CN204735850U - Controllable high quality drilling processing equipment of tapering - Google Patents

Controllable high quality drilling processing equipment of tapering Download PDF

Info

Publication number
CN204735850U
CN204735850U CN201520295473.9U CN201520295473U CN204735850U CN 204735850 U CN204735850 U CN 204735850U CN 201520295473 U CN201520295473 U CN 201520295473U CN 204735850 U CN204735850 U CN 204735850U
Authority
CN
China
Prior art keywords
optical glass
wedge
glass substrate
shaped optical
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
CN201520295473.9U
Other languages
Chinese (zh)
Inventor
赵晓杰
张�杰
马明鸿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN INNO LASER TECHNOLOGY Co Ltd
Original Assignee
SHENZHEN INNO LASER TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN INNO LASER TECHNOLOGY Co Ltd filed Critical SHENZHEN INNO LASER TECHNOLOGY Co Ltd
Priority to CN201520295473.9U priority Critical patent/CN204735850U/en
Application granted granted Critical
Publication of CN204735850U publication Critical patent/CN204735850U/en
Withdrawn - After Issue legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model provides a controllable high quality drilling processing equipment of tapering which characterized in that includes along laser irradiation orientation circuit in proper order: a light beam revolves rotary die group, a focusing lens, a first wedge optical glass base plate and a second wedge optical glass base plate, rotating device, rotating device connect in first wedge optical glass base plate and second wedge optical glass base plate, wherein, laser loops through the light beam revolve that rotary die group, focusing lens, first wedge optical glass base plate and second wedge optical glass base plate focus on laser beam and the dynamic scan after act on and treat the machined part to, first wedge optical glass base plate and second wedge optical glass base plate are controlled rotating device rotates to change the laser irradiation circuit. The utility model discloses a processingequipment, module simple structure can be integrated with conventional laser beam machining, and easily the preparation is with low costs, and the light path is adjusted and is become easy. Can realize the high quality processing of cone of nulls degree and back taper drilling fast.

Description

The high-quality Drilling operation equipment that a kind of tapering is controlled
Technical field
The utility model relates to laser processing device technical field, particularly relates to the high-quality Drilling operation equipment that a kind of tapering is controlled.
Background technology
The general principle of Laser Processing is exactly by Laser Focusing at material surface, makes the interaction of laser and material, the mechanism of the Gaussian Profile of laser beam and laser and object interaction, forms positive taper laser drill after laser and material effects on object.
In prior art, use Gaussian beam processing, realize cone of nulls degree or back taper groove processing, laser beam wants oblique incidence to sample surfaces.Have the way that two kinds basic: one is inclination sample, another is oblique laser light beam.Inclination sample can bring very large inconvenience to processing.Therefore the side of oblique laser light beam sends out and is widely adopted.The method of this kind of problem of current solution has its weak point.First, price is high, because special optics module is difficult to the laser-processing system of routine integrated, must be used alone.Its two, system complex, uses multiple optics, reach the requirement of processing, need two cover to diaxon piezo-galvanometer or Gavo-galvanometer.Its three, regulate difficulty large, because the position of this special optical module is before lens, therefore any deviation can cause the deviation that goes out in focus.
Utility model content
The purpose of this utility model is to provide a kind of laser processing device realizing cone of nulls degree and back taper groove, for solving the integrated inconvenience of cone of nulls degree laser processing device in prior art, the problem of process complexity.Meanwhile, realized rotation or the revolution of light beam by a Beam rotation module, to obtain higher laser drilled via quality and drilling efficiency.
For achieving the above object, the technical scheme that the utility model proposes is:
The high-quality Drilling operation equipment that a kind of tapering of the present utility model is controlled, is characterized in that, comprise successively along laser direction of illumination circuit: a Beam rotation module; One condenser lens; One first wedge-shaped optical glass substrate and one second wedge-shaped optical glass substrate, tumbler, described tumbler is connected to described first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate; Wherein, laser to be focused on laser beam by described Beam rotation module, condenser lens, the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate successively and acts on workpiece to be added after dynamic scan, and, first wedge-shaped optical glass substrate and the controlled described tumbler of the second wedge-shaped optical glass substrate rotate, and irradiate circuit to change laser.
Wherein, described Beam rotation module rotation or along one central shaft revolution.
Wherein, between described Beam rotation module and condenser lens, be also provided with a laser reflection device, to change laser beam irradiation angle.
Wherein, described laser reflection device is a plane mirror.
Wherein, described laser reflection device is made up of the first galvanometer and the second galvanometer.
Wherein, the first described wedge-shaped optical glass substrate and the thickness of the second wedge-shaped optical glass substrate are 1 to 10 millimeter.
Wherein, the tumbler of described wedge-shaped optical glass substrate is a galvanometer motor.
Compared with prior art, this utility model solves the weak point of existing special optics module, is embodied in:
Because wedge-shaped optical module is placed on the rear of condenser lens, can be integrated with the laser-processing system of routine, improve applicability, thus greatly reduce equipment preparation cost.Use the wedge-shaped optical sheet glass that two millimeter magnitudes are thick, do not occupy large space, the short operating distance especially allowed when using short focal length lens.Because this wedge-shaped optical module is placed on the rear of condenser lens, therefore the adjustment of the light path of this wedge-shaped optical module can not affect the light path before condenser lens, and optics regulates and becomes is relatively easy.This wedge-shaped optical eyeglass can be placed on galvanometer motor and regulate to realize quick incident angle.Two wedge-shaped optical eyeglasses are coordinated with each other can reach required machining shape and tapering.In addition, adopt Beam rotation die set can realize the rotation of light beam in process, solve the impact of light beam polarization direction on laser drilled via quality, and bore path can be changed by light beam revolution, accelerate drilling efficiency, improve drilling quality.In addition, add at needs micropore (micron dimension) and can only adopt Beam rotation to realize processing man-hour, do not need platform or galvanometer motion, improve drilling quality.
Accompanying drawing explanation
Fig. 1 is the first embodiment structure chart of the controlled high-quality Drilling operation equipment of the utility model tapering;
Fig. 2 is the structural representation of the wedge-shaped optical glass substrate connection of rotating device of the controlled high-quality Drilling operation equipment of the utility model tapering;
Fig. 3 is the structural representation of the second embodiment of the controlled high-quality Drilling operation equipment of the utility model tapering;
Fig. 4 is the cone of nulls degree structure chart of the controlled high-quality Drilling operation equipment of the utility model tapering;
Fig. 5 is the back taper groove structure figure of the controlled high-quality Drilling operation equipment of the utility model tapering;
Fig. 6 is the optics rotating module part-structure schematic diagram of the controlled high-quality Drilling operation equipment of the utility model tapering.
Detailed description of the invention
Below with reference to accompanying drawing, elaboration is further given to the utility model.
Refer to Fig. 1 to accompanying drawing 5, the high-quality Drilling operation equipment that a kind of tapering of the utility model is controlled, have a laser beam emitting device, comprise successively along laser direction of illumination circuit: a Beam rotation module 1; One condenser lens 3; One first wedge-shaped optical glass substrate 41; One second wedge-shaped optical glass substrate 42; Wherein, laser acts on workpiece to be added by described Beam rotation module 1, condenser lens 3, first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 successively, and, the first described wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 controlled rotation device, thus change laser irradiation circuit, thus realize Drilling operation.
Wherein, described Beam rotation module adopts rotation or revolves round the sun around a center.Being connected with a motor apparatus at described Beam rotation module drives it to rotate, and beam rotator can regulate radius of turn, namely can realize light beam rotation or rotate with a given radius.Thus minimizing laser causes because of polarization the problem that drilling quality is not high, meanwhile, can be realized the change of Drilling operation route, to obtain more efficient Drilling operation by light beam revolution.And when boring micropore (micron dimension), directly boring can be realized by the revolution of light beam, without the need to designing machining path, without the need to platform and galvanometer motion, such that laser drill efficiency is higher, quality is higher.Refer to accompanying drawing 1, accompanying drawing 1 is the structural representation of the first embodiment, as seen from the figure, the controlled high-quality Drilling operation equipment of this tapering comprises: a laser beam emitting device, be provided with successively from the circuit going out laser beam that this laser beam emitting device is launched: dynamic adjustable lens 1, one plane mirror 2, this plane mirror 2 is wherein a kind of structure of laser reflection device.Laser beam after described plane mirror 2 reflects changes straight line exit direction, laser beam after bending enters the condenser lens 3 being located at described plane mirror 2 rear, the rear of described condenser lens 3 is provided with one first wedge-shaped optical glass substrate 41, the side of described first wedge-shaped optical glass substrate 41 is connected to a tumbler by a connection piece, by described tumbler drive described first wedge-shaped optical glass substrate 41 in X-Z plane around Z axis high-speed rotation, by the wedge structure of described first wedge-shaped optical glass substrate 41, laser beam is reflected, thus dynamically change the engraving position of laser beam.Simultaneously, the dead astern of the first described wedge-shaped optical glass substrate 41 is also provided with one second wedge-shaped optical glass substrate 42, and, the side of the second described wedge-shaped optical glass substrate 42 is also connected with a tumbler, by the drive of this tumbler, the second wedge-shaped optical glass substrate 42 is rotated, changed the advance circuit of laser beam by wedge structure, thus change the position of laser beam engraving.Laser beam along with the motion of wedge-shaped optical glass substrate 41,41 device, thus achieves hole workpiece to be added processing arbitrary taper again, comprises the hole of zero draft and back draught.One workpiece 5 to be added is positioned at the rear of described second wedge-shaped optical glass substrate 42, by regulating the rotation of the first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 simultaneously, realizes the processing of the boring 50 on workpiece 5 to be added.Wherein, described Beam rotation module 1, for rotary laser light beam, can realize rotation and the revolution of light beam, guarantee the quality of focal beam spot, thus obtains higher drilling quality.Meanwhile, the change of Drilling operation route can be realized by light beam revolution, to obtain more efficient Drilling operation.And when boring micropore (micron dimension), directly boring can be realized by the revolution of light beam, without the need to designing machining path, more efficiently, quality is higher.The first described wedge-shaped optical glass substrate and the thickness of the second wedge-shaped optical glass substrate are 1 millimeter to 10 millimeters.Preferably, described wedge-shaped optical glass substrate and the tumbler of Beam rotation module are a galvanometer motor.Described light velocity rotating module is by a motor driving.
Refer to accompanying drawing 2, it is the first wedge-shaped optical glass substrate 41 and the last structural representation being connected with a tumbler 411 and 421 of the second wedge-shaped optical glass substrate 42, and wherein a kind of laser beam when described first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42.From accompanying drawing, the first described wedge-shaped optical glass substrate 41 rotates along in X-Z plane around Z axis under the drive of tumbler, and the second wedge-shaped optical glass substrate 42 rotates along Y-Z plane around Z axis under the drive of tumbler, described X-Y-Z reference axis is cartesian coordinate axes, and wherein said tumbler 411 is mutually vertical in 90 degree with the straight line at the rotating shaft place of tumbler 421.
Refer to accompanying drawing 3, it is the structural representation of another embodiment of the controlled high-quality Drilling operation equipment of a kind of tapering of the present utility model.The difference of itself and the first embodiment is, described laser reflection device, i.e. plane mirror 2 in a first embodiment, be made up of a galvanometer device, comprise the first galvanometer 21 and the second galvanometer 22, wherein, the first described galvanometer rotates around Z axis in X-Y plane, rotate around X-axis in the second described galvanometer Y-Z plane, in other words, the turning cylinder of the first galvanometer 21 is mutually vertical with the turning cylinder of the second galvanometer 22.Wherein, described workpiece to be added 5 is positioned on a board 6, and described board 6 can move along X-Y axle.Other structure divisions are identical with the first embodiment, again do not repeated.
Refer to accompanying drawing 4, it is the processing method of the controlled high-quality Drilling operation equipment of the tapering of employing first embodiment, and it comprises the steps:
The first step, aims at laser beam by the machining position of workpiece to be added, opens outside laser aid Emission Lasers;
Second step, Beam rotation module, the first wedge-shaped optical glass substrate, the second wedge-shaped optical glass substrate and board described in synchronous averaging; Wherein, Beam rotation module rotates, and the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate rotate along orthogonal axle respectively, and board is along flat transverse and vertically move, and scans on workpiece to be added to make laser.That is, the first wedge-shaped optical glass substrate 41 rotates along in X-Z face around Z axis, and the second wedge-shaped optical glass substrate 42 rotates along in Y-Z face around Z axis, and board 6 moves along X-Y direction, until machine.
Meanwhile, in process, dynamically adjustable lens devices realizes the rotation of light beam by rotation or revolution, improves beam quality.To ensure to obtain higher drilling quality, avoid the polarization direction of laser own on the impact of Drilling operation.Meanwhile, the change of Drilling operation route can be realized by light beam revolution, to obtain more efficient Drilling operation.And when boring micropore (micron dimension), directly boring can be realized by the revolution of light beam, without the need to designing machining path, more efficiently, quality is higher.
Refer to accompanying drawing 5, the method for the high-quality Drilling operation that another kind of tapering is controlled, it comprises the steps:
The first step, aims at laser beam by the machining position of workpiece to be added, opens outside laser aid Emission Lasers;
Second step, Beam rotation module, the first wedge-shaped optical glass substrate, the second wedge-shaped optical glass substrate and board described in synchronous averaging; Wherein, Beam rotation module rotates, and the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate rotate along orthogonal axle respectively, and board is along flat transverse and vertically move, and scans on workpiece to be added to make laser.Described Beam rotation module 1 starts to rotate, and start the first galvanometer 21, second galvanometer 22, first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 and board 6 and make it rotate, 5 carry out scanning until machine to machined part.
Meanwhile, in process, dynamically adjustable lens devices realizes the rotation of light beam by rotation or revolution, improves beam quality.To ensure to obtain higher drilling quality, avoid the polarization direction of laser own on the impact of Drilling operation.
Wherein, in above-mentioned second method, the 3rd step, board 6 not with described Beam rotation module 1, first galvanometer 21, second galvanometer 22, first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 synchronous axial system, can realize equally processing.
Use above-mentioned a set of module or method can reach the requirement controlling tapering and realize the controlled difform boring of tapering, as circular hole, square hole, different in nature hole etc.
Refer to accompanying drawing 6, it is the composition structural representation of optics rotating module 1, and this optics rotating module 1 comprises: optical mirror slip 11, conveyer belt 12 and motor 13, wherein, optical mirror slip 11 is in cylindric, its sidewall is set with conveyer belt 12, under the drive of motor 13, rotates with conveyer belt 12 transmission.
Foregoing; be only preferred embodiment of the present utility model; not for limiting embodiment of the present utility model; those of ordinary skill in the art are according to central scope of the present utility model and spirit; can carry out corresponding flexible or amendment very easily, therefore protection domain of the present utility model should be as the criterion with the protection domain required by claims.

Claims (7)

1. the high-quality Drilling operation equipment that tapering is controlled, is characterized in that, comprises successively along laser direction of illumination circuit: a Beam rotation module; One condenser lens; One first wedge-shaped optical glass substrate and one second wedge-shaped optical glass substrate, tumbler, described tumbler is connected to described first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate; Wherein, laser to be focused on laser beam by described Beam rotation module, condenser lens, the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate successively and acts on workpiece to be added after dynamic scan, and, first wedge-shaped optical glass substrate and the controlled described tumbler of the second wedge-shaped optical glass substrate rotate, and irradiate circuit to change laser.
2. the high-quality Drilling operation equipment that tapering as claimed in claim 1 is controlled, is characterized in that, described Beam rotation module can rotation or along a central shaft revolution.
3. the high-quality Drilling operation equipment that tapering as claimed in claim 1 is controlled, is characterized in that, be also provided with a laser reflection device between described Beam rotation module and condenser lens, to change laser beam irradiation angle.
4. the high-quality Drilling operation equipment that tapering as claimed in claim 3 is controlled, it is characterized in that, described laser reflection device is a plane mirror.
5. the high-quality Drilling operation equipment that tapering as claimed in claim 3 is controlled, it is characterized in that, described laser reflection device is made up of the first galvanometer and the second galvanometer.
6. the high-quality Drilling operation equipment that tapering as claimed in claim 1 is controlled, it is characterized in that, the first described wedge-shaped optical glass substrate and the thickness of the second wedge-shaped optical glass substrate are 1 to 10 millimeter.
7. the high-quality Drilling operation equipment that tapering as claimed in claim 1 is controlled, it is characterized in that, the tumbler of described wedge-shaped optical glass substrate is a galvanometer motor.
CN201520295473.9U 2015-05-08 2015-05-08 Controllable high quality drilling processing equipment of tapering Withdrawn - After Issue CN204735850U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520295473.9U CN204735850U (en) 2015-05-08 2015-05-08 Controllable high quality drilling processing equipment of tapering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520295473.9U CN204735850U (en) 2015-05-08 2015-05-08 Controllable high quality drilling processing equipment of tapering

Publications (1)

Publication Number Publication Date
CN204735850U true CN204735850U (en) 2015-11-04

Family

ID=54417609

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520295473.9U Withdrawn - After Issue CN204735850U (en) 2015-05-08 2015-05-08 Controllable high quality drilling processing equipment of tapering

Country Status (1)

Country Link
CN (1) CN204735850U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105033470A (en) * 2015-05-08 2015-11-11 深圳英诺激光科技有限公司 High-quality conicity-controllable drilling machining device and method
CN105598593A (en) * 2016-02-29 2016-05-25 深圳英诺激光科技有限公司 Laser processing system and method used for hard and brittle material drilling
CN107175415A (en) * 2017-07-12 2017-09-19 裴向东 A kind of laser enhancing device and arc welding system
CN114769845A (en) * 2022-04-20 2022-07-22 华东师范大学 Laser rotary cutting drill device based on burst mode and drilling method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105033470A (en) * 2015-05-08 2015-11-11 深圳英诺激光科技有限公司 High-quality conicity-controllable drilling machining device and method
CN105598593A (en) * 2016-02-29 2016-05-25 深圳英诺激光科技有限公司 Laser processing system and method used for hard and brittle material drilling
CN105598593B (en) * 2016-02-29 2018-05-22 英诺激光科技股份有限公司 For the laser-processing system and method for hard brittle material drilling
CN107175415A (en) * 2017-07-12 2017-09-19 裴向东 A kind of laser enhancing device and arc welding system
CN114769845A (en) * 2022-04-20 2022-07-22 华东师范大学 Laser rotary cutting drill device based on burst mode and drilling method

Similar Documents

Publication Publication Date Title
CN105033470A (en) High-quality conicity-controllable drilling machining device and method
CN204735850U (en) Controllable high quality drilling processing equipment of tapering
CN103203541B (en) Laser machining device
CN103203552B (en) A kind of large format micropore high speed drilling system
WO2022022067A1 (en) Laser processing device capable of controlling light beam incident angle, and laser processing method
CN102773605B (en) A kind of rotary light beam module group laser motion tracking control system
CN204353654U (en) The laser aid of cone of nulls degree and back taper groove processing can be realized
CN103056519A (en) Taper-controllable laser micropore machining light beam scanning device and control method thereof
CN101856772A (en) Light beam-rotating galvanometer-scanning focused processing system
CN102950385A (en) System and method for processing micro conical bore by rotation of laser beam
US20190275609A1 (en) Laser Machining Systems and Methods
CN204565419U (en) A kind of processing unit (plant) realizing cone of nulls degree and back taper boring
CN106271118B (en) A kind of device and method improving multiple aperture micropore laser processing quality
CN112008239A (en) Spiral scanning laser processing device and processing method
CN104690423B (en) A kind of realize cone of nulls degree and back taper boring processing unit (plant) and method
CN110133842B (en) Galvanometer scanning device and system
KR102621458B1 (en) Laser processing device, laser processing system, rotator unit device, laser processing method and production method of probe card
CN204248222U (en) A kind of three axle dynamic focusing laser mark printing devices
KR20170025997A (en) Laser processing apparatus and laser processing method using the laser processing apparatus
KR20220032862A (en) Laser processing system and laser processing method
WO2022142975A1 (en) Laser hole making device suitable for cfrp and laser hole making method
CN101982317B (en) Fixture carried equipment for preventing counterfeit by carrying out online laser micro engraving and marking on inner surfaces of transparent wine bottles
CN106312331A (en) Laser small-hole punching device based on Dove prism and method
JP2021142546A (en) Optical unit, laser beam machining apparatus and laser beam machining method
CN112247379A (en) Rotary-cut perforating device

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20151104

Effective date of abandoning: 20170524

AV01 Patent right actively abandoned