CN103100797B - Based on laser assisted microprocessing equipment and the method for adaptive optics - Google Patents
Based on laser assisted microprocessing equipment and the method for adaptive optics Download PDFInfo
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- CN103100797B CN103100797B CN201310024788.5A CN201310024788A CN103100797B CN 103100797 B CN103100797 B CN 103100797B CN 201310024788 A CN201310024788 A CN 201310024788A CN 103100797 B CN103100797 B CN 103100797B
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Abstract
The present invention discloses a kind of laser assisted microprocessing equipment based on adaptive optics and method, it passes through adaptive optical technique, the optical path states of laser process equipment can be adjusted with dynamically adjusting, effectively can solve focus size that laser process equipment adopts flight light path to bring, depth of focus changes, focal position offsets to obtain problem; Meanwhile, the generation Gauss light of adaptive optical technique system, flat-top light, super-Gaussian light isocandela can also be utilized to distribute, and utilize the light distribution obtained to carry out laser cutting, laser boring.Therefore, based on the automatic laser process equipment of adaptive optics, the stability of system, accuracy and practicality can be improved.
Description
Technical field
The present invention relates to field of laser processing, be specifically related to a kind of laser assisted microprocessing equipment based on adaptive optics and method.
Background technology
At present, laser process equipment is widely used in metal, pottery, glass, the laser cutting of printed circuit and laser boring.The workbench of current laser process equipment mainly contains two kinds of frame modes, and one is monoblock type x, y bidimensional platform, and another kind is separate type x, y two-dimensional stage.Along with the development of technology and the demand of application, laser process equipment is also gradually to separate type future development.This is because separate type platform more adapts to the needs of automation and production line balance.But this mode also brings very large challenge to laser optical path, wherein main is the change of the following aspects that flight light path brings: (1) due to the emergent light of current laser instrument be all Gaussian beam, it has certain angle of divergence, when flight light path length changes, in conglomeration mirror light, the angle of divergence is also different, the beam cross section area on condenser lens surface, also along with change, creates impact to the focusing effect of light beam.(2) emergent light of laser instrument is not a desirable light beam, can have certain aberration, and meanwhile, light path system also deposits any aberration, when flight light path position changes, can produce different diffracting effects, have an impact to the focusing of light beam.(3) flight light path is all fixed on a moveable platform, and the flatness of platform in the several direction of x-y, y-z-z-x can have an impact to the incident angle of light beam, thus focal position is changed.Therefore, flight light path can to Laser Focusing focus size, and the depth of focus, focal position all can change, and this will inevitably have a huge impact processing, seriously have impact on the performance of laser cutting particularly laser boring.
In order to solve the problem that flight light path brings, there has been proposed a lot of method, as (1) adopts beam expanding lens to carry out beam path alignment, far-field divergence angle is reduced by increasing the with a tight waist of light beam, but the size of light beam can not infinitely expand, and beam expanding lens also can bring extra system aberration and power attenuation.(2) curvature radius eyeglass (VRM) is adopted, curvature radius dynamically can adjust the characteristic parameter of light beam when optical path length changes, what keep the radius of focus and focus to attempt is stable, but this method can not adjust a light path system error well.(3) the aplanatism system of servomotor Direct driver, it is simple that it has structure, the advantages such as cost is low, easy to adjust, but can not the impact of correcting motor flatness effectively, can only adjust the focal radius of laser equipment and the size of depth of focus.
At present, adaptive optical technique is widely used in astronomical telescope, the fields such as laser beam shaping, US Patent No. Pat.No.8, 198, 564 and US.Pat.No.US2012/0250134 propose the technology utilizing adaptive optical technique to be applied to laser process equipment, dynamically adjust the quality of laser beam, good laser cutting can be obtained, laser boring effect, simultaneously, utilize adaptive optical technique, shaping can also be carried out to laser beam, obtain flat-top light output, be conducive to obtaining good laser boring effect, but this invention adopts double wave front sensor, structure is more complicated, cost is higher, and their mechanical platform employing is monolithic two-dimensional translation stage, can not combine in automation loading and unloading well, be unfavorable for improving Laser Processing efficiency.
Summary of the invention
Technical problem to be solved by this invention is certainly that focus size, the depth of focus that existing laser assisted microprocessing equipment adopts flight light path and brings changes and the problem such as focal position skew, provides a kind of laser assisted microprocessing equipment based on adaptive optics and method.
For solving the problem, the present invention is achieved by the following scheme:
Based on a laser assisted microprocessing equipment for adaptive optics, form primarily of laser instrument, beam expander, the first speculum, distorting lens, the second speculum, vertical support frame, x-axis motor, the 3rd speculum, x-axis platform, spectroscope, the 4th speculum, z-axis motor, z-axis platform, two-dimensional scanning mirrors, scanning objective, horizontal stand, y-axis motor, y-axis platform, the first lens, the second lens, Wavefront sensor and computer;
Speculum, two-dimensional scanning mirrors and scanning objective are positioned on z-axis platform; Z-axis platform, spectroscope, the first lens, the second lens and Wavefront sensor are positioned on x-axis platform; X-axis platform, the 3rd speculum, the second speculum, distorting lens, the first speculum, beam expander and laser instrument are positioned on vertical support frame; Y-axis platform is positioned on horizontal stand;
X-axis motor, z-axis motor are connected with computer with y-axis motor; Z-axis platform is connected with z-axis motor, and z-axis motor drives z-axis platform to move up and down on x-axis platform under control of the computer; X-axis platform is connected with x-axis motor, and x-axis motor drives x-axis platform to move left and right on vertical support frame under control of the computer; Y-axis platform is connected with y-axis motor, and it is movable that y-axis motor drives y-axis platform to do on horizontal stand under control of the computer;
Wavefront sensor is connected computer with distorting lens; The light that laser instrument sends is incided spectroscope carried out light splitting by the first speculum, distorting lens, the second speculum, the 3rd speculum successively after beam expander expands, a part light enters Wavefront sensor through the first lens and the first lens successively, by sending in computer after Wavefront sensor detecting light beam wavefront properties, the light of another part incides two-dimensional scanning mirrors through the 4th speculum, reflexes to scanning objective and focus on y-axis platform by two-dimensional scanning mirrors.
In such scheme, described distorting lens can be discrete distorting lens, continuous deformation mirror, twin voltage distorting lens, MEMS distorting lens, membrane deformable mirror, LCD space light modulator or quick titling mirror one of them.
In such scheme, the target hot spot of emergent light near focal position of described distorting lens is Gauss light, super-Gaussian beam or flat-top light.
In such scheme, described y-axis platform can be the common translation stage of artificial loading, also can be the automation charging equipment of automatic charging.
The laser micro-processing method based on adaptive optics designed according to above-mentioned laser process equipment, comprises the steps:
1. computer reads laser assisted microprocessing file, obtain the path planning needing processing, and issue instructions to x-axis motor, y-axis motor and/or z-axis motor and go to control that x-axis platform moves along x-axis, y-axis platform moves along y-axis and/or z-axis platform moves along z-axis, move with the three-dimensional realizing focal beam spot;
2. before laser assisted microprocessing work, by mobile z-axis motor, z-axis platform is made to be in different positions, Wavefront sensor and distorting lens is utilized to carry out closed-loop control, obtain the target hot spot that light beam focuses on through scanning objective, and distoring mirror shape now and wavefront sensor data are saved as demarcation file in computer;
3. during laser assisted microprocessing work, the wavefront of Wavefront sensor real-time detection light beam, by calculating with the demarcation file in computer, obtain the deflection of distorting lens, controlling distortion mirror adjusts the wavefront of light beam and angle, makes light beam obtain target hot spot at scanning objective near focal point and incide exactly in sample to be processed.
Step 2. and 3. in, also comprise the wavefront of distorting lens to incident beam further and adjust, make emergent light near focal position, obtain the step of flat top beam, super-Gaussian beam or flat-top optical target hot spot.
The demarcation file that the present invention utilizes the dynamic characteristic of Wavefront sensor exploring laser light light path and demarcates in advance, according to target hot spot, the angular deviation of controlling distortion mirror Caliberation Flight light path and wavefront properties, obtain desirable focus characteristics at scanning objective near focal point and focus point is focused on sample exactly, carrying out laser cutting and Laser Processing; By adaptive optical technique, the optical path states of laser process equipment can be adjusted with dynamically adjusting, effectively can solve focus size that laser process equipment adopts flight light path to bring, depth of focus changes, focal position offsets to obtain problem; Meanwhile, the generation Gauss light of adaptive optical technique system, flat-top light, super-Gaussian light isocandela can also be utilized to distribute, and utilize the light distribution obtained to carry out laser cutting, laser boring.Therefore, based on the automatic laser microfabrication equipments of adaptive optics, the stability of system, accuracy and practicality can be improved.
Accompanying drawing explanation
Fig. 1 is a kind of schematic diagram of the laser assisted microprocessing equipment based on adaptive optics.
Detailed description of the invention
A kind of laser assisted microprocessing equipment based on adaptive optics shown in Fig. 1, forms primarily of laser instrument 1, beam expander 2, first speculum 3, distorting lens 4, second speculum 5, vertical support frame 6, x-axis motor 7, the 3rd speculum 8, x-axis platform 9, spectroscope 10, the 4th speculum 11, z-axis motor 12, z-axis platform 13, two-dimensional scanning mirrors 14, scanning objective 15, horizontal stand 16, y-axis motor 17, y-axis platform 18, first lens 19, second lens 20, Wavefront sensor 21 and computer.
In the present embodiment, laser instrument 1 adopts ultraviolet fixed laser, and wavelength is 355nm, and emergent light spot size is 2mm.The light that laser instrument 1 sends is after beam expander 2 expands, and emergent light spot is 10mm.In the present invention, described distorting lens 4 can be discrete distorting lens, continuous deformation mirror, twin voltage distorting lens, MEMS distorting lens, membrane deformable mirror, LCD space light modulator or quick titling mirror one of them.The target hot spot of emergent light near focal position of distorting lens 4 is Gauss light, super-Gaussian beam or flat-top light.In the present embodiment, distorting lens 4 adopts two piezoelectric deforming mirrors of Unit 37, has larger dynamic stroke, is used in and corrects and obtain flat-top light and super-Gaussian light to wavefront.Wavefront sensor 21 adopts traditional Shack-Hartmann wavefront sensor, and sub-aperture number is 127.What two-dimensional scanning mirrors 14 adopted is ScanLab two-dimensional scanning mirrors.Scanning objective 15 adopts F-theta lens, can ensure that focal beam spot vertically arrives sample in a subtle way.What x-axis motor 7, z-axis motor 12 and y-axis motor 17 adopted is HIWIN linear electric motors, and positioning precision and repeatable accuracy are 5um.In the present invention, described y-axis platform 18 can be the common translation stage of artificial loading, also can be the automation charging equipment of automatic charging.In the present embodiment, y-axis platform 18 platform size is the automation charging equipment of 450mm × 450mm.
Speculum 11, two-dimensional scanning mirrors 14 and scanning objective 15 are positioned on z-axis platform 13.Z-axis platform 13, spectroscope 10, first lens 19, second lens 20 and Wavefront sensor 21 are positioned on x-axis platform 9.X-axis platform 9, the 3rd speculum 8, second speculum 5, distorting lens 4, first speculum 3, beam expander 2 and laser instrument 1 are positioned on vertical support frame 6.Y-axis platform 18 is positioned on horizontal stand 16.
X-axis motor 7, z-axis motor 12 are connected with computer with y-axis motor 17.Z-axis platform 13 is connected with z-axis motor 12, and z-axis motor 12 drives z-axis platform 13 to move up and down on x-axis platform 9 under control of the computer.X-axis platform 9 is connected with x-axis motor 7, and x-axis motor 7 drives x-axis platform 9 to move left and right on vertical support frame 6 under control of the computer.Y-axis platform 18 is connected with y-axis motor 17, and y-axis motor 17 drives y-axis platform 18 to do movable on horizontal stand 16 under control of the computer.
Wavefront sensor 21 is connected computer with distorting lens 4.The light that laser instrument 1 sends is incided spectroscope 10 carried out light splitting by the first speculum 3, distorting lens 4, second speculum 5, the 3rd speculum 8 successively after beam expander 2 expands, a part light enters Wavefront sensor 21 through the first lens 19 and the first lens 20 successively, by sending in computer after Wavefront sensor 21 detecting light beam wavefront properties, the light of another part incides two-dimensional scanning mirrors 14 through the 4th speculum 11, reflexes to scanning objective 15 and focus on y-axis platform 18 by two-dimensional scanning mirrors 14.
The laser micro-processing method based on adaptive optics designed according to above-mentioned laser assisted microprocessing equipment, comprises the steps:
1. computer reads Laser Processing file, obtain the path planning needing processing, and issue instructions to x-axis motor 7, y-axis motor 17 and/or z-axis motor 12 and go to control that x-axis platform 9 moves along x-axis, y-axis platform 18 moves along y-axis and/or z-axis platform 13 moves along z-axis, move with the three-dimensional realizing focal beam spot;
2. before laser assisted microprocessing work, by mobile z-axis motor 12, z-axis platform 13 is made to be in different positions, Wavefront sensor 21 and distorting lens 4 is utilized to carry out closed-loop control, obtain the target hot spot that light beam focuses on through scanning objective 15, and distorting lens 4 shapes now and Wavefront sensor 21 data are saved as demarcation file in computer;
3. during laser assisted microprocessing work, the wavefront of Wavefront sensor 21 real-time detection light beam, by calculating with the demarcation file in computer, obtain the deflection of distorting lens 4, wavefront and the angle of controlling distortion mirror 4 pairs of light beams adjust, and make light beam obtain target hot spot at scanning objective near focal point and incide exactly in sample to be processed.
In addition, step 2. and 3. in, the wavefront also comprising distorting lens 4 pairs of incident beams further adjusts, and makes emergent light near focal position, obtain flat top beam, super-Gaussian beam or flat-top optical target hot spot, adapts to the step of the demand of different laser processing.
More than that better enforcement of the present invention is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent variations or replacement under the prerequisite without prejudice to spirit of the present invention, and these equivalent distortion or replacement are all included in the application's claim limited range.
Claims (4)
1., based on the laser assisted microprocessing equipment of adaptive optics, it is characterized in that:
Primarily of laser instrument (1), beam expander (2), first speculum (3), distorting lens (4), second speculum (5), vertical support frame (6), x-axis motor (7), 3rd speculum (8), x-axis platform (9), spectroscope (10), 4th speculum (11), z-axis motor (12), z-axis platform (13), two-dimensional scanning mirrors (14), scanning objective (15), horizontal stand (16), y-axis motor (17), y-axis platform (18), first lens (19), second lens (20), Wavefront sensor (21) and computer composition,
4th speculum (11), two-dimensional scanning mirrors (14) and scanning objective (15) are positioned on z-axis platform (13); Z-axis platform (13), spectroscope (10), the first lens (19), the second lens (20) and Wavefront sensor (21) are positioned on x-axis platform (9); X-axis platform (9), the 3rd speculum (8), the second speculum (5), distorting lens (4), the first speculum (3), beam expander (2) and laser instrument (1) are positioned on vertical support frame (6); Y-axis platform (18) is positioned on horizontal stand (16);
X-axis motor (7), z-axis motor (12) are connected with computer with y-axis motor (17); Z-axis platform (13) is connected with z-axis motor (12), and z-axis motor (12) drives z-axis platform (13) to move up and down on x-axis platform (9) under control of the computer; X-axis platform (9) is connected with x-axis motor (7), and x-axis motor (7) drives x-axis platform (9) to move left and right on vertical support frame (6) under control of the computer; Y-axis platform (18) is connected with y-axis motor (17), and it is movable that y-axis motor (17) drives y-axis platform (18) to do on horizontal stand (16) under control of the computer;
Wavefront sensor (21) is connected computer with distorting lens (4), the light that laser instrument (1) sends after beam expander (2) expands successively by the first speculum (3), distorting lens (4), second speculum (5), 3rd speculum (8) incides spectroscope (10) and carries out light splitting, the light of a part enters Wavefront sensor (21) through the first lens (19) and the first lens (20) successively, by sending in computer after Wavefront sensor (21) detecting light beam wavefront properties, the light of another part incides two-dimensional scanning mirrors (14) through the 4th speculum (11), reflex to scanning objective (15) by two-dimensional scanning mirrors (14) and focus on y-axis platform (18).
