CN112672514B - Preparation method of rigid-flexible printed circuit board and rigid-flexible printed circuit board - Google Patents
Preparation method of rigid-flexible printed circuit board and rigid-flexible printed circuit board Download PDFInfo
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- CN112672514B CN112672514B CN202011604489.5A CN202011604489A CN112672514B CN 112672514 B CN112672514 B CN 112672514B CN 202011604489 A CN202011604489 A CN 202011604489A CN 112672514 B CN112672514 B CN 112672514B
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Abstract
The invention provides a method for preparing a rigid-flexible board and the rigid-flexible board, comprising the following steps of preparing an inner-layer flexible board, attaching a cover film on the inner-layer flexible board, attaching protective glue in the area of the cover film corresponding to the flexible board, and pressing the inner-layer flexible board and the rigid board by using a non-flowing glue PP medium layer which is provided with a groove with a connecting rib in advance; and (4) routing the connecting ribs by using a channel routing mode, uncovering and removing the dielectric layer and the protective film layer in the soft board area part, and uncovering. And then the soft-hard combined board is produced according to the later process. The traditional windowing is replaced by the groove with the connecting rib point position on the dielectric layer, and in the pressing process, the hard board has no suspension area and is cooperated with the protection film layer, so that the soft board area is effectively protected, and the adverse phenomena of PP glue residue, copper sheet breakage, liquid medicine seepage and the like are avoided.
Description
Technical Field
The invention relates to the technical field of preparation of rigid-flex boards, in particular to a method for preparing a rigid-flex board and the rigid-flex board.
Background
In the traditional rigid-flexible printed circuit board preparation method, the rigid-flexible printed circuit board has the characteristics of both the FPC and the PCB, so that the rigid-flexible printed circuit board can be used in products with special requirements, has a certain flexible area and a certain rigid area, and is greatly helpful for saving the internal space of the products, reducing the volume of finished products and improving the performance of the products.
The traditional soft and hard combined board is manufactured by generally adopting a mode of opening a window on a PP layer, namely, PP corresponding to a soft board area is cut off firstly, and then the inner layer soft board and the outer layer hard board are combined together through the PP layer through pressing. Because there is the through window on the PP layer, can make the soft board region become the fretwork district among the pressfitting process, produce easily in later process flow that PP glues remaining, copper skin fracture, ooze liquid medicine scheduling problem.
Disclosure of Invention
Based on the above, the invention provides a preparation method of the rigid-flexible printed circuit board, and the groove with the connecting rib is only formed on the PP layer, so that the area of the hollow area is greatly reduced in the pressing process, and the problems of PP glue residue, copper sheet fracture, liquid medicine seepage and the like are not easy to generate in the subsequent process flow.
The technical scheme for solving the technical problems is as follows:
the preparation method of the rigid-flex board comprises the following steps:
respectively manufacturing an upper circuit layer and a lower circuit layer on the upper surface and the lower surface of the inner-layer soft board;
manufacturing a covering film layer, and pasting covering films on the upper circuit layer and the lower circuit layer in an aligned mode respectively to manufacture an upper covering film layer and a lower covering film layer;
manufacturing a protective film layer, and respectively sticking protective adhesive tapes in a soft board area surrounded by soft and hard cross-linking wires R-F on the upper covering film layer and the lower covering film layer to manufacture an upper protective film layer and a lower protective film layer;
manufacturing a dielectric layer, slotting near a soft-hard boundary line R-F corresponding to the non-gumming PP dielectric layer, reserving a plurality of point positions in the slot as connecting ribs, and enabling the single edge of the inner periphery of the slot to be smaller than the single edge of the protective tape;
laminating, namely laminating an upper hard board layer, an upper dielectric layer, an upper protective film layer, an upper covering film layer, an upper circuit layer, an inner soft board, a lower circuit layer, a lower covering film layer, a lower protective film layer, a lower dielectric layer and a lower hard board layer which are sequentially stacked from top to bottom to obtain a laminated board;
manufacturing circuits on the upper hard board layer and the lower hard board layer of the laminated board to obtain a production board;
uncovering the soft board area;
manufacturing a solder mask layer;
and (5) producing the soft and hard combined board according to the later process.
