CN204565419U - A kind of processing unit (plant) realizing cone of nulls degree and back taper boring - Google Patents
A kind of processing unit (plant) realizing cone of nulls degree and back taper boring Download PDFInfo
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- CN204565419U CN204565419U CN201520051375.0U CN201520051375U CN204565419U CN 204565419 U CN204565419 U CN 204565419U CN 201520051375 U CN201520051375 U CN 201520051375U CN 204565419 U CN204565419 U CN 204565419U
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Abstract
Realize a processing unit (plant) for cone of nulls degree and back taper boring, comprise successively along laser direction of illumination circuit: a dynamic adjustable lens; One plane mirror or a galvanometer, a condenser lens; One first wedge-shaped optical glass substrate; One second wedge-shaped optical glass substrate; Wherein, laser acts on workpiece to be added by described dynamic adjustable lens, condenser lens, the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate successively, and, the first described wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate controlled rotation device, thus change laser irradiation circuit, thus realize Drilling operation.Wherein, dynamic zoom can be realized by dynamic adjustable lens means, guarantee light not out of focus when surface deflections, motion.Processing unit (plant) of the present utility model, modular structure is simple, can with conventional laser process, be easy to make, cost is low, and optical path adjusting becomes easy.The processing of cone of nulls degree and back taper boring can be realized fast.
Description
Technical field
The utility model relates to laser processing device technical field, particularly relates to a kind of processing unit (plant) realizing cone of nulls degree and back taper boring.
Background technology
The general principle of Laser Processing is exactly by Laser Focusing at material surface, makes the interaction of laser and material, the mechanism of the Gaussian Profile of laser beam and laser and object interaction, forms positive taper laser drill after laser and material effects on object.
In prior art, use Gaussian beam processing, realize cone of nulls degree or back taper groove processing, laser beam wants oblique incidence to sample surfaces.Have the way that two kinds basic: one is inclination sample, another is oblique laser light beam.Inclination sample can bring very large inconvenience to processing.Therefore the side of oblique laser light beam sends out and is widely adopted.There are two kinds of method of operating at present to realize the inclination of laser beam:
Method 1: use completely reflecting mirror, by rotating speculum, change laser and speculum angle change the angle that laser beam incides sample nominal value surface.
Method 2: use prism, changes the angle of incident sample by the angle changing laser entrance prism.
Process technology based on these two kinds of principles has grown up and commercialization forms special optics module.But these two kinds of methods have its weak point.First, price is high, because special optics module is difficult to the laser-processing system of routine integrated, must be used alone.Its two, system complex, uses multiple optics, reach the requirement of processing, need two cover to diaxon piezo-galvanometer or Gavo-galvanometer.Its three, regulate difficulty large, because the position of this special optical module is before lens, therefore any deviation can cause the deviation that goes out in focus.
Utility model content
The purpose of this utility model is to provide a kind of laser processing device realizing cone of nulls degree and back taper groove, for solving the integrated inconvenience of cone of nulls degree laser processing device in prior art, the problem of process complexity.
For achieving the above object, the technical scheme that the utility model proposes is:
A kind of processing unit (plant) realizing cone of nulls degree and back taper boring of the present utility model, comprises successively along laser direction of illumination circuit: the dynamic adjustable lens of a controlled working process dynamics zoom; One condenser lens; One first wedge-shaped optical glass substrate; One second wedge-shaped optical glass substrate; Wherein, laser acts on workpiece to be added by described dynamic adjustable lens, condenser lens, the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate successively, and, the first described wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate controlled rotation device, thus change laser irradiation circuit, thus realize Drilling operation.
Wherein, a laser reflection device is also provided with between described dynamic adjustable lens and condenser lens.
Wherein, described laser reflection device is a plane mirror.
Wherein, described laser reflection device is made up of the first galvanometer and the second galvanometer.
Wherein, the first described wedge-shaped optical glass substrate and the thickness of the second wedge-shaped optical glass substrate are 1 millimeter to 10 millimeters.
Wherein, in process, lens in dynamic adjustable lens means are made to move forward and backward the focus regulating laser at sample surfaces.
Preferably, described tumbler is a galvanometer motor.
