CN113382546A - Manufacturing method of PCB with convex-shaped side surface - Google Patents
Manufacturing method of PCB with convex-shaped side surface Download PDFInfo
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- CN113382546A CN113382546A CN202110615197.XA CN202110615197A CN113382546A CN 113382546 A CN113382546 A CN 113382546A CN 202110615197 A CN202110615197 A CN 202110615197A CN 113382546 A CN113382546 A CN 113382546A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 238000003825 pressing Methods 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 17
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000010931 gold Substances 0.000 claims abstract description 12
- 229910052737 gold Inorganic materials 0.000 claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 238000003801 milling Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 238000012546 transfer Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000011162 core material Substances 0.000 description 84
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 26
- 229910052802 copper Inorganic materials 0.000 description 25
- 239000010949 copper Substances 0.000 description 25
- 238000005530 etching Methods 0.000 description 7
- 238000003475 lamination Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention provides a method for manufacturing a PCB with a convex side step, which comprises the following steps; the first step is as follows: determining a laminated structure; a second step; manufacturing an inner-layer core board circuit, wherein the inner-layer core board circuit comprises an inner-layer core board protruding part circuit electric gold; a third step; pre-pressing a core plate; the fourth step: a convex cover plate is gonged on the cover plate; the fifth step: pressing; and a sixth step: outer layer circuit, solder resist and characters; the seventh step: and (4) forming. The invention solves the PCB production mode of a structure with fixed height difference, realizes the scheme of multi-region welding and connection design, solves partial problems of the transfer of a large number of connectors, realizes effective heat dissipation design for the PCB with serious inner layer heating, realizes quick heat conduction while dissipating heat, and realizes the design of the PCB with high precision, high conduction and high heat dissipation.
Description
Technical Field
The invention relates to production and manufacturing of a PCB (printed circuit board), in particular to a method for manufacturing a PCB with a side surface in a convex structure.
Background
With the rapid development of the electronic industry, the technical requirements for the printed circuit board are higher and higher, the design of the printed circuit board is promoted to be continuously developed towards high-level and high-density, and a plurality of corresponding problems also occur while the high-level and high-density development is carried out, for example, the high centralization of functions also leads to the practicability of a large number of connectors, a plurality of connectors are needed on the periphery of one PCB and are respectively connected to different components, so that the corresponding use of different functions and operations is realized, but the periphery of the PCB bears a large amount of connector weight and also needs a large amount of maintenance problems, the abnormity of any connector can lead to the abnormal work of the PCB, the use of the connectors is reduced as much as possible, and the quality and the efficiency are also improved.
In order to avoid connection looseness of the connector and realize quick and effective connection processing, and simultaneously, in order to facilitate the consideration of fixation and circuit safety and also the consideration of comprehensive cost, the invention realizes quick fixed installation and connection design, reduces a plurality of corresponding unnecessary production flows, and realizes safe, effective and efficient combination.
Disclosure of Invention
The invention provides a method for producing a PCB board with a specific structure, which can realize effective height difference fixation, reduce corresponding components such as a connector and the like, further improve the quality and improve the aging, and simultaneously realizes the production scheme of the PCB board with the functions of high-speed heat dissipation, fixed support, quick heat conduction and the like of an inner layer,
In order to solve the above problems, the technical scheme provided by the invention is as follows: a manufacturing method of a side convex step PCB comprises the following steps;
the first step is as follows: determining a laminated structure;
a second step; the inner core board circuit manufacturing comprises inner core board circuit manufacturing, wherein the inner core board circuit manufacturing comprises inner core board protruding part circuit electric gold;
a third step; pre-pressing a core plate;
the fourth step: a convex cover plate is gonged on the cover plate;
the fifth step: pressing;
and a sixth step: outer layer circuit, solder resist and characters;
the seventh step: and (4) forming.
In a preferred embodiment, the stacked structure is a symmetrical structure.
According to the preferable technical scheme, the inner core board is the core board and the PP sheet which are necessary for manufacturing the protruding structure, and the electric gold of the circuit of the protruding part of the inner core board is whole-board electric gold or local electric gold, or the protruding part has no circuit and does not need electric gold.
According to the preferred technical scheme, the core plate pre-pressing is cover plate pre-pressing, and the cover plate pre-pressing is pressing containing outer layer circuits; the pressfitting containing the outer layer circuit at least comprises the outer layer circuit and the light panel layer, and the outer layer circuit and the light panel layer are two surfaces of the core board which are pressfitted in advance respectively.
According to the preferred technical scheme, the fourth step is to gong board dividing lines along the convex-shaped forming lines; the plate dividing line is of an isolated structure and cannot form a closed structure;
according to the preferable technical scheme, the plate dividing line and the formed forming line form a closed area, and the closed area is a cover plate of the protruding part of the convex-shaped structure.
According to the preferable technical scheme, the board dividing line protrudes out of a half milling position of the forming line.
According to the preferable technical scheme, the pressing further comprises the step of cutting a no-flow glue PP sheet, wherein a groove is formed in the no-flow glue PP sheet, the groove is in a shape like a Chinese character 'tu', extends to a process edge or an auxiliary edge, and the extending part is smaller than a forming gong vacancy.
According to the preferable technical scheme, the protruding part of the convex structure is also provided with a metal half hole or a metal wrapping edge.
Compared with the prior art, the PCB with the fixed height difference structure has the advantages that by adopting the scheme, the PCB production mode with the fixed height difference structure is achieved, the scheme of multi-region welding and connection design is achieved, partial problems of transfer of a large number of connectors are solved, meanwhile, effective heat dissipation design is achieved for the PCB with the seriously heated inner layer, heat conduction is achieved rapidly while heat dissipation is achieved, and the design of the PCB with high precision, high conduction and high heat dissipation is achieved.
Drawings
For a clearer explanation of the embodiments or technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained from the drawings without creative efforts.
FIG. 1 is a schematic view of a stacked structure according to the present invention.
Detailed Description
In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The use of the terms "fixed," "integrally formed," "left," "right," and the like in this specification is for illustrative purposes only, and elements having similar structures are designated by the same reference numerals in the figures.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in fig. 1, one embodiment of the present invention is: a manufacturing method of a side convex step PCB comprises the following steps;
the first step is as follows: determining a laminated structure; the laminated structure is adjusted according to the lamination requirements of customers and actual conditions, the protruding parts of the convex structures are independent core plates or the thickness of PP sheets between each core plate and the core plate, the core plates comprise metal-based core plates, and the laminated structure is a symmetrical structure.
A second step; manufacturing a circuit of an inner core board 4, wherein the circuit of the inner core board 4 comprises a circuit electric gold of a convex part of the inner core board 4; the inner core board 4 is a core board and a cut PP sheet which are necessary for manufacturing the protruding structure, when the core board is a single metal substrate and no graph is arranged on the substrate, the single metal substrate is the inner core board 4 and an inner circuit does not need to be manufactured.
When the inner core 4 is a metal-based FR4 core, the inner core 4 is a laminate of a metal-based FR4 core.
When the inner core board 4 is a combination of a plurality of FR4 core boards, the FR4 core boards are produced by pressing according to a single PCB to form the inner core board 4.
And exposing and developing the outer layer circuit 1 of the inner layer core plate 4, then electrifying the circuit to be reserved, and etching after the electroplating. The electrogilding is electrogilding.
A third step; pre-pressing a core plate; the core plate pre-pressing is cover plate pre-pressing, and the cover plate pre-pressing is pressing containing outer layer circuits 1; the pressfitting containing the outer layer circuit 1 at least comprises the outer layer circuit 1 and the light panel layer 2, wherein the outer layer circuit 1 and the light panel layer 2 are respectively two surfaces of the core board which are pressfitted in advance.
The pressing of the circuit 1 containing the outer layer is divided into two conditions of a layer of circuit 1 containing the outer layer, a layer of circuit 1 containing the outer layer and other layers of circuits containing the outer layer, and when the circuit 1 containing the outer layer is a layer of circuit 1, the pressing of the circuit 1 containing the outer layer is a single-sided copper core board; the copper-containing surface is an outer layer circuit 1, and the optical plate layer 2 and the inner core plate 4 are bonded through a PP sheet.
When the circuit is an outer-layer circuit 1 and contains other multilayer circuits, the pressing structure is added to the outer-layer circuit 1 and the other multilayer circuits and the outer-layer optical plate layer 2, and pressing is carried out according to a normal multilayer plate structure.
The fourth step: a convex cover plate is gonged on the cover plate; routing board dividing lines along the convex-shaped forming lines; the plate dividing line is of an isolated structure and cannot form a closed structure; and the board dividing line protrudes out of a half milling position of the forming line. The plate dividing line and the formed forming line form a closed area, and the closed area is a cover plate of a protruding part of the convex-shaped structure.
The fifth step: pressing; the pressing is the pressing between the inner core plate 4 and the cover plate, the pressing also comprises cutting the no-flow glue PP sheet 3, a groove is arranged on the no-flow glue PP sheet 3, the groove is in a shape like a Chinese character 'tu', extends to the process edge or the auxiliary edge, and the extending part is smaller than the forming gong vacancy.
And a sixth step: outer layer circuit 1, solder resist and characters;
the seventh step: and (4) forming.
Example 1
The thickness of a protruding part of a 1.6mm PCB board with copper-based double surfaces is 1mm, a laminated structure is manufactured according to requirements, and the laminated structure comprises a 0.25mm copper-containing single-sided core board, 0.025mm non-flowing glue PP, 1.0mm copper-based and 0.025mm non-flowing glue PP and 0.25mm copper-containing core board. The inner core plate 4 is copper-based, and after the laminated structure is determined, the inner core plate 4 is manufactured in a line mode, the inner core plate 4 is a copper-based substrate, the line does not need to be manufactured, meanwhile, the core plate is not required to be pre-pressed, the non-flowing glue PP sheet 3 is cut according to the typesetting structure, meanwhile, the glue-free PP sheet is grooved, the grooving position is a copper-based convex part, the non-flowing glue PP sheet 3 is grooved relative to the copper-based convex part, the inner groove is cut by 0.025mm, and the grooving is larger than the single side of the copper-based convex part by 0.025 mm.
Aiming at a copper-containing single-sided core plate with the upper and lower 0.25mm, a board dividing line is milled according to a forming line of a copper-based convex part, the line dividing line is a milling groove, the milling groove exceeds a half milling position of the forming line, and a notch of the board dividing cannot be formed in the forming time.
And pressing the 0.25mm copper-containing single-sided core plate with the screw grooves and the cut no-flow glue PP sheets 3, wherein the screw grooves are manufactured according to non-metallization grooves, the subsequent procedures are normally manufactured, and after the copper-containing single-sided core plate is formed, the core material corresponding to the copper-based convex parts on the 0.25mm copper-containing core plate automatically falls off to form the PCB with the required side surface in a convex structure.
The design realizes the production of high-density and high-power PCBs, and can realize effective safe fixation and efficient heat conduction and heat dissipation.
Example 2
The four-layer PCB comprises four layers of 1.6mm PCBs, wherein the thickness of a protruding part is 1mm, and a laminated structure is manufactured according to requirements, wherein the laminated structure comprises a copper-containing single-side core plate with the thickness of 0.25mm, a non-flowing glue PP with the thickness of 0.035mm, a double-side FR4 core plate with the thickness of 1.0mm, a non-flowing glue PP with the thickness of 0.035mm and a copper-containing core plate with the thickness of 0.25 mm. The inner layer core board 4 is a double-sided FR4 core board, and an inner layer circuit is manufactured after a laminated structure is determined, wherein the inner layer circuit is manufactured in two conditions, namely, the first condition is that no circuit is arranged at the convex position, the second condition is that a conducting circuit is arranged at the convex position, and the conducting circuit comprises a conducting line, a bonding pad and a chip area. The normal tin-plating etching that adopts that does not have the circuit corresponds the mode preparation that has the needs that switch on the circuit and adopt the electrogold etching of second kind, avoids because gong groove leads to outer layer circuit 1 etching in-process circuit to suffer destruction.