In one embodiment, the single side of the protective tape is 0.3mm smaller than the area of the soft board.
In one embodiment, the protective adhesive tape can resist pressing for more than 4 hours, resist high temperature of more than 200 ℃, keep the high temperature for more than 90min and has the parting force with the copper surface within the range of 8g-10 g.
In one embodiment, the step of manufacturing the protective film layer includes the following steps:
attaching a protective adhesive tape to the upper covering layer and the lower covering film layer in a transfer mode;
and pre-pressing to ensure that the protective adhesive tape is more firmly attached to the upper covering layer and the lower covering film layer.
In one embodiment, the pre-compression parameter is: the temperature is 180 ℃, the pressure is 20kg, and the pressing time is 10s.
In one embodiment, in the step of manufacturing the dielectric layer, a die cutting manner is adopted for slotting.
In one embodiment, the groove width is greater than 0.8mm, and the tie bar length is greater than 0.2mm.
In one embodiment, the single edge of the PP in the non-flowing PP dielectric layer groove is smaller than that of the protective tape by more than 0.5 mm.
In one embodiment, in the step of uncovering the flexible board area, the connecting ribs are routed in a groove routing mode, and the medium layer and the protective film layer on the flexible board area are uncovered and removed.
Another object of the present invention is to provide a rigid-flex board manufactured by the above method.
Advantageous effects
The traditional windowing is replaced by the point location groove with the connecting ribs on the dielectric layer, and in the pressing process, the hard board has no suspension area and is cooperated with the protection film layer, so that the soft board area is effectively protected, and the adverse phenomena of PP glue residue, copper sheet breakage, liquid medicine seepage and the like are avoided.
Drawings
FIG. 1 is a process flow diagram of the present invention.
In the drawings, the reference numerals denote the following components:
the circuit board comprises an inner layer soft board 1, an upper circuit layer 1-1, a lower circuit layer 1-2, an upper covering film layer 2-1, a lower covering film layer 2-2, an upper protective film layer 3-1, a lower protective film layer 3-2, an upper dielectric layer 4-1, a lower dielectric layer 4-2, an upper hard board layer 5-1 and a lower hard board layer 5-2.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
Example 1
The embodiment provides a rigid-flex board method, which comprises the following steps:
s1, manufacturing an inner-layer soft board, comprising the following steps:
cutting: the inner layer soft board is cut according to the size of the jointed board of 250mm multiplied by 400 mm. The inner layer soft board comprises a soft board inner layer 1 and outer layer copper foils on the upper surface and the lower surface of the soft board inner layer, wherein the thickness of the soft board inner layer 1 is 49 mu m, and the thickness of the outer layer copper foil is 1/3OZ.
Preparing an inner layer circuit according to a conventional process: the copper foil on the upper surface of the soft board inner layer 1 is provided with an upper circuit layer 1-1, and the copper foil on the lower surface is provided with a lower circuit layer 1-2.
Browning according to a conventional process.
S2, manufacturing a covering film layer: and (3) attaching PI cover films to the upper circuit layer 1-1 and the lower circuit layer 1-2 in an aligned mode to obtain an upper cover film layer 2-1 and a lower cover film layer 2-2. In this step, the cover film may be attached after being windowed according to actual requirements, and in this embodiment, the cover film is not windowed.
And (3) quick pressing: the adhesive layer (epoxy resin) of the covering film is completely bonded with the inner layer of the flexible printed circuit board in a short time in a high-temperature and high-pressure mode, so that the effect of protecting the flexible printed circuit board area is achieved; the parameters of the rapid pressing are as follows: the temperature is 180 ℃, the pressure is 120kg, and the pressing time is 2min.
Baking the plate: baking at 160 ℃ for 1h to completely cure the covering film.
S3, manufacturing a protective film layer, comprising the following steps:
and sticking protective adhesive tapes in corresponding soft board areas on the upper covering film layer 2-1 and the lower covering film layer 2-2 in a prepressing mode, wherein the single side of each protective adhesive tape is 0.3mm smaller than that of each soft board area, and manufacturing an upper protective film layer 3-1 and a lower protective film layer 3-2.
The protective tape is FN9008NG type protective tape manufactured by Bester film industries, inc. of Huizhou city.
The prepressing parameters are as follows: the temperature is 180 ℃, the pressure is 20kg, and the pressing time is 10s.
Foreign matters on the surface of the inner layer of the flexible board are removed in a gas reaction mode, the cleanliness is improved, the surface of the PI covering film is roughened, and the bonding force with PP during pressing is enhanced.
S4, manufacturing a dielectric layer, comprising the following steps:
and (3) grooving by taking the R-F line of the soft and hard intersection line as a groove peripheral line, wherein the groove width is 0.9mm, the groove is provided with a connecting rib, and the length of the connecting rib is 0.3mm.
And removing the glass fiber generated by cutting.
S5, pressing, comprising the following steps:
and (4) pre-laminating the inner layer soft board with the covering film layer and the outer layer core board manufactured in the step (S3) together by using a dielectric layer, and compounding in a false pasting or hot melting mode. The board arrangement sequentially comprises an upper hard board layer 5-1, an upper dielectric layer 4-1, an upper protective film layer 3-1, an upper covering film layer 2-1, an upper circuit layer 1-1, an inner layer soft board 1, a lower circuit layer 2-1, a lower covering film layer 2-2, a lower protective film layer 3-2, a lower dielectric layer 4-2 and a lower hard board layer 5-2 from top to bottom, and the laminated board is obtained.
The pressing is carried out according to the conventional process.
S6, manufacturing circuits on an upper hard board layer 5-1 and a lower hard board layer 5-2 of the laminated board, drilling holes on the upper hard board layer 5-1 and the lower hard board layer 5-2 of the laminated board, sequentially depositing copper and electroplating copper on hole walls, then manufacturing a circuit layer through a negative film process, transferring an outer layer pattern, completing outer layer circuit exposure by using a full-automatic exposure machine and a negative film circuit film and using 5-7 exposure rulers (21 exposure rulers), and forming an outer layer circuit pattern on a production board through development; then etching, film stripping and drying are carried out in sequence, and an outer layer circuit is etched on the production board; and (4) detecting whether the outer layer line has the defects of open circuit, gap, incomplete etching, short circuit and the like by using an automatic optical detection system and comparing with CAM data to obtain the production board.
S7, uncovering the soft board area; and routing the connecting ribs at the positions of the notches of the non-flowing PP on the production board in a routing mode, stripping waste materials corresponding to the soft board area on the production board from the product by uncovering (removing the part corresponding to the soft board area on the outer layer of the hard board after uncovering), and removing the protective adhesive tape when uncovering to expose the internal part of the soft board area.
And S8, manufacturing the solder mask layer according to a conventional process.
And S9, producing the soft-hard combined board according to the later process.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (7)
1. A method for preparing a rigid-flex board is characterized by comprising the following steps:
manufacturing an inner-layer soft board, and respectively manufacturing an upper circuit layer (1-1) and a lower circuit layer (1-2) on the upper surface and the lower surface of the inner-layer soft board (1);
manufacturing a covering film layer, and respectively pasting covering films on the upper circuit layer (1-1) and the lower circuit layer (1-2) in an alignment manner to manufacture an upper covering film layer (2-1) and a lower covering film layer (2-2);
manufacturing a protective film layer, and respectively sticking protective adhesive tapes in a soft board area surrounded by R-F lines of the soft and hard cross-linked wires on the upper covering film layer (2-1) and the lower covering film layer (2-2) to manufacture an upper protective film layer (3-1) and a lower protective film layer (3-2);
manufacturing a dielectric layer, slotting near a soft-hard boundary line R-F corresponding to the non-gumming PP dielectric layer, reserving a plurality of point positions in the slot as connecting ribs, and enabling the single edge of the inner periphery of the slot to be smaller than the single edge of the protective tape; in the step of manufacturing the dielectric layer, slotting is carried out in a die cutting mode; the width of the groove is larger than 0.8mm, and the length of the connecting rib is larger than 0.2mm; the single side of PP at the inner periphery of the non-gummosis PP dielectric layer groove is smaller than that of the protective adhesive tape by more than 0.5 mm;
laminating, namely laminating an upper hard board layer (5-1), an upper dielectric layer (4-1), an upper protective film layer (3-1), an upper covering film layer (2-1), an upper circuit layer (1-1), an inner layer soft board (1), a lower circuit layer (2-1), a lower covering film layer (2-2), a lower protective film layer (3-2), a lower dielectric layer (4-2) and a lower hard board layer (5-2) which are sequentially stacked from top to bottom to obtain a laminated board;
manufacturing circuits on the upper hard board layer (5-1) and the lower hard board layer (5-2) of the laminated board to obtain a production board;
uncovering the soft board area;
manufacturing a solder mask layer;
and producing according to the subsequent process to obtain the finished product of the rigid-flexible printed circuit board.
2. The method for manufacturing a rigid-flexible printed circuit board according to claim 1, wherein the single edge of the protective tape is 0.3mm smaller than the area of the flexible printed circuit board.
3. The method for preparing the rigid-flex board according to claim 1, wherein the protective tape can resist pressing for more than 4 hours, resist high temperature of more than 200 ℃, keep the high temperature for more than 90min, and has a release force with a copper surface within a range of 8g-10 g.
4. The method for preparing the rigid-flexible printed circuit board according to claim 1, wherein the step of preparing the protective film layer comprises the following steps:
attaching a protective adhesive tape to the upper covering layer (2-1) and the lower covering film layer (2-1) in a transfer mode;
and pre-pressing to ensure that the protective adhesive tape is more firmly attached to the upper covering layer (2-1) and the lower covering film layer (2-1).
5. The method for preparing the rigid-flex board according to claim 4, wherein the prepressing parameters are as follows: the temperature is 180 ℃, the pressure is 20kg, and the pressing time is 10s.
6. The method for manufacturing a rigid-flexible printed circuit board according to claim 1, wherein in the step of uncovering the flexible printed circuit board area, the connecting ribs are routed by using a routing manner, and the dielectric layer and the protective film layer in the portion of the flexible printed circuit board area are uncovered and removed.
7. A rigid-flex board manufactured by the rigid-flex board manufacturing method according to any one of claims 1 to 6.
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| CN202011604489.5A CN112672514B (en) | 2020-12-30 | 2020-12-30 | Preparation method of rigid-flexible printed circuit board and rigid-flexible printed circuit board |
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| CN202011604489.5A CN112672514B (en) | 2020-12-30 | 2020-12-30 | Preparation method of rigid-flexible printed circuit board and rigid-flexible printed circuit board |
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| CN112672514B true CN112672514B (en) | 2023-04-07 |
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| CN113382536B (en) * | 2021-07-27 | 2023-06-30 | 生益电子股份有限公司 | PCB preparation method and PCB |
| CN114206030A (en) * | 2021-12-06 | 2022-03-18 | 博罗县精汇电子科技有限公司 | Production process of thin rigid-flex board |
| CN113891585B (en) * | 2021-12-09 | 2022-03-01 | 四川英创力电子科技股份有限公司 | Manufacturing method of rigid-flex board |
| CN115633439A (en) * | 2022-09-21 | 2023-01-20 | 欣强电子（清远）有限公司 | Rigid-flex board and laminating method thereof |
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| KR101051491B1 (en) * | 2009-10-28 | 2011-07-22 | 삼성전기주식회사 | Manufacturing method of multilayer flexible printed circuit board and multilayer flexible printed circuit board |
| CN108521723A (en) * | 2018-05-22 | 2018-09-11 | 深圳崇达多层线路板有限公司 | A kind of production method of Rigid Flex |
| CN108617113A (en) * | 2018-06-13 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A kind of PP adds the method for Protection glue band making Rigid Flex |
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