CN113977111B - Laser processing method for transparent material micropore with ultra-large depth-diameter ratio - Google Patents
Laser processing method for transparent material micropore with ultra-large depth-diameter ratio Download PDFInfo
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- CN113977111B CN113977111B CN202111249424.8A CN202111249424A CN113977111B CN 113977111 B CN113977111 B CN 113977111B CN 202111249424 A CN202111249424 A CN 202111249424A CN 113977111 B CN113977111 B CN 113977111B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
Abstract
The invention provides a micropore laser processing method for a transparent material with an ultra-large depth-diameter ratio, which mainly solves the problem that the depth-diameter ratio of micropores processed by the existing laser processing mode cannot meet the requirement. According to the method, the femtosecond laser space shaping long-focus-depth light beam moves in a stepping mode along the direction of the optical axis, so that the multi-pulse laser splicing processing of the micropores is carried out, and the processing depth-diameter ratio of the micropores is improved. Meanwhile, the method adopts inversion processing, so that the laser can be continuously focused in the transparent substrate. In addition, the method of the invention arranges the water film layer under the transparent substrate, and adopts capillary action to improve the permeability of the manufactured micropores.
Description
Technical Field
The invention belongs to the field of laser processing, and particularly relates to a micropore laser processing method for a transparent material with an ultra-large depth-diameter ratio.
Background
With the continuous updating of aerospace technology, various micro-holes need to be processed on parts such as blades, oil nozzles and frequency selection surfaces of an aero-engine to meet the increasingly severe requirements. The ultrafast laser processing technology has become a key manufacturing technology in the aerospace field due to its advantages of no thermal effect, no stress, high flexibility, etc.
The femtosecond laser drilling is a non-contact micropore manufacturing method, the method has the advantages of small processing scale, high processing quality and the like, in addition, the depth-diameter ratio of micropore manufacturing can be greatly improved through beam shaping, the depth-diameter ratio of micropores processed on a transparent material can reach several hundred to one, but the requirement of the depth-diameter ratio in related application fields cannot be met.
In order to further improve the depth-diameter ratio of micropore manufacture, Chinese patent CN108747059A discloses a device for preparing high-quality high-depth-diameter ratio micropores by femtosecond laser/space shaping optical fibers, wherein laser in the device is focused by two lenses, the diameters of micropores formed on a sample to be processed are equal, and the two focusing lenses are adjusted to make two independent optical fibers collinear in space and overlapped end to form an extended uniform optical fiber, so that the depth-diameter ratio of the micropores is improved. However, the above processing method still has the following disadvantages: 1) the light energy distribution of the laser light filaments formed by two groups of different light paths is inconsistent, so that the prolonged light filaments are not uniform, and the consistency of micropores is reduced; 2) the light silk formed after light splitting adopts a head-to-tail superposition mode, so that the light path is complex, and the superposition length is limited.
Disclosure of Invention
Aiming at the problem that the depth-diameter ratio of the micropore processed by the existing laser cannot meet the requirement, the invention provides a micropore laser processing method for a transparent material with an ultra-large depth-diameter ratio, which is a method for processing the micropore with the ultra-large depth-diameter ratio of the transparent material based on femtosecond laser space shaping, inverted splicing processing and the like.
