CN115633439A - Rigid-flex board and laminating method thereof - Google Patents
Rigid-flex board and laminating method thereof Download PDFInfo
- Publication number
- CN115633439A CN115633439A CN202211153857.8A CN202211153857A CN115633439A CN 115633439 A CN115633439 A CN 115633439A CN 202211153857 A CN202211153857 A CN 202211153857A CN 115633439 A CN115633439 A CN 115633439A
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- layer
- rigid
- circuit board
- board
- flex
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000010030 laminating Methods 0.000 title abstract description 8
- 239000011241 protective layer Substances 0.000 claims abstract description 14
- 238000013461 design Methods 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 66
- 238000003825 pressing Methods 0.000 claims description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000010408 film Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a rigid-flex board and a laminating method thereof. Based on this, through the design of protective layer to and cancel the fretwork part in the region of uncapping, the unevenness appears in the soft and hard combination board when preventing the pressfitting, improves the circuit yield and the stability of soft and hard combination board.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a rigid-flexible board and a laminating method thereof.
Background
The soft and hard combined board, namely the flexible circuit board and the hard circuit board are combined together according to the relevant process requirements through processes such as pressing and the like, so as to form the circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics. Among them, in the rigid-flex board, the flexible circuit board is usually designed in a multilayer layered structure.
The flexible circuit board layer is arranged on an outer layer product due to the fact that the rigid-flex board is designed to be stacked, the surface of the flexible circuit board layer is not flat after the cover opening area is pressed in the existing stacking design and production process, and when the circuit is manufactured, the dry film is not pressed to be compact, so that the outer layer circuit is opened and scrapped. In order to solve the problem in the operation process, the current solution method adopts a vacuum film pressing machine, a wet film screen printing machine and the like. However, the above solution requires special equipment such as a vacuum laminator to assist, and an additional work flow is required, which increases the production cost of the flexible printed circuit board and affects the yield to a certain extent.
To sum up, the conventional method for solving the problems of the laminated board surface in the cover opening area of the flexible circuit board stacking design and the production process still has the above disadvantages.
Disclosure of Invention
Therefore, it is necessary to provide a rigid-flex board and a laminating method thereof to overcome the defects of the conventional method for solving the problem of board surface after lamination in the cover opening area of the flexible circuit board stacking design and the production process.
A rigid-flex board comprising:
a base layer;
a PP layer disposed on the base layer;
the flexible circuit board layer is used for butt joint and lamination with the PP layer;
and the protective layer is used for being attached and arranged between the flexible circuit board layer and the PP layer.
Foretell rigid-flex board, including the basic unit, the PP layer of setting on the basic unit for with the flexible circuit board layer of PP layer butt joint laminating, and be used for the laminating to set up the protective layer between flexible circuit board layer and PP layer. Based on this, through the design of protective layer to and cancel the fretwork part in the region of uncapping, the unevenness appears in the soft and hard combination board when preventing the pressfitting, improves the circuit yield and the stability of soft and hard combination board.
In one embodiment, the PP layer and the base layer corresponding to the coverage area of the protective layer are used to design an uncapped area.
In one embodiment, the edges of the uncapped region are pre-cut.
Through the pre-cutting treatment, the hollowing is prevented before the pressing, the problem of unevenness of the pressing is further avoided, and the sinking probability is reduced.
In one embodiment, the edge of the uncapped region is subjected to a laser pre-cutting process.
In one embodiment, the base layer comprises a rigid wiring board.
In one embodiment, the protective layer comprises a thin film.
In one embodiment, the film comprises a PI film.
In one embodiment, the film has a thickness of 10-15um.
A pressing method of a rigid-flex board is applied to the rigid-flex board of any embodiment, and comprises the following steps:
arranging a gasket on the surface of the flexible circuit board layer of the rigid-flex printed circuit board;
and pressing the rigid-flex board by pressing the gasket.
According to the method for pressing the rigid-flexible printed circuit board, on the basis of the improved rigid-flexible printed circuit board, the pressing treatment is performed through the arrangement of the gasket, so that the probability of depression of the rigid-flexible printed circuit board after pressing is further reduced, and the flatness is improved.
In one embodiment, the gasket comprises an aluminum sheet.
Wherein, adopt the aluminum sheet as the gasket, in the actual operation in-process, the sunken probability of test is 0%.
Drawings
Fig. 1 is a schematic structural view of a rigid-flex board according to an embodiment;
fig. 2 is a flowchart of a press-fitting method of a rigid-flex board according to an embodiment.
Detailed Description
For better understanding of the objects, technical solutions and technical effects of the present invention, the present invention will be further explained with reference to the accompanying drawings and examples. It is to be noted that the following examples are provided only for illustrating the present invention and are not intended to limit the present invention.
The embodiment of the invention provides a rigid-flex board
Fig. 1 is a schematic structural view of a rigid-flexible printed circuit board according to an embodiment, as shown in fig. 1, the rigid-flexible printed circuit board according to an embodiment includes:
a base layer 100;
a PP (prepeg, prepreg) layer 101 disposed on the base layer 100;
a flexible circuit board layer 102 for butt-bonding with the PP layer 101;
and the protective layer 103 is used for being attached and arranged between the flexible circuit board layer 102 and the PP layer 101.
Wherein, the base layer 100 is used as the base of the flexible circuit board layer 102, and is persevered with the flexible circuit board layer 102 through the PP layer 101. The PP layer 101 serves as a basis for insulation. The flexible circuit board layer 102 implements a core function of the flexible circuit board for deploying a corresponding line, and if the flexible circuit board layer 102 is recessed, normal operation of the line may be affected.
Wherein, in the corresponding areas of the base layer 100 and the PP layer 101, an uncapped area needs to be provided. In conventional designs, the uncapped area is hollowed out before being pressed, which may create a stress point for the flexible circuit board layer 102 corresponding to the uncapped area.
Based on this, in one embodiment, as shown in fig. 1, the PP layer 101 and the base layer 100 corresponding to the coverage area of the protective layer 103 are used to design an uncapped area, and the edge of the uncapped area is subjected to a pre-cutting process. By the pre-cutting process, the force of the uncapping area on the press fit is maintained, and the hollowing out is prevented from causing the dent of the flexible circuit board layer 102. Meanwhile, the uncovering area after precutting treatment is convenient for hollowing out the window after pressing. As a preferred embodiment, the edges of the uncapped region are subjected to a laser pre-cutting process.
The protection layer 103 can improve the stress protection of the uncapped region and prevent dishing.
In one embodiment, the protective layer 103 comprises a film, and the film design is adopted to avoid influence on the PP layer 101 and the base layer 100. As a preferred embodiment, a PI (polyimide) film is used as the film.
Wherein, the thickness of the film is 10-15um. As a preferred embodiment, the film has a thickness of 12.5um. Therefore, the film with the preferable thickness can avoid the influence on each layer and has good protection effect.
The rigid-flex board of any of the above embodiments comprises a base layer 100, a PP layer 101 disposed on the base layer 100, a flexible circuit board layer 102 for butt-joint bonding with the PP layer 101, and a protective layer 103 for bonding disposed between the flexible circuit board layer 102 and the PP layer 101. Based on this, through the design of protective layer 103 to and cancel the fretwork part in the region of uncapping, the unevenness appears in the rigid-flex board when preventing the pressfitting, improves rigid-flex board's circuit yield and stability.
The embodiment of the invention also provides a laminating method of the rigid-flex board.
Fig. 2 is a flowchart of a press-fitting method of a rigid-flex board according to an embodiment, and as shown in fig. 2, the press-fitting method of the rigid-flex board according to an embodiment includes steps S100 and S101:
s100, arranging a gasket on the surface of a flexible circuit board layer of the rigid-flex printed circuit board;
and S101, pressing the rigid-flex board through a pressing gasket.
According to the pressing method of the rigid-flexible printed circuit board, on the basis of the improved rigid-flexible printed circuit board, the pressing treatment is performed through the gasket, so that the probability of the rigid-flexible printed circuit board sinking after pressing is further reduced, and the flatness is improved.
In one embodiment, the gasket comprises an aluminum sheet.
Wherein, adopt aluminum sheet as the gasket, in the actual operation in-process, sunken probability of test is 0%.
The gasket is used as an auxiliary material for pressing, and the flexible circuit board layer is thin and easy to deform during pressing, so that the aluminum gasket sheet of the flexible circuit board layer is pressed, and the surface of the flexible circuit board layer is absolutely flat.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A rigid-flex board, comprising:
a base layer;
a PP layer disposed on the base layer;
the flexible circuit board layer is used for butting and fitting with the PP layer;
and the protective layer is used for being attached and arranged between the flexible circuit board layer and the PP layer.
2. The board according to claim 1, wherein the PP layer and the base layer corresponding to the covering area of the protective layer are used to design an open cover area.
3. The board according to claim 2, wherein edges of the open cover region are pre-cut.
4. The board according to claim 3, wherein the edge of the cap-opening area is subjected to a laser pre-cutting process.
5. The board according to claim 1, wherein the base layer comprises a rigid wiring board.
6. The board according to claim 1, wherein the protective layer comprises a film.
7. The board according to claim 6, wherein the film comprises a PI film.
8. The board according to claim 6, wherein the film has a thickness of 10-15um.
9. A press-fitting method of a rigid-flex board, applied to the rigid-flex board according to any one of claims 1 to 8, comprising the steps of:
arranging a gasket on the surface of the flexible circuit board layer of the rigid-flex printed circuit board;
and pressing the rigid-flexible printed circuit board by pressing a gasket.
10. The method for pressing a rigid-flex printed circuit board according to claim 9, wherein the pad comprises an aluminum sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211153857.8A CN115633439A (en) | 2022-09-21 | 2022-09-21 | Rigid-flex board and laminating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211153857.8A CN115633439A (en) | 2022-09-21 | 2022-09-21 | Rigid-flex board and laminating method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115633439A true CN115633439A (en) | 2023-01-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211153857.8A Pending CN115633439A (en) | 2022-09-21 | 2022-09-21 | Rigid-flex board and laminating method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115633439A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061122A (en) * | 2016-08-01 | 2016-10-26 | 台山市精诚达电路有限公司 | Processing method for improving flatness of soft and hard combined plate |
| CN106572611A (en) * | 2016-10-21 | 2017-04-19 | 惠州市金百泽电路科技有限公司 | Cover film laminating method with flexible plate at outer layer |
| CN107835589A (en) * | 2017-09-29 | 2018-03-23 | 苏州福莱盈电子有限公司 | A kind of FPC multilayers Rigid Flex diaphragm is counter to paste resistance adhesive process |
| CN107846791A (en) * | 2017-10-30 | 2018-03-27 | 高德（江苏）电子科技有限公司 | Uncapped before a kind of Rigid Flex and protect the production method of soft board |
| CN109640519A (en) * | 2018-12-28 | 2019-04-16 | 深圳市景旺电子股份有限公司 | Rigid-flex combined board and preparation method thereof |
| CN110691479A (en) * | 2019-10-11 | 2020-01-14 | 博敏电子股份有限公司 | Manufacturing method for solving mass production of electromagnetic shielding type rigid-flex printed circuit board |
| CN210351777U (en) * | 2019-08-16 | 2020-04-17 | 昆山迈捷电子材料有限公司 | Protection component and circuit board in circuit board area of uncapping |
| CN112672514A (en) * | 2020-12-30 | 2021-04-16 | 黄石西普电子科技有限公司 | Preparation method of rigid-flexible printed circuit board and rigid-flexible printed circuit board |
-
2022
- 2022-09-21 CN CN202211153857.8A patent/CN115633439A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061122A (en) * | 2016-08-01 | 2016-10-26 | 台山市精诚达电路有限公司 | Processing method for improving flatness of soft and hard combined plate |
| CN106572611A (en) * | 2016-10-21 | 2017-04-19 | 惠州市金百泽电路科技有限公司 | Cover film laminating method with flexible plate at outer layer |
| CN107835589A (en) * | 2017-09-29 | 2018-03-23 | 苏州福莱盈电子有限公司 | A kind of FPC multilayers Rigid Flex diaphragm is counter to paste resistance adhesive process |
| CN107846791A (en) * | 2017-10-30 | 2018-03-27 | 高德（江苏）电子科技有限公司 | Uncapped before a kind of Rigid Flex and protect the production method of soft board |
| CN109640519A (en) * | 2018-12-28 | 2019-04-16 | 深圳市景旺电子股份有限公司 | Rigid-flex combined board and preparation method thereof |
| CN210351777U (en) * | 2019-08-16 | 2020-04-17 | 昆山迈捷电子材料有限公司 | Protection component and circuit board in circuit board area of uncapping |
| CN110691479A (en) * | 2019-10-11 | 2020-01-14 | 博敏电子股份有限公司 | Manufacturing method for solving mass production of electromagnetic shielding type rigid-flex printed circuit board |
| CN112672514A (en) * | 2020-12-30 | 2021-04-16 | 黄石西普电子科技有限公司 | Preparation method of rigid-flexible printed circuit board and rigid-flexible printed circuit board |
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