CN102528280A - Laser-water jet composite micromachining process and device - Google Patents
Laser-water jet composite micromachining process and device Download PDFInfo
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- CN102528280A CN102528280A CN2012100127319A CN201210012731A CN102528280A CN 102528280 A CN102528280 A CN 102528280A CN 2012100127319 A CN2012100127319 A CN 2012100127319A CN 201210012731 A CN201210012731 A CN 201210012731A CN 102528280 A CN102528280 A CN 102528280A
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Abstract
The invention relates to a laser micromachining process and in particular relates to a laser-water jet composite micromachining process and device. The composite micromachining process comprises the following steps of: positioning water jet at the back of a laser beam, leaning the water jet, and simultaneously acting the water jet on the surface of a material, wherein the parameter of a water jet offset distance is as follows: the water jet offset distance, namely the range of the distance between a laser beam action point and post-positioned water jet erosion point, is 0.4-0.8mm; the focal plane position (fpp) parameter of the laser beam is minus 0.6mm-0mm; the energy parameter of laser pulse is 0.3mJ-0.6mJ; the overlap coefficient of mobile laser pulse is 99.3%-99.9%; and the pressure of water jet is 5MPa-20Mpa, and the erosion angle of the water jet is 30-60 degrees. The device provided by the invention is composed of a base body consisting of a horizontal guide rail and a vertical guide rail, a horizontal slide plate, a vertical slide plate, a rotary adjusting support, a water jet unit and a laser cutting unit. According to the invention, the laser heating and softening temperature is far less than the melting or gasifying temperature, the heat influence on a material machining zone is reduced, and high-efficiency, stable and near-nondestructive precise machining is realized.
Description
One, technical field
The present invention relates to the laser fine technology, especially a kind of laser-water jet composite fine processing technology and device thereof.
Two, background technology
The laser fine system of processing can be processed multiple materials such as plastics, glass, pottery, semi-conducting material and metallic films, and machining accuracy can reach micron order.Its system of processing is widely used in every field such as the processing, the production of biologic medical apparatus, computer manufacturing, telecommunications of semi-conducting material and microelectronic component.The diameter of laser can reach several microns even littler, and has high photon energy, and institute's material processed can heat, melts and gasify.Therefore, utilize the laser processing technology of this principle to be widely used in the fine processes such as cutting, micropore, etching.But Laser Processing also exists machining area to produce the defective of fire damage.Be to reduce the fire damage of processing district, many researchers have carried out process modification to the conventional laser Micrometer-Nanometer Processing Technology, and commonly used has: use ultra-short pulse laser process technology, Wei Shui to lead laser processing technology and the water jet auxiliary laser heat process technology of shaking:
1. ultra-short pulse laser process technology: through sending very short pulse laser (comprising picosecond laser and femtosecond laser), to prevent in the erosion process accumulation of heat and around the little tissue of material, to transmit.For example picosecond laser and femtosecond laser have high photon energy, can at heat before the workpiece material internal delivery, destroy the atomic lattice of material in a short period of time and remove rapidoprint, and not cause that workpiece material produces melt layer and thermal stress.But the material removing rate of this method is lower.
2. little water is led laser processing technology: utilize the optical fiber effect guiding laser of little water jet, little water jet also plays the effect of cooling machining area simultaneously.This technology can reach higher material removing rate, little heat affected area.But high power laser and water under high pressure all can cause the atomizing of little water jet, influence the continuity of little water jet, thus influence laser beam transmission, cause the instability of process.In addition, the size of laser spots depends on the size of water jet, is difficult to realize the demand of micron order processing.
3. the water jet auxiliary laser heat process technology of shaking: this technology adopts LASER HEATING material, utilizes the quick coolant of low-pressure water jet again, and being shaken by heat causes the controlled expansion of material production crackle, to reach the purpose of removing material.But this process technology has inevitably been introduced the crackle damage to the processing district, and causes the reduction of crudy.
Three, summary of the invention
The objective of the invention is to overcome existing conventional laser microfabrication, ultra-short pulse laser processing, little water and lead Laser Processing and the water jet auxiliary laser heat defective that process technology exists of shaking, a kind of laser-water jet composite fine processing technology and device thereof is provided.
In laser-water jet composite fine machining process, pulsed laser energy is big more, and the width in its thermoplastic district is big approximately, so the increase of the material removing rate of water jet erosion, and width of slit and degree of depth increase.High mobile laser pulse overlap coefficient can increase the width of LASER HEATING softened zone, therefore can improve the material removing rate of water jet erosion, increases the width of slit and the degree of depth simultaneously.Water jet pressure is high more, and the erosion shear ability of water jet is strong more, also can cause the width of slit and the degree of depth to increase.Simultaneously, excessive water jet pressure also can increase the damage in erosion district.Impact dynamics and shear action in the water jet erosion angle erosion process, thus material removing rate influenced.Therefore, optimizing above technological parameter is the important means that improves in laser-water jet composite fine processing crudy.The present invention adopts a kind of new laser material to remove theory; Promptly with laser with the material local softening, through preferred machined parameters; Optimize processing technology, the water jet erosion is removed by the softening material of laser simultaneously, to reach the nearly not damaged processing to difficult-to-machine material.
