CN109048088B - Method and device for processing micropores by combining long-pulse laser and plasma jet - Google Patents

Method and device for processing micropores by combining long-pulse laser and plasma jet Download PDF

Info

Publication number
CN109048088B
CN109048088B CN201810966408.2A CN201810966408A CN109048088B CN 109048088 B CN109048088 B CN 109048088B CN 201810966408 A CN201810966408 A CN 201810966408A CN 109048088 B CN109048088 B CN 109048088B
Authority
CN
China
Prior art keywords
plasma jet
laser
processing
laser head
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810966408.2A
Other languages
Chinese (zh)
Other versions
CN109048088A (en
Inventor
任乃飞
石春辉
王后孝
夏凯波
柳苏洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu University
Original Assignee
Jiangsu University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu University filed Critical Jiangsu University
Priority to CN201810966408.2A priority Critical patent/CN109048088B/en
Publication of CN109048088A publication Critical patent/CN109048088A/en
Application granted granted Critical
Publication of CN109048088B publication Critical patent/CN109048088B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/346Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding

Abstract

The invention discloses a method and a device for processing a micropore by combining long pulse laser and plasma jet, which relate to the field of laser processing, wherein the processing method comprises the following steps of (1) clamping a workpiece on a workpiece clamp; (2) carrying out tool setting on a workpiece through a positioning system of a machine tool; (3) laser starts to punch; (4) when the material is punched, the laser head stops emitting laser, the laser head rotates 90 degrees around the rotating shaft, so that the plasma jet nozzle faces the position of the hole, and an alternating current high-voltage power supply is supplied to the plasma jet device; the device comprises a laser, a power box, a laser head, a CCD camera, a light guide pipe, an x-y moving platform, a z-direction moving mechanism, a workpiece clamp and a plasma jet device; the invention combines the long pulse laser drilling and the plasma jet surface treatment technology, can clean slag on the inner wall of the micropore and change the performance of the inner wall, effectively improves the quality of the micropore, and solves the problem of removing splashes on the surface of the orifice after laser drilling.

Description

Method and device for processing micropores by combining long-pulse laser and plasma jet
Technical Field
The invention relates to the field of micropore processing by utilizing laser, in particular to a method and a device for processing micropores by combining long-pulse laser and plasma jet.
Background
Plasma (Plasma) is a form of matter having free electrons and charged ions as the main components, widely existing in the universe, and is often considered to be the fourth state of matter, called the Plasma state, or "super-gaseous", also called "Plasma body".
For low-pressure discharge, the collision frequency of electrons and neutral particles is low due to the low density of the gas, so that electrons can easily obtain high energy under the action of an electric field. This makes ionization easier, resulting in a higher density plasma at low pressures, where the concentration of active species is relatively high, while still ensuring that the temperature of the gas is kept at a low level. This makes the low-pressure non-equilibrium plasma have wide application in industry, such as plasma etching, material surface modification and cleaning, improving the biocompatibility of materials, generating nano materials, etc. Furthermore, it is relatively easy to generate a uniform plasma at low pressure, which is crucial for many applications, such as surface modification, etching, etc. However, the generation of plasma at low pressure has a fatal disadvantage that a vacuum system is inevitable. This makes the low-pressure plasma only usable for applications which have high added value and are suitable for vacuum conditions.
In order to overcome the above disadvantages, researchers have developed atmospheric pressure non-equilibrium plasma jets in recent years. The atmospheric pressure non-equilibrium plasma jet can generate the atmospheric pressure non-equilibrium plasma in an open space instead of a gap, so that the combined processing process of the plasma and the laser can be realized under the atmospheric pressure.
At present, the laser drilling technology is applied to the industries such as automobile industry, ship manufacturing, aerospace, instruments and meters, medical technology and the like. Compared with the traditional mechanical drilling method, the laser drilling technology has the advantages of high precision, high speed, high efficiency, good economic benefit, no cutter loss, large depth-diameter ratio and the like, and becomes one of the main application fields of laser processing. However, for drilling holes in high-precision instruments, high-quality group holes need to be drilled, for example, aeroengine turbine blades, the requirements on the properties of wear resistance, high temperature resistance, corrosion resistance and the like of the base body of the turbine blade are high, the requirements on the quality of a film cooling hole on the turbine blade are also high, the quality of the hole is evaluated by conicity and roundness, the quality of the inner wall of the hole is also important, the hole wall has problems of recast layer, microcrack, slag and the like, and in addition, a lot of slag splashes exist near the upper surface of the hole opening, and the holes are troublesome to remove once solidified.
Disclosure of Invention
The invention provides a method for processing micropores by combining long pulse laser and plasma jet, which combines laser drilling with micropore processing, when laser acts on material, the laser drilling process is instantly completed, at the moment, a laser head is immediately rotated by 90 degrees, so that a nozzle of a plasma jet device is just aligned with an orifice on the micropore, a high-voltage power supply is connected, nitrogen with a certain flow rate is connected to generate plasma jet, the plasma jet acts on the orifice and the inner wall of the micropore, slag at the orifice can be removed, the vicinity of the orifice can be polished, and simultaneously, because the melt which is not ejected after the laser acts on the inner wall can be removed under the action of the plasma jet, the nitrogen is selected as working gas, the nitrogen plasma jet can also change the performance of the inner wall while cleaning the slag on the inner wall of the micropore, such as improving the hardness and wear resistance of the material, and effectively improving the quality of micropores. Meanwhile, the invention also provides a device for processing the micropores by combining the long pulse laser and the plasma jet.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a device for processing micropores by combining long pulse laser and plasma jet is characterized by comprising a power supply box, a workpiece clamp, a laser head, a light guide pipe, a CCD camera, a laser, a rotating shaft, a z-direction moving mechanism, an x-y moving platform, a plasma jet device, a nitrogen tank and a laser head auxiliary gas tank;
the power supply box is arranged on the left side of a base of the machine tool, an x-y moving platform is arranged on the base of the machine tool, and a workpiece clamp is arranged on the x-y moving platform;
the laser is arranged on the Z-direction moving mechanism and connected with a laser head through a light guide pipe, the laser head comprises a reflecting plane mirror and a focusing lens, and a CCD camera is arranged right above the laser head;
the laser head is connected with the z-direction moving mechanism through a rotating shaft, and the plasma jet device is installed on the laser head.
The x-y movable workbench comprises a workbench, a y-direction guide rail, a lead screw support frame, a coupler, a first servo motor, a first motor support block, a y-direction guide rail support frame, a y-direction lead screw, an x-direction bottom plate, an x-direction guide rail support frame, a second servo motor, an x-direction guide rail, a second motor support block, an x-direction lead screw and a y-direction bottom plate;
the bottom of the x-y moving workbench is a bottom plate in the x direction, a screw in the x direction is arranged on the bottom plate in the x direction, the screw in the x direction is connected with a second servo motor through a coupler, the second servo motor is supported through a second motor supporting block, guide rails in the x direction are arranged on the upper surface of the bottom plate in the x direction in parallel on the left side and the right side of the screw in the x direction, the lower surface of the bottom plate in the y direction can slide along the guide rails in the x direction, and the screw in the y direction is supported on the upper surface of the bottom plate in the y direction through a screw supporting frame, the lead screw in the y direction is connected with a first servo motor through a coupler, the first servo motor is supported through a first motor supporting block, guide rails in the y direction are arranged on the upper surface of the bottom plate in the y direction in parallel to the left side and the right side of the lead screw in the y direction in parallel, and a workbench is connected to the guide rails in the y direction.
Preferably, the laser head is 90 degrees to the plasma jet device, the laser head, the plasma jet device and the rotating shaft intersect at a point, and can rotate 90 degrees around the rotating shaft, so that the positions of the laser head and the plasma jet device can be rapidly switched, and plasma jet treatment can be performed immediately after laser drilling.
Preferably, the plasma jet device comprises an alternating current high-voltage power supply, two round aluminum sheets, a dielectric sheet, a Teflon tube and a high-voltage hose, wherein the two electrode aluminum sheets are separated by the round dielectric sheet.
Preferably, the plasma jet device is connected with the nitrogen tank through a high-pressure hose and a gas flow controller.
Preferably, the two round aluminum sheets have a diameter of 20mm and a thickness of 3mm, and the center of the electrode of the two aluminum sheets is provided with a round hole with a diameter of 500 μm; the dielectric sheet has a thickness of 1.5mm and a circular hole with a diameter of 500 μm at the center.
Preferably, the plasma jet device is connected with an alternating-current high-voltage power supply, and the power supply frequency is adjustable.
Preferably, the working gas adopted by the plasma jet device is nitrogen, and the flow rate of the nitrogen is adjusted by a gas flow controller, so that the length of the plasma jet can be adjusted according to holes with different depths of the material to meet different processing requirements.
A method for processing micropores by combining long-pulse laser and plasma jet comprises the following steps:
step 1: and clamping the workpiece on the clamp.
Step 2: and (4) carrying out tool setting on the workpiece through a positioning system of the machine tool.
And step 3: the laser starts to punch and when the laser head moves downwards so that the laser focus is focused on the surface of the material, the pump of the laser is switched on, at which time the z-direction moving mechanism starts to feed downwards at a speed so that the focus always acts on the surface of the material.
And 4, step 4: when the material is punched, the laser head stops emitting laser, the laser head rotates 90 degrees around the rotating shaft, so that the plasma jet nozzle faces the position of the hole, the plasma jet device is powered by an alternating current high-voltage power supply, and nitrogen with high flow rate is introduced at the same time, so that the nozzle sprays plasma jet, the jet jets into the micropore and acts on the hole wall and the upper surface of the hole opening of the micropore, and the quality of the hole opening and the hole wall is improved.
The invention has the beneficial effects that:
firstly, the invention uses laser micropore processing and nitrogen plasma jet composite processing, the plasma jet acts on the inner wall of the micropore, the melt attached on the inner wall can be removed under the action of the plasma jet, nitrogen is selected as working gas, the nitrogen plasma jet can change the performance of the inner wall while cleaning the slag on the inner wall of the micropore, such as improving the hardness and wear resistance of the material, and the like, thereby effectively improving the quality of the micropore.
The invention integrates the micro plasma jet device on the laser head of the laser processing center, so that the micro-hole processing is very quick and convenient, and the processing efficiency is greatly improved.
Thirdly, in the invention, after the long pulse laser is acted on the material, the material absorbs the energy of the laser, the gasification and melting processes are generated, and finally the small hole is formed, and the material is sprayed with the melt in the vicinity of the orifice in the melting process to form the slag, so that the material is generally subjected to secondary treatment after laser processing to remove the slag on the surface, and the surface melt is solidified, hardened and adhered on the surface of the material and is difficult to remove, however, the plasma jet is sprayed on the orifice, and the problem of removing the splashes on the surface of the orifice after laser drilling can be solved.
Drawings
FIG. 1 is a schematic structural diagram of a method and an apparatus for processing micro-holes by combining long-pulse laser and plasma jet;
FIG. 2 is a schematic diagram of the nitrogen plasma jet apparatus of FIG. 1 according to the present invention;
FIG. 3 is a schematic view of the x-y stage of FIG. 1 according to the present invention;
fig. 4 is an internal optical path diagram of the laser head.
The reference numbers are as follows:
a power supply box 1, a workpiece clamp 2, a laser head 3, a light guide pipe 4, a CCD camera 5, a laser 6, a rotating shaft 7, a z-direction moving mechanism 8, an x-y moving platform 9, a plasma jet device 10, a nitrogen tank 11, a laser head auxiliary gas tank 12, a plane reflector 3.1, a focusing lens 3.2, a workbench 9.1, a y-direction guide rail 9.2, a lead screw support frame 9.3, a coupler 9.4, a first servo motor 9.5, a first motor support block 9.6, a y-direction guide rail support frame 9.7, a y-direction lead screw 9.8, an x-direction bottom plate 9.9, an x-direction guide rail support frame 9.10, a second servo motor 9.11, an x-direction guide rail 9.12, a second motor support block 9.13, an x-direction lead screw 9.14, a y-direction bottom plate 9.15, an alternating current high-voltage power supply 10.1, a first circular aluminum sheet 10.2, a second circular aluminum sheet 10.3, a dielectric sheet 10.5, a Teflon high voltage hose 10.6, a Teflon hose 10.7, Gas flow controller 10.8.
Detailed Description
In order to better explain the implementation details of the present invention, the following further describes the technical solution of the present invention with reference to the attached drawings.
With reference to fig. 1, a device for processing micropores by combining long pulse laser and plasma jet is characterized in that a power supply box 1, a workpiece clamp 2, a laser head 3, a light guide pipe 4, a CCD camera 5, a laser 6, a rotating shaft 7, a z-direction moving mechanism 8, an x-y moving platform 9, a plasma jet device 10, a nitrogen tank 11 and a laser head auxiliary gas tank 12;
the laser head 3, the plasma jet device 10 together rotate 90 ° about the axis of rotation 7. When the plasma jet device is rotated by 90 degrees clockwise, the plasma jet device 10 is vertically downward, and is rotated by 90 degrees anticlockwise, and the laser head 3 is vertically downward.
The rotating shaft 7 can be controlled to rotate clockwise and anticlockwise through a numerical control program, so that the positions of the laser head 3 and the plasma jet device 10 can be rapidly switched back and forth, and plasma jet processing can be immediately carried out after laser drilling; the positions of the laser head 3 and the plasma jet device 10 can be rapidly switched, and plasma jet processing can be performed immediately after laser drilling.
The power supply box 1 is arranged on the left side of a base of the machine tool, an x-y moving platform 9 is arranged on the base of the machine tool, and the workpiece clamp 2 is arranged on the x-y moving platform 9.
With reference to fig. 2, the plasma jet device 10 includes an ac high voltage power supply 10.1, two circular aluminum sheets 10.2, 10.3, a dielectric sheet 10.5, a teflon tube 10.6, a high voltage hose 10.7, and a gas flow controller 10.8, where the two electrode aluminum sheets are separated by a circular dielectric sheet 10.5;
the plasma jet device 10 is connected with a nitrogen tank 11 through a high-pressure hose 10.7 and a gas flow controller 10.8;
the two round aluminum sheets have the diameter of 20mm and the thickness of 3mm, and a round hole with the diameter of 500 mu m is arranged at the center of the electrode of the two aluminum sheets; the dielectric sheet 10.5 has a thickness of 1.5mm and also has a circular hole with a diameter of 500 μm in the center.
With reference to fig. 3, the x-y moving table includes a table 9.1, a y-direction guide rail 9.2, a lead screw support frame 9.3, a coupler 9.4, a first servo motor 9.5, a first motor support block 9.6, a y-direction guide rail support frame 9.7, a y-direction lead screw 9.8, an x-direction bottom plate 9.9, an x-direction guide rail support frame 9.10, a second servo motor 9.11, an x-direction guide rail 9.12, a second motor support block 9.13, an x-direction lead screw 9.14, and a y-direction bottom plate 9.15; the shaft coupling is driven by the motor to rotate, and the lead screw is driven by the shaft coupling to rotate, so that the workbench can move in the x-y direction.
Combine attached fig. 1 and 4, laser instrument 6 is installed on z direction moving mechanism 8, and laser instrument 6 is connected with laser head 3 through light pipe 4, laser head 3 includes reflecting plane mirror 3.1 and focusing lens 3.2, installs CCD camera 5 directly over 3 of laser head.
The laser head 3 and the plasma jet device 10 form a 90-degree angle, the laser head 3, the plasma jet device 10 and the rotating shaft 7 are intersected at one point, and can rotate 90 degrees around the rotating shaft 7, so that the positions of the laser head 3 and the plasma jet device 10 can be rapidly switched, and plasma jet processing can be immediately carried out after laser drilling.
The plasma jet device 10 is connected with an alternating current high-voltage power supply 10.1, and the power supply frequency is adjustable.
The working gas adopted by the plasma jet device 10 is nitrogen, the flow rate of the nitrogen is adjusted by a gas flow controller, so that the length of the plasma jet can be adjusted according to holes with different depths of the material, and different processing requirements can be met.
The invention provides a method for processing micropores by combining long pulse laser and plasma jet, which comprises the following steps:
the method comprises the following steps: clamping a workpiece on the workpiece clamp 2;
step two: carrying out tool setting on a workpiece through a positioning system of a machine tool;
step three: the laser starts to make a hole and when the laser head 3 is moved downwards so that the laser focus is focused on the surface of the material, the pump of the laser is turned on, and at this time the z-direction moving mechanism 8 starts to feed downwards at a speed so that the focus always acts on the surface of the material.
Step four: when the material is punched, the laser head 3 stops emitting laser, the laser head 3 rotates 90 degrees around the rotating shaft 8, so that the plasma jet nozzle faces the position of the hole, at the moment, a high-voltage alternating current power supply is communicated to the plasma jet device 10, nitrogen with a certain flow rate is introduced, the plasma jet is sprayed out from the nozzle, and the jet is injected into the micropore and acts on the hole wall and the upper surface of the micropore, so that the quality of the orifice and the hole wall is improved.
The present invention is not limited to the above-described embodiments, and any obvious improvements, substitutions or modifications can be made by those skilled in the art without departing from the spirit of the present invention.

Claims (8)

1. A device for processing micropores by combining long-pulse laser and plasma jet is characterized by comprising a power supply box (1), a workpiece clamp (2), a laser head (3), a light guide pipe (4), a CCD camera (5), a laser (6), a rotating shaft (7), a z-direction moving mechanism (8), an x-y moving platform (9) and a plasma jet device (10);
the power supply box (1) is arranged on the left side of a machine tool base, an x-y moving platform (9) is arranged on the machine tool base, and a workpiece clamp (2) is arranged on the x-y moving platform (9);
the laser (6) is installed on the Z-direction moving mechanism (8), the laser (6) is connected with the laser head (3) through the light guide pipe (4), the laser head (3) comprises a reflecting plane mirror (3.1) and a focusing lens (3.2), and a CCD camera (5) is installed right above the laser head (3);
laser head (3) are connected with z direction moving mechanism (8) through rotation axis (7), plasma jet device (10) is installed on laser head (3), and the axis between the two is 90 degrees.
2. The device for processing the micro-hole by combining the long-pulse laser and the plasma jet is characterized in that the axes of the laser head (3), the plasma jet device (10) and the rotating shaft (7) are intersected at a point, and the laser head (3) and the plasma jet device (10) can rotate by 90 degrees around the rotating shaft (7).
3. The device for processing the micropore by combining the long pulse laser with the plasma jet according to claim 1, wherein the plasma jet device (10) comprises an alternating current high-voltage power supply (10.1), a first round aluminum sheet (10.2), a second round aluminum sheet (10.3), a dielectric sheet (10.5), a Teflon tube (10.6), a high-voltage hose (10.7) and a gas flow controller (10.8); the first round aluminum sheet (10.2) and the second round aluminum sheet (10.3) are separated by a round dielectric sheet (10.5).
4. The device for processing the micro-hole by combining the long-pulse laser and the plasma jet according to the claim 1, characterized in that the plasma jet device (10) is connected with a nitrogen tank (11) through a high-pressure hose (10.7) and a gas flow controller (10.8).
5. The apparatus for processing the micro-hole by the combination of the long pulse laser and the plasma jet according to claim 3, wherein the first round aluminum sheet (10.2) and the second round aluminum sheet (10.3) have a diameter of 20mm and a thickness of 3mm, and the centers of the electrodes of the first round aluminum sheet (10.2) and the second round aluminum sheet (10.3) have a round hole with a diameter of 500 μm; the thickness of the dielectric sheet (10.5) is 1.5mm, and a round hole with the diameter of 500 mu m is formed in the center of the dielectric sheet.
6. The device for processing the micro-hole by combining the long-pulse laser and the plasma jet according to claim 1, wherein the plasma jet device (10) is connected with an alternating-current high-voltage power supply (10.1), and the power supply frequency is adjustable.
7. The device for processing the micropore by combining the long pulse laser and the plasma jet according to claim 1, wherein the working gas adopted by the plasma jet device (10) is nitrogen, the flow rate of the nitrogen is adjusted by a gas flow controller, and the length of the plasma jet can be adjusted according to holes with different depths of materials so as to meet different processing requirements.
8. A method for processing micropores by combining long-pulse laser and plasma jet is characterized by comprising the following steps:
step 1: clamping a workpiece on the workpiece clamp (2);
step 2: carrying out tool setting on a workpiece through a positioning system of a machine tool;
and step 3: the laser starts to punch, when the laser head (3) moves downwards to focus the laser focus on the surface of the material, the pump of the laser (6) is switched on, and the z-direction moving mechanism (8) starts to feed downwards at a certain speed to enable the focus to act on the surface of the material all the time;
and 4, step 4: when the material is punched, the laser head (3) stops emitting laser, the laser head (3) rotates 90 degrees around the rotating shaft (7) to enable the plasma jet nozzle to face the position of the hole, at the moment, the plasma jet device (10) is communicated with a high-voltage alternating current power supply (10.1), and nitrogen with a certain flow rate is introduced at the same time, so that the plasma jet is sprayed out from the nozzle, and the jet is injected into the micropore and acts on the hole wall and the upper surface of the hole opening of the micropore, so that the quality of the hole opening and the hole wall is improved.
CN201810966408.2A 2018-08-23 2018-08-23 Method and device for processing micropores by combining long-pulse laser and plasma jet Active CN109048088B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810966408.2A CN109048088B (en) 2018-08-23 2018-08-23 Method and device for processing micropores by combining long-pulse laser and plasma jet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810966408.2A CN109048088B (en) 2018-08-23 2018-08-23 Method and device for processing micropores by combining long-pulse laser and plasma jet

Publications (2)

Publication Number Publication Date
CN109048088A CN109048088A (en) 2018-12-21
CN109048088B true CN109048088B (en) 2020-09-25

Family

ID=64755881

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810966408.2A Active CN109048088B (en) 2018-08-23 2018-08-23 Method and device for processing micropores by combining long-pulse laser and plasma jet

Country Status (1)

Country Link
CN (1) CN109048088B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114193942B (en) * 2021-11-23 2022-09-16 华中科技大学 Multi-process in-situ processing method and device for flexible electronic device
CN114473189A (en) * 2021-12-18 2022-05-13 太仓戴尔塔精密科技有限公司 Production process of quick-response high-precision throttle valve filtering device for aircraft engine
CN114344511B (en) * 2021-12-31 2024-02-23 桂林电子科技大学 Plasma sterilization apparatus and plasma sterilization method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032556B2 (en) * 1980-02-15 1985-07-29 新日本製鐵株式会社 Laser welding nozzle
US20100275950A1 (en) * 2007-12-10 2010-11-04 Helmut Mack Method and device for the treatment of surfaces
CN101942546B (en) * 2010-10-19 2012-08-15 江苏大学 Method and device for laser shock processing of fastening holes
CN102764747B (en) * 2012-07-03 2015-02-25 安徽工业大学 Method and device for descaling inner wall of metal pipeline based on laser impact wave technology
CN103008293B (en) * 2012-12-25 2015-07-08 江苏大学 Tiny hole cleaning method
CN103491699A (en) * 2013-09-30 2014-01-01 东南大学 Shunt capacitance type low-temperature plasma jet generating device
CN107695543A (en) * 2017-08-24 2018-02-16 江苏大学 One kind utilizes eddy current effect auxiliary heating laser spiral perforating device and method

Also Published As

Publication number Publication date
CN109048088A (en) 2018-12-21

Similar Documents

Publication Publication Date Title
CN109048088B (en) Method and device for processing micropores by combining long-pulse laser and plasma jet
CN107486640B (en) A kind of laser drilling device and method improving hole taper and inner wall quality
CN108526627B (en) Laser-electrochemical composite micromachining method and device for semiconductor material
CN110340471B (en) Laser-induced plasma-assisted electric spark combined machining device and method under action of magnetic field
CN108655521B (en) Processing device and method for synchronizing piezoelectric ceramic vibration and electrochemical discharge
JP5192216B2 (en) Laser processing equipment
CN106238918A (en) The ceramic etching system of a kind of ultrasonic wave added laser and method
CN111889895A (en) Jet-assisted multi-pulse-width laser ingot stripping method
CN101508054A (en) Large-breadth jointless splicing precise laser drilling device
CN213196184U (en) Double-light-source composite laser processing device
CN105195903A (en) Laser microjet processing device for perforating turbine blade
CN114939740A (en) Three-dimensional ultrasonic-assisted ultrafast laser hole making device and method
CN110280915B (en) Laser drilling device and method for improving hole making quality based on underwater drilling
CN110625273A (en) Laser processing method and device
US5951884A (en) Electric discharge machining method and apparatus
KR101973636B1 (en) Cemented carbide, high-quality laser micro-discharge complex processing device
CN111940895A (en) Method and device for micromachining liquid plasma through laser induction based on flowing water layer
CN101168204A (en) Air blast electric spark processing method in liquid
CN114939741B (en) Ultrasonic jet assisted femtosecond laser rotary-cut composite machining equipment and method for turbine blade air film cooling hole
JP5324828B2 (en) Laser processing equipment
CN111943499B (en) Ultra-fast laser precision cutting method based on ultrasonic nitrogen jet
JP2008296266A (en) Laser cutting apparatus
CN114273800A (en) Ultrafast laser drilling method and system suitable for stainless steel workpiece
CN111940930A (en) Micropore laser processing method and equipment
JP4196123B2 (en) Glassy carbon processing method and apparatus

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant