CN110572958B - Rigid-flex printed circuit board lamination structure and manufacturing method - Google Patents
Rigid-flex printed circuit board lamination structure and manufacturing method Download PDFInfo
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- CN110572958B CN110572958B CN201910919410.9A CN201910919410A CN110572958B CN 110572958 B CN110572958 B CN 110572958B CN 201910919410 A CN201910919410 A CN 201910919410A CN 110572958 B CN110572958 B CN 110572958B
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- gummosis
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a rigid-flex printed circuit board pressing structure and a manufacturing method, wherein the method comprises the following steps: separating the non-adhesive PP sheet from the exposed area by the adhesive-free PP sheet; and pressing the rigid plate, the flexible plate, the non-gummosis PP sheet and the non-gummosis PP sheet to form the rigid-flex combination plate. The lamination structure comprises a rigid plate, a flexible plate, a non-gummosis PP sheet and a non-gummosis PP sheet; the flexible board comprises an exposure area, and the non-gummosis PP sheet separates the non-gummosis PP sheet from the exposure area; and pressing the rigid plate, the flexible plate, the non-gummosis PP sheet and the non-gummosis PP sheet to form the rigid-flex combination plate. According to the embodiment of the invention, the non-gummosis PP sheet is separated from the exposure area by the non-gummosis PP sheet, so that gummosis can be prevented from flowing to the exposure area; and pressing the rigid plate, the flexible plate, the non-gummosis PP sheet and the non-gummosis PP sheet to generate the rigid-flex printed circuit board meeting the flatness requirement.
Description
Technical Field
The invention relates to the technical field of PCB production, in particular to a rigid-flex printed circuit board lamination structure and a manufacturing method.
Background
The rigid-flex board is provided with a flexible area for bending, and the adhesive of the rigid area needs to be ensured not to overflow to the flexible area during lamination, so that the adhesive for lamination bonding of the rigid board and the flexible board adopts a non-flowing PP sheet as the adhesive of the rigid-flex board.
The non-flowing PP sheet is also called no-flow-PP, i.e. the glue flow is very low during lamination. Because the glue flow is very low, the flow is small after the glue is directly filled between the circuit intervals or on the surface in the lamination process, and the plate surface is uneven after the rigid-flex printed circuit board is laminated.
With the higher and higher level development of rigid-flex boards, the rigid-flex boards are fused with some blind buried hole technical designs of rigid boards, and the requirements of the designs on the flatness of the board surfaces are very high. If the previous method is adopted, the flatness of the rigid-flex printed circuit board pressed by the non-gummed PP sheet cannot meet the requirement of the current technical development.
Disclosure of Invention
Embodiments of the present invention aim to solve at least one of the technical problems in the related art to some extent. Therefore, an objective of the embodiments of the present invention is to provide a lamination structure of a rigid-flex printed circuit board.
Therefore, a second object of the present invention is to provide a method for manufacturing a lamination structure of a flex-rigid board.
The technical scheme adopted by the invention is as follows:
in a first aspect, an embodiment of the present invention provides a lamination structure for a rigid-flex printed circuit board, including: rigid board, flexible board, non-gummosis PP piece and non-gummosis PP piece; the flexible board comprises an exposure area, and the non-gummosis PP sheet separates the non-gummosis PP sheet from the exposure area; and pressing the rigid plate, the flexible plate, the non-gummosis PP sheet and the non-gummosis PP sheet to form the rigid-flex combination plate.
Preferably, the non-gumming PP sheet is strip-shaped and is arranged at the edge of the exposed area.
Preferably, the non-gummosis PP sheet is frame-shaped, and the non-gummosis PP sheet is positioned in the frame.
Preferably, the rigid-flex printed circuit board pressing structure further comprises a covering film arranged on the exposed area.
Preferably, the gumming amount of the non-gumming PP sheet is 0.2-0.5mm, and the gumming amount of the non-gumming PP sheet is more than 2.0mm.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a lamination structure of a rigid-flex printed circuit board, which is applicable to the lamination structure, including: separating the non-adhesive PP sheet from the exposed area by the adhesive-free PP sheet; and pressing the rigid plate, the flexible plate, the non-gummosis PP sheet and the non-gummosis PP sheet to form the rigid-flex combination plate.
