CN106061122A - Processing method for improving flatness of soft and hard combined plate - Google Patents

Processing method for improving flatness of soft and hard combined plate Download PDF

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Publication number
CN106061122A
CN106061122A CN201610630223.5A CN201610630223A CN106061122A CN 106061122 A CN106061122 A CN 106061122A CN 201610630223 A CN201610630223 A CN 201610630223A CN 106061122 A CN106061122 A CN 106061122A
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CN
China
Prior art keywords
steel plate
film
flatness
plate
processing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610630223.5A
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Chinese (zh)
Inventor
韩秀川
刘振华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TAISHAN JINGCHENGDA CIRCUIT Co Ltd
Original Assignee
TAISHAN JINGCHENGDA CIRCUIT Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TAISHAN JINGCHENGDA CIRCUIT Co Ltd filed Critical TAISHAN JINGCHENGDA CIRCUIT Co Ltd
Priority to CN201610630223.5A priority Critical patent/CN106061122A/en
Publication of CN106061122A publication Critical patent/CN106061122A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0014Shaping of the substrate, e.g. by moulding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Plates And Materials Therefor (AREA)

Abstract

The invention discloses a processing method for improving the flatness of a soft and hard combined plate. The method comprises the following steps of S1) lamination in which a steel plate is placed on a table top, and a piece of brown paper, a PE film, an aluminum sheet, a separating sheet, the soft and hard combined plate, another separating sheet, another aluminum sheet, another PE film, another piece of brown paper and another steel plate are placed on the steel plate successively; and S2) press fit in which the laminated plate of the step S1) is placed in a pressure transmission machine to implement press fit. According to the processing method, the steel plate, brown paper, PE film, aluminum sheet, separating sheet, soft and hard combined plate, separating sheet, aluminum sheet, PE film, brown paper and steel plate are laminated from bottom to top, routine materials are changed, so that during press-fit coating, the flat aluminum sheets can be used for coating, the flatness can be controlled within 30micron, the flatness is improved effectively, and a better shooting effect can be obtained even for a camera of the pixel of 20M.

Description

The processing method improving Rigid Flex flatness
Technical field
The present invention relates to circuit board technology field, particularly relate to a kind of processing method improving Rigid Flex flatness.
Background technology
Now in consumer electronics, photographic head is widely used, and the good rigid-flexible circuit board of flatness can be Camera lens provides the shooting effect of high-resolution, during conventional making Rigid Flex controls flatness, typically uses silica gel to apply type Pressing, or PE film (polyethylene film) apply type carry out pressing, the method is disadvantageous in that flatness precision is the highest, typically may be used Control at about 50um, the photographic head shooting of pixel 8M can be met, and pixel 20M photographic head is shot, the most unable to do what one wishes, clap Take the photograph effect poor.
Summary of the invention
The technical problem to be solved is to provide one and can add enhancing and take the photograph effect, be effectively improved Rigid Flex The processing method of flatness.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is: provides one to improve Rigid Flex and puts down The processing method of whole degree, comprises the steps,
S1, lamination, place a block plate on table top, and steel plate is sequentially placed PE film, aluminium flake, separating sheet, soft or hard combination Plate, separating sheet, aluminium flake, PE film and steel plate;
S2, pressing, put into pressure transmission machine by the plate of step S1 lamination and carry out pressing.
The beneficial effects of the present invention is: the present invention improves the processing method of Rigid Flex flatness, use by down to Upper steel plate, PE film, aluminium flake, separating sheet, Rigid Flex, separating sheet, aluminium flake, PE film and the stacked system of steel plate, change routine Material so that when type is applied in pressing, utilizes smooth aluminium flake to apply type, within flatness can be controlled in 30um, is effectively increased smooth Degree, even for pixel 20M photographic head, it is possible to there is preferable shooting effect.
Accompanying drawing explanation
Fig. 1 is the FB(flow block) of the processing method improving Rigid Flex flatness of the embodiment of the present invention;
Fig. 2 is the STRUCTURE DECOMPOSITION figure of the Rigid Flex laminated construction of the embodiment of the present invention.
Label declaration:
1, Rigid Flex;2, separating sheet;3, aluminium flake;4, PE film;5, kraft paper;6, steel plate.
Detailed description of the invention
By describing the technology contents of the present invention, structural feature in detail, being realized purpose and effect, below in conjunction with embodiment And coordinate accompanying drawing to be explained in detail.
The design of most critical of the present invention is: the method for the present invention, uses steel plate, kraft paper, PE film, aluminum from the bottom to top Sheet, separating sheet, Rigid Flex, separating sheet, aluminium flake, PE film, kraft paper and the stacked system of steel plate, can be effectively improved soft or hard knot The processing method of plywood flatness.
Referring to Fig. 1, the present invention improves the processing method of Rigid Flex flatness,
Comprise the steps,
S1, lamination, place a block plate on table top, and steel plate is sequentially placed PE film, aluminium flake, separating sheet, soft or hard combination Plate, separating sheet, aluminium flake, PE film and steel plate, as shown in Figure 2;
S2, pressing, put into pressure transmission machine by the plate of step S1 lamination and carry out pressing.
Knowable to foregoing description, the beneficial effects of the present invention is: the present invention improves the processing of Rigid Flex flatness Method, uses steel plate PE film, aluminium flake, separating sheet, Rigid Flex, separating sheet, aluminium flake, PE film and the lamination of steel plate from the bottom to top Mode, changes conventional material so that when type is applied in pressing, utilize smooth aluminium flake to apply type, within flatness can be controlled in 30um, have Effect improves flatness, even for pixel 20M photographic head, it is possible to have preferable shooting effect.
Further, kraft paper all it is placed with between described steel plate and described PE film.
Seen from the above description, kraft paper can play the effect of buffering in bonding processes, simultaneously can uniformly transfer heat, make Rigid Flex has more preferable pressing effect.
Refer to Fig. 1 and Fig. 2, embodiments of the invention one are: adding of the raising Rigid Flex flatness of the present embodiment Work method, is used for improving Rigid Flex flatness.It comprises the steps,
S1, lamination, as in figure 2 it is shown, place a block plate 6 on table top, steel plate 6 is sequentially placed kraft paper 5, PE film 4, Aluminium flake 3, separating sheet 2, Rigid Flex 1, separating sheet 2, aluminium flake 3, PE film 4, kraft paper 5 and steel plate 6;
S2, pressing, put into pressure transmission machine by the plate of step S1 lamination and carry out pressing.
In sum, the processing method improving Rigid Flex flatness that the present invention provides, it is effectively increased flatness, Even for pixel 20M photographic head, it is possible to there is preferable shooting effect.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this The equivalents that bright description and accompanying drawing content are made, or directly or indirectly it is used in relevant technical field, the most in like manner include In the scope of patent protection of the present invention.

Claims (2)

1. the processing method improving Rigid Flex flatness, it is characterised in that
Comprise the steps,
S1, lamination, place a block plate on table top, steel plate is sequentially placed PE film, aluminium flake, separating sheet, Rigid Flex, divides From sheet, aluminium flake, PE film and steel plate;
S2, pressing, put into pressure transmission machine by the plate of step S1 lamination and carry out pressing.
The processing method of raising Rigid Flex flatness the most according to claim 1, it is characterised in that described step S1 Further comprising the steps of: between described steel plate and described PE film, to be all placed with kraft paper.
CN201610630223.5A 2016-08-01 2016-08-01 Processing method for improving flatness of soft and hard combined plate Pending CN106061122A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610630223.5A CN106061122A (en) 2016-08-01 2016-08-01 Processing method for improving flatness of soft and hard combined plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610630223.5A CN106061122A (en) 2016-08-01 2016-08-01 Processing method for improving flatness of soft and hard combined plate

Publications (1)

Publication Number Publication Date
CN106061122A true CN106061122A (en) 2016-10-26

Family

ID=57197262

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610630223.5A Pending CN106061122A (en) 2016-08-01 2016-08-01 Processing method for improving flatness of soft and hard combined plate

Country Status (1)

Country Link
CN (1) CN106061122A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107914056A (en) * 2017-11-20 2018-04-17 苏州安洁科技股份有限公司 A kind of welding procedure for improving soldering tip flatness
CN110831338A (en) * 2019-11-28 2020-02-21 南京宏睿普林微波技术股份有限公司 Process method for plugging holes with resin by using press
CN112930037A (en) * 2021-01-29 2021-06-08 深圳市三德冠精密电路科技有限公司 Method for controlling thickness uniformity of medium of rigid-flex board
CN114286542A (en) * 2021-12-06 2022-04-05 龙南骏亚柔性智能科技有限公司 Laminating method of OLED circuit board
CN115633439A (en) * 2022-09-21 2023-01-20 欣强电子(清远)有限公司 Rigid-flex board and laminating method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202918582U (en) * 2012-10-23 2013-05-01 深圳市迅捷兴电路技术有限公司 Rigid-flexible printed circuit board mixed pressing type laminated structure
US20140230998A1 (en) * 2013-02-19 2014-08-21 Seiko Instruments Inc. Pressure-sensitive adhesive label, method of manufacturing pressure-sensitive adhesive label, and label issuing device
CN203994924U (en) * 2014-07-11 2014-12-10 景旺电子科技(龙川)有限公司 A kind of novel PC B iterative structure
CN204031627U (en) * 2014-08-30 2014-12-17 江西景旺精密电路有限公司 A kind of laminater of rigid-flex combined board
CN104470199A (en) * 2014-11-25 2015-03-25 镇江华印电路板有限公司 Rigid-flexible combined board laminar structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202918582U (en) * 2012-10-23 2013-05-01 深圳市迅捷兴电路技术有限公司 Rigid-flexible printed circuit board mixed pressing type laminated structure
US20140230998A1 (en) * 2013-02-19 2014-08-21 Seiko Instruments Inc. Pressure-sensitive adhesive label, method of manufacturing pressure-sensitive adhesive label, and label issuing device
CN203994924U (en) * 2014-07-11 2014-12-10 景旺电子科技(龙川)有限公司 A kind of novel PC B iterative structure
CN204031627U (en) * 2014-08-30 2014-12-17 江西景旺精密电路有限公司 A kind of laminater of rigid-flex combined board
CN104470199A (en) * 2014-11-25 2015-03-25 镇江华印电路板有限公司 Rigid-flexible combined board laminar structure

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107914056A (en) * 2017-11-20 2018-04-17 苏州安洁科技股份有限公司 A kind of welding procedure for improving soldering tip flatness
CN110831338A (en) * 2019-11-28 2020-02-21 南京宏睿普林微波技术股份有限公司 Process method for plugging holes with resin by using press
CN110831338B (en) * 2019-11-28 2020-08-28 南京宏睿普林微波技术股份有限公司 Process method for plugging holes with resin by using press
CN112930037A (en) * 2021-01-29 2021-06-08 深圳市三德冠精密电路科技有限公司 Method for controlling thickness uniformity of medium of rigid-flex board
CN114286542A (en) * 2021-12-06 2022-04-05 龙南骏亚柔性智能科技有限公司 Laminating method of OLED circuit board
CN115633439A (en) * 2022-09-21 2023-01-20 欣强电子(清远)有限公司 Rigid-flex board and laminating method thereof

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Application publication date: 20161026

RJ01 Rejection of invention patent application after publication