2. the laser assisted microprocessing equipment based on adaptive optics according to claim 1, is characterized in that:
Y-axis platform (18) is common translation stage or automation charging equipment.
3., according to claim 1 based on the laser micro-processing method based on adaptive optics of the laser assisted microprocessing equipment of adaptive optics, it is characterized in that comprising the steps:
1. computer reads laser assisted microprocessing file, obtain the path planning needing processing, and issue instructions to x-axis motor (7), y-axis motor (17) and/or z-axis motor (12) go control x-axis platform (9) move along x-axis, y-axis platform (18) moves along y-axis and/or z-axis platform (13) moves along z-axis, move with the three-dimensional realizing focal beam spot;
2. before laser assisted microprocessing work, by mobile z-axis motor (12), z-axis platform (13) is made to be in different positions, Wavefront sensor (21) and distorting lens (4) is utilized to carry out closed-loop control, obtain the target hot spot that light beam focuses on through scanning objective (15), and distorting lens (4) face shape now and Wavefront sensor (21) data are saved as demarcation file in computer;
3. during laser assisted microprocessing work, the wavefront of Wavefront sensor (21) real-time detection light beam, by calculating with the demarcation file in computer, obtain the deflection of distorting lens (4), controlling distortion mirror (4) adjusts the wavefront of light beam and angle, makes light beam obtain target hot spot at scanning objective near focal point and incide exactly in sample to be processed.
4. the laser micro-processing method based on adaptive optics according to claim 3, it is characterized in that step 2. and 3. in, also comprise distorting lens (4) wavefront to incident beam further to adjust, make emergent light near focal position, obtain the step of flat top beam, super-Gaussian beam or flat-top optical target hot spot.
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| CN104858544B (en) * | 2014-02-26 | 2018-09-21 | 恩耐公司 | Laser-stripping method and system for causing laser lift-off in target |
| CN105527796B (en) * | 2014-09-28 | 2018-03-13 | 上海微电子装备（集团）股份有限公司 | Planer-type equipment and control method |
| US10589385B2 (en) * | 2015-01-08 | 2020-03-17 | General Electric Company | Method and system for confined laser drilling |
| US20160199943A1 (en) * | 2015-01-08 | 2016-07-14 | General Electric Company | Method and system for confined laser drilling |
| CN106271122B (en) * | 2015-05-29 | 2019-01-18 | 上海微电子装备（集团）股份有限公司 | A kind of vertical control device and method of laser package equipment |
| KR101825923B1 (en) * | 2015-09-03 | 2018-03-22 | 주식회사 이오테크닉스 | Laser processing apparatus and laser processing method |
| CN109029719B (en) * | 2018-06-25 | 2020-12-25 | 南京理工大学 | Ultraviolet light energy distribution detection system based on shack Hartmann method and detection method thereof |
| CN110996557A (en) * | 2020-01-15 | 2020-04-10 | 深圳市聚永能科技有限公司 | Method and apparatus for laser roughening copper foil surface of printed circuit board |
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