In order to achieve the purpose, the invention adopts the following technical scheme:
a micropore laser processing method for a transparent material with an ultra-large depth-diameter ratio comprises the following steps:
step one, setting a femtosecond laser Bessel beam processing system;
the femtosecond laser Bessel beam processing system comprises a femtosecond laser, and a beam expander, a wave plate, a diaphragm and a beam shaping module which are sequentially arranged on an output light path of the femtosecond laser; the beam shaping module comprises a conical lens, a first plano-convex lens and a second plano-convex lens which are arranged in sequence;
secondly, placing the transparent material test piece on a motion platform with XYZ three axes;
moving the motion platform, focusing the Bessel beam formed by the femtosecond laser inside the transparent material test piece, and triggering the femtosecond laser to output a laser pulse to realize the processing of a single micropore in the transparent material test piece;
adjusting the optical spacing between the conical lens and the first plano-convex lens and the optical spacing between the conical lens and the second plano-convex lens, moving the X axis or the Y axis of the moving platform, triggering the femtosecond laser again to output a laser pulse, and processing different positions in the transparent material test piece again to form micropores;
step five, repeating the step four to obtain a plurality of micropores processed by the laser pulse in the transparent material test piece under different optical distances;
measuring the diameter and the depth of the micropore from the side surface of the transparent material test piece to obtain the relation between different optical distances and the processing diameter and depth of the micropore;
placing an optical flat crystal on the motion platform, dripping deionized water or distilled water above the optical flat crystal, and placing the transparent substrate to be processed on the optical flat crystal to form a water film between the optical flat crystal and the transparent substrate, wherein the thickness of the water film is required to be 0.01-0.02 mm;
step eight, according to the relation between the optical spacing obtained in the step six and the processing diameter and depth of the micro-hole, and meanwhile, according to the diameter of the micro-hole to be processed, adjusting the optical spacing of the cone lens, the first plano-convex lens and the second plano-convex lens;
step nine, focusing the laser focus of the Bessel beam of the femtosecond laser on the lower surface of the transparent substrate, triggering the femtosecond laser to output a laser pulse, and realizing single micropore processing;
tenth, according to the relation between the optical spacing obtained in the sixth step and the processing diameter and depth of the micropore, the processing depth of the micropore is obtained according to the diameter of the processed micropore, the laser focus is moved upwards along the Z axis according to the processing depth, the femtosecond laser is triggered again to output a laser pulse, and the micropore processed at this time is connected with the micropore processed in the ninth step;
and step eleven, repeating the step eleven until the depth of the micropores meets the processing requirement.
Furthermore, in the sixth step, the side surface of the transparent material test piece is aligned with an optical microscope, and the diameter and the depth of the micropore are measured from the side surface of the micropore, so that the relation between different optical pitches and the processing diameter and the processing depth of the micropore is obtained.
And further, in the seventh step, a dial indicator is fixed on one side of the beam shaping module, the Z axis of the motion platform is moved, the thickness of the optical flat crystal and the thickness of the transparent substrate are respectively measured by the dial indicator, and the thickness of the water film is obtained through calculation.
Compared with the prior art, the method has the following beneficial effects:
the invention provides a micropore laser processing method for a transparent material with an ultra-large depth-diameter ratio. Meanwhile, the invention adopts the inverted (from the bottom of the substrate to the top) processing, so that the laser can be continuously focused in the transparent substrate. In addition, the water film layer is arranged under the transparent substrate, and the permeability of the manufactured micropores is improved by adopting the capillary action.
Drawings
FIG. 1 is a flow chart of a method for processing a transparent material with a micropore with a super large depth-diameter ratio by using laser;
FIG. 2 is a schematic diagram of the optical path of the femtosecond laser Bessel beam processing system according to the present invention;
FIG. 3 is a schematic structural diagram of a femtosecond laser Bessel beam processing system according to the present invention;
FIG. 4 is a schematic diagram of the arrangement of water films in the method of the present invention.
Reference numerals: the device comprises a 1-femtosecond laser, a 2-beam expander, a 3-wave plate, a 4-diaphragm, a 5-beam shaping module, a 6-reflector, a 7-optical flat crystal, an 8-transparent substrate, a 9-water film, a 10-motion platform, an 11-Bessel beam, a 51-cone lens, a 52-first plano-convex lens and a 53-second plano-convex lens.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention and are not intended to limit the scope of the present invention.
The invention provides a micropore laser processing method for a transparent material with an ultra-large depth-diameter ratio, which moves a femtosecond laser space shaping long-focus deep light beam in a stepping mode along the direction of an optical axis so as to realize the splicing processing of micropores by multi-pulse laser; meanwhile, the water film layer is arranged under the transparent substrate, and micropores are dredged by adopting the capillary action, so that the permeability of the micropores is improved.