Preferably, the manufacturing method comprises the following steps: and arranging strip-shaped non-gummosis PP sheets at the edge of the exposed area.
Preferably, the manufacturing method comprises the following steps: and setting a frame-type non-gummosis PP sheet, and setting a non-gummosis PP sheet in the frame.
Preferably, the manufacturing method further includes providing a cover film on the exposed region.
Preferably, the gumming amount of the non-gumming PP sheet is 0.2-0.5mm, and the gumming amount of the non-gumming PP sheet is more than 2.0mm.
The embodiment of the invention has the beneficial effects that:
according to the embodiment of the invention, the non-gummosis PP sheet is separated from the exposure area by the non-gummosis PP sheet, so that gummosis can be prevented from flowing to the exposure area; and pressing the rigid plate, the flexible plate, the non-gummosis PP sheet and the non-gummosis PP sheet to generate the rigid-flex printed circuit board meeting the flatness requirement.
Drawings
FIG. 1 is a flow chart of one embodiment of a method of manufacturing a flex-rigid board laminate structure;
FIG. 2 is a flowchart of one embodiment of a method of fabricating a flex-rigid board laminate structure;
FIG. 3 is a flowchart of one embodiment of a method of fabricating a flex-rigid board laminate structure;
FIG. 4 is a flowchart of one embodiment of a method of manufacturing a flex-rigid board bonding structure;
FIG. 5 is a side view of one embodiment of a flex-rigid board bonding structure;
fig. 6 is a top view of an embodiment of a flex-rigid board pressing structure.
Detailed Description
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other.
The technical names involved are as follows:
PP sheet is Prepreg (Prepreg is english abbreviation of Pre-pregnant) and is a sheet-like adhesive material synthesized by resin and carrier. The resin is a thermosetting material of high molecular polymer, and the resin commonly used at present is epoxy resin.
no-flow-PP for non-gumming prepreg: the low-flow prepreg (low-flow-PP) is characterized in that the PP sheet is internally provided with a low-fluidity polymer material so as to reduce the fluidity of the PP sheet, but the performance of other glass fiber cloth is not affected, and meanwhile, the toughness of the polymer material is very good, so that drilling holes are machined after the PP sheet is combined with a soft board, the routing effect is very good, the bonding force heat resistance is very good, and the abnormal lamination cannot occur. Therefore, the material is selected as a common adhesive for the production of the rigid-flex printed circuit board.
Example 1.
The embodiment of the invention provides a manufacturing method of a rigid-flex printed circuit board pressing structure shown in fig. 1, which comprises the following steps:
s1, separating a non-gummosis PP sheet from an exposed area through the non-gummosis PP sheet;
s2, pressing the rigid plate, the flexible plate, the non-gummosis PP sheet and the non-gummosis PP sheet to form the rigid-flex combination plate.
The manufacturing method shown in fig. 2 comprises the following steps:
s1, separating a non-gummosis PP sheet from an exposed area through the non-gummosis PP sheet;
s21, arranging a strip-shaped non-gummosis PP sheet at the edge of the exposed area.
S2, pressing the rigid plate, the flexible plate, the non-gummosis PP sheet and the non-gummosis PP sheet to form the rigid-flex combination plate.
The non-adhesive PP sheet is arranged at the edge of the exposed area, and the adhesive is prevented from flowing by utilizing the adhesive non-flowing characteristic of the non-adhesive PP sheet, so that the non-adhesive PP sheet does not flow to the exposed area of the flexible board. The middle adopts a common PP sheet (namely a non-gummosis PP sheet) with large gummosis quantity, and the spacing between the circuits and between the copper surfaces is fully filled under the flowing of the gum by utilizing the characteristic of the gummosis, so that the phenomenon of uneven surface of the plate after lamination is avoided.
The manufacturing method shown in fig. 3 comprises the following steps:
s1, separating a non-gummosis PP sheet from an exposed area through the non-gummosis PP sheet;
s22, setting a frame-type non-gummosis PP sheet, and setting a non-gummosis PP sheet in the frame.
S2, pressing the rigid plate, the flexible plate, the non-gummosis PP sheet and the non-gummosis PP sheet to form the rigid-flex combination plate.
The outline of the non-gummosis PP sheet is set to be a frame, and compared with a strip shape, the area capable of limiting the gummosis is better in capacity, so that the occurrence probability of the gummosis abnormal area can be reduced. The middle of the frame is provided with a common PP sheet (namely a non-gummosis PP sheet) with larger gummosis, and the gap between the lines and between the copper surfaces is fully filled under the flowing of the gum by utilizing the characteristic of large gummosis, so that the phenomenon of uneven surface of the plate is avoided after lamination.
The manufacturing method as shown in fig. 4 further comprises:
s1, separating a non-gummosis PP sheet from an exposed area through the non-gummosis PP sheet;
s11, providing a cover film on the exposed area.
S2, pressing the rigid plate, the flexible plate, the non-gummosis PP sheet and the non-gummosis PP sheet to form the rigid-flex combination plate.
The toughness of the exposed area can be increased, the service life is prolonged, and the purpose of protecting the surface can be achieved through the covering film. The material of the cover film may specifically be CVL crystal violet lactone (crystal violet lactone).
Experiments prove that when the gummosis amount of the non-gummosis PP sheet is 0.2-0.5mm and the gummosis amount of the non-gummosis PP sheet is more than 2.0mm, the combination effect of the rigid-flex printed circuit board is relatively good.
According to the embodiment, the PP sheets with two different characteristics are used for lamination in the rigid plate area, so that the surface of the rigid-flex printed circuit board is smooth, and the defects of manufacture caused by the fact that the surface of the rigid-flex printed circuit board laminated by the non-gummosis PP sheets is uneven are avoided, and the design and manufacture requirements of some special requirements cannot be met.
Example 2.
The embodiment of the invention provides a side view of the rigid-flex printed circuit board pressing structure of fig. 5, which comprises: a rigid plate 1, a flexible plate 2, a non-gummosis PP sheet 3 and a non-gummosis PP sheet 4; the flexible board 2 comprises an exposure area, and the non-gummosis PP sheet 3 separates a non-gummosis PP sheet 4 from the exposure area; the rigid board 1, the flexible board 2, the non-gummosis PP sheet 3 and the non-gummosis PP sheet 4 are pressed together to form the rigid-flex board.
The rigid board 1 may be one layer or two layers, in this embodiment, two layers, i.e. an upper layer and a lower layer, and the flexible board 2 is disposed in the middle and is connected by a PP sheet in a press fit manner.
The non-gumming PP sheet 3 is strip-shaped and is arranged at the edge of the exposed area.
Fig. 6 is a top view of the lamination structure of the rigid-flex printed circuit board, wherein the non-gummosis PP sheet 3 is a frame, and the non-gummosis PP sheet 4 is located in the frame.
The rigid-flex printed circuit board pressing structure further comprises a covering film arranged in the exposed area.
The gummosis amount of the non-gummosis PP sheet 3 is 0.2-0.5mm, and the gummosis amount of the non-gummosis PP sheet 4 is more than 2.0mm.
Wherein the rigid plate can specifically comprise a phenolic paper laminate, an epoxy paper laminate, a polyester glass felt laminate and an epoxy glass cloth laminate; the material of the flexible board may specifically include polyimide or mylar. The size of the non-gumming PP sheet is reduced by a certain value, such as 0.2mm, relative to the hard board area at the required size, and the purpose of the non-gumming PP sheet is to reserve deformation in the lamination process, so that the gumming does not flow to the flexible area after lamination.
The specific rigid plate manufacturing process comprises the following steps: cutting, manufacturing an inner layer circuit, and waiting for combination (before the flexible board is pressed).
The specific flexible board manufacturing process comprises the following steps: cutting, manufacturing an inner layer circuit, attaching a cover film, pressing the cover film, and waiting for combination (before the flexible board is pressed).
The specific PP sheet flow is as follows: cutting-laser cutting-waiting (before the bending plate is pressed) for combination. The two PP sheets are cut by laser cutting, so that the purpose can ensure the consistent size and the good lamination quality.
The specific rigid-flex board compression and flow process is as follows: the PP sheet is laminated on the flexible board, the flexible board is riveted together, the flexible board is pressed together, and the flexible board is manufactured through other working procedures.
While the preferred embodiment of the present invention has been described in detail, the present invention is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and these equivalent modifications or substitutions are included in the scope of the present invention as defined in the appended claims.
