CN111940895A - Method and device for micromachining liquid plasma through laser induction based on flowing water layer - Google Patents
Method and device for micromachining liquid plasma through laser induction based on flowing water layer Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
The invention relates to a laser micromachining technology, in particular to a method and a device for micromachining laser-induced liquid plasma based on a flowing water layer. The method comprises the steps of introducing an inclined water jet to deviate from a laser beam, enabling the laser beam to act on a stable flow area formed by impacting a workpiece by the water jet, and inducing plasma to process the surface of the workpiece in a stable and flowing water layer. The water jet offset distance is: 4-10 mm; the target distance of the water jet is as follows: 10-40 mm; the laser single pulse energy is: 3-30 muJ; the laser pulse frequency is: 2-50 kHz; the processing speed is as follows: 0.5-20 mm/s; the flow rate of the water jet is as follows: 6-8 mm/s; the water jet impact angle is: 30-60 degrees; the thickness of the water layer is: 0.5-4 mm. The device of the invention consists of a water jet unit, a nozzle adjusting bracket and a laser processing unit. The invention allows higher processing speed and pulse frequency, can process a groove with a larger depth-diameter ratio, reduces the processing heat influence, simultaneously improves the processing quality and stability, and is a high-efficiency, low-consumption and stable fine micromachining technology.
Description
Technical Field
The invention relates to a laser micromachining technology, in particular to a method and a device for laser-induced liquid plasma micromachining based on a flowing water layer.
Background
The laser-induced liquid plasma micromachining technology is a laser micromachining technology and can realize surface treatment of various materials such as metal, ceramic, glass and semiconductor. The laser beam is focused in the liquid medium, and when the peak power density of the laser beam exceeds the ionization threshold of the medium, the liquid medium is broken down to induce plasma. The plasma then continues to absorb the laser energy and act on the workpiece, removing material under the combined action of thermal and mechanical energy. Compared with the laser direct-writing micromachining technology, the laser-induced liquid plasma micromachining technology can obtain larger depth-diameter ratio, smoother machined surface and less heat affected zone, and can better machine materials with low absorption rate. Therefore, the laser-induced liquid plasma micromachining has a wide application prospect.
Traditional laser-induced liquid plasma micromachining is mostly carried out in static water, a workpiece is placed in a static water layer, and plasma is induced above the workpiece. However, the movement of the stage during the processing causes the water layer to shake, which affects the laser focusing and the stability of the energy density, resulting in unstable energy of the generated plasma. Therefore, laser-induced liquid plasma micromachining requires a smaller scanning speed to reduce the influence of water layer shaking on the machining result. Meanwhile, a large amount of bubbles and residues are generated in the processing process, so that the propagation of laser in an aqueous medium is influenced, and unstable plasma is formed. Therefore, lower pulse frequencies are often used during processing to ensure that there is a sufficiently long separation between pulses to eliminate bubbles and debris from the water layer. In previous studies, for example [ PallavK, Ehmann K, 2010.Feasibility of laser-induced plasma micro-machining (LIP-MM) [ Precision analysis Technologies and Systems 315, 73-80], [ Saxena I, Ehmann K, 2014, Multi-material capability of laser-induced plasma micro-machining. journal of Mico and Nano-Manufacturing, 2, 031005], [ Xinsheng Wang, ChenbinMa, Chengyu Li, Min Kang, Ehmann K, 2018. infiltration of pulse energy engineering ceramics in laser micro-machining 262, journal of plasma machining Technology of kHz, 85 MM for process quality assurance, generally less than 10MM, for process frequency/stability, etc. However, the lower scanning speed and the lower pulse frequency also affect the processing efficiency, and limit the practical application of the laser-induced liquid plasma micromachining.
Disclosure of Invention
Aiming at the defects of the existing laser-induced liquid plasma micromachining technology, the invention provides a method and a device for micromachining laser-induced liquid plasma based on a flowing water layer, so that the problems of low machining speed and low pulse frequency in the prior art are solved, and the machining efficiency and the machining precision are improved.
The method for micromachining the liquid plasma through the laser induction based on the flowing water layer comprises the steps of introducing an inclined water jet to be biased to a laser beam, enabling the laser beam to act on a stable flow area formed by impacting a workpiece through the water jet, and inducing plasma to machine the surface of the workpiece in the stable and flowing water layer. The water jet offset distance, namely the distance between the laser beam action point and the rear water jet impact point, is selected in the range: 4mm-10 mm; selection range of water jet target distance: 10mm-40 mm; the selection range of the laser single pulse energy is 3-30 muJ; the selection range of the laser pulse frequency is 2kHz-50 kHz; the selection range of the processing speed is 0.5mm/s-20 mm/s; the water jet flow speed is selected within the range of 6-8 mm/s; the range of the water jet impact angle is 30-60 degrees, and the range of the water layer thickness is 0.5-4 mm.
The device structure for implementing the laser-induced liquid plasma micromachining method consists of a water jet unit, a nozzle adjusting bracket and a laser processing unit; the water jet unit consists of a water jet nozzle, a water pipe, a water pump and a water storage tank; the laser processing unit consists of a laser, an optical system, a supporting frame, an XY-axis moving platform, a Z-axis moving platform and a computer.
The water jet unit device is characterized in that deionized water in the water storage tank generates water flow with the flow speed of 6-8mm/s through the water pump, the water flow flows into the nozzle through the water inlet pipe to form water jet impact on the surface of a workpiece, the workpiece is placed in an open container, and the processed water flow flows back to the water storage tank through the water outlet to realize the recycling of the deionized water. The offset distance, target distance and impact angle of the water jet can be controlled by manually adjusting the nozzle adjusting bracket.
Wherein, picosecond pulse laser with the wavelength of 532nm is used, and the laser is focused in the thin water layer through a reflecting mirror and a focusing mirror to induce out plasma. The inner diameter of the nozzle is selected to be larger than the diameter of the laser spot, and the inner diameter of the nozzle is preferably 1 mm. The flow velocity of the water jet is as large as possible to wash away residues and bubbles, but the water jet cannot splash out in a large amount, so that the processing quality of the laser beam is influenced.
The basic principle of the invention is as follows: the water jet impact plane can form a section of thin and stable water layer, and the laser focuses on the plasma induced in the water layer to act with the material, so that the material is vaporized and melted. The flowing water layer can wash away processing residues and bubbles in water, and a better cooling effect is achieved.
Compared with the existing laser-induced liquid plasma processing technology, the method allows higher processing speed and pulse frequency, generates larger depth-diameter ratio, improves the processing efficiency, can reduce the processing heat influence, and ensures higher processing quality and stability. The device has low cost, is simple and easy to operate, can realize the recycling of the deionized water, and is a fine micromachining technology with high efficiency, low consumption, stability and near damage.
Drawings
FIG. 1 is a schematic diagram of a laser-induced liquid plasma micromachining process according to the present invention
FIG. 2 is a schematic structural diagram of a laser-induced liquid plasma micromachining apparatus according to the present invention
Fig. 3(a) is a solid microscope photograph of the surface quality of a laser-induced liquid plasma micromachined workpiece in a stationary aqueous layer using the same parameters as in example 1, and (b) is a cross-sectional view of the workpiece. FIG. 3(c) is a solid microscopic photograph of the processed surface of the workpiece of example 1, and (d) is a cross-sectional view of the workpiece
Fig. 4(a) is a solid microscope photograph of the surface quality of the laser-induced liquid plasma micromachined workpiece in the stationary water layer using the same parameters as in example 2, and (b) is a cross-sectional view of the workpiece. FIG. 4(c) is a solid microscopic photograph of the processed surface of the workpiece in example 2, and (d) is a cross-sectional view of the workpiece
Reference numerals: 1. the device comprises a laser beam, 2 a focusing lens, 3 a plasma, 4 a workpiece, 5 a nozzle, 6 water flow, 7 a reflector, 8 an XY axis moving platform, 9 a Z axis moving platform, 10 a support table, 11 a water storage cylinder, 12 a container, 13 a nozzle adjusting support, d nozzle diameter, theta water jet impact angle, L water jet target distance, x water jet offset distance and h water layer thickness.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific examples described herein are intended to illustrate and not to limit the invention.
Example 1:
and (3) generating high-peak power laser pulse by using a picosecond laser to act on a flowing water layer above the surface of the stainless steel to generate plasma, and processing the stainless steel by using the plasma to realize the micro-processing of the stainless steel. The laser-induced liquid plasma microprocessing parameters were selected as follows:
single pulse energy: 20 muJ
Pulse frequency: 10kHz
Scanning speed: 2mm/s
Water jet offset distance: 6mm
Water jet impact angle: 45 degree
Water jet flow rate: 7mm/s
Water jet target distance: 28mm
Thickness of water layer: 1mm
Workpiece installation: the stainless steel sheet workpiece 4 is fixed on a supporting table 10 in a container, the container 12 is installed on an XY-axis moving platform 8, the work feeding is completed through the computer control, the movement precision is 500nm, and the Z-axis moving platform 9 moves up and down to realize the laser focusing.
The offset distance of the water jet is adjusted to be 6mm through the nozzle adjusting bracket 13, the impact angle of the water jet is 45 degrees, and the target distance of the water jet is 28 mm; adjusting the laser parameter energy to be 20 muJ through a computer, controlling the laser pulse frequency to be 10kHz and controlling the moving speed of an XY axis moving platform to be 2mm/s by a processing program; and (3) adjusting a water pump to select water jet with the water speed of 7mm/s, and scanning for 2 times.
During the processing, a proper shelter can be added to prevent the water flow from splashing without influencing the processing.
According to fig. 3 and 4, the groove width and depth obtained in the conventional laser-induced liquid plasma processing were 21.8 μm and 8 μm, respectively, and the groove width and depth of 19.7 μm and 24.4 μm were obtained by performing the laser-induced liquid plasma processing in the flowing water layer. By reasonably selecting the laser parameters, the water jet offset distance, the water jet flow velocity, the water jet inclination angle, the water jet target distance and other process parameters, the fine micromachining of the stainless steel can be realized. The micro-processing of the flowing water layer by the liquid plasma induced by the laser can obtain larger depth-diameter ratio, and simultaneously, the heat affected zone is smaller and the processing continuity is better.
Example 2:
carrying out laser-induced liquid plasma micromachining at a higher machining speed, ensuring the machining quality and continuity, and selecting the following parameters of the laser-induced liquid plasma micromachining process:
single pulse energy: 20 muJ
Pulse frequency: 10kHz
Scanning speed: 10mm/s
Water jet offset distance: 6mm
Water jet impact angle: 45 degree
Water jet flow rate: 7mm/s
Water jet target distance: 28mm
Thickness of water layer: 1mm
Workpiece installation: the stainless steel sheet workpiece 4 is fixed on a supporting table 10 in a container, the container 12 is installed on an XY-axis moving platform 8, the work feeding is completed through the computer control, the movement precision is 500nm, and the Z-axis moving platform 9 moves up and down to realize the laser focusing.
The offset distance of the water jet is adjusted to be 6mm through the nozzle adjusting bracket 13, the impact angle of the water jet is 45 degrees, and the target distance of the water jet is 28 mm; adjusting the laser parameter energy to be 20 muJ through a computer, controlling the laser pulse frequency to be 10kHz and controlling the moving speed of an XY axis moving platform to be 10mm/s by a processing program; and (3) adjusting a water pump to select water jet with the water speed of 7mm/s, and scanning for 2 times.
During the processing, a proper shelter can be added to prevent the water flow from splashing without influencing the processing.
According to fig. 4, the width and depth of the grooves obtained in the conventional laser-induced liquid plasma processing were 19 μm and 2.3 μm, respectively, and the grooves 18.3 μm wide and 5.1 μm deep were obtained by performing the laser-induced liquid plasma processing in the flowing water layer. Under the condition of higher processing speed, the flowing water layer laser-induced liquid plasma micromachining has larger depth-diameter ratio, smaller heat influence area and better processing continuity.
Claims (2)
1. The laser-induced liquid plasma micromachining method based on the flowing water layer is characterized in that an inclined water jet is introduced to be biased to a laser beam, so that the laser beam acts on a stable flow area formed by impacting a workpiece with the water jet, and plasma is induced to machine the surface of the workpiece in the stable and flowing water layer. The water jet offset distance, namely the selection range of the distance between the laser beam action point and the rear water jet impact point: 4-10 mm; selection range of water jet target distance: 10-40 mm; the selection range of the laser single pulse energy is 3-30 muJ; the selection range of the laser frequency is 2-50 kHz; the selection range of the processing speed is 0.5-20 mm/s; the water jet flow speed selection range is 68 mm/s; the water jet impact angle ranges from 30 degrees to 60 degrees; the thickness of the water layer is 0.5-4 mm.
2. The laser-induced liquid plasma micromachining apparatus for carrying out the machining method of claim 1, comprising a water jet unit, a nozzle adjusting bracket, and a laser machining unit; the water jet unit consists of a water jet nozzle, a water pipe, a water pump and a water storage tank; the laser processing unit consists of a laser, an optical system, a supporting frame, an XY-axis moving platform, a Z-axis moving platform and a computer. The water jet unit device is characterized in that deionized water in the water storage tank generates water flow with a certain flow velocity through the water pump, the water flow flows into the nozzle through the water inlet pipe to form water jet impact on the surface of a workpiece, the workpiece is placed in an open container, and the processed water flow flows back into the water storage tank through the water outlet to realize the recycling of the deionized water. By manually adjusting the holder, the offset distance, target distance and impact angle of the water jet can be controlled.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112894359A (en) * | 2021-01-05 | 2021-06-04 | 中国人民解放军陆军装甲兵学院 | Jet cutting method and system thereof |
| CN114273790A (en) * | 2022-02-15 | 2022-04-05 | 山东大学 | Femtosecond laser processing device and method for etching gallium nitride in liquid phase |
| CN114918535A (en) * | 2022-05-30 | 2022-08-19 | 武汉大学 | Multi-factor experimental device for water jet assisted laser machining and experimental method using multi-factor experimental device |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004027229A1 (en) * | 2004-06-03 | 2006-01-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for welding workpieces made from aluminum or aluminum alloy comprises electrolytically oxidizing the workpieces and vaporizing each anodized layer using a pulsed laser beam |
| CN102528280A (en) * | 2012-01-16 | 2012-07-04 | 山东大学 | Laser-water jet composite micromachining process and device |
| CN103056520A (en) * | 2013-01-14 | 2013-04-24 | 温州大学 | Laser drilling method |
| CN103358028A (en) * | 2013-07-16 | 2013-10-23 | 桂林电子科技大学 | Method and system for scribing brittle ultrathin piece by water jet and laser |
| CN104175001A (en) * | 2014-08-26 | 2014-12-03 | 江苏大学 | Laser micro-pit array making device and method |
| US20150294840A1 (en) * | 2014-04-14 | 2015-10-15 | Northwestern University | Laser Induced Plasma Micromachining (LIPMM) |
| CN107433397A (en) * | 2017-08-02 | 2017-12-05 | 武汉大学 | A kind of wafer cutting device and method of jet auxiliary laser plasma |
| CN108213748A (en) * | 2018-01-17 | 2018-06-29 | 山东大学 | Laser Beam Quality Factor measuring device and method in laser-water jet Compound Machining |
| CN108326554A (en) * | 2018-04-12 | 2018-07-27 | 桂林电子科技大学 | A kind of laser water jet Machining System |
| CN108526627A (en) * | 2018-06-27 | 2018-09-14 | 江苏大学 | A kind of semi-conducting material laser electrochemical copolymerization micro-processing method and device |
| CN109092802A (en) * | 2018-08-06 | 2018-12-28 | 山东大学 | A kind of minimizing technology of scrap hard alloy surface covering |
| CN109514078A (en) * | 2019-01-09 | 2019-03-26 | 桂林电子科技大学 | Water jet auxiliary laser system of processing and method |
-
2019
- 2019-05-16 CN CN201910409264.5A patent/CN111940895A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004027229A1 (en) * | 2004-06-03 | 2006-01-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for welding workpieces made from aluminum or aluminum alloy comprises electrolytically oxidizing the workpieces and vaporizing each anodized layer using a pulsed laser beam |
| CN102528280A (en) * | 2012-01-16 | 2012-07-04 | 山东大学 | Laser-water jet composite micromachining process and device |
| CN103056520A (en) * | 2013-01-14 | 2013-04-24 | 温州大学 | Laser drilling method |
| CN103358028A (en) * | 2013-07-16 | 2013-10-23 | 桂林电子科技大学 | Method and system for scribing brittle ultrathin piece by water jet and laser |
| US20150294840A1 (en) * | 2014-04-14 | 2015-10-15 | Northwestern University | Laser Induced Plasma Micromachining (LIPMM) |
| CN104175001A (en) * | 2014-08-26 | 2014-12-03 | 江苏大学 | Laser micro-pit array making device and method |
| CN107433397A (en) * | 2017-08-02 | 2017-12-05 | 武汉大学 | A kind of wafer cutting device and method of jet auxiliary laser plasma |
| CN108213748A (en) * | 2018-01-17 | 2018-06-29 | 山东大学 | Laser Beam Quality Factor measuring device and method in laser-water jet Compound Machining |
| CN108326554A (en) * | 2018-04-12 | 2018-07-27 | 桂林电子科技大学 | A kind of laser water jet Machining System |
| CN108526627A (en) * | 2018-06-27 | 2018-09-14 | 江苏大学 | A kind of semi-conducting material laser electrochemical copolymerization micro-processing method and device |
| CN109092802A (en) * | 2018-08-06 | 2018-12-28 | 山东大学 | A kind of minimizing technology of scrap hard alloy surface covering |
| CN109514078A (en) * | 2019-01-09 | 2019-03-26 | 桂林电子科技大学 | Water jet auxiliary laser system of processing and method |
Non-Patent Citations (1)
| Title |
|---|
| V.TANGWARODOMNUKUN ET AL.: "An investigation of hybrid laser–waterjet ablation of silicon substrates", 《INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112894359A (en) * | 2021-01-05 | 2021-06-04 | 中国人民解放军陆军装甲兵学院 | Jet cutting method and system thereof |
| CN112894359B (en) * | 2021-01-05 | 2022-03-01 | 中国人民解放军陆军装甲兵学院 | Jet cutting method and system thereof |
| CN114273790A (en) * | 2022-02-15 | 2022-04-05 | 山东大学 | Femtosecond laser processing device and method for etching gallium nitride in liquid phase |
| CN114918535A (en) * | 2022-05-30 | 2022-08-19 | 武汉大学 | Multi-factor experimental device for water jet assisted laser machining and experimental method using multi-factor experimental device |
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