As shown in FIG. 1, the method for processing the transparent material by the micropore laser with the ultra-large depth-diameter ratio specifically comprises the following steps:
step one, setting a femtosecond laser Bessel beam processing system;
as shown in fig. 2 and 3, the femtosecond laser bessel beam processing system includes a femtosecond laser 1, and a beam expander 2, a wave plate 3, a diaphragm 4 and a beam shaping module 5 sequentially arranged on an output light path of the femtosecond laser 1; meanwhile, a single or a plurality of reflectors 6 can be arranged between the diaphragm 4 and the beam shaping module 5, so that the position arrangement of each part in the processing system is more reasonable;
the output light beam of the femtosecond laser 1 passes through the beam expander 2, the wave plate 3 and the diaphragm 4 and then enters the light beam shaping module 5, so that the Gaussian light beam of the femtosecond laser 1 is changed into a Bessel light beam 11 with long focal depth; the beam shaping module 5 includes a cone lens 51, a first plano-convex lens 52, and a second plano-convex lens 53, which are sequentially arranged, and an adjustment structure can be adopted to change the optical distance among the three cone lenses 51, the first plano-convex lens 52, and the second plano-convex lens 53, wherein in the adjustment of the optical distance, the position of the cone lens 51 is unchanged, and the position of the first plano-convex lens 52 and the position of the second plano-convex lens 53 are changed, so as to change the beam diameter of the bessel beam, and the adjustment structure can specifically refer to the structure in chinese patent CN 111702346A;
secondly, placing the transparent material test piece on a moving platform 10 with XYZ three axes;
step three, moving the motion platform 10, focusing the Bessel beam formed by the femtosecond laser 1 in the transparent material test piece, namely setting a laser focus in the transparent material test piece, and then triggering the femtosecond laser 1 to output a laser pulse to realize the processing of a single micropore in the transparent material test piece;
step four, adjusting the optical spacing of the conical lens 51, the first plano-convex lens 52 and the second plano-convex lens 53, thereby changing the shape of the laser pulse; then moving the X axis or the Y axis of the motion platform 10, triggering the femtosecond laser 1 again to output a laser pulse, and processing different positions in the transparent material test piece again to form micropores;
in this step, the position of the axicon 51 is not changed, and the first plano-convex lens 52 and the second plano-convex lens 53 are moved, so that the adjustment of the optical distance between the axicon 51 and the first plano-convex lens 52 and the second plano-convex lens 53 is realized;
step five, repeating the step four to obtain a plurality of micropores processed by the laser pulse in the transparent material test piece under different optical distances;
aligning the side surface of the transparent material test piece with an optical microscope, and observing and measuring the diameter and the depth of the micropore from the side surface of the micropore to obtain the relation between different optical intervals and the processing diameter and depth of the micropore;
seventhly, as shown in fig. 4, placing an optical flat crystal 7 on an objective table of the moving platform 10, dripping a few drops of deionized water on the optical flat crystal 7, and placing a transparent substrate 8 to be processed on the optical flat crystal 7 to form a water film 9 between the optical flat crystal 7 and the transparent substrate 8; then, fixing a dial indicator near a laser processing head (namely the light beam shaping module 5), moving a Z axis of the moving platform 10, respectively measuring the thicknesses of the optical flat crystal 7 and the transparent substrate 8 by adopting the dial indicator, and calculating to obtain the thickness of a water film 9, wherein the thickness of the water film 9 is required to be 0.01 mm-0.02 mm;
in the step, distilled water can be used for replacing deionized water, and at the moment, the distilled water must be filtered, so that micron-sized particles cannot exist, otherwise, the processed micropores can be blocked;
the water film 9 is arranged in the step, because the micropores are processed from the bottom end of the transparent substrate 8 in the following step, water can enter the micropores from the bottom end of the substrate due to the capillary action, the water can gradually move upwards along the micropores along with the increase of the length of the micropores, and the inner walls of the micropores are washed in the process of moving upwards, so that the inner walls of the processed micropores are smoother, residues can be taken away along with water flow, and the micropores are prevented from being blocked; at the moment, the thickness of the water film 9 is required to be between 0.01mm and 0.02mm, and when the thickness of the water film 9 is less than 0.01mm, the capability of water entering the micropores in the test is limited, and the water can only enter the micropores with the depth of about 200 microns; when the thickness of the water film 9 is more than 0.02mm, the thickness of the water film 9 is not uniform, and the transparent substrate 8 is difficult to be parallel to the XY horizontal plane, so that the laser focus cannot be aligned accurately, and therefore, the thickness of the water film 9 is required to be 0.01 mm-0.02 mm;
step eight, according to the relation between the different optical distances and the processing diameter and depth of the micro-hole obtained in the step six, and meanwhile, according to the diameter of the micro-hole to be processed, adjusting the optical distances among the conical lens 51, the first plano-convex lens 52 and the second plano-convex lens 53;
step nine, focusing a laser focus at the bottom of the transparent substrate 8, namely focusing the laser focus on the lower surface of the processed transparent substrate 8, triggering the femtosecond laser 1 to output a laser pulse, and realizing the processing of a single micropore;
step ten, according to the relation between the optical spacing obtained in the step six and the processing diameter and depth of the micropore, the processing depth of the micropore is obtained according to the diameter of the processed micropore, according to the processing depth, the laser focus is moved upwards along the Z axis (in the step six, the relation between the diameter of a single micropore and the depth is obtained, the corresponding depth value is obtained according to the diameter of the micropore to be processed, the moving amount of the focus along the Z axis is determined), the femtosecond laser 1 is triggered again to output a laser pulse, and the micropore processed at this time is connected with the micropore processed in the step nine, so that the micropore with the larger depth-diameter ratio is formed; observing the side surface of the transparent substrate 8 by using a microscope, wherein all the processed micropores (head and tail ends) are in the material, namely the Bessel light beam is focused in the transparent substrate 8 during each processing;
and eleventh, repeating the tenth step until the depth of the micropores meets the processing requirement, and forming the micropores with the ultra-large depth-diameter ratio.