Claims (3)
1. A manufacturing method of a rigid-flex printed circuit board lamination structure, wherein the rigid-flex printed circuit board lamination structure used by the manufacturing method comprises the following steps: the flexible board comprises an exposure area, and the non-gummosis PP sheet separates the non-gummosis PP sheet from the exposure area; the non-gummosis PP sheet is strip-shaped and is arranged at the edge of the exposed area; the non-gummosis PP sheet is in a frame shape, and the non-gummosis PP sheet is positioned in the frame;
the rigid plate, the flexible plate, the non-gummosis PP sheet and the non-gummosis PP sheet are pressed together to form a rigid-flex combination plate;
the manufacturing method is characterized by comprising the following steps:
separating the non-gummosis PP sheet from the exposed area by the gummosis PP sheet; setting a strip-shaped non-gummosis PP sheet at the edge of the exposed area; setting a frame-type non-gummosis PP sheet, and setting the non-gummosis PP sheet in a frame;
pressing the rigid plate, the flexible plate, the non-gummosis PP sheet and the non-gummosis PP sheet to form a rigid-flex combination plate; the two ends of the flexible plate are symmetrically provided with a non-gummosis PP sheet, a non-gummosis PP sheet and a rigid plate, the rigid plates at the two ends of the flexible plate are covered on the non-gummosis PP sheet and the non-gummosis PP sheet, and an exposure area is arranged between two adjacent non-gummosis PP sheets close to the middle area of the flexible plate.
2. The method of claim 1, further comprising disposing a cover film on the exposed area.
3. The manufacturing method of the rigid-flex printed circuit board pressing structure according to claim 2, wherein the gummosis amount of the non-gummosis PP sheet is 0.2-0.5mm, and the gummosis amount of the non-gummosis PP sheet is more than 2.0mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910919410.9A CN110572958B (en) | 2019-09-26 | 2019-09-26 | Rigid-flex printed circuit board lamination structure and manufacturing method |
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| CN201910919410.9A CN110572958B (en) | 2019-09-26 | 2019-09-26 | Rigid-flex printed circuit board lamination structure and manufacturing method |
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| CN110572958A CN110572958A (en) | 2019-12-13 |
| CN110572958B true CN110572958B (en) | 2023-06-30 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111315158A (en) * | 2020-03-27 | 2020-06-19 | 深圳市景旺电子股份有限公司 | Circuit board manufacturing method and circuit board |
| CN112839453B (en) * | 2021-01-20 | 2022-05-31 | 福立旺精密机电（中国）股份有限公司 | Rigid-flexible combined circuit board and preparation method thereof |
| CN114449755A (en) * | 2021-12-27 | 2022-05-06 | 江西弘信柔性电子科技有限公司 | High-toughness combined rigid-flex board |
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| CN106793567A (en) * | 2016-12-23 | 2017-05-31 | 东莞康源电子有限公司 | A kind of preparation method of rigid and flexibility plate |
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| CN201274603Y (en) * | 2008-08-18 | 2009-07-15 | 欣兴电子股份有限公司 | Soft and hard composite board |
| CN102281725B (en) * | 2010-06-10 | 2013-03-20 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN102184049B (en) * | 2011-05-27 | 2014-12-10 | 南京瀚宇彩欣科技有限责任公司 | Glue-overflow-preventing stitching structure and method for flexible circuit board for touch screen |
| CN102769996B (en) * | 2012-08-03 | 2015-03-18 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
| CN104735924B (en) * | 2015-03-31 | 2018-01-12 | 广州美维电子有限公司 | Technique of uncapping for multi-step shape Rigid Flex |
| CN104853543B (en) * | 2015-05-18 | 2017-10-20 | 惠州市金百泽电路科技有限公司 | A kind of rigid-flexible combined circuit plate adhesive dispensing method |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203661421U (en) * | 2013-11-27 | 2014-06-18 | 广州兴森快捷电路科技有限公司 | Circuit board bonding structure with small size thin blind slot |
| CN106793567A (en) * | 2016-12-23 | 2017-05-31 | 东莞康源电子有限公司 | A kind of preparation method of rigid and flexibility plate |
| CN108040427A (en) * | 2017-11-22 | 2018-05-15 | 江门崇达电路技术有限公司 | One kind solves the undesirable method of Rigid Flex filling holes with resin nog plate |
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