CN203292701U - Coaxial laser machining mechanism - Google Patents
Coaxial laser machining mechanism Download PDFInfo
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- CN203292701U CN203292701U CN2013201580382U CN201320158038U CN203292701U CN 203292701 U CN203292701 U CN 203292701U CN 2013201580382 U CN2013201580382 U CN 2013201580382U CN 201320158038 U CN201320158038 U CN 201320158038U CN 203292701 U CN203292701 U CN 203292701U
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Abstract
The utility model provides a coaxial laser machining mechanism which comprises a laser device, a galvanometer system and a CCD collecting system. The galvanometer system is used for reflecting laser emitted by the laser device, and the CCD collecting system is used for positioning a machining position. A first light-transmitting reflection lens is arranged in the galvanometer system, the laser emitted by the laser device is reflected by the light-transmitting reflection lens, and a machining light beam is formed and focuses on a workpiece to be machined. The CCD collecting system collects image information of the workpiece to be machined through the light-transmitting reflection lens, and the optical axis of the machining light beam and the optical axis, receiving the collected image information, of the CCD collecting system are coaxial. In the process of actual machining, the CCD collecting system can work with the galvanometer system simultaneously, alternate moving is not needed any more, and the problems that in the prior art, machining time is long and machining precision is not high are solved.
Description
Technical field
The utility model relates to the laser application, is specifically related to a kind of coaxial laser processing mechanism.
Background technology
Laser processing technology be the characteristic of utilizing laser beam and matter interaction to material (comprising metal and nonmetal) bore out, welding, surface treatment, punching, little processing and as light source, a special kind of skill of recognition object etc.It is luminous that laser machine generally drives laser tube by Laser Power Devices, refraction by several reflective mirrors, make light transmission arrive laser head, by the focus lamp of installing on laser head, light is converged and becomes a bit again, and this point can reach very high temperature, thereby, with material moment removal or incision, reach to bore and open or cut purpose.
Existing laser-processing system comprises for the galvanometer system of reflector laser and is used for the ccd image acquisition system of identification Working position, wherein galvanometer system need to be with the to be processed position of Laser Focusing to workpiece, the ccd image acquisition system also needs to gather the image information of position to be processed on workpiece, Working position for confirmation and machined parameters simultaneously.Present laser-processing system is to adopt the mode of rotation contraposition to process and monitor the collection image information described galvanometer system and ccd image acquisition system, such as: motor first drives the ccd image acquisition system and carries out IMAQ to preposition, after collection was completed, the ccd image acquisition system was removed; By motor, galvanometer system is driven into preposition cutting again.The mode of this rotation contraposition is due to the exchange process of location, so lose time; And, owing to can having error in the displacement process,, so also increased mismachining tolerance, increased difficulty for the raising machining accuracy.
The utility model content
The utility model proposes a kind of coaxial laser organisation of working, solved the slow and not high problem of machining accuracy process time that in the prior art, galvanometer system and ccd image acquisition system rotation contraposition cause.
The technical solution of the utility model is achieved in that
A kind of coaxial laser organisation of working, this coaxial laser organisation of working comprise laser instrument, for reflecting described laser instrument, send the galvanometer system of laser, and are used for the CCD acquisition system of location Working position; Be provided with a transparency mirror sheet in described galvanometer system, the laser that described laser instrument sends after described transparency mirror sheet reflection, forms machining beams, focuses on workpiece to be processed; Described CCD acquisition system sees through described transparency mirror sheet and gathers the image information of described workpiece to be processed, and the light shaft coaxle of the optical axis of described machining beams and described CCD acquisition system reception collection image information.In actual process, described CCD acquisition system can be worked simultaneously with galvanometer system, and no longer needs rotation to move.
Preferably, described galvanometer system comprises the first speculum and described transparency mirror sheet, the laser that described laser instrument sends after described the first mirror reflects, the described transparency mirror sheet of directive; After described transparency mirror sheet reflection, form machining beams, the laser that described laser instrument sends is parallel with described machining beams.
Preferably, described the first speculum and transparency mirror sheet are separately positioned on the first carriage and the second carriage, so that fixing and mobile each eyeglass.
Preferably, described the first speculum and transparency mirror sheet capable of regulating reflection angle, with shape and the size that adapts to workpiece.
Preferably, described CCD acquisition system comprises CCD camera lens and the 3rd speculum, the image information of described the 3rd described workpiece to be processed of mirror reflects, and described CCD camera lens gathers the image information of the workpiece to be processed of described the 3rd mirror reflects.Further,, described the 3rd speculum is arranged on the 3rd carriage.
Preferably, described CCD acquisition system is arranged on displacement platform; Described displacement platform can be in motion in one dimension platform, two-dimension moving platform or three-dimensional motion platform.
Coaxial laser organisation of working of the present utility model has following beneficial effect:
1, CCD camera lens and machining beams are worked simultaneously, have saved process time;
2, eliminate delay and displacement and the kinematic error of signal transmission, improved the yield of machining accuracy and product.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, below will the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of the utility model coaxial laser organisation of working preferred embodiment.
The specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making under the creative work prerequisite the every other embodiment that obtains, and all belong to the scope of the utility model protection.
Coaxial laser organisation of working of the present utility model as shown in Figure 1, this coaxial laser organisation of working comprises laser instrument 100, the laser that is used for the emission firm power, also comprise the galvanometer system of the laser that sends for reflection laser 100, and be used for the CCD acquisition system of location Working position.Also be provided with a transparency mirror sheet in galvanometer system of the present utility model, i.e. the second speculum 120 in Fig. 1; The laser that laser instrument 100 sends after the reflection of transparency mirror sheet, forms machining beams 190, focuses on workpiece to be processed; Described CCD acquisition system sees through this transparency mirror sheet and gathers the image information of workpiece to be processed, so this transparency mirror sheet, namely the second speculum 120 in Fig. 1 not only can reflector laser but also can throw light; The optical axis of the machining beams 190 in the utility model and CCD acquisition system receive the light shaft coaxle that gathers image information 200.
In this preferred embodiment, described galvanometer system comprises the first speculum 110 and the second speculum 120, and described transparency mirror sheet is illustrated the second speculum 120.The laser that laser instrument 100 sends is after the first speculum 110 reflections, and directive the second speculum 120, after the second speculum 120 reflections, form machining beams 190 again.Machining beams 190 focuses on workpiece to be processed, is used for cutting or boring etc.The laser parallel that the machining beams 190 of the laser that laser instrument 100 sends after two secondary reflections and laser instrument 100 send.
CCD is the abbreviation of charge coupled device (Charge Couple Device), and the subject reflection ray, propagate into camera lens, and to the CCD chip, CCD gathers corresponding electric charge according to the power of light through lens focus,, through periodic discharge, produces expression one width width picture.In this preferred embodiment, the CCD acquisition system comprises the image information of CCD camera lens 170 and the 3rd speculum 130, the three speculum 130 reflection workpieces to be processed, the image information 200 of CCD camera lens 170 gathers again from the 3rd speculum 130 workpiece to be processed.The information that the parameter of laser instrument 100 Emission Lasers and CCD camera lens 170 gather is controlled and is processed by control module 180.
Certainly, also can comprise more speculum in galvanometer system in the utility model, and be not limited to the first speculum 110 and the second speculum 120 in preferred embodiment, as long as can reach the optical axis coincidence of the optical axis that makes machining beams 190 and the image information 200 that gathers workpiece to be processed.Simultaneously, the CCD camera lens 170 in the CCD acquisition system also can directly receive the image information 200 of workpiece to be processed, and does not adopt the 3rd speculum 130, also can reach coaxial effect.In actual process, can adopt the structure in this preferred embodiment, also can adopt more lens to reach the purpose that gathers image information.
As shown in Figure 1, the first speculum 110 and the second speculum 120 are separately positioned on the first carriage 140 and the second carriage 150, and the 3rd speculum 130 is arranged on the 3rd carriage 160.Simultaneously, the first speculum 110 and the second speculum 120 can be adjusted reflection angle by the first carriage 140 and the second carriage 150.