As shown in FIG. 4, the method of the present invention first controls the Z-axis to move the laser focus to the bottom of the transparent substrate 8 and triggers a single pulse to process a certain length (L) 0 ) Micropore n 0 Moving up the laser focus L 0 Triggering the laser single pulse again, along the micropore n 0 And processing the micropores with a certain length at the upper end again, and repeating the steps until the micropores are processed at the upper end of the transparent substrate 8.
In this step, when a single micro-hole is processed, since the diameter of the micro-hole to be processed is determined, it is not necessary to adjust the optical distance between the axicon 51 and the first and second plano- convex lenses 52 and 53, and if micro-holes with other diameters are to be processed, the optical distance is adjusted.
For a better understanding of the process, the process is described in detail below with reference to the examples.
Taking the processing of micropores with a diameter of 2 μm and a depth of 2000 μm as an example:
step one, arranging a femtosecond laser Bessel beam processing system, wherein a light path comprises a femtosecond laser 1, a beam expander 2, a wave plate 3, a diaphragm 4, a beam shaping module 5 and the like, and adjusting the optical distance between a cone lens 51 and a first plano-convex lens 52 and a second plano-convex lens 53 to focus a beam with 2 mu m and 500 mu m of focal depth;
| serial number | Distance (mm) between the axicon and the first plano-convex lens | Spacing (mm) between two plano- |
| 1 | 116.8 | 35.7 |
| 2 | 117.2 | 32.5 |
| 3 | 117.7 | 30.8 |
| 4 | 118.1 | 29.3 |
| 5 | 118.6 | 28.2 |
| 6 | 119.2 | 27.4 |
| 7 | 119.8 | 26.6 |
Secondly, placing the transparent material test piece on a moving platform 10 with XYZ three axes;
step three, moving the motion platform 10, focusing the Bessel beam formed by the femtosecond laser 1 in the transparent material test piece, triggering the femtosecond laser 1 to output a laser pulse, and realizing the processing of a single micropore on the transparent material test piece;
step four, adjusting the optical spacing between the conical lens 51 and the first plano-convex lens 52 as well as the optical spacing between the conical lens 53 and the second plano-convex lens 53, moving the X axis or the Y axis of the motion platform 10, triggering the femtosecond laser 1 again to output a laser pulse, and processing the laser pulse again at different positions in the transparent material test piece to form micropores;
step five, repeating the step four to obtain micropores manufactured by the single-pulse laser in the transparent material test piece under different optical intervals;
aligning the side surface of the transparent material test piece with an optical microscope, and observing and measuring the diameter and the depth of the micropore from the side surface of the micropore to obtain the relation between different optical intervals and the processing diameter and depth of the micropore;
the following table shows the relationship between different optical pitches and the processing diameter and depth of the micro-hole
Seventhly, placing the optical flat crystal 7 on an objective table of a Z-axis motion platform 10, dripping a few drops of deionized water on the optical flat crystal 7, and placing a transparent substrate 8 to be processed on the optical flat crystal 7, so that a water film 9 is formed between the optical flat crystal 7 and the transparent substrate 8, wherein the thickness of the water film 9 is required to be 0.015 mm;
step eight, according to the relation between the different optical distances and the processing diameter and depth of the micro-hole obtained in the step six, and meanwhile, according to the diameter of the micro-hole to be processed, adjusting the optical distances among the conical lens 51, the first plano-convex lens 52 and the second plano-convex lens 53;
step nine, focusing a laser focus at the bottom of the transparent substrate 8, triggering the femtosecond laser 1 to output a laser pulse, and realizing single micropore processing;
tenth, according to the relation between the optical spacing obtained in the sixth step and the processing diameter and depth of the micropore, the processing depth of the micropore is 500 microns according to the diameter of the processed micropore, the laser focus is moved up by 500 microns along the Z axis, the femtosecond laser 1 is triggered again to output a laser pulse, and the processed micropore is connected with the micropore processed in the ninth step to form a micropore with a larger depth-diameter ratio;
and step eleven, repeating the step fifteen twice again until the depth of the micropores is 2000 mu m.