Meanwhile, in process, dynamically adjustable lens devices by changing the angle of divergence of laser beam, thus to guarantee in laser processing procedure not out of focus.
Compared with prior art, this utility model solves the weak point of existing special optics module, is embodied in:
Because this optics module is placed on the rear of condenser lens, can be integrated with the laser-processing system of routine, improve applicability, thus greatly reduce equipment preparation cost.Use the wedge-shaped optical sheet glass that two millimeter magnitudes are thick, do not occupy large space, the short operating distance especially allowed when using short focal length lens.Because this wedge-shaped optical module is placed on the rear of condenser lens, therefore the adjustment of the light path of this wedge-shaped optical module can not affect the light path before condenser lens, and optics regulates and becomes is relatively easy.This wedge-shaped optical eyeglass can be placed on galvanometer motor and regulate to realize quick incident angle.Two wedge-shaped optical eyeglasses are coordinated with each other can reach required machining shape and tapering.
Accompanying drawing explanation
Fig. 1 is the first embodiment structure chart that the utility model can realize the processing unit (plant) of cone of nulls degree and back taper boring;
Fig. 2 is the structural representation that the utility model can realize the wedge-shaped optical glass substrate connection of rotating device of the processing unit (plant) of cone of nulls degree and back taper boring;
Fig. 3 is the structural representation that the utility model can realize the second embodiment of the processing unit (plant) of cone of nulls degree and back taper boring;
Fig. 4 is the cone of nulls degree structure chart that the utility model can realize the processing unit (plant) of cone of nulls degree and back taper boring;
Fig. 5 is the back taper groove structure figure that the utility model can realize the processing unit (plant) of cone of nulls degree and back taper boring.
Detailed description of the invention
Below with reference to accompanying drawing, elaboration is further given to the utility model.
Refer to Fig. 1 to accompanying drawing 5, a kind of processing unit (plant) realizing cone of nulls degree and back taper boring of the utility model, has a laser beam emitting device, comprises successively along laser direction of illumination circuit: a dynamic adjustable lens 1; One condenser lens 3; One first wedge-shaped optical glass substrate 41; One second wedge-shaped optical glass substrate 42; Wherein, laser acts on workpiece to be added by described dynamic adjustable lens 1, condenser lens 3, first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 successively, and, the first described wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 controlled rotation device, thus change laser irradiation circuit, thus realize Drilling operation.
Refer to accompanying drawing 1, accompanying drawing 1 is the structural representation of the first embodiment, as seen from the figure, this processing unit (plant) that can realize cone of nulls degree and back taper boring comprises: a laser beam emitting device, be provided with successively from the circuit going out laser beam that this laser beam emitting device is launched: dynamic adjustable lens 1, one plane mirror 2, this plane mirror 2 is wherein a kind of structure of laser reflection device.Laser beam after described plane mirror 2 reflects changes straight line exit direction, laser beam after bending enters the condenser lens 3 being located at described plane mirror 2 rear, the rear of described condenser lens 3 is provided with one first wedge-shaped optical glass substrate 41, the side of described first wedge-shaped optical glass substrate 41 is connected to a tumbler by a connection piece, by described tumbler drive described first wedge-shaped optical glass substrate 41 in X-Z plane around Z axis high-speed rotation, by the wedge structure of described first wedge-shaped optical glass substrate 41, laser beam is reflected, thus dynamically change the engraving position of laser beam.Simultaneously, the dead astern of the first described wedge-shaped optical glass substrate 41 is also provided with one second wedge-shaped optical glass substrate 42, and, the side of the second described wedge-shaped optical glass substrate 42 is also connected with a tumbler, by the drive of this tumbler, the second wedge-shaped optical glass substrate 42 is rotated, changed the advance circuit of laser beam by wedge structure, thus change the position of laser beam engraving.Laser beam is along with the motion of wedge-shaped optical glass substrate 41,41 device, thus achieve again the hole (comprising the hole of zero draft and back draught) workpiece to be added processing arbitrary taper, one workpiece 5 to be added is positioned at the rear of described second wedge-shaped optical glass substrate 42, by regulating the rotation of the first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 simultaneously, realize the processing of the boring 50 on workpiece 5 to be added.Wherein, described dynamic adjustable lens 1, for regulating focus, guarantee laser beam not out of focus when the surface deflections of sample.The first described wedge-shaped optical glass substrate and the thickness of the second wedge-shaped optical glass substrate are 1 millimeter to 10 millimeters.Preferably, described wedge-shaped optical glass substrate tumbler is a galvanometer motor.
