CN108746994B - A kind of device and method of compound Milling Process micro-structure - Google Patents
A kind of device and method of compound Milling Process micro-structure Download PDFInfo
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- CN108746994B CN108746994B CN201810644539.9A CN201810644539A CN108746994B CN 108746994 B CN108746994 B CN 108746994B CN 201810644539 A CN201810644539 A CN 201810644539A CN 108746994 B CN108746994 B CN 108746994B
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- 238000003801 milling Methods 0.000 title claims abstract description 100
- 150000001875 compounds Chemical class 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 11
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 238000000608 laser ablation Methods 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 230000003321 amplification Effects 0.000 claims description 2
- 238000005422 blasting Methods 0.000 claims description 2
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 2
- 230000001476 alcoholic effect Effects 0.000 claims 1
- 238000003754 machining Methods 0.000 abstract description 7
- 239000007769 metal material Substances 0.000 abstract description 2
- 229910052755 nonmetal Inorganic materials 0.000 abstract description 2
- 239000011343 solid material Substances 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
- B23P23/04—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass for both machining and other metal-working operations
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention discloses a kind of device of compound Milling Process micro-structure, including laser and micro- milling cutter, suitable for carrying out the processing of high-aspect-ratio and complicated long path micro-structure on metal material or nonmetal solid material.The present invention also provides a kind of method of compound Milling Process micro-structure, laser can be removed material roughing to workpiece to be processed；After obtaining micro-structure, enables micro- milling cutter be in the inlet of the micro-structure of roughing acquisition, drive micro- milling cutter to carry out Milling Process to micro-structure, obtain final micro-structure.The present invention can not only improve the processing efficiency and machining accuracy of micro-structure, while can also reduce the edge wear degree of micro- milling cutter and extend the service life of micro- milling cutter.
Description
Technical field
The present invention relates to micro pipes processing technique fields, more particularly to a kind of device of compound Milling Process micro-structure
And method.
Background technique
The micro-structure that characteristic size is 0.01mm to 2mm is widely used in the neck such as national defence, Aeronautics and Astronautics, the energy and medical treatment
The key part of domain tip device has been greatly facilitated the development of micro-processing technology as microminiature technology is increasingly mature.Micro-structure
The superiority and inferiority of surface integrity directly influence the technical indicators such as the relevant electromagnetism of micro-structure, optics, vibration and fatigue, Zhu Rulei
Characteristic width is the high-aspect-ratio metal folding slow-wave structure of 0.02mm to 1.5mm, deep space exploration on up to Terahertz amplifying device
Being 0.01mm with characteristic width requires high surface integrity to complex micro structures such as the X-ray alignment gratings of 1mm spacing.
The micro-processing technology of existing many maturations, as photoetching, EDM micro elements, reaction ion deep etching and focused ion beam are processed
Deng, due to being limited and being difficult to ensure the dimensional accuracy of micro-structure and the requirement of surface integrity by rapidoprint, so that these
The existing usage performance of micro-structure is difficult to reach higher practical demand.
In view of the above-mentioned problems, micro-milling technology is shown one's talent, micro-milling technology has machinable material diversification, adds
The advantages that work precision is controllable, at low cost is suitble to the preparation of high-accuracy complex micro structure.The processing quality of micro-milling technology is very big
Material and structure in degree by micro- milling cutter are influenced, while the abrasion of cutter also constrains the retentivity of keen edge.Especially
When processing high aspect ratio microstructures, micro- milling cutter of big L/D ratio is easy to appear tipping, is broken due to integral strength and insufficient rigidity
The phenomenon that knife, causes cutter life, processing efficiency, machining accuracy to reduce, and surface integrity is deteriorated.
Therefore, how to change in the prior art, the status that micro-milling machining accuracy is low, the tool wear serious service life is low,
It is those skilled in the art's urgent problem to be solved.
Summary of the invention
The object of the present invention is to provide a kind of device and methods of compound Milling Process micro-structure, to solve above-mentioned existing skill
Art there are the problem of, improve the machining accuracy of micro-structure, reduce the edge wear degree of micro- milling cutter, improve micro- milling cutter use the longevity
Life.
To achieve the above object, the present invention provides following schemes: the present invention provides a kind of compound Milling Process micro-structure
Device, including platen, the first CCD electron microscope, laser, micro- milling cutter and the 2nd CCD electron microscope are described
There is the fixture for capableing of card engaging workpiece, position of the fixture on the platen is adjustable, described on platen
First CCD electron microscope is connected with the laser, and the laser can laser machine workpiece, micro- milling cutter
Milling Process can be carried out to workpiece, the 2nd CCD electron microscope and the laser are located at micro- milling cutter
Two sides, the first CCD electron microscope are located at side of the laser far from micro- milling cutter.
Preferably, the first CCD electron microscope is connected with the laser by attachment device, the attachment device
Scalable, the attachment device is detachably connected with the first CCD electron microscope.
Preferably, micro- milling cutter is mounted on main shaft, and the main shaft is driven by driving device.
Preferably, the device of compound Milling Process micro-structure further includes pedestal, and the platen is installed on the base
On seat, the platen is detachably connected with the pedestal.
Preferably, the 2nd CCD electron microscope is supported by support frame, and support frame as described above is fixed on the pedestal,
The adjustable angle of support frame as described above, support frame as described above are detachably connected with the 2nd CCD electron microscope.
Preferably, the diameter of micro- milling cutter is not more than 1mm, and micro- milling cutter is by hard alloy, diamond, polycrystalline cubic
Boron nitride or ceramic material are made.
The present invention also provides a kind of methods of compound Milling Process micro-structure, include the following steps:
Step 1: measuring flatness by flatness measuring instrument, and be adjusted to mistake by clamping workpiece on platen
In poor allowed band, to obtain more smooth workpiece surface；
Step 2: workpiece to be processed is moved under the 2nd CCD electron microscope, biggish amplification factor is set, adjusts the
The focal length of one CCD electron microscope determines the position of the first CCD electron microscope when image cleaning is visible；
Step 3: workpiece is moved to below the camera lens of laser, laser is opened, adjusts laser camera lens and work to be processed
The relative position on part surface enables the focal plane of laser be overlapped with work surface, the machined parameters of laser is arranged, to be processed
Workpiece carries out the roughing of laser ablation material, obtains micro-structure；
Step 4: adjusting the relative position of micro- milling cutter and workpiece surface, point of a knife and work surface is made to be in same level
Position, while travelling workpiece make micro- milling cutter be in the inlet for the micro-structure that roughing obtains, adjust the phase of micro- milling cutter and microflute
Milling Process is carried out to position, obtains final micro-structure, withdrawing.
Preferably, before carrying out step 1, workpiece to be processed is pre-processed, workpiece to be processed surface is polished,
Then be processed by shot blasting, be then cleaned by ultrasonic in ethanol solution, remove workpiece to be processed surface impurity and
Greasy filth.
Preferably, the laser of laser transmitting is nanosecond or ultrafast laser, and pulsewidth is less than 100ns.
Preferably, workpiece to be processed is by under the first CCD electron microscope in the determination of the focal plane under laser
It is obtained at the focus adjustment method of clear image.
The present invention achieves following technical effect compared with the existing technology: the dress of compound Milling Process micro-structure of the invention
It sets, including laser and micro- milling cutter, is suitable for carrying out high-aspect-ratio on metal material or nonmetal solid material and complexity is long
The processing of path micro-structure；The present invention also provides a kind of method of compound Milling Process micro-structure, laser can be to work to be processed
Part is removed material roughing；After obtaining micro-structure, micro- milling cutter is enabled to be in the inlet for the micro-structure that roughing obtains, driven
Micro- milling cutter carries out Milling Process to micro-structure, obtains final micro-structure.The present invention can not only improve the processing effect of micro-structure
Rate and machining accuracy, while can also reduce the edge wear degree of micro- milling cutter and extend the service life of micro- milling cutter.
Detailed description of the invention
It in order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, below will be to institute in embodiment
Attached drawing to be used is needed to be briefly described.It should be evident that the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without any creative labor, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the structural schematic diagram of the device of compound Milling Process micro-structure of the invention；
Fig. 2 is the electricity on the high aspect ratio microstructures surface processed using the method for compound Milling Process micro-structure of the invention
Mirror figure；
Fig. 3 is the electricity of the high aspect ratio microstructures side processed using the method for compound Milling Process micro-structure of the invention
Mirror figure；
Wherein, 1 is pedestal, and 2 be platen, and 3 be workpiece, and 4 be the first CCD electron microscope, and 5 be attachment device, 6
It is micro- milling cutter for laser, 7,8 be main shaft, and 9 be support frame, and 10 be the 2nd CCD electron microscope.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description.Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The object of the present invention is to provide a kind of device and methods of compound Milling Process micro-structure, to solve above-mentioned existing skill
Art there are the problem of, improve the machining accuracy of micro-structure, reduce the edge wear degree of micro- milling cutter, improve micro- milling cutter use the longevity
Life.
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing and specific real
Applying mode, the present invention is described in further detail.
Please refer to Fig. 1-3, wherein Fig. 1 is the structural schematic diagram of the device of compound Milling Process micro-structure of the invention, figure
2 be the electron microscope on the high aspect ratio microstructures surface processed using the method for compound Milling Process micro-structure of the invention, and Fig. 3 is
Electron microscope for the high aspect ratio microstructures side processed using the method for compound Milling Process micro-structure of the invention.
The present invention provides a kind of device of compound Milling Process micro-structure, including platen 2, the first CCD electronic display
Micro mirror 4, laser 6, micro- milling cutter 7 and the 2nd CCD electron microscope 10 have the card for capableing of card engaging workpiece on platen 2
Tool, position of the fixture on platen 2 is adjustable, and the first CCD electron microscope 4 is connected with laser 6, and laser 6 can
Workpiece is laser machined, micro- milling cutter 7 can carry out Milling Process, the 2nd CCD electron microscope 10 and laser 6 to workpiece
The two sides of micro- milling cutter 7 are located at, the first CCD electron microscope 4 is located at side of the laser 6 far from micro- milling cutter 7.
When processing micro structure, laser 6 can be removed material roughing to workpiece to be processed, obtain micro-structure, rear to enable
Micro- milling cutter 7 is in the inlet for the micro-structure that roughing obtains, and drives micro- milling cutter 7 to carry out Milling Process to micro-structure, obtains most
Whole micro-structure, improves the processing efficiency and machining accuracy of micro-structure, obtains preferable surface integrity, while reducing micro- milling cutter
7 edge wear degree improves the service life of micro- milling cutter 7, meanwhile, adjust the 2nd CCD electron microscope of micro- 7 side of milling cutter
10 angle, convenient for observing the relative position of micro- milling cutter 7 and workpiece in real time.
Wherein, the first CCD electron microscope 4 is connected with laser 6 by attachment device 5, and attachment device 5 is scalable, even
Connection device 5 is detachably connected with the first CCD electron microscope 4.By the first CCD electron microscope 4 of the adjustment of attachment device 5 and swash
The relative position up and down of light device 6 determines after forming clearly image under identical high magnification, workpiece is moved to 6 camera lens of laser
Lower section, focal plane and work surface are overlapped, and realization is quick and precisely focused.
In addition, micro- milling cutter 7 is mounted on main shaft 8, main shaft 8 is driven by driving device.
Specifically, the device of compound Milling Process micro-structure further includes pedestal 1, and platen 2 is installed on pedestal 1,
Platen 2 is detachably connected with pedestal 1, and the position of workbench is adjustable, is conveniently adjusted the position of workpiece to be processed.
In order to allow the operator to observe the relative position of micro- milling cutter 7 and workpiece, the 2nd CCD electron microscope 10 in real time
It is supported by support frame 9, support frame 9 is fixed on pedestal 1, the adjustable angle of support frame 9, support frame 9 and the 2nd CCD electron microscopic
Mirror 10 is detachably connected, and adjusts the angle of support frame 9, is made between the 2nd CCD electron microscope 10 and platen 2 in certain
Angle, convenient for observing micro- milling cutter 7 and workpiece.
More specifically, the diameter of micro- milling cutter 7 is not more than 1mm, micro- milling cutter 7 is nitrogenized by hard alloy, diamond, polycrystalline cubic
Boron or ceramic material are made.
The present invention also provides a kind of methods of compound Milling Process micro-structure, below by taking TU1 oxygen-free copper as an example, oxygen and miscellaneous
Matter content is extremely low, and the YLP-1/100/20 type pulse Yb-doping optical fiber laser 6 of laser 6 uses high-accuracy three axis micro-milling
Lathe is specifically comprised the following steps: using the compound processing method of laser-milling
Step 1: workpiece surface is successively used the liquid honing of 320#~2000# by the pretreatment of workpiece, then with 1 μm
Then the high-efficiency diamond polishing agent polishing treatment of granularity is cleaned by ultrasonic 10~15 minutes in ethanol solution, remove work
The impurity and greasy filth on part surface；
Step 2: by clamping workpiece on platen 2, flatness is measured by flatness measuring instrument, by playing table
Mensuration makes flatness error lower than 1 μm；
Step 3: workpiece to be processed is moved under the first CCD electron microscope 4, is set enlargement ratio as 8, is adjusted first
The focal length of CCD electron microscope 4 determines the position of the first CCD electron microscope 4 when image is high-visible；
Step 4: it controls micro- milling machine bed platform and moves to workpiece below 6 camera lens of laser, open laser 6, adjust laser
The relative position of device 6 camera lens and workpiece surface, is overlapped the focal plane of laser with work surface；
Step 5: the single pulse energy of 6 machined parameters of laser is set for 900 μ J, pulse width 100ns, laser is swept
Retouching speed is 500mm/s, and repetition rate 20kHz, scanning times are 30 times, carries out the roughing of laser ablation material to workpiece,
Micro-structure is obtained, machine tool chief axis 8 is then opened, opens the 2nd CCD electron microscope 10, the hard that diameter is 0.2mm is adjusted and closes
Gold shell revolves the relative position of twolip miniature slotting cutter and workpiece surface, and point of a knife and work surface is made to be in the same horizontal position,
Travelling workpiece simultaneously, makes micro- milling cutter 7 be in the inlet for the micro-structure that roughing obtains, and adjusts micro- milling cutter 7 and microflute
Relative position, 8 revolution of main shaft of setting micro-milling machined parameters are 20000r/min, and feed engagement is 1.5 μm/z, axial
Cutting-in is 6 μm, starts to carry out Milling Process, obtains final micro-structure；
Step 6: closing laser 6, the first CCD electron microscope 4 and the 2nd CCD electron microscope 10, and withdrawing is closed
Main shaft 8, specifically the electron microscope of micro-structure surface and side please refers to Fig. 2 and Fig. 3 after processing is completed.
Specific examples are applied in the present invention, and principle and implementation of the present invention are described, above embodiments
Illustrate to be merely used to help understand method and its core concept of the invention；At the same time, for those skilled in the art, according to
According to thought of the invention, there will be changes in the specific implementation manner and application range.In conclusion the content of the present specification
It should not be construed as limiting the invention.
Claims (7)
1. a kind of device of compound Milling Process micro-structure, it is characterised in that: including platen, the first CCD electron microscopic
Mirror, laser, micro- milling cutter and the 2nd CCD electron microscope have the fixture for capableing of card engaging workpiece, institute on the platen
It is adjustable to state position of the fixture on the platen, the first CCD electron microscope is connected with the laser, described
Laser can laser machine workpiece, and micro- milling cutter can carry out Milling Process, the 2nd CCD electronics to workpiece
Microscope and the laser are located at the two sides of micro- milling cutter, and the first CCD electron microscope is located at the laser
Side of the device far from micro- milling cutter；The first CCD electron microscope is connected with the laser by attachment device, described
Attachment device is scalable, and the attachment device is detachably connected with the first CCD electron microscope；The platen peace
Loaded on pedestal, the platen is detachably connected with the pedestal, and the 2nd CCD electron microscope is by support frame branch
Support, support frame as described above are fixed on the pedestal, the adjustable angle of support frame as described above, support frame as described above and the 2nd CCD electricity
Sub- microscope is detachably connected.
2. the device of compound Milling Process micro-structure according to claim 1, it is characterised in that: micro- milling cutter is mounted on
On main shaft, the main shaft is driven by driving device.
3. the device of compound Milling Process micro-structure according to claim 1, it is characterised in that: the diameter of micro- milling cutter
No more than 1mm, micro- milling cutter is made of hard alloy, diamond, polycrystalline cubic boron nitride or ceramic material.
4. a kind of method of compound Milling Process micro-structure, micro- using the described in any item compound Milling Process of claim 1-3
The device of structure, which comprises the steps of:
Step 1: measuring flatness by flatness measuring instrument by clamping workpiece on platen, and it is adjusted to error and permits
Perhaps in range, to obtain more smooth workpiece surface；
Step 2: workpiece to be processed is moved under the 2nd CCD electron microscope, biggish amplification factor is set, adjusts the first CCD
The focal length of electron microscope determines the position of the first CCD electron microscope when image is high-visible；
Step 3: workpiece is moved to below the camera lens of laser, laser is opened, adjusts laser camera lens and workpiece to be processed table
The relative position in face enables the focal plane of laser be overlapped with work surface, the machined parameters of laser is arranged, to workpiece to be processed
The roughing of laser ablation material is carried out, micro-structure is obtained；
Step 4: adjusting the relative position of micro- milling cutter and workpiece surface, point of a knife and work surface is made to be in the same horizontal position,
Travelling workpiece simultaneously, makes micro- milling cutter be in the inlet for the micro-structure that roughing obtains, adjusts the opposite position of micro- milling cutter and microflute
Carry out Milling Process is set, final micro-structure, withdrawing are obtained.
5. the method for compound Milling Process micro-structure according to claim 4, it is characterised in that: carry out step 1 it
Before, workpiece to be processed is pre-processed, workpiece to be processed surface is polished, is then processed by shot blasting, then in anhydrous second
It is cleaned by ultrasonic in alcoholic solution, removes the impurity and greasy filth on workpiece to be processed surface.
6. the method for compound Milling Process micro-structure according to claim 4, it is characterised in that: the laser of laser transmitting
For nanosecond or ultrafast laser, pulsewidth is less than 100ns.
7. the method for compound Milling Process micro-structure according to claim 4, it is characterised in that: workpiece to be processed is in laser
The determination of focal plane under device is by obtaining under the first CCD electron microscope at the focus adjustment method of clear image.
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| CN114101898A (en) * | 2021-11-30 | 2022-03-01 | 西南交通大学 | Laser processing device |
| CN114804011B (en) * | 2022-04-29 | 2024-09-03 | 中国兵器科学研究院宁波分院 | Ultra-precise manufacturing method of polymer microstructure |
| CN114918670A (en) * | 2022-06-10 | 2022-08-19 | 江苏理工学院 | Device and method for machining microchannel by using paraxial jet water assisted laser and micro milling |
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| DE102009008284A1 (en) * | 2009-02-10 | 2010-08-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Laser-supported machining of high-strength workpiece, uses rotating tool on drive shaft and laser beam bundle passing through hole in shaft while overlapping rotational axis of shaft |
| DE202009010177U1 (en) * | 2009-07-27 | 2009-11-26 | König, Wilhelm | HSK tool holder with nearly axially parallel laser guide with all-round drive for positioning to the maximum chip volume in the feed direction before the cutting operation |
| CN102172883A (en) * | 2011-03-18 | 2011-09-07 | 哈尔滨工业大学 | Method and device for machining high-quality tiny through hole of hard and crisp material |
| CN106271493A (en) * | 2015-05-21 | 2017-01-04 | 中国科学院宁波材料技术与工程研究所 | A kind of prefabricated micro-texture assisting ultrasonic milling process method of laser and system of processing |
| CN107097072A (en) * | 2017-04-18 | 2017-08-29 | 南京航空航天大学 | A kind of induced with laser oxidation assist milling method and its device |
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