By adopting the method, the manufacturing of the micropores with the depth-diameter ratio of more than 1000:1 can be realized on the transparent material.
Claims (3)
1. A micropore laser processing method for a transparent material with an ultra-large depth-diameter ratio is characterized by comprising the following steps:
step one, setting a femtosecond laser Bessel beam processing system;
the femtosecond laser Bessel beam processing system comprises a femtosecond laser, and a beam expander, a wave plate, a diaphragm and a beam shaping module which are sequentially arranged on an output light path of the femtosecond laser; the beam shaping module comprises a conical lens, a first plano-convex lens and a second plano-convex lens which are arranged in sequence;
secondly, placing the transparent material test piece on a motion platform with XYZ three axes;
moving the motion platform, focusing the Bessel beam formed by the femtosecond laser inside the transparent material test piece, and triggering the femtosecond laser to output a laser pulse to realize the processing of a single micropore in the transparent material test piece;
adjusting the optical spacing between the conical lens and the first plano-convex lens and the optical spacing between the conical lens and the second plano-convex lens, moving the X axis or the Y axis of the moving platform, triggering the femtosecond laser again to output a laser pulse, and processing different positions in the transparent material test piece again to form micropores;
step five, repeating the step four to obtain a plurality of micropores processed by the laser pulse in the transparent material test piece under different optical distances;
measuring the diameter and the depth of the micropore from the side surface of the transparent material test piece to obtain the relation between different optical distances and the processing diameter and depth of the micropore;
placing an optical flat crystal on the motion platform, dripping deionized water or distilled water above the optical flat crystal, and placing the transparent substrate to be processed on the optical flat crystal to form a water film between the optical flat crystal and the transparent substrate, wherein the thickness of the water film is required to be 0.01-0.02 mm;
step eight, according to the relation between the optical spacing obtained in the step six and the processing diameter and depth of the micro-hole, and meanwhile, according to the diameter of the micro-hole to be processed, adjusting the optical spacing of the cone lens, the first plano-convex lens and the second plano-convex lens;
step nine, focusing the laser focus of the Bessel beam of the femtosecond laser on the lower surface of the transparent substrate, triggering the femtosecond laser to output a laser pulse, and realizing single micropore processing;
tenth, according to the relation between the optical spacing obtained in the sixth step and the processing diameter and depth of the micropore, the processing depth of the micropore is obtained according to the diameter of the processed micropore, the laser focus is moved upwards along the Z axis according to the processing depth, the femtosecond laser is triggered again to output a laser pulse, and the micropore processed at this time is connected with the micropore processed in the ninth step;
and step eleven, repeating the step eleven until the micropore depth meets the processing requirement.
2. The method for laser processing the transparent material with ultra-large depth-diameter ratio by using the micro-holes as claimed in claim 1, wherein the method comprises the following steps: and step six, aligning the side surface of the transparent material test piece with an optical microscope, and measuring the diameter and the depth of the micropore from the side surface of the micropore so as to obtain the relation between different optical intervals and the processing diameter and the depth of the micropore.
3. The method for processing the transparent material with the ultra-large depth-diameter ratio micropore laser as claimed in claim 1 or 2, wherein the method comprises the following steps: and seventhly, fixing a dial indicator on one side of the beam shaping module, moving the Z axis of the moving platform, measuring the thicknesses of the optical flat crystal and the transparent substrate respectively by adopting the dial indicator, and calculating to obtain the thickness of the water film.
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