Because the inner core plate 4 is a single core plate, the outer circuit 1 is a circuit-surface-one-surface optical plate layer 2 directly, the core plate is not needed to be pre-pressed, the no-flow PP sheet 3 is cut according to the typesetting structure, and meanwhile, the no-flow PP sheet is slotted on the no-flow PP sheet, the slotted position is a convex part of the inner core plate 4, the no-flow PP sheet 3 is internally slotted for 0.025mm relative to the convex part of the copper base, namely, the slotted position is larger than the single edge of the convex part of the inner core plate 4 by 0.025 mm.
Aiming at a copper-containing single-sided core plate with the upper and lower 0.25mm, a board dividing line is milled according to a forming line of a copper-based convex part, the line dividing line is a milling groove, the milling groove exceeds a half milling position of the forming line, and a notch of the board dividing cannot be formed in the forming time.
0.25mm copper-containing single face core with gong groove carries out the pressfitting with the no flow of gluing PP piece 3 that cuts, no flow of gluing PP requires practical 0.035mm, in order to avoid the scarce glue that the inlayer circuit copper thickness leads to, be greater than 35um to the inlayer circuit, need practical corresponding thickness's no flow of gluing PP piece 3, the gong groove is makeed according to the non-metallization groove, and the normal preparation of successor process after the shaping is crossed, the core material that corresponds copper base bulge on the 0.25mm copper-containing core drops automatically, forms the PCB board that the side of needs becomes the type structure.
Example 3
The thickness of a convex part of the ten-layer PCB with the thickness of 2.5mm is 1mm, and the part between the third layer of circuit and the eighth layer of circuit is required to be used as an inner core board 4 to form the convex part; the laminated structure is manufactured according to the requirement, the thickness between 3-8 layers is required to be 1mm, namely, one core board for the third layer of circuits and the fourth layer of circuits, one core board for the fifth layer of circuits and the sixth layer of circuits, one core board for the seventh layer of circuits and the eighth layer of circuits, and the three core boards are of a symmetrical laminated structure, and the thickness of the formed inner core board 4 is 1 mm. The sum of the thickness from the first layer of circuits to the third layer of circuits and the thickness from the tenth layer of circuits to the eighth layer of circuits is 1.4mm, for symmetrical design, the core board pre-lamination thickness from the first layer of circuits to the third layer of circuits is 0.7mm, namely a core board of 0.3mm + a PP sheet of 0.1mm + a single-sided core board of 0.25mm can be designed to carry out solder mask production circuit, and then core board pre-lamination is carried out, the combined outer layer circuit 1 is an outer layer core board with the first layer of circuits and the light board layer 2 outside, the outer layer core board is a cover board in the fourth step, and meanwhile, the core board pre-lamination of the core board can also be understood as an outer layer core board and a cover board.
Carry out the pressfitting through the no-flow adhesive PP between apron and the inner core 4, inner core 4 basis two kinds of circumstances of inner circuit preparation, first type the type position does not have the circuit, and the second type does the type position has the circuit that switches on, corresponds the normal tin-plating etching of adoption that does not have the circuit, and the mode preparation that the needs that have the circuit that switches on of corresponding second type adopted the electrogold etching avoids suffering destruction because gong groove leads to 1 etching in-process circuit of outer circuit.
Because the inner core plate 4 is also understood as a single core plate, the outer circuit 1 after the core plate is pre-pressed is a circuit-surface optical plate layer 2, then according to the typesetting structure, the no-flow glue PP sheet 3 is cut, and meanwhile, the groove is formed on the no-flow glue PP sheet, the groove is a convex part of the inner core plate 4, the no-flow glue PP sheet 3 is internally cut by 0.025mm relative to the convex part of the inner core plate 4, namely, the groove is larger than the single edge of the convex part of the inner core plate 4 by 0.025 mm.
For the outer layer circuit 1, a board dividing line is routed according to a forming line of a protruding part of the inner layer core board 4, the line dividing line is a routing groove, the routing groove exceeds a half routing position of the forming line, and a notch of the board dividing line cannot be formed in the forming time.
The subsequent manufacturing is substantially the same as the manner of the first embodiment and the second embodiment 2, and the manufacturing of the PCB with the convex structure is realized.
In addition, for the multilayer boards with various laminated structures, the inner core board 4 is a core board pressing body with an inner layer protruding structure, the outer layer circuit 1 is a single-sided core board or a single-sided core board assembly consisting of a plurality of core boards, and the corresponding PCB with the side surface in the convex structure is realized through the structural combination of corresponding PCB with various manufacturing methods.
The technical features mentioned above are combined with each other to form various embodiments which are not listed above, and all of them are regarded as the scope of the present invention described in the specification; also, modifications and variations may be suggested to those skilled in the art in light of the above teachings, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A method for manufacturing a PCB with a convex side step is characterized by comprising the following steps;
the first step is as follows: determining a laminated structure;
a second step; the inner core board manufacturing comprises inner core board circuit manufacturing, wherein the inner core board circuit manufacturing comprises inner core board protruding part circuit electric gold;
a third step; pre-pressing a core plate;
the fourth step: a convex cover plate is gonged on the cover plate;
the fifth step: pressing;
and a sixth step: outer layer circuit, solder resist and characters;
the seventh step: and (4) forming.
2. The method of fabricating a side convex step PCB according to claim 1, wherein the laminated structure is a symmetrical structure.
3. The method for manufacturing a PCB with a convex side surface step according to claim 1, wherein the inner core board is a core board and a PP sheet which are necessary for manufacturing the convex structure, and the circuit gold of the convex part of the inner core board is whole board gold or local gold, or the convex part has no circuit and does not need gold.
4. The method of claim 1, wherein the core pre-press is a cover pre-press, the cover pre-press being a press containing outer layer circuitry; the pressfitting containing the outer layer circuit at least comprises the outer layer circuit and the light panel layer, and the outer layer circuit and the light panel layer are two surfaces of the core board which are pressfitted in advance respectively.
5. The method for manufacturing the PCB with the convex side steps as claimed in claim 1, wherein the fourth step is routing board dividing lines along convex-shaped forming lines; the plate dividing line is of an isolated structure and cannot form a closed structure.
6. The method for manufacturing a PCB with a convex side step according to claim 5, wherein the board dividing line and the molded molding line form a closed area, and the closed area is a cover plate of the protruding part of the convex structure.
7. The method for manufacturing the PCB with the convex side steps as claimed in claim 5, wherein the board dividing line protrudes out of a half milling position of the forming line.
8. The method for manufacturing the PCB with the convex step on the side surface according to claim 1, wherein the pressing further comprises cutting a no-flow glue PP sheet, wherein a groove is formed in the no-flow glue PP sheet, the groove is in a convex shape and extends to a process edge or an auxiliary edge, and the extending part is smaller than a forming gong vacancy.
9. The method for manufacturing the PCB with the convex side steps as claimed in claim 1, wherein the protruding part of the convex structure is further provided with a metal half hole or a metal wrapping.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110615197.XA CN113382546A (en) | 2021-06-02 | 2021-06-02 | Manufacturing method of PCB with convex-shaped side surface |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110615197.XA CN113382546A (en) | 2021-06-02 | 2021-06-02 | Manufacturing method of PCB with convex-shaped side surface |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060019965A (en) * | 2004-08-30 | 2006-03-06 | 엘지전자 주식회사 | Making method of printed circuit board |
| CN101336051A (en) * | 2007-01-12 | 2008-12-31 | 安迪克连接科技公司 | Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein |
| CN112770540A (en) * | 2020-12-05 | 2021-05-07 | 深圳市辉煌线路板有限公司 | Processing method of thick copper PCB with step position containing bonding structure |
-
2021
- 2021-06-02 CN CN202110615197.XA patent/CN113382546A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060019965A (en) * | 2004-08-30 | 2006-03-06 | 엘지전자 주식회사 | Making method of printed circuit board |
| CN101336051A (en) * | 2007-01-12 | 2008-12-31 | 安迪克连接科技公司 | Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein |
| CN112770540A (en) * | 2020-12-05 | 2021-05-07 | 深圳市辉煌线路板有限公司 | Processing method of thick copper PCB with step position containing bonding structure |
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Application publication date: 20210910 |