCB with a convex side step, which comprises the following steps of; the first step is as follows: determining a laminated structure; a second step; manufacturing an inner-layer core board circuit, wherein the inner-layer core board circuit comprises an inner-layer core board protruding part circuit electric gold; a third step; pre-pressing a core plate; the fourth step: a convex cover plate is gonged on the cover plate; the fifth step: pressing; and a sixth step: outer layer circuit, solder resist and characters; the seventh step: and (4) forming. The invention solves the PCB production mode of a structure with fixed height difference, realizes the scheme of multi-region welding and connection design, solves partial problems of the transfer of a large number of connectors, realizes effective heat dissipation design for the PCB with serious inner layer heating, realizes quick heat conduction while dissipating heat, and realizes the design of the PCB with high precision, high conduction and high heat dissipation.

Description

Manufacturing method of PCB with convex-shaped side surface

Technical Field

The invention relates to production and manufacturing of a PCB (printed circuit board), in particular to a method for manufacturing a PCB with a side surface in a convex structure.

Background

With the rapid development of the electronic industry, the technical requirements for the printed circuit board are higher and higher, the design of the printed circuit board is promoted to be continuously developed towards high-level and high-density, and a plurality of corresponding problems also occur while the high-level and high-density development is carried out, for example, the high centralization of functions also leads to the practicability of a large number of connectors, a plurality of connectors are needed on the periphery of one PCB and are respectively connected to different components, so that the corresponding use of different functions and operations is realized, but the periphery of the PCB bears a large amount of connector weight and also needs a large amount of maintenance problems, the abnormity of any connector can lead to the abnormal work of the PCB, the use of the connectors is reduced as much as possible, and the quality and the efficiency are also improved.

In order to avoid connection looseness of the connector and realize quick and effective connection processing, and simultaneously, in order to facilitate the consideration of fixation and circuit safety and also the consideration of comprehensive cost, the invention realizes quick fixed installation and connection design, reduces a plurality of corresponding unnecessary production flows, and realizes safe, effective and efficient combination. Meanwhile, due to high-density wiring, the power born by the PCB is correspondingly improved or relatively improved, so that the PCB is quickly heated, how to realize quick heat dissipation is an important problem, and meanwhile, quick heat conduction is also an important way for solving the heat dissipation, so that the metal-based circuit board in the shape of the Chinese character 'tu' successfully solves the corresponding problem.

Disclosure of Invention

The invention provides a method for producing a PCB board with a specific structure, which can realize effective height difference fixation, reduce corresponding components such as a connector and the like, further improve the quality and improve the aging, and simultaneously realizes the production scheme of the PCB board with the functions of high-speed heat dissipation, fixed support, quick heat conduction and the like of an inner layer,

In order to solve the above problems, the technical scheme provided by the invention is as follows: a method for manufacturing a metal-based PCB with a convex side step comprises the following steps;

the first step is as follows: determining a laminated structure;

a second step; manufacturing an inner core board circuit, wherein the inner core board is manufactured into a convex part core board; the inner core board circuit manufacturing comprises the step of performing circuit electrogilding on the protruding part of the inner core board;

a third step; pre-pressing a core plate; the core plate is pre-pressed to manufacture the cover plate;

the fourth step: a convex cover plate is gonged on the cover plate;

the fifth step: pressing;

and a sixth step: an outer layer of circuitry, the outer layer of circuitry including fabrication of a raised portion of circuitry.

The seventh step: solder resist and characters;

eighth step: and (4) forming.

According to the preferable technical scheme, the inner core board is a core board and a PP sheet which are necessary for manufacturing the protruding structure, and the inner core board is a metal substrate or a mixed structure body of the metal substrate, the PP sheet and an FR4 core board.

According to the preferable technical scheme, the cover plate comprises at least one layer of circuit, one layer of circuit is formed by directly pressing the cover plate and the metal substrate, and the other layer of circuit is formed by pressing the cover plate and the inner core plate of the mixed structure body.

