CN102699526A - Method and device for cutting machined object by using laser - Google Patents
Method and device for cutting machined object by using laser Download PDFInfo
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- CN102699526A CN102699526A CN2012101787299A CN201210178729A CN102699526A CN 102699526 A CN102699526 A CN 102699526A CN 2012101787299 A CN2012101787299 A CN 2012101787299A CN 201210178729 A CN201210178729 A CN 201210178729A CN 102699526 A CN102699526 A CN 102699526A
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Abstract
The invention relates to a method for cutting a machined object by using laser, which comprises the following steps of: providing at least two laser beams, wherein the two laser beams comprises a first laser beam and a second laser beam; focusing the first laser beam inside the machined object, and producing an internal stress layer inside the machined object by means of the action of the first laser beam on the machined object; focusing the second laser beam on the surface of the machined object, and producing an surface stress layer on the surface of the machined object by means of the action of the second laser beam on the machined object; and at least partially utilizing the superposition of stresses released by the internal stress layer and the surface stress layer, so that the machined object is at least partially fractured and further segmented. The invention also relates to a device for cutting the machined object by using the method.
Description
Technical field
The present invention relates to a kind of method of utilizing the Laser cutting object.More particularly; The present invention relates to adopt at least two bundle laser; Focus at least two stressor layers of formation on the inside and the top layer of processing object thing respectively, and the supercoated stress that utilizes stressor layers to discharge impels the processing object thing to rupture also and then the laser processing that is separated.The invention still further relates to a kind of device that is used to realize this method.
Background technology
Utilizing laser that the processing object thing is cut is technology common in the field of laser processing.Traditional cut mode is that laser is converged at body surface, and when the material damage threshold was lower than laser power density, object just can produce fusion, gasification, ionization, heavily physics or chemical change such as cover.When the power of used laser was enough big, the processing object thing can break apart along the position that above-mentioned variation takes place, thereby realized the purpose of cutting processing object.The used laser instrument kind of this mode is more, like pulse laser and continuous laser.Cutting can use that maximum laser power reaches kilowatt even the CO of myriawatt level during steel plate
2Laser instrument.
But, when the fineness of processed object is had relatively high expectations, tend to adopt the pulse laser of less power, like nanosecond laser or ultrashort pulse laser.More special is the laser cutting parameter that is applied in the glass-cutting field, and this technology had both been used the CO of higher-wattage
2Continuous wave laser can reach good cutting accuracy again.In its cutting process, laser only plays heat effect to the glass devices as the processing object thing, glass is not produced and destroys.It is actually to be utilized in and cools off fast after the glass devices heating, thereby on glass devices, produces stress, is aided with mechanical external force afterwards again with Stress Release, thereby reaches the purpose of cutting apart glass devices.Yet, for this kind cutting mode, because CO
2The reasons such as pollution that produce when thermal diffusion that the restriction of the focussing property of laser itself (its minimum focal beam spot diameter needs greater than its wavelength), high power cause and cooling; Make this cutting mode can only be applied to the cutting of common large format glass; And can not be applied to the long fine cut that functional areas glass is arranged in surface, for example be the wafer of substrate with glass.
Therefore; The purpose of this invention is to provide a kind of method of utilizing the Laser cutting object; This method should have cutting accuracy height, pollution-free, no fire damage, high, the advantages of wide application range of working (machining) efficiency, thereby overcomes the technological deficiency of the conventional laser cutting method that is used for the glass-cutting device.
The laser cutting method that proposes according to the present invention is to utilize at least two bundles laser action of different nature in the inside and the top layer of processed object, and combines the cooling to the top layer, forms the two or more stressor layers that comprise skin stress layer and internal stress layer.Through the suitably scope and the spacing of control table ply stress layer and internal stress layer; Make the stress in the stressor layers be released to form the stress section; Also can extraly be aided with certain mechanical external force; Thereby cause of the fully fracture of processing object thing, and then reach the purpose of cutting apart machined object along the predetermined cuts path.
Another object of the present invention provides a kind of device of realizing above-mentioned laser cutting method.
Summary of the invention
The present invention proposes a kind of method of utilizing the Laser cutting object, comprising: at least two bundle laser are provided, and wherein this at least two bundles laser comprises first laser beam and second laser beam; First laser beam is focused on the inside of processing object thing, nationality by first laser beam to the inner internal stress layer that produces of acting on of processing object thing; Second laser beam is focused on the surface layer of processing object thing, and nationality produces the skin stress layer by second laser beam to the surface layer that acts on of processing object thing; At least part is utilized the stack of stress of the release of internal stress layer and skin stress layer, and the part fracture is also and then can be separated at least to make the processing object thing.
In technical scheme of the present invention, the top layer of processing object thing can comprise the surface of processing object thing.
According to a kind of specific embodiment, the internal stress layer produces through the photic damage of first laser beam to the processing object thing, and the skin stress layer is to utilize second laser beam that the fuel factor of processing object thing is being heated after cooling produces the top layer of processing object thing.
According to a kind of specific embodiment, first laser beam in the power density of along greater than the minimal threshold value of processing object thing under the first laser beam effect.
According to a kind of specific embodiment, to photic damage of processing object deposits yields and formation stress point, photic damage is selected from fusion, gasification, plasma, variations in refractive index or its combination to first laser beam near along.
According to a kind of specific embodiment, the relative motion between first laser beam and the processing object thing makes and forms a plurality of stress points along a predefined paths, thereby constitutes the internal stress layer.
According to a kind of specific embodiment, a plurality of internal stress layers that the internal stress layer is arranged on comprising roughly along first laser beam incident to the direction of processing object thing.
According to a kind of specific embodiment, a plurality of internal stress layers are to form in order near the direction on the top layer of processing object thing gradually.
According to a kind of specific embodiment, first laser beam belongs to pulse laser, and its pulse width is less than 1ns, and range of pulse repetition frequency is 10kHz-1MHz, and the range of pulse repetition frequency of first laser beam is 1MHz-80MHz more preferably.
According to a kind of specific embodiment, first laser beam has transmittance for the processing object thing, and its transmissivity is greater than 0.
According to a kind of specific embodiment, the processing object thing is for being selected from glass, silicon, quartz or sapphire transparent material.
According to a kind of specific embodiment, second laser beam is continuous laser or pulse laser.
According to a kind of specific embodiment; The wavelength of second laser beam is in the scope of processed object linear absorption; Thereby the processed object of mode that its energy is transmitted with heat absorbs; Cause near the processing object thing skin temperature of focus to rise, but do not make the damage of processing object deposits yields essence.
According to a kind of specific embodiment, second laser beam in the power density of along less than the minimal threshold value of processing object thing under the second laser beam effect.
According to a kind of specific embodiment, use gaseous cooling medium or liquid cooling medium that the top layer of the processing object thing of warp heating is cooled off.
According to a kind of specific embodiment, employed cooling medium is in a normal atmosphere to be depressed, and temperature is between-210 ℃-20 ℃.
According to a kind of specific embodiment, to the heating and cooling on the top layer of processing object thing with produce the internal stress layer and carry out simultaneously.
According to a kind of specific embodiment, wherein only in the internal stress layer that forms near the top layer of processing object thing, carry out heating and cooling to the top layer of processing object thing.
According to a kind of specific embodiment, can after producing the internal stress layer, carry out the heating and cooling on the top layer of processing object thing.
According to a kind of specific embodiment, wherein part is utilized the stack of stress of the release of internal stress layer and skin stress layer at least, makes the processing object thing rupture fully and quilt is separated.
According to a kind of specific embodiment, wherein outside the stack of the stress that internal stress layer and skin stress layer discharge,, make the processing object thing rupture fully and separated through further applying mechanical external force.
The invention still further relates to a kind of device that utilizes the Laser cutting object, comprising:
The first laser portion comprises first lasing light emitter that produces first laser beam, and first laser beam can focus on the inside of processing object thing through a focus lamp or object lens, nationality by first laser beam to the inner internal stress layer that produces of acting on of processing object thing;
The second laser portion; Comprise second lasing light emitter that produces second laser beam; Second laser beam can be located through the top layer (surface that comprises the processing object thing) that focus lamp or object lens focus on the processing object thing, and nationality produces the skin stress layer by second laser beam to the surface layer that acts on of processing object thing;
Imaging portion, it comprises imaging optical path and camera, so that the processing object thing is carried out to picture, confirms to move the datum mark of focus lamp or object lens;
Kinematic system; It comprises mobile focus lamp or the parts of object lens and the parts of mobile processing object thing; The parts that move focus lamp or object lens can move to the precalculated position with focus lamp or object lens; Thereby first laser beam and second laser beam are focused on the inside and the surface layer of processing object thing respectively; The parts that move the processing object thing can make the processing object thing move with respect to focus lamp or object lens along a predefined paths; Thereby produce internal stress layer and skin stress layer in the inside of processing object thing and surface layer respectively, wherein part is utilized the stack of stress of the release of internal stress layer and skin stress layer at least, can make the processing object thing at least part rupture also and then can be separated.
According to a kind of specific embodiment, above-mentioned focus lamp or the numerical aperture of object lens is not less than 0.4.
The device of Laser cutting object that utilizes of the present invention also comprises the cooling device that can discharge cooling medium; Wherein the internal stress layer produces through the photic damage of first laser beam to the processing object thing, and the skin stress layer is to utilize second laser beam that the fuel factor of processing object thing is being heated after the cooling medium that cooling device is discharged produces its cooling the top layer of processing object thing.
Preferably, this cooling medium is in a normal atmosphere to be depressed, and temperature is between-210 ℃-20 ℃.
According to a kind of specific embodiment, cooling device is discharged the direction of cooling medium basically along the axis of focus lamp or object lens, and wherein cooling medium is a gaseous state.
According to a kind of specific embodiment, cooling device is discharged the direction of cooling medium and the axes intersect of focus lamp or object lens, and wherein cooling medium is gaseous state or liquid state.
In the device that utilizes the Laser cutting object of the present invention, first laser beam can be a pulse laser, and its pulse width is less than 1ns, and range of pulse repetition frequency is 10kHz-1MHz, and this range of pulse repetition frequency is 1MHz-80MHz more preferably
In the device that utilizes the Laser cutting object of the present invention, first laser beam has transmittance for the processing object thing, and its transmissivity is greater than 0.
In the device that utilizes the Laser cutting object of the present invention, first laser beam in the power density of along greater than the minimal threshold value of processing object thing under the first laser beam effect.
In the device that utilizes the Laser cutting object of the present invention, second laser beam can be continuous laser or pulse laser.
In the device that utilizes the Laser cutting object of the present invention, second laser beam in the power density of along less than the minimal threshold value of processing object thing under the second laser beam effect.
The device of Laser cutting object that utilizes of the present invention also can comprise the mechanism that the processing object thing is applied mechanical external force; Thereby outside the stack of the stress that internal stress layer and skin stress layer discharge; The mechanical external force that further utilizes this mechanism to apply makes the processing object thing rupture fully and by being separated.
Description of drawings
Below in conjunction with accompanying drawing technical scheme of the present invention is elaborated:
Shown in Figure 1 is the light path and the system schematic of the laser cutting method of embodiment of the present invention.
Fig. 2 a is depicted as and utilizes pulse laser to make the laser beam L1 line focus mirror among Fig. 1 converge at processing object thing inside, forms the process sketch map of internal stress layer.
Fig. 2 b is depicted as and utilizes accurate continuous impulse laser to make the laser beam L1 line focus mirror among Fig. 1 converge at processing object thing inside, forms the process sketch map of internal stress layer.
Shown in Figure 3 for utilizing laser cutting method of the present invention at the inner process sketch map that forms a plurality of internal stress layers of processing object thing.
Fig. 4 a is depicted as the sketch map on the laser beam L2 irradiation processing object thing top layer among Fig. 1.
Fig. 4 b is depicted as the focal beam spot of laser beam L2 on processing object thing surface and distributes.
Sketch map for utilizing cooling medium the top layer of processing object thing to be cooled off shown in Figure 5 with coaxial manner.
Sketch map for utilizing cooling medium the top layer of processing object thing to be cooled off shown in Figure 6 with the paraxonic mode.
Shown in Figure 7 is a skin stress layer and an inner internal stress layer generation Stress Release on the processing object thing, causes the processing object thing sketch map that partly ruptures.
Shown in Figure 8 is skin stress layer and two inner internal stress layer generation Stress Release on the processing object thing, causes the processing object thing sketch map that partly ruptures.
Shown in Figure 9 is skin stress layer and three inner internal stress layer generation Stress Release on the processing object thing, causes the processing object thing sketch map that partly ruptures.
Shown in Figure 10 is the skin stress layer and the internal stress layer generation Stress Release of processing object thing, causes the sketch map that the processing object thing ruptures fully.
Shown in Figure 11 for after the fracture of processing object thing generation part, apply mechanical external force and cause the sketch map that the processing object thing ruptures fully.
Shown in Figure 12 is schematic flow sheet according to laser cutting method of the present invention.
The specific embodiment
Referring now to the accompanying drawing of summary, further explain the specific embodiment of laser cutting method of the present invention.And, in the accompanying drawing of this specification, also diagrammatically show the device for carrying out said of laser cutting method of the present invention.
Fig. 1 shows the light path and the system schematic of the laser cutting method of embodiment of the present invention.The explanation of property is as shown in Figure 1 as an example, and the light path system of embodiment of the present invention laser cutting method totally can be made up of three parts.Wherein first, is got into laser condensing lens 11 through laser mirror 10 reflections, and focuses on the inside of processing object thing 12 behind laser beam expanding lens 3 expanded light beam diameters and collimation by first lasing light emitter, 1 emission laser beam L1.At this moment; Can produce physical property to processing object thing 12 near processing object thing 12 inner laser focuses certain zone destroys; A kind of photic damage or multiple simultaneous photic damages such as fusion, gasification, plasma, variations in refractive index take place, and processing object thing 12 does not receive the influence of laser radiation outside above-mentioned certain zone.Like this, in processing object thing 12, produce STRESS VARIATION inside and outside near the certain zone the focus, thereby formed internal stress point 16.
According to a preferred embodiment of the present invention, laser condensing lens 11 has short focal length.In addition, also available objective lenses as laser condensing lens.Preferably, the numerical aperture NA of focus lamp or object lens>0.4.
Second portion in the light path system of embodiment of the present invention laser cutting method is by second lasing light emitter, 2 emission laser beam L2; Behind laser aligner 4 collimations; Through laser mirror 9 reflections, penetrate laser mirror 10 and get into laser condensing lens 11, and focus on the surface of processing object thing 12.
The third part of light path system is an imaging optical path, its objective is processing object thing 12 is carried out to picture, thereby confirms a datum mark, so that mobile focus lamp or object lens 11 are regulated the focal position of laser beam on processing object thing 12.Preferably, this imaging optical path is the coaxial imaging optical path shown in the accompanying drawing 1.So-called coaxial imaging optical path is meant that the imaging axis of this imaging optical path is coaxial with laser condensing lens 11.Specifically, in this coaxial imaging optical path, utilize a lighting source 5 to send light beam, light beam penetrates laser mirror 9, laser mirror 10 entering laser condensing lens 11 successively through speculum 8 reflections, shines in the surface of processing object thing 12.The reverse entering laser condensing lens 11 of its reverberation penetrates laser mirror 10, laser mirror 9, speculum 8 successively, and by imaging lens 7 focal imagings on CCD camera 6.It should be understood that the present invention also can adopt the imaging system of other type in the field of laser processing.
The device of embodiment of the present invention laser cutting method also can comprise a kinematic system, shown in accompanying drawing 1, this kinematic system comprise have X axle motion platform 13, the three-dimensional motion device of Y axle motion platform 14 and Z axle motion platform 15.Wherein laser condensing lens 11 is connected on the Z axle motion platform 15, can move up and down with moving of Z axle motion platform 15.Processing object thing 12 is arranged on the work stage (not shown) that can be driven by X axle motion platform 13 and Y axle motion platform 14, thereby makes processing object thing 12 to move for focus lamp or object lens 11 along with the mobile phase of X axle motion platform 13 or Y axle motion platform 14.
Like this, utilize the coaxial imaging optical path of light path system, can move up and down Z axle motion platform 15, move up and down, make the upper surface blur-free imaging of processing object thing 12 on CCD camera 6 thereby drive laser condensing lens 11.Z axle moving platform position with this moment is a datum mark, makes Z axle motion platform towards the inner preset distance that moves of processing object thing, makes the focus of laser condensing lens 11 be positioned at the inner precalculated position of processing object thing.If at this moment open first lasing light emitter, 1 shoot laser, can cause photic damage to processing object thing 12 near the certain zone above-mentioned focus, thereby form stress point 16 in the inside of processing object thing 12.Keep Z axle moving platform position motionless this moment, can make X axle motion platform 13 or Y axle motion platform 14 drive processing object thing 12 and move with respect to laser condensing lens 11 along a predetermined cuts path.When moving like this, shoot laser (being laser beam L1) can form internal stress layer 17 in the inside of processing object thing 12, shown in the dash area among Fig. 2 a and Fig. 2 b.Specifically, in Fig. 2 a, when laser beam L1 used pulse laser, its internal stress point (illustrating with stain in the drawings) presented Discrete Distribution, and these discrete stress points have constituted internal stress layer 17; In Fig. 2 b, when laser beam L1 used quasi-continuous lasing, its internal stress point was overlapped, presents the continuous distributed state, and internal stress layer 17 is to form with these overlapping continuously stress points.Should be noted that, in Fig. 2 b, only show internal stress layer 17, the overlapped internal stress point that is the continuous distributed state of concrete drafting.
Referring now to accompanying drawing 3; When driving processing object things 12, X axle motion platform 13 or Y axle motion platform 14 move with respect to laser condensing lens 11 along cutting path; After forming one deck internal stress layer 17; Change Z axle motion platform 15 towards the processing object thing 12 inner preset distances that move, can make laser beam L1 converge at another precalculated position of processing object thing 12 inside.At this moment, the identical cutting path of X axle motion platform 13 or Y axle motion platform 14 edges is moved with respect to laser condensing lens 11 once more, thereby can form new internal stress layer 17.And the like, can be at the processing object thing 12 inner a plurality of internal stress layers 17 that are in diverse location that form.Preferably, above-mentioned a plurality of internal stress layers 17 are to form in order near the direction of the top layer of processing object thing 12 (implication of relevant this term " top layer " hereinafter will be done illustrated in detail and explanation) gradually.Technical scheme to form three internal stress layers among Fig. 3 is an example; The preferred internal stress layer of below that forms earlier among the figure; Form the internal stress layer be positioned at the centre position afterwards, last formation again is positioned at the top that is near the internal stress layer on processing object thing top layer.
Elaborate in the technology of the surface layer formation skin stress layer of processing object thing 12 to utilizing laser cutting method of the present invention and system or device below in conjunction with accompanying drawing 4a and 4b.Wherein Fig. 4 a is depicted as the sketch map on the laser beam L2 irradiation processing object thing top layer among Fig. 1.Fig. 4 b is depicted as the focal beam spot of laser beam L2 on processing object thing surface and distributes.Need to prove that in to the description of technical scheme of the present invention and explanation, term " top layer " refers on the processing object thing very near the material layer as the finished surface place of laser entrance face, but also comprise the finished surface of this processing object thing.In other words, term " top layer " refer on the processing object thing machined surface and next-door neighbour machined surface the position.
According to the preferred embodiments of the invention,, can carry out heat treated to the surface of processing object thing 12 when utilizing laser beam L1 when the inside of processing object thing 12 forms the stressor layers near the top layer.Specifically, laser beam L2 converges at the top layer or the surface of processing object thing 12 through laser condensing lens 11 after laser aligner 4 is regulated.Shown in Fig. 4 a, laser beam L2 focuses on the surface of processing object thing 12, forms focal beam spot 18 (shown in accompanying drawing 4b).Regulate the watt level of laser beam L2; Make the interior power density of focal beam spot scope less than the damage threshold of processing object thing 12 under this kind laser action, thereby make laser beam L2 not produce one or more photic damages such as fusion, gasification, plasma, variations in refractive index processing object thing 12 surfaces and top layer.Like this; Laser energy only is passed to the surface and the top layer of processing object thing 12 with the mode that forms heat; In the focal beam spot scope and outside the scope, form heat distribution, cause near the processing object thing skin temperature of focus to rise, but do not make the damage of processing object deposits yields essence.When processing object thing 12 moves with respect to laser condensing lens 11 along the predetermined cuts path, can form strip heat distribution zone along cutting path.When employed laser beam L2 was pulse laser, focal beam spot 18 was discrete shape, and the speed of service of control work stage and the frequency of laser beam L2 make 18 heating regions of focal beam spot be the continuous distributed state, shown in accompanying drawing 4b.
According to the preferred embodiments of the invention, when in the above described manner the surface of processing object thing 12 or top layer being heated or afterwards, available cryogenic gas or liquid cools off it as cooling medium.Like this, can form skin stress layer 21 (being illustrated in accompanying drawing 7 to the accompanying drawing 9) at the surface layer of processing object thing 12.Further, when the inside of processing object thing 12 only forms a stressor layers, can when forming the internal stress layer, carry out the heating and the cooling on its top layer; When inside forms a plurality of stressor layers, preferably when forming stressor layers, carry out heating and cooling procedure to the top layer near the top layer.Need to prove in addition, for some processing object thing, only it is cooled off and save heating process also can be on its top layer or the surface form stressor layers.
The explanation of property as an example, accompanying drawing 5 are depicted as and utilize 19 pairs of sketch mapes that cool off through the top layer of the processing object thing 12 of heating of coaxial cooling device.So-called coaxial cooling device, the center and the laser condensing lens 11 that refer to the cooling medium tap of cooling device are on the same axis basically.In other words, cooling device discharge cooling medium direction basically along the axis of focus lamp or object lens 11.Need to prove; Coaxial cooling device 19 is inappropriate for and adopts liquid as cooling medium; Its reason is, because the cooling medium tap and the laser condensing lens 11 of coaxial cooling device 19 are in same axis basically, so in liquid cooling medium is imported into the space between laser condensing lens 11 and processing object thing 12 surfaces time; Just be easy to pollute the eyeglass of focus lamp 11, thereby cause the eyeglass damage.Therefore, for coaxial cooling device 19, preferably adopt cryogenic gas as cooling medium.Specifically, can cryogenic gas be imported in the space between laser condensing lens 11 and processing object thing 12 surfaces from the outside, and blow to the surface of processing object thing 12.Simultaneously, processing object thing 12 moves along predetermined cutting path, the strip heat distribution zone on processing object thing 12 surfaces is cooled off fast, and heat is arranged around the outside.Preferably, employed refrigerating gas for example is CO
2Gas, low temperature nitrogen etc., its temperature range is-210 ℃-20 ℃.
Sketch map for utilizing cooling medium that the top layer of processing object thing is cooled off shown in Figure 6 with the paraxonic mode.Different with coaxial cooling device 19, for paraxonic cooling device 20, cooling device is discharged the direction of cooling medium and the axis of focus lamp or object lens 11 intersects, but not coaxial or parallel.As shown in Figure 6; Because when using paraxonic cooling device 20 to cool off; Cooling medium is the side importing from laser condensing lens 11; Therefore cooling medium is not easy to touch the eyeglass of focus lamp 11, for paraxonic cooling device 20, adopts gas or liquid all is feasible as cooling medium.Like this, refrigerating gas or liquid are directed to the surface of processing object thing 12, and processing object thing 12 moves along predetermined cutting path simultaneously, and the surface of processing object thing 12 is cooled off fast, and with the opposite side of heat row to laser condensing lens 11.Preferably, employed refrigerating gas for example is CO
2Gas, low temperature nitrogen etc., its temperature range is-210 ℃-20 ℃.
Stress Release takes place with inner one or more internal stress layers 17 in the skin stress layer 21 that accompanying drawing 7 to accompanying drawing 9 shows on the processing object thing, causes the sketch map that the processing object thing partly ruptures.Wherein in accompanying drawing 7, only has an internal stress layer 17; In accompanying drawing 8, have two internal stress layers 17; In accompanying drawing 9, have three internal stress layers 17.From these accompanying drawings, can be clear that; After the internal stress layer that utilizes above-mentioned laser processing technology on processing object thing 12, to form to form 17 and skin stress layer 21 by internal stress point; When the supercoated stress with internal stress layer 17 and skin stress layer 21 discharges; Can on processing object thing 12, form the stress section, cause processing object thing 12 at least partly to rupture.According to the concrete condition of processing object thing and concrete split requirement; And other processing conditions; The suitably regional extent and the spacing of control table ply stress layer 21 and internal stress layer 17, and the spacing between each internal stress layer 17 with arrange, make the combined stress that in the processing object thing, obtains suitable size and Orientation; When this stress is released, promptly form required stress section.The situation of the stress section that produces under above-mentioned three kinds of different conditions has been shown in accompanying drawing 7 to the accompanying drawing 9.
Figure 10 show from the viewed of processing object thing to the situation of a plurality of stress sections of generation.When the top layer of processing object thing and inner stress were enough big, top layer and inner stress stack release can make the processing object deposits yields rupture fully.This situation usually occurs in the longitudinal fracture degree of depth that skin stress layer and internal stress layer caused more than or equal to three/for the moment of processing object thing thickness.
As a preferred implementation, shown in Figure 11 for after the fracture of processing object thing generation part, apply mechanical external force in addition and cause the sketch map that the processing object thing ruptures fully.Shown in figure 11; The part fracture only takes place like the processing object thing; The processing object thing is not separated fully; At this moment corresponding device thereof capable of using or parts apply a certain size mechanical external force along cutting path, just can make processing object thing generation complete rupture, thereby reach the purpose of division processing object.
Shown in Figure 12 is simple and easy exemplary flow chart according to laser cutting method of the present invention.Specifically, when utilizing laser cutting method of the present invention that the processing object thing is cut, at step S1, the cutting path that at first setting one is scheduled on the processing object thing.This cutting path can be the imaginary path that is positioned on the processing object thing.Then; At step S2; Utilize an imaging optical path that the processing object thing is carried out to picture (preferably to its surface imaging), thereby confirm a datum mark, so that the laser condensing lens in the laser processing device of mobile embodiment of the present invention method is regulated the focal position of laser beam on the processing object thing.Specifically, at step S3, when on the camera of processing object thing at imaging optical path during blur-free imaging, with this moment the driving laser focus lamp Z axle moving platform position as the datum mark that moves laser condensing lens.Like this, at step S4, can laser beam be focused on the inner assigned position of processing object thing according to concrete cutting demand.Next, at step S5, the X axle motion platform of the work stage through driving the processing object thing or the motion of Y axle motion platform make the processing object thing move with respect to laser condensing lens along the predetermined cuts path, thereby in the processing object thing, form the internal stress layer.According to concrete needs, can form a plurality of internal stress layers through regulating laser beam at the inner focal position of processing object thing.Utilizing laser beam when the inside of processing object thing forms the stressor layers near the top layer; Available other beam of laser bundle carries out heat treated to the top layer of processing object thing; And simultaneously or be aided with cooling processing subsequently, thereby form skin stress layer (S6) at the surface layer of processing object thing.In other words, step S5 and step S6 both can carry out simultaneously, also can be after step S5 accomplishes, and began to carry out the technology of step S6 again.After this, at step S7, part is utilized the release of the supercoated stress of internal stress layer and skin stress layer at least, and the part fracture is also and then can be separated at least to make the processing object thing.
Above with reference to accompanying drawing and combine some specific embodiment that the method and system of Laser cutting object or the device of utilizing according to the present invention done detailed description.It should be understood that above-mentioned specific embodiment just is used for preferred implementation of the present invention is described, is not to be used for limiting protection scope of the present invention.For example; Though in the above-described embodiments; Forming the internal stress layer along the predetermined cuts path on the inside of processing object thing and top layer (comprising the surface) is motionless through the focus lamp that keeps the processing laser beam with the skin stress layer, simultaneously along X axle or the moving processing object thing realization of y-axis shift.Yet it is motionless also to exist maintenance processing object thing, through moving the processing laser beam forms internal stress layer and skin stress layer on the processing object thing technical scheme.It will be understood by those skilled in the art that and in the processing object thing, to form and impel its required stressor layers that ruptures so long as make between focus lamp and the processing object thing of processing laser beam and relative motion takes place along the predetermined cuts path.Therefore, other variation that after reading this specification and accompanying drawing, can expect of those skilled in the art all should be within protection scope of the present invention.And concrete protection domain of the present invention should be limited the appended claim of this specification.
Claims (38)
1. method of utilizing the Laser cutting object comprises:
At least two bundle laser are provided, and wherein said at least two bundle laser comprise first laser beam and second laser beam;
First laser beam is focused on the inside of said processing object thing, nationality by first laser beam to the inner internal stress layer that produces of acting on of processing object thing;
Second laser beam is focused on the surface layer of said processing object thing, and nationality produces the skin stress layer by second laser beam to the surface layer that acts on of processing object thing;
At least part is utilized the stack of stress of the release of said internal stress layer and said skin stress layer, makes the part fracture and and then being separated at least of processing object thing.
2. the method for claim 1, the said top layer of wherein said processing object thing comprises the surface of said processing object thing.
3. the method for claim 1; Wherein said internal stress layer produces through the photic damage of said first laser beam to the processing object thing, and said skin stress layer is to utilize said second laser beam that the fuel factor of processing object thing is being heated after cooling produces the top layer of processing object thing.
4. the method for claim 1, wherein said first laser beam in the power density of along greater than the minimal threshold value of processing object thing under the first laser beam effect.
5. to said photic damage of processing object deposits yields and formation stress point, said photic damage is selected from fusion, gasification, plasma, variations in refractive index or its combination near along for method as claimed in claim 3, wherein said first laser beam.
6. method as claimed in claim 5, the relative motion between wherein said first laser beam and the processing object thing make and form a plurality of stress points along a predefined paths, constitute said internal stress layer.
7. a plurality of internal stress layers that method as claimed in claim 6, wherein said internal stress layer are arranged on comprising roughly along said first laser beam incident to the direction of processing object thing.
8. method as claimed in claim 7 is wherein to form said a plurality of internal stress layer near the direction on the top layer of said processing object thing gradually in order.
9. the method for claim 1, wherein said first laser beam belongs to pulse laser, and its pulse width is less than 1ns, and range of pulse repetition frequency is 10kHz-1MHz.
10. method as claimed in claim 9, the range of pulse repetition frequency of wherein said first laser beam are 1MHz-80MHz.
11. the method for claim 1, wherein said first laser beam has transmittance for said processing object thing, and its transmissivity is greater than 0.
12. method as claimed in claim 11, wherein said processing object thing is for being selected from glass, silicon, quartz or sapphire transparent material.
13. the method for claim 1, wherein said second laser beam is continuous laser or pulse laser.
14. method as claimed in claim 13; The wavelength of wherein said second laser beam is in by in the scope of said processing object thing linear absorption; Thereby the processed object of mode that its energy is transmitted with heat absorbs; Cause near the processing object thing skin temperature of focus to rise, but do not make the damage of processing object deposits yields essence.
15. the method for claim 1, wherein said second laser beam in the power density of along less than the minimal threshold value of processing object thing under the second laser beam effect.
16. method as claimed in claim 3 wherein uses gaseous cooling medium or liquid cooling medium that the top layer of the processing object thing of warp heating is cooled off.
Depress 17. method as claimed in claim 16, wherein employed cooling medium are in a normal atmosphere, temperature is between-210 ℃-20 ℃.
18. method as claimed in claim 3, wherein to the heating and cooling on the top layer of said processing object thing with produce the internal stress layer and carry out simultaneously.
19. method as claimed in claim 8 wherein only in the internal stress layer that forms near the top layer of said processing object thing, is carried out the heating and cooling to the top layer of said processing object thing.
20. method as claimed in claim 3 is wherein carried out after producing the internal stress layer the heating and cooling on the top layer of said processing object thing.
21. the method for claim 1, wherein part is utilized the stack of stress of the release of said internal stress layer and said skin stress layer at least, makes the processing object thing rupture fully and is separated.
22. method as claimed in claim 21 wherein outside the stack of the stress that internal stress layer and skin stress layer discharge, further applies mechanical external force, makes the processing object thing rupture fully and is separated.
23. a device that utilizes the Laser cutting object comprises:
The first laser portion comprises first lasing light emitter that produces first laser beam, and said first laser beam can focus on the inside of said processing object thing through a focus lamp or object lens, nationality by first laser beam to the inner internal stress layer that produces of acting on of processing object thing;
The second laser portion; Comprise second lasing light emitter that produces second laser beam; Said second laser beam can focus on the surface layer of said processing object thing through said focus lamp or object lens, and nationality produces the skin stress layer by second laser beam to the surface layer that acts on of processing object thing;
Imaging portion, it comprises imaging optical path and camera, so that the processing object thing is carried out to picture, confirms to move the datum mark of said focus lamp or object lens;
Kinematic system; It comprises parts that move said focus lamp or object lens and/or the parts that move said processing object thing; Said kinematic system can make said focus lamp or object lens and said processing object thing relative to each other move; Thereby can first laser beam and second laser beam be focused on the inside and the surface layer of processing object thing respectively; And can make said processing object thing and said focus lamp or object lens produce relative motion along a predefined paths between the two; Thereby produce internal stress layer and skin stress layer in the inside of processing object thing and surface layer respectively, wherein part is utilized the stack of stress of the release of said internal stress layer and said skin stress layer at least, and the part fracture is also and then can be separated at least to make the processing object thing.
24. device as claimed in claim 23, wherein said focus lamp or the numerical aperture of object lens is not less than 0.4.
25. device as claimed in claim 23; Also comprise the cooling device that to discharge cooling medium; Wherein said internal stress layer produces through the photic damage of said first laser beam to the processing object thing, and said skin stress layer is to utilize said second laser beam that the fuel factor of processing object thing is being heated after the cooling medium that said cooling device is discharged produces its cooling the top layer of processing object thing.
26. the direction that device as claimed in claim 25, wherein said cooling device are discharged cooling medium is basically along the axis of said focus lamp or object lens.
27. device as claimed in claim 25, wherein said cooling device is discharged the direction of cooling medium and the axes intersect of said focus lamp or object lens.
28. device as claimed in claim 26, wherein said cooling medium are gaseous state.
29. device as claimed in claim 27, wherein said cooling medium are gaseous state or liquid state.
30. device as claimed in claim 23, wherein said first laser beam belongs to pulse laser, and its pulse width is less than 1ns, and range of pulse repetition frequency is 10kHz-1MHz.
31. device as claimed in claim 30, the range of pulse repetition frequency of wherein said first laser beam are 1MHz-80MHz.
32. method as claimed in claim 23, wherein said first laser beam has transmittance for said processing object thing, and its transmissivity is greater than 0.
33. device as claimed in claim 23, the said top layer of wherein said processing object thing comprises the surface of said processing object thing.
34. device as claimed in claim 23, wherein said first laser beam in the power density of along greater than the minimal threshold value of processing object thing under the first laser beam effect.
35. device as claimed in claim 23, wherein said second laser beam is continuous laser or pulse laser.
36. device as claimed in claim 23, wherein said second laser beam in the power density of along less than the minimal threshold value of processing object thing under the second laser beam effect.
37. method as claimed in claim 25, wherein cooling medium is in a normal atmosphere and depresses, and temperature is between-210 ℃-20 ℃.
38. method as claimed in claim 23; Also comprise the mechanism that said processing object thing is applied mechanical external force; Thereby outside the stack of the stress that internal stress layer and skin stress layer discharge; The mechanical external force that further utilizes this mechanism to apply makes the processing object thing rupture fully and by being separated.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN2012101787299A CN102699526A (en) | 2012-06-01 | 2012-06-01 | Method and device for cutting machined object by using laser |
| TW101131609A TW201350246A (en) | 2012-06-01 | 2012-08-30 | Method for cutting workpiece by layer and apparatus by same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012101787299A CN102699526A (en) | 2012-06-01 | 2012-06-01 | Method and device for cutting machined object by using laser |
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| CN102699526A true CN102699526A (en) | 2012-10-03 |
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| CN2012101787299A Pending CN102699526A (en) | 2012-06-01 | 2012-06-01 | Method and device for cutting machined object by using laser |
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Address after: 215021 No. 77 Middle Road, Suzhou Industrial Park, Suzhou, Jiangsu, China Applicant after: Suzhou Delphi Laser Co., Ltd. Address before: 215021 No. 77 Middle Road, Suzhou Industrial Park, Suzhou, Jiangsu, China Applicant before: Suzhou Delphi Laser Co., Ltd. |
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Application publication date: 20121003 |