Described CCD acquisition system can be arranged on displacement platform, to adjust collection position.So scope of structure capable of regulating of the present utility model and expansion of laser light processing.Described displacement platform can be in motion in one dimension platform, two-dimension moving platform or three-dimensional motion platform, also can according to circumstances be set to rotating platform.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (8)
1. a coaxial laser organisation of working, is characterized in that, this coaxial laser organisation of working comprises laser instrument, for reflecting described laser instrument, sends the galvanometer system of laser, and be used for the CCD acquisition system of location Working position; Be provided with a transparency mirror sheet in described galvanometer system, the laser that described laser instrument sends after described transparency mirror sheet reflection, forms machining beams, focuses on workpiece to be processed; Described CCD acquisition system sees through described transparency mirror sheet and gathers the image information of described workpiece to be processed, and the light shaft coaxle of the optical axis of described machining beams and described CCD acquisition system reception collection image information.
2. coaxial laser organisation of working as claimed in claim 1, it is characterized in that, described galvanometer system comprises the first speculum and described transparency mirror sheet, the laser that described laser instrument sends after described the first mirror reflects, the described transparency mirror sheet of directive; After described transparency mirror sheet reflection, form machining beams, the laser that described laser instrument sends is parallel with described machining beams.
3. coaxial laser organisation of working as claimed in claim 2, is characterized in that, described the first speculum and transparency mirror sheet are separately positioned on the first carriage and the second carriage.
4. coaxial laser organisation of working as claimed in claim 3, is characterized in that, described the first speculum and transparency mirror sheet capable of regulating reflection angle.
5. coaxial laser organisation of working as claimed in claim 1, it is characterized in that, described CCD acquisition system comprises CCD camera lens and the 3rd speculum, the image information of described the 3rd described workpiece to be processed of mirror reflects, described CCD camera lens gathers the image information of the workpiece to be processed of described the 3rd mirror reflects.
6. coaxial laser organisation of working as claimed in claim 5, is characterized in that, described the 3rd speculum is arranged on the 3rd carriage.
7. coaxial laser organisation of working as claimed in claim 1, is characterized in that, described CCD acquisition system is arranged on displacement platform.
8. coaxial laser organisation of working as claimed in claim 7, is characterized in that, described displacement platform is in motion in one dimension platform, two-dimension moving platform or three-dimensional motion platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201580382U CN203292701U (en) | 2013-04-01 | 2013-04-01 | Coaxial laser machining mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201580382U CN203292701U (en) | 2013-04-01 | 2013-04-01 | Coaxial laser machining mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203292701U true CN203292701U (en) | 2013-11-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013201580382U Expired - Fee Related CN203292701U (en) | 2013-04-01 | 2013-04-01 | Coaxial laser machining mechanism |
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| CN (1) | CN203292701U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103170733A (en) * | 2013-04-01 | 2013-06-26 | 深圳市木森科技有限公司 | Coaxial laser processing mechanism |
| CN108311793A (en) * | 2018-03-19 | 2018-07-24 | 深圳市前景自动化科技有限公司 | A kind of coaxial vision positioning laser scribing processing head |
| CN108941885A (en) * | 2017-05-26 | 2018-12-07 | 株式会社迪思科 | Laser processing device and laser processing |
-
2013
- 2013-04-01 CN CN2013201580382U patent/CN203292701U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103170733A (en) * | 2013-04-01 | 2013-06-26 | 深圳市木森科技有限公司 | Coaxial laser processing mechanism |
| CN108941885A (en) * | 2017-05-26 | 2018-12-07 | 株式会社迪思科 | Laser processing device and laser processing |
| CN108941885B (en) * | 2017-05-26 | 2021-10-01 | 株式会社迪思科 | Laser processing apparatus and laser processing method |
| CN108311793A (en) * | 2018-03-19 | 2018-07-24 | 深圳市前景自动化科技有限公司 | A kind of coaxial vision positioning laser scribing processing head |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131120 Termination date: 20200401 |
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| CF01 | Termination of patent right due to non-payment of annual fee |