According to the preferable technical scheme, the inner core board is the core board and the PP sheet which are necessary for manufacturing the protruding structure, and the electric gold of the circuit of the protruding part of the inner core board is whole-board electric gold or local electric gold, or the protruding part has no circuit and does not need electric gold.

According to the preferred technical scheme, the core plate pre-pressing is cover plate pre-pressing, and the cover plate pre-pressing is pressing containing outer layer circuits; the pressfitting containing the outer layer circuit at least comprises the outer layer circuit and the light panel layer, and the outer layer circuit and the light panel layer are two surfaces of the core board which are pressfitted in advance respectively.

According to the preferred technical scheme, the fourth step is to gong board dividing lines along the convex-shaped forming lines; the plate dividing line is of an isolated structure and cannot form a closed structure;

according to the preferable technical scheme, the plate dividing line and the formed forming line form a closed area, and the closed area is a cover plate of the protruding part of the convex-shaped structure.

According to the preferable technical scheme, the board dividing line protrudes out of a half milling position of the forming line.

According to the preferable technical scheme, the pressing further comprises the step of cutting a no-flow glue PP sheet, wherein a groove is formed in the no-flow glue PP sheet, the groove is in a shape like a Chinese character 'tu', extends to a process edge or an auxiliary edge, and the extending part is smaller than a forming gong vacancy.

According to the preferable technical scheme, the protruding part of the convex structure is also provided with a metal half hole or a metal wrapping edge.

Compared with the prior art, the PCB with the fixed height difference structure has the advantages that by adopting the scheme, the PCB production mode with the fixed height difference structure is achieved, the scheme of multi-region welding and connection design is achieved, partial problems of transfer of a large number of connectors are solved, meanwhile, effective heat dissipation design is achieved for the PCB with the seriously heated inner layer, heat conduction is achieved rapidly while heat dissipation is achieved, and the design of the PCB with high precision, high conduction and high heat dissipation is achieved.

Drawings

For a clearer explanation of the embodiments or technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained from the drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure of the present invention.

Detailed Description

In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The use of the terms "fixed," "integrally formed," "left," "right," and the like in this specification is for illustrative purposes only, and elements having similar structures are designated by the same reference numerals in the figures.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

As shown in fig. 1, one embodiment of the present invention is: a method for manufacturing a metal-based PCB with a convex side step comprises the following steps;

the first step is as follows: determining a laminated structure; the laminated structure is adjusted according to the lamination requirements of customers and actual conditions, the protruding parts of the convex structures are independent core plates or the thickness of PP sheets between each core plate and the core plate, the core plates comprise metal-based core plates, and the laminated structure is a symmetrical structure.

A second step; manufacturing an inner-layer core board circuit, wherein the inner-layer core board circuit comprises an inner-layer core board protruding part circuit electric gold; the inner core board is a core board and a cut PP sheet which are necessary for manufacturing the protruding structure, when the core board is a single metal substrate and no pattern is arranged on the substrate, the single metal substrate is the inner core board and an inner circuit does not need to be manufactured.

When the inner core board is a metal base plus FR4 core board, the inner core board is a laminated body of the metal base and the FR4 core board.

And exposing and developing the outer layer circuit of the inner layer core plate, then electrifying the circuit to be reserved, and etching after the electroplating. The electrogilding is electrogilding.

A third step; pre-pressing a core plate; the core plate pre-pressing is cover plate pre-pressing, and the cover plate pre-pressing is pressing containing outer layer circuits; the pressfitting containing the outer layer circuit at least comprises the outer layer circuit and the light panel layer, and the outer layer circuit and the light panel layer are two surfaces of the core board which are pressfitted in advance respectively.

The lamination of the circuit containing the outer layer is divided into two conditions of a layer of outer layer circuit, an outer layer circuit and other multilayer circuits, and when the circuit containing the outer layer is a layer of outer layer circuit, the lamination of the outer layer circuit is a single-side copper-containing core board; the copper-containing surface is an outer layer circuit, and the optical plate layer and the inner layer core plate are bonded through a PP sheet.

When the circuit is an outer layer circuit and contains other multilayer circuits, the laminating structure is added to the outer layer circuit and the other multilayer circuits and the outer layer optical plate layer, and laminating is carried out according to a normal multilayer plate structure.

The fourth step: a convex cover plate is gonged on the cover plate; routing board dividing lines along the convex-shaped forming lines; the plate dividing line is of an isolated structure and cannot form a closed structure; and the board dividing line protrudes out of a half milling position of the forming line. The plate dividing line and the formed forming line form a closed area, and the closed area is a cover plate of a protruding part of the convex-shaped structure.

The fifth step: pressing; the pressing is the pressing between the inner core plate and the cover plate, the pressing also comprises cutting the no-flow glue PP sheet, a groove is arranged on the no-flow glue PP sheet, the groove is in a shape like a Chinese character 'tu', extends to the process edge or the auxiliary edge, and the extending part is smaller than the forming gong vacancy.

And a sixth step: an outer layer of circuitry, the outer layer of circuitry including fabrication of a raised portion of circuitry. And routing the protruding part on the cover plate to form a groove, and carrying out full-page electroplating copper deposition, wherein copper is covered in the groove and on the groove wall.

The seventh step: solder resist and characters;

eighth step: and forming, wherein the side surface protruding part forms a metal structure with copper coated on the surface.

Example 1

The thickness of a protruding part of a 1.6mm PCB board with copper-based double surfaces is 1mm, a laminated structure is manufactured according to requirements, and the laminated structure comprises a 0.25mm copper-containing single-sided core board, 0.025mm non-flowing glue PP, 1.0mm copper-based and 0.025mm non-flowing glue PP and 0.25mm copper-containing core board. The inner core board is copper-based, and after the laminated structure is determined, the inner core board circuit is manufactured, and the inner core board is a copper-based substrate, so that the circuit does not need to be manufactured, and meanwhile, the core board is not required to be pre-pressed, a no-flow glue PP sheet is cut according to a typesetting structure, and meanwhile, a groove is formed in the no-flow glue PP sheet, the groove is a copper-based convex part, the no-flow glue PP sheet is cut by 0.025mm relative to an inner groove of the copper-based convex part, namely, the groove is larger than the single edge of the copper-based convex part by 0.025 mm.

Aiming at a copper-containing single-sided core plate with the upper and lower 0.25mm, a board dividing line is milled according to a forming line of a copper-based convex part, the line dividing line is a milling groove, the milling groove exceeds a half milling position of the forming line, and a notch of the board dividing cannot be formed in the forming time.

And pressing the 0.25mm copper-containing single-sided core plate with the screw grooves and the cut no-flow glue PP sheets, wherein the screw grooves are manufactured according to non-metallization grooves, the subsequent procedures are normally manufactured, and after the copper-containing single-sided core plate is formed, the core material corresponding to the copper-based convex parts on the 0.25mm copper-containing core plate automatically falls off to form the PCB with the required side face in the convex structure.

The design realizes the production of high-density and high-power PCBs, and can realize effective safe fixation and efficient heat conduction and heat dissipation.

Example 2

The PCB comprises six layers of 1.6mm PCBs, the thickness of a protruding portion is 1mm, the third layer and the fourth layer are metal bases, the protruding portion is a second layer circuit and a fifth layer circuit, and the thickness of the metal bases is 0.6 mm.

The laminated structure is manufactured as required, and the laminated structure comprises a copper-containing single-sided core board of 0.25mm, a non-gumming PP of 0.035mm, a single-sided core board of 0.2mm, a PP sheet of 0.05mm, a base of 0.6mm, a PP sheet of 0.05mm, a single-sided core board of 0.2mm, a non-gumming PP of 0.035mm and a copper-containing core board of 0.25 mm. The inner core board is a double-sided FR4 core board, and the inner core board is manufactured after a laminated structure is determined; the manufacturing method of the core board comprises the steps of manufacturing a 0.2mm single-sided core board, a 0.05mm PP sheet, a 0.6mm base, a 0.05mm PP sheet and a 0.2mm single-sided core board, wherein the manufacturing of the inner-layer core board also comprises the manufacturing of inner-layer circuits, the circuits of each layer are etched according to the lamination sequence for the corresponding core boards, then the lamination is carried out according to the specified lamination structure, and the second-layer circuits and the fifth-layer circuits are used as outer-layer circuits of the inner-layer core board.

The inner layer circuit is manufactured in two conditions, namely, the first type is provided with no circuit at the convex-shaped position, the second type is provided with a conducting circuit at the convex-shaped position, and the conducting circuit comprises a conducting wire, a bonding pad and a chip area. The normal tin-plating etching that adopts that does not have the circuit corresponds the mode preparation that has the needs that switch on the circuit and adopt the electrogold etching of second kind, avoids because gong groove leads to outer layer circuit etching in-process circuit to suffer destruction.

0.25mm copper-containing single face core with gong groove carries out the pressfitting with the no flow of gluing PP piece that cuts, no flow of gluing PP requires practical 0.035mm, in order to avoid the scarce glue that the inlayer circuit copper thickness leads to, be greater than 35um to the inlayer circuit, need practical corresponding thickness's no flow of gluing PP piece, the gong groove is makeed according to non-metallization groove, and the normal preparation of follow-up process after the shaping is passed, the core material that corresponds copper base bulge on the 0.25mm copper-containing core drops automatically, forms the PCB board that the side becomes the type structure that needs.

Because the inner core plate is a single core plate, the outer circuit is directly a circuit-surface optical plate layer, the core plate is not needed to be pre-pressed, the no-flow PP sheet is cut according to the typesetting structure, and meanwhile, the groove is formed in the no-flow PP sheet, the groove is a convex part of the inner core plate, the no-flow PP sheet is cut by 0.025mm relative to the inner groove of the convex part of the copper base, namely, the groove is larger than the single edge of the convex part of the inner core plate by 0.025 mm.

Aiming at the second layer or fifth layer cover plate position needing metallization, the cover plate position corresponding to the protruding position of the inner layer core plate is hollowed, and the side wall of the hollowed position and the second layer or fifth layer cover plate position are metallized through a copper-plating plate.

In order to increase the functions of the PCB and facilitate corresponding welding, the protruding problem of the inner core plate can be further provided with a metal half hole or a metal groove, so that side edge welding is conveniently realized or the welding area is increased. And the manufacturing process is synchronous with the normal PCB process, and the flow is not increased.

Example 3

The thickness of a convex part of the PCB with ten layers of boards of which the thickness is 2.5mm is 1mm, and the part between the third layer of circuits and the eighth layer of circuits is required to be used as an inner layer core board to form the convex part; the protruding part contains a metal base, a laminated structure is manufactured according to requirements, the thickness between 3-8 layers is required to be 1mm, namely a core plate for the third layer of circuits and the fourth layer of circuits, a core plate for the fifth layer of circuits and the sixth layer of circuits, a core plate for the seventh layer of circuits and the eighth layer of circuits, and the thickness of the core plate for the inner layer formed by the three core plates in the symmetrical laminated structure is 1 mm. The sum of the thickness from the first layer of circuits to the third layer of circuits and the thickness from the tenth layer of circuits to the eighth layer of circuits is 1.4mm, for symmetrical design, the core plate pre-pressing thickness from the first layer of circuits to the third layer of circuits is 0.7mm, namely a 0.3mm core plate +0.1mm PP sheet +0.25mm single-sided core plate can be designed to carry out outer layer production circuit, further core plate pre-pressing is carried out, the combined outer layer circuit is an outer layer core plate with the first layer of circuits and the light plate layer outside, the outer layer core plate is the cover plate in the fourth step, and meanwhile, the core plate pre-pressed by the core plate can also be understood as the outer layer core plate and the cover plate.

Carry out the pressfitting through the no-flow adhesive PP between apron and the inner core, the inner core is according to two kinds of circumstances of inner circuit preparation, first type the type position does not have the circuit, and the second type does the type position has the circuit that switches on, corresponds the normal tin-plating etching of adoption that does not have the circuit, and the mode preparation that the needs that have the circuit that switches on that corresponds the second type adopted the electrogold etching avoids because the gong groove leads to outer circuit etching in-process circuit to suffer destruction.

Because the inner core board is also understood as a single core board, the outer layer circuit after the core board is pre-laminated is a circuit-surface board layer, then according to the typesetting structure, the no-flow glue PP sheet is cut, and meanwhile, the groove is formed on the no-glue PP sheet, the groove is the convex part of the inner core board, the no-flow glue PP sheet is cut by 0.025mm relative to the convex part of the inner core board, namely, the groove is larger than the single edge of the convex part of the inner core board by 0.025 mm.

For the outer-layer circuit, a board dividing line is routed according to the forming line of the protruding part of the inner-layer core board, the line dividing line is a routing groove, the routing groove exceeds a half routing position of the forming line, and a notch of the board dividing cannot be formed in the forming time.

The subsequent manufacturing is substantially the same as the manner of the first embodiment and the second embodiment 2, and the manufacturing of the PCB with the convex structure is realized.

In addition, for the multilayer boards with various laminated structures, the core board of the inner layer is a core board pressing body with a protruding structure of the inner layer, the circuit of the outer layer is a single-sided core board or a combination of single-sided core boards consisting of a plurality of core boards, and the corresponding PCB with the side surface in the convex structure is realized through the corresponding structural combination of various manufacturing methods of the PCB.

The technical features mentioned above are combined with each other to form various embodiments which are not listed above, and all of them are regarded as the scope of the present invention described in the specification; also, modifications and variations may be suggested to those skilled in the art in light of the above teachings, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.

Claims

1. A method for manufacturing a metal-based PCB with a convex side step is characterized by comprising the following steps;

the first step is as follows: determining a laminated structure;

a second step; manufacturing an inner-layer core plate, wherein the inner-layer core plate is manufactured into a convex part core plate;

the fourth step: a convex cover plate is gonged on the cover plate;

the fifth step: pressing;

and a sixth step: the outer layer circuit comprises a manufacture of a convex part circuit;

the seventh step: solder resist and characters;

eighth step: and (4) forming.

2. The method for manufacturing a metal-based PCB of convex side surface type according to claim 1, wherein the inner core board is a core board and a PP sheet which are necessary for manufacturing the convex structure, and the inner core board is a metal base board or a mixed structure of the metal base board, the PP sheet and the FR4 core board.

3. The method of claim 1, wherein the cover plate comprises at least one layer of circuitry, one is formed by direct lamination of the cover plate and the metal substrate, and one is formed by lamination of the cover plate and the inner core of the hybrid structure.

4. The method for manufacturing a metal-based PCB plate with a convex side step according to claim 1, wherein the fourth step is to gong a board dividing line along a convex-shaped forming line; the plate dividing line is of an isolated structure and cannot form a closed structure.

5. The method for manufacturing a metal-based PCB plate with a convex side step according to claim 1, wherein the fourth step is to gong a board dividing line along a convex-shaped forming line; the plate dividing line is of a closed structure, and the cover plate and the protruding part are in conduction connection or non-metallization connection.

6. The method of manufacturing a metal-based PCB of convex side profile according to claim 4, wherein the parting line and the molded line form a closed area, and the closed area is a cover plate of the protruding portion of the convex structure.

7. The method for manufacturing a metal-based PCB of the convex side step according to claim 4, wherein the board dividing line protrudes by half of the routing position of the forming line.

8. The method for manufacturing the metal-based PCB plate with the convex side step as claimed in claim 1, wherein the pressing further comprises cutting a no-flow glue PP sheet, wherein a slot is formed in the no-flow glue PP sheet, the slot is in a convex shape and extends to a process edge or an auxiliary edge, and the extending part is smaller than a forming gong vacancy.

9. The method for manufacturing a metal-based PCB plate with a convex side step according to claim 1, wherein the protruding part of the convex structure is further provided with a metal half hole or a metal wrapping edge.