Refer to accompanying drawing 2, it is the first wedge-shaped optical glass substrate 41 and the last structural representation being connected with a tumbler 411 and 421 of the second wedge-shaped optical glass substrate 42, and wherein a kind of laser beam when described first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42, the anterior approach line chart of light beam.From accompanying drawing, the first described wedge-shaped optical glass substrate 41 rotates along in X-Z plane around Z axis under the drive of tumbler, and the second wedge-shaped optical glass substrate 42 rotates along Y-Z plane around Z axis under the drive of tumbler, described X-Y-Z reference axis is cartesian coordinate axes, and wherein said tumbler 411 is mutually vertical in 90 degree with the straight line at the rotating shaft place of tumbler 421.
Refer to accompanying drawing 3, it is a kind of structural representation realizing another embodiment of the processing unit (plant) of cone of nulls degree and back taper boring of the present utility model.The difference of itself and the first embodiment is, described laser reflection device (namely plane mirror 2) is in a first embodiment made up of a galvanometer device, comprise the first galvanometer 21 and the second galvanometer 22, wherein, the first described galvanometer rotates around Z axis in X-Y plane, rotate around X-axis in the second described galvanometer Y-Z plane, in other words, the turning cylinder of the first galvanometer 21 is mutually vertical with the turning cylinder of the second galvanometer 22.Wherein, described workpiece to be added 5 is positioned on a board 6, and described board 6 can move along X-Y axle.Other structure divisions are identical with the first embodiment, again do not repeated.
Refer to accompanying drawing 4, it is the processing method of the realized cone of nulls degree of employing first embodiment and the processing unit (plant) of back taper boring, and it comprises the steps:
The first step, irradiates circuit by dynamic adjustable lens 1, plane mirror 2, condenser lens 3, first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 according to laser and fixedly mounts successively, and be positioned on board 6 by workpiece 5 to be added;
Second step, is positioned over the front of the second wedge-shaped optical glass substrate 42 by workpiece 5 to be added, and under working position is placed in laser beam;
3rd step, opens tumbler, and the first wedge-shaped optical glass substrate 41 rotates along in X-Z face around Z axis, and the second wedge-shaped optical glass substrate 42 rotates along in Y-Z face around Z axis, and board 6 moves along X-Y direction, until machine.
Meanwhile, in process, dynamically adjustable lens devices by changing the angle of divergence of laser beam, thus to guarantee in laser processing procedure not out of focus.
Refer to accompanying drawing 5, another kind can realize the method for the processing of cone of nulls degree and back taper boring, and it comprises the steps:
The first step, by dynamic adjustable lens 1, first galvanometer 21, second galvanometer 22, focuses on 3, and the first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 irradiate circuit according to laser and fixedly mount successively;
Second step, is positioned over workpiece to be added on the board 6 in the front of the second wedge-shaped optical glass substrate 42, and under working position is placed in laser beam;
3rd step, start described dynamic adjustable lens 1, first galvanometer 21, second galvanometer 22, first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 and board 6 and make it rotate, 5 carry out scanning until machine to machined part.
Meanwhile, in process, lens in dynamic adjustable lens means are made to move forward and backward the focus regulating laser at sample surfaces.
Wherein, in above-mentioned second method, the 3rd step, board 6 not with described dynamic adjustable lens 1, first galvanometer 21, second galvanometer 22, first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 synchronous axial system, can realize equally processing.
Use above-mentioned a set of module or method can reach the requirement controlling tapering and realize the controlled difform boring of tapering, as circular hole, square hole, different in nature hole etc.
Foregoing; be only preferred embodiment of the present utility model; not for limiting embodiment of the present utility model; those of ordinary skill in the art are according to central scope of the present utility model and spirit; can carry out corresponding flexible or amendment very easily, therefore protection domain of the present utility model should be as the criterion with the protection domain required by claims.
Claims (6)
1. can realize a processing unit (plant) for cone of nulls degree and back taper boring, it is characterized in that, comprise successively along laser direction of illumination circuit: a dynamic adjustable lens realizing the dynamic zoom of process; One condenser lens; One first wedge-shaped optical glass substrate; One second wedge-shaped optical glass substrate; Wherein, laser acts on workpiece to be added by described dynamic adjustable lens, condenser lens, the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate successively, and, the first described wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate are controlled by tumbler, thus change laser irradiation circuit, realize Drilling operation.
2. can realize the processing unit (plant) of cone of nulls degree and back taper boring as claimed in claim 1, it is characterized in that, between described dynamic adjustable lens and condenser lens, be also provided with a laser reflection device.
3. can realize the processing unit (plant) of cone of nulls degree and back taper boring as claimed in claim 2, it is characterized in that, described laser reflection device is a plane mirror.
4. can realize the processing unit (plant) of cone of nulls degree and back taper boring as claimed in claim 2, it is characterized in that, described laser reflection device is made up of the first galvanometer and the second galvanometer.
5. can realize the processing unit (plant) of cone of nulls degree and back taper boring as claimed in claim 1, it is characterized in that, the first described wedge-shaped optical glass substrate and the thickness of the second wedge-shaped optical glass substrate are 1 millimeter to 10 millimeters.
6. can realize the processing unit (plant) of cone of nulls degree and back taper boring as claimed in claim 1, it is characterized in that, the tumbler of described wedge-shaped optical glass substrate is a galvanometer motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520051375.0U CN204565419U (en) | 2015-01-23 | 2015-01-23 | A kind of processing unit (plant) realizing cone of nulls degree and back taper boring |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520051375.0U CN204565419U (en) | 2015-01-23 | 2015-01-23 | A kind of processing unit (plant) realizing cone of nulls degree and back taper boring |
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| CN204565419U true CN204565419U (en) | 2015-08-19 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104690423A (en) * | 2015-01-23 | 2015-06-10 | 深圳英诺激光科技有限公司 | Machining device and method capable of realizing zero taper and reverse taper drilling |
| CN109396666A (en) * | 2018-12-21 | 2019-03-01 | 广东正业科技股份有限公司 | A kind of laser hole drilling system and its method |
| WO2020244200A1 (en) * | 2019-06-04 | 2020-12-10 | 西安中科微精光子制造科技有限公司 | Light beam scanning system and laser processing device |
| WO2021036270A1 (en) * | 2019-08-30 | 2021-03-04 | 温州大学 | Femtosecond laser-machining hole drilling device having controllable taper, and hole drilling process thereof |
-
2015
- 2015-01-23 CN CN201520051375.0U patent/CN204565419U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104690423A (en) * | 2015-01-23 | 2015-06-10 | 深圳英诺激光科技有限公司 | Machining device and method capable of realizing zero taper and reverse taper drilling |
| CN104690423B (en) * | 2015-01-23 | 2016-08-24 | 深圳英诺激光科技有限公司 | A kind of realize cone of nulls degree and back taper boring processing unit (plant) and method |
| CN109396666A (en) * | 2018-12-21 | 2019-03-01 | 广东正业科技股份有限公司 | A kind of laser hole drilling system and its method |
| WO2020244200A1 (en) * | 2019-06-04 | 2020-12-10 | 西安中科微精光子制造科技有限公司 | Light beam scanning system and laser processing device |
| WO2021036270A1 (en) * | 2019-08-30 | 2021-03-04 | 温州大学 | Femtosecond laser-machining hole drilling device having controllable taper, and hole drilling process thereof |
| US11865643B2 (en) | 2019-08-30 | 2024-01-09 | Lyncwell Innovation Intelligent System (zhejiang) Co., Ltd. | Drilling device with controllable femtosecond laser processing taper and drilling process thereof |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Shenzhen, Nanshan District science and Technology Park, North District, Long Hill Road, No. two, No. 8, Qing Guang photoelectric building, the Office (305) Patentee after: Innovo laser Polytron Technologies Inc Patentee after: Inno Machining Co., Ltd. Address before: 518000 Shenzhen, Nanshan District science and Technology Park, North District, Long Hill Road, No. two, No. 8, Qing Guang photoelectric building, the Office (305) Patentee before: Shenzhen Inno Laser Technology Co., Ltd. Patentee before: Inno Machining Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder |