CN112739072A - Preparation method of rigid-flex board - Google Patents
Preparation method of rigid-flex board Download PDFInfo
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- CN112739072A CN112739072A CN202011366058.XA CN202011366058A CN112739072A CN 112739072 A CN112739072 A CN 112739072A CN 202011366058 A CN202011366058 A CN 202011366058A CN 112739072 A CN112739072 A CN 112739072A
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- protective film
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- 238000002360 preparation method Methods 0.000 title description 5
- 239000010408 film Substances 0.000 claims abstract description 116
- 239000003292 glue Substances 0.000 claims abstract description 51
- 230000001681 protective effect Effects 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 claims abstract description 25
- 239000013039 cover film Substances 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 18
- 238000005520 cutting process Methods 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 137
- 239000011241 protective layer Substances 0.000 claims description 3
- 230000002441 reversible effect Effects 0.000 claims description 2
- 238000010030 laminating Methods 0.000 abstract description 6
- 230000002829 reductive effect Effects 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a method for preparing a rigid-flexible board, which comprises the following steps of firstly preparing an inner-layer flexible board, attaching a cover film on the inner-layer flexible board, attaching a pure film to the periphery of a cut PI protective film to prepare a PI protective film, and attaching the PI protective film to a cover film/flexible board area; manufacturing a dielectric layer; laminating the inner layer soft board and the hard board through the medium layer; CO 22And (5) laser depth control cutting, namely uncovering the dielectric layer and the protective film layer to complete uncovering. The pure glue is only attached to the periphery of the PI film, so that the glue amount is greatly reduced compared with the traditional method, the glue amount is moderate with the viscosity of the covering film/soft board area, the glue is not easy to remain in the covering film/soft board area, the pure glue can still be torn off from the covering film/soft board area when the cover is uncovered after multiple times of pressing, no residual glue exists on the covering film, and the product quality is improved.
Description
Technical Field
The invention relates to the technical field of preparation of rigid-flex boards, in particular to a preparation method of a rigid-flex board.
Background
The rigid-flex circuit board has the characteristics of both FPC and PCB, has a certain flexible area and a certain rigid area, can save the internal space of a product, reduce the volume of a finished product and improve the performance of the product.
In the traditional method for preparing the rigid-flex board, in order to avoid the pollution of the covering film/flexible board area caused in the manufacturing process, a protective film is bonded in the covering film/flexible board area, in order to prevent the glue for bonding the protective film from remaining on the covering film/flexible board area, generally, high-temperature glue with strong viscosity is coated on the whole surface of one surface of the protective film, which is far away from the covering film/flexible board area, when the pressing is carried out for two times or more than two times, the high-temperature glue on the protective film easily overflows to the covering film/flexible board area, therefore, when the rigid-flex board with more than 4 layers is prepared, the high-temperature glue with strong viscosity is easily adhered to the covering film/flexible board area and is difficult to remove after the cover is.
Disclosure of Invention
Based on the method, the method overcomes the technical prejudice, and the pure glue is attached to one surface, close to the cover film, of the protective film, but only a small amount of the pure glue is attached to the periphery of the protective film, so that the protective film can be fixed on the cover film before the cover is opened, and the pure glue can be smoothly torn off from the cover film/soft board area during the cover is opened, and the problem that the cover film/soft board area is easily polluted by the residual glue in the traditional method for preparing the soft and hard combined board is solved.
The technical scheme of the invention provides a preparation method of a rigid-flex board, which comprises the following steps:
s1, manufacturing a soft board with an upper surface and a lower surface which are respectively a soft and hard combination board inner layer of the upper circuit layer and the lower circuit layer;
s2, respectively pasting an upper covering film layer and a lower covering film layer on the surfaces of the upper circuit layer and the lower circuit layer;
s3, adhering pure films to the peripheries of PI protective films in advance, and adhering the PI protective films to the soft board areas of the upper covering film layer and the lower covering film layer respectively through the pure films to form an upper PI protective film layer and a lower PI protective film layer, wherein the pure films are smaller than one side of the soft board areas by 0.2 mm; the pure film is 0.2-0.3mm larger than the single side of the PI film;
s4, manufacturing dielectric layers, and forming a groove with the thickness of 0.6-0.8mm on the Normal Flow PP dielectric layer a and the No Flow PP dielectric layer b by taking the R-F line of the soft and hard cross-connecting line as a central line;
s5, performing primary pressing, namely performing primary pressing on an upper hard board, an upper dielectric layer a, an upper dielectric layer b, a soft board adhered with a PI protective film, a lower dielectric layer a, a lower dielectric layer b and a lower hard board which are sequentially stacked from top to bottom to obtain a primary pressed board;
s6, manufacturing a circuit layer on the primary laminated board to obtain a 4-layer board;
s7, repeating the steps S4, S5, S6 and S7 as appropriate to obtain a 4+2n laminate, wherein n is the number of times of repeating the steps S4, S5, S6 and S7;
s8, using CO2Performing depth-controlled cutting on the dielectric layer in the soft board area along the R-F line of the soft and hard cross-connecting line by laser, wherein the thickness of the ink is less than the cutting depth (the depth of the dielectric layer is minus 20 mu m), the width of the ink is 0.5mm, and uncovering the dielectric layer and the PI protective layer;
and S9, producing the soft and hard combined board finished product according to the later process.
In step S2, a cover film is partially attached to the inner-layer flexible printed circuit board.
In the step S4, a groove of 0.6-0.8mm is punched on the Normal Flow PP dielectric layer a and the No Flow PP dielectric layer b with the R-F line of the soft-hard junction line as the center line, and a certain width is reserved on the dielectric layer a and the dielectric layer b as the connecting rib.
The traditional windowing mode is replaced by a mode of slotting on the dielectric layer, in the laminating process, the overflow glue of Normal FlowPP fills the slot to ensure the smoothness of the whole board in laminating, after the slot is filled, no hollow area is formed on the dielectric layer, and no suspension area is formed on the hard board, so that the soft board area is effectively protected, and the adverse phenomena of PP glue residue, copper sheet breakage, liquid medicine seepage and the like are avoided. And after the slot is formed on the dielectric layer, the glass fiber in the dielectric layer is cut off, and subsequent CO is generated2During laser cutting, the uniform medium layer is cut, so that the cutting quality is improved.
Because the No Flow PP is expensive, the medium layer adopts two medium layers of Normal Flow PP and Nol Flow PP, and the Normal Flow PP replaces part of the No Flow PP, thereby reducing the cost and reducing the glue overflow risk.
In one embodiment, in step S2, a cover film is partially attached or entirely attached to the inner flexible printed circuit board.
The attaching width of the cover film is mainly determined according to the requirement of a customer, and when the cover film is partially attached to the inner-layer flexible printed circuit board, the PI protective film is partially attached to the cover film.
In one embodiment, the pure glue is AD glue, the width of the pure glue piece attached to the single side of the PI protective film is 0.4-0.6mm, and the thickness of the pure glue piece is 12-25 μm.
In one embodiment, in step S3, the PI protection film is transferred to the flexible board area through the carrier film, and the carrier film is torn off after vacuum fast pressing; the alignment deviation among the pure glue, the PI protective film and the bearing film is not more than 0.1 mm; the vacuum fast pressure condition is satisfied: the PI protective film and the pure glue reverse release type problem do not occur when the bearing film is torn off, and the pure glue can be completely combined on the upper covering film layer and the lower covering film layer.
In one embodiment, the vacuum fast pressure parameters are: the temperature is 90 ℃, the pressing time is 10s, and the pressure is 5 kg; the release force of the carrier film is 5g, and the carrier film can resist the high temperature of 210 ℃.
In one embodiment, an automatic laminator is used to bond the PI protective film to the cover film.
The laminating precision can be improved by adopting an automatic laminating machine.
In one embodiment, in step S4, a cleaning process is performed after the dielectric layers a and b are grooved.
The cleaning process can remove residual glass fibers from the grooving process.
In one embodiment, n ≧ 1.
The invention can be used to prepare 4 layers, when n is 0. But the invention has the advantage that the problem of adhesive residue can not be generated after multiple times of pressing, and n is preferably more than or equal to 1.
In one embodiment, the rigid board is a core board.
Advantageous effects
The pure glue is only attached to the periphery of the PI protective film, so that the glue amount is greatly reduced compared with the traditional method, the glue amount is moderate with the viscosity of the covering film/soft board area, the glue is not easy to remain in the covering film/soft board area, the pure glue can still be torn off from the covering film/soft board area when the cover is uncovered after multiple times of pressing, no residual glue exists on the covering film, and the product quality is improved.
The consumption of pure glue is reduced, and the cost is also reduced.
The PI protective film prepared by pure glue and the PI film in advance is attached, so that the production efficiency is improved.
After the cover is uncovered, the mixed components of the PP resin of the medium layer and the pure glue are arranged at the joint of the edge of the exposed soft board area and the hard board, and no extra glue dispensing or other treatment is needed, so that the binding force at the joint can be ensured, and the production efficiency is improved.
Drawings
FIG. 1 is a process flow diagram of the present invention;
fig. 2 is a schematic structural view (partial view) after pressing.
In the drawings, the components represented by the respective reference numerals are listed below:
the circuit board comprises an inner layer soft board 1, an upper circuit layer 1-1, a lower circuit layer 1-2, an upper covering film layer 2-1, a lower covering film layer 2-2, an upper protective film layer 3-1, a lower protective film layer 3-2, an upper dielectric layer a 4-1-1, an upper dielectric layer b 4-1-2, a lower dielectric layer a4-2-1, a lower dielectric layer b 4-2-2, an upper hard board layer 5-1 and a lower hard board layer 5-2.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
Example 1
The embodiment provides a rigid-flex board method, which comprises the following steps:
s1, manufacturing the inner layer soft board of the rigid-flexible combined board, comprising the following steps:
cutting: the inner soft board is cut according to the size of the jointed board of 250mm multiplied by 400 mm. The inner layer soft board comprises a soft board inner layer 1 and outer copper foils on the upper surface and the lower surface of the inner layer of the soft board, wherein the thickness of the inner layer of the soft board is 49um, and the thickness of the outer copper foils is 1/3 OZ.
Preparing an inner layer circuit according to a conventional process: an upper circuit layer 1-1 is formed on the copper foil on the upper surface of the soft board inner layer 1, and a lower circuit layer 1-2 is formed on the copper foil on the lower surface.
S2, pasting a covering film: and (3) attaching PI cover films to the upper circuit layer 1-1 and the lower circuit layer 1-2 in an aligned mode to obtain an upper cover film layer 2-1 and a lower cover film layer 2-2. The covering film is adhered by a conventional process.
S3, manufacturing the PI protective film layer, and the method comprises the following steps:
cutting out a PI protective film;
attaching pure glue to the periphery of the PI film to prepare a PI protective film, wherein the pure glue is 0.2mm larger than the single edge of the PI film, the width of the pure glue is 0.6mm, and the thickness of the pure glue is 12 micrometers;
and transferring the PI protective film with pure glue pre-adhered to the periphery to an upper protective film layer 2-1 and a lower protective film layer 2-2 through a bearing film, performing vacuum fast pressing, and tearing off the bearing film to obtain an upper protective film layer 3-1 and a lower protective film layer 3-2, wherein the pure glue is positioned between the upper protective film layer 2-1 and the upper protective film layer 3-1, and the lower protective film layer 2-2 and the lower protective film layer 3-2.
The alignment deviation among the pure glue, the PI layer and the bearing film is not more than 0.1 mm. The single side of the pure glue is 0.2mm smaller than the soft board area.
Vacuum rapid pressure parameters: the temperature is 90 ℃, the pressing time is 10s, and the pressure is 5 kg; the release force of the bearing film is 5 g.
S4, manufacturing the dielectric layer, including the following steps:
and (3) forming positioning holes in the medium aNormal Flow PP and the medium b No Flow PP, slotting by taking the R-F line of the soft and hard cross-connecting line as a central line, wherein the width of the slot is 0.8mm, and removing the glass fiber generated by cutting.
S5, primary pressing, comprising the following steps:
and (4) pre-laminating the inner soft board and the outer core board manufactured in the step S3 by using a medium PP through a base material compounding hot melting mode, and compounding through a false pasting or hot melting mode. The specific plate arrangement sequence is shown in figure 1 (pure glue is not shown in the figure), and comprises an upper hard plate layer 5-1, an upper dielectric layer a 4-1-1, an upper dielectric layer b 4-1-2, an upper protective film layer of the 3-1, a covering film layer on the 2-1, an upper circuit layer of the 1-1, an inner soft plate layer of the 1-2, a lower circuit layer of the 1-2, a lower covering film layer of the 2-2, a lower protective film layer of the 3-2, a lower dielectric layer a4-2-1, a lower dielectric layer b 4-2-2 and a lower hard plate layer 5-2 from top to bottom.
The pressing is carried out according to the conventional process.
And S6, manufacturing a circuit layer on the primary laminated board, wherein the manufacturing of the circuit layer adopts a conventional process to manufacture a 4-layer board.
And S7, manufacturing the dielectric layer again according to the step S4, and performing secondary lamination on the manufactured dielectric layer and the rigid-flex board manufactured in the step S6.
And S8, manufacturing a circuit layer on the secondary laminated plate, wherein the manufacturing of the circuit layer adopts a conventional process to manufacture a 6-layer plate.
And S9, finishing the manufacture of the outermost ink layer according to the conventional process.
S10, using CO2And (3) performing depth-controlled cutting on the medium layer in the soft board area along the R-F line of the soft and hard cross-connecting line by laser, wherein the cutting depth is the thickness of the medium layer, the cutting width is 0.5mm, and removing the medium layer and the PI protective layer.
And S11, producing the soft and hard combined board finished product according to the later process.
Fig. 2 is a schematic view of a structure of a rigid-flex board after a rigid-flex board is laminated with a cover film partially attached to the flexible board, and only a portion near a line R-F of a rigid-flex line is shown.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A method for preparing a rigid-flex board is characterized by comprising the following steps:
s1, manufacturing a soft board (1) with an inner layer of a soft-hard combined board, wherein the upper surface and the lower surface of the soft board are respectively an upper circuit layer (1-1) and a lower circuit layer (1-2);
s2, respectively sticking an upper covering film layer (2-1) and a lower covering film layer (2-2) on the surfaces of the upper circuit layer (1-1) and the lower circuit layer (1-2);
s3, adhering a pure film to the periphery of a PI protective film in advance, adhering the PI protective film to a soft board area of an upper covering film layer (2-1) and a lower covering film layer (2-2) through pure glue to form an upper PI protective film layer (3-1) and a lower PI protective film layer (3-2), adhering the pure film to the surface of the PI protective film close to the covering film side, and making the pure film 0.2mm smaller than one edge of the soft board area; the pure film is 0.2-0.3mm larger than the single side of the PI film;
s4, manufacturing dielectric layers, and forming a groove with the thickness of 0.6-0.8mm on the Normal Flow PP dielectric layer a and the No Flow PP dielectric layer b by taking the R-F line of the soft and hard cross-connecting line as a central line;
s5, performing primary pressing, namely performing primary pressing on an upper hard board layer (5-1), an upper dielectric layer a (4-1-1), an upper dielectric layer b (4-1-2), a soft board adhered with a PI protective film, a lower dielectric layer a (4-2-1), a lower dielectric layer b (4-2-2) and a lower hard board layer (5-2) which are sequentially stacked from top to bottom to obtain a primary pressed board;
s6, manufacturing circuit layers on the upper hard board layer (5-1) and the lower hard board layer (5-2) of the primary laminated board to obtain a 4-layer board;
s7, repeating the steps S4, S5, S6 and S7 as appropriate to obtain a 4+2n laminate, wherein n is the number of times of repeating the steps S4, S5 and S6;
s8, using CO2Performing depth-controlled cutting on the dielectric layer in the soft board area along the R-F line of the soft and hard cross-connecting line by laser, wherein the thickness of ink is less than the cutting depth (the depth of the dielectric layer is minus 20 um), the width of a cutting seam is 0.5mm, and uncovering and removing the dielectric layer and the PI protective layer;
and S9, producing the soft and hard combined board finished product according to the later process.
2. The method for manufacturing a rigid-flexible printed board according to claim 1, wherein in step S2, a cover film is partially attached to the inner flexible printed board (1).
3. The method for preparing the rigid-flex printed circuit board according to claim 1, wherein the pure glue is AD glue, the width of the pure glue piece attached to the single side of the PI protective film is 0.4-0.6mm, and the thickness of the pure glue piece is 12-25 μm.
4. The method for preparing a rigid-flex board according to claim 1, wherein in step S3, the PI protective film is transferred to the flexible board region through the carrier film, and the carrier film is torn off after vacuum rapid pressing; the alignment deviation among the pure glue, the PI protective film and the bearing film is not more than 0.1 mm; the vacuum fast pressure condition is satisfied: the problems of PI protective film and pure glue reverse release do not occur when the bearing film is torn off, and the pure glue can be completely combined on the upper covering film layer (3-1) and the lower covering film layer (3-2).
5. The method for preparing a rigid-flex board according to claim 5, wherein in step S3, the vacuum fast-pressing parameters are: the temperature is 90 ℃, the pressing time is 10s, and the pressure is 5 kg; the release force of the carrier film is 5g, and the carrier film can resist the high temperature of 210 ℃.
6. The method for manufacturing a rigid-flexible printed circuit board according to claim 1, wherein the PI protective film is attached to the upper cover film layer (3-1) and the lower cover film layer (3-2) by using an automatic attaching machine.
7. The method for preparing a rigid-flex board according to any one of claims 1 to 6, wherein in step S4, the dielectric layers a and b are cleaned after being grooved.
8. The method for preparing the rigid-flexible printed circuit board according to any one of claims 1 to 6, wherein n is greater than or equal to 1.
9. The method for manufacturing a rigid-flex board according to any one of claims 1 to 6, wherein the upper and lower hard board layers are core boards.
10. A rigid-flex board manufactured by the rigid-flex board manufacturing method according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011366058.XA CN112739072A (en) | 2020-11-29 | 2020-11-29 | Preparation method of rigid-flex board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011366058.XA CN112739072A (en) | 2020-11-29 | 2020-11-29 | Preparation method of rigid-flex board |
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| CN112739072A true CN112739072A (en) | 2021-04-30 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573507A (en) * | 2021-07-28 | 2021-10-29 | 恒赫鼎富(苏州)电子有限公司 | Manufacturing process of rigid-flex board |
| CN113891583A (en) * | 2021-09-27 | 2022-01-04 | 九江明阳电路科技有限公司 | Anti-layering laminating method for PCB cover plate |
| WO2023005497A1 (en) * | 2021-07-27 | 2023-02-02 | 生益电子股份有限公司 | Preparation method for pcb, and pcb |
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|---|---|---|---|---|
| KR20110023576A (en) * | 2009-08-31 | 2011-03-08 | 삼성전기주식회사 | Rigid-flexible printed circuit board |
| CN102487577A (en) * | 2010-12-01 | 2012-06-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board with combination of flexible circuit board and hard circuit board |
| CN104168711A (en) * | 2014-08-29 | 2014-11-26 | 广州美维电子有限公司 | Pressing structure of cavity circuit board and pressing method of cavity circuit board |
-
2020
- 2020-11-29 CN CN202011366058.XA patent/CN112739072A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110023576A (en) * | 2009-08-31 | 2011-03-08 | 삼성전기주식회사 | Rigid-flexible printed circuit board |
| CN102487577A (en) * | 2010-12-01 | 2012-06-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board with combination of flexible circuit board and hard circuit board |
| CN104168711A (en) * | 2014-08-29 | 2014-11-26 | 广州美维电子有限公司 | Pressing structure of cavity circuit board and pressing method of cavity circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023005497A1 (en) * | 2021-07-27 | 2023-02-02 | 生益电子股份有限公司 | Preparation method for pcb, and pcb |
| CN113573507A (en) * | 2021-07-28 | 2021-10-29 | 恒赫鼎富(苏州)电子有限公司 | Manufacturing process of rigid-flex board |
| CN113891583A (en) * | 2021-09-27 | 2022-01-04 | 九江明阳电路科技有限公司 | Anti-layering laminating method for PCB cover plate |
| CN113891583B (en) * | 2021-09-27 | 2023-07-07 | 九江明阳电路科技有限公司 | PCB uncovering plate layering-preventing pressing method |
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Application publication date: 20210430 |
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