Basic design of the present invention comprises laser-water jet composite fine processing technology and back biasing laser-water jet combined cutting device:
Laser-water jet composite fine processing technology is that water jet is placed on laser beam, and water jet is tilted, and makes laser and water jet act on material surface simultaneously; The water jet offset or dish is the range of choice of distance between laser beam application point and the rearmounted water jet eroded spot: 0.4-0.8mm; The adjusting range of the focal plane position of laser beam (fpp) is: according to the processing request of different depths of cut and width, adjusting range is-0.6mm-0mm; The range of choice of pulsed laser energy is: 0.3mJ-0.6mJ; The range of choice that moves the laser pulse overlap coefficient is: 99.3%-99.9%; The range of choice of water jet pressure is: 5MPa-20MPa; The range of choice of water jet erosion angle is: 30 °-60 °.
Implement the back biasing laser-water jet combined cutting device of laser-water jet composite fine processing technology; Its structure is that matrix, horizontal adjusting slider, vertical adjusting slide plate, revolution adjusting support, water jet unit, the cut unit be made up of horizontal guide rail, vertical guide rail constitute; Horizontal adjusting slider is installed on the horizontal guide rail, revolution is installed on the horizontal adjusting slider regulates support, the vertical adjusting slide plate is installed on the vertical guide rail, horizontal adjusting slider and vertical adjusting slide plate are respectively by driven by servomotor; The water jet unit is installed in revolution and regulates on the support, and the cut unit is installed on the vertical adjusting slide plate; The water jet unit is to be made up of water jet nozzle, water jet nozzle pipe, water under high pressure pipeline, accumulator and pneumatic booster pump; The cut unit is made up of laser cutting head and optical system thereof and accurate focal plane position adjusting device.This device cooperates numerical control diaxon travelling table to use, and the diaxon travelling table is placed in biasing laser-water jet combined cutting device bottom, back.
For ease of control, the water jet nozzle bore should be greater than laser spot, and the water jet nozzle bore is preferably 0.57mm.The hydraulic pressure of water jet should increase shearing force as far as possible, but can not damage workpiece.The cut unit uses nanosecond pulse optical-fiber laser, its wavelength 1080nm; The maximum pulse energy of laser is at 42ns 0mJ-1mJ in the time, frequency range 20kHz-100kHz.
Biasing laser-water jet combined cutting device in back through the water under high pressure of pneumatic booster pump generation 0MPa-67MPa, is stablized hydraulic pressure with accumulator; The cut unit uses nanosecond pulse optical-fiber laser, its wavelength 1080nm; The maximum pulse energy of laser is at 42ns 0mJ-1mJ in the time, frequency range 20kHz-100kHz.The laser focal plane position can be through having the accurate focal plane position adjusting device manual adjustments of 1 μ m sensitivity in the laser cutting head.
Three adjustment motions can be realized in water jet unit in the combined cutting device.First motion is to regulate through the interlock of vertical adjusting slide plate and horizontal adjusting slider, and the realization water jet nozzle moves along its axis, to realize different water jet ranges.Second motion is through the horizontal adjusting slider of independent adjusting, makes water jet nozzle to regulate the relative position between water jet eroded spot and the LASER HEATING point, promptly regulate the water jet offset or dish along moving horizontally.The 3rd motion is to regulate the angular adjustment that support is realized water jet nozzle through regulating the water jet unit rotational, to regulate water jet erosion angle.
Basic principle of the present invention is: be not to rely on laser that material is melted or gasification, but utilize laser with material heating, softening, high-pressure water jet is removed softening material through the high speed erosion then, simultaneously coolant.
The present invention compares with existing laser processing technology; LASER HEATING, softening temperature had both reduced the processing heat affecting far below melting or the temperature of gasification, had reduced the energy input quantity of machining area again; Can allow higher process velocity; And the cooling effect of water jet is stronger, has further reduced the heat affecting to the materials processing zone, has improved crudy.The removal of material is main with the erosion removal in the process, also comprises the booster action that liquidates the thermal shock effect etching off removes.The present invention is a kind of efficient, low consumption, stable, near undamaged retrofit technology.
Four, description of drawings
Fig. 1 is laser-water jet composite fine processing technology schematic diagram;
Fig. 2 is back biasing laser-water jet combined cutting device structural representation;
Fig. 3 is a common laser work piece surface quality entities microphotograph;
Fig. 4 is embodiment 1 a workpiece machining surface quality entities microphotograph;
Fig. 5 is embodiment 2 workpiece machining surface quality entities microphotographs.
Reference numeral:
1, laser beam, 2, the water-jet a fluid stream, 3, the water jet nozzle pipe, 4, workpiece, 5, the vertical adjusting slide plate; 6, vertical guide rail, 7, laser cutting head, 8, horizontal guide rail, 9, horizontal adjusting slider; 10, water jet unit, 11, water jet nozzle rotate to regulate support, 12, water jet nozzle, 13, diaxon moves numerical control table, NC table; θ, water jet erosion angle, L, water jet range, f, water jet offset or dish, h, focal plane distance.
Five, the specific embodiment
The present invention is applied to the precise cutting processing of silicon single crystal wafer, has obtained desirable processing effect.Describe implementation process of the present invention in detail in conjunction with Fig. 1, Fig. 2.
Embodiment 1:
Processing thickness is the silicon single crystal wafer of 700 μ m, material property such as table 1.
Table 1 silicon single crystal wafer material property
| Density [kg/m 3] | Thermal conductivity [W/mK] | Thermal capacity [J/kgK] | Thermal diffusivity [m 2/s] | Melt temperature [K] |
| ?2329 | 130 | 700 | 7.974×10 -5 | ?1687 |
Processing request: thermal injury zone's width is less than 20 μ m
According to material property, thickness and the processing request of rapidoprint, select laser-water jet composite fine fabrication process condition following:
Water jet offset or dish: 0.6mm
The focal plane position of laser beam (fpp): 0mm
Pulsed laser energy: 0.3mJ
Move the laser pulse overlap coefficient: 99.3%
Water jet pressure: 5MPa
Water jet erosion angle: 30 °
Water jet range: 2mm
Workpiece is installed: silicon single crystal wafer workpiece 4 is installed on diaxon and moves on the numerical control table, NC table 13, moves numerical control table, NC table 13 by diaxon and drives the silicon single crystal wafers feeding of finishing the work.The moving displacement that diaxon moves numerical control table, NC table 13 can reach 300mm, kinematic accuracy 1 μ m.
The adjustment of back biasing laser-water jet combined cutting device: at first through regulating horizontal adjusting slider 9 separately, make water jet nozzle along moving horizontally, regulating the water jet offset or dish is 0.6mm; Through being installed on the accurate focal plane position adjusting handle in the laser cutting head 7 on the vertical adjusting slide plate 5, the optical lens position of manual adjustments laser cutting head optical system, the focal plane position that makes laser beam is 0mm; Through regulating laser cutting head 7 selection pulsed laser energies is 0.3mJ; Through regulating the laser pulse frequency that diaxon moves the translational speed of numerical control table, NC table 13 and selects to adapt with it, it is 99.3% that the laser pulse overlap coefficient is moved in control; The pressure of regulating pneumatic booster pump selection water jet is 5MPa; The water jet nozzle rotation adjusting support 11 selection water jet erosion angles that are installed on the horizontal adjusting slider 9 through adjusting are 30 °; Interlock through vertical adjusting slide plate 5 and horizontal adjusting slider 9 is regulated, and realizes that water jet nozzle moves along its axis, to realize that the water jet range is 2mm.
In the process; The pulse laser that at first utilizes laser cutting head 7 to send heats the silicon single crystal wafer material, soften; Utilize the water jet of 5MPa to impact the silicon single crystal wafer surface with 30 ° of erosion angles again, through the erosion effect softening material is removed, the while is cooling silicon single crystal wafer material rapidly.
Present embodiment shows; Through rational selection laser power and technological parameters such as other parameter, laser spot plan range, mobile laser pulse overlap coefficient (this coefficient is relevant with laser frequency and cutting head translational speed), water jet pressure, water jet offset or dish and erosion angle; Realization is with the laser of smaller power; The erosion effect of hydrous water jet realizes the cutting of silicon single crystal wafer, and the approaching no fire damage of finished surface, and thermal injury zone's width is less than 20 μ m; Minimum less than 10 μ m, the breakable layer of monocrystalline silicon piece surface to be machined (promptly not having lattice layer) thickness is less than 40nm.
Embodiment 2:
Processing thickness is the silicon single crystal wafer of 700 μ m, material property such as table 1.
Processing request: the one-stroke cutting width is greater than 50 μ m (characterizing material removing rate with the one-stroke cutting width) indirectly
According to material property, thickness and the processing request of rapidoprint, select laser-water jet composite fine fabrication process condition following:
Water jet offset or dish: 0.6mm
The focal plane position of laser beam (fpp): 0mm
Pulsed laser energy: 0.6mJ
Move the laser pulse overlap coefficient: 99.9%
Water jet pressure: 20MPa
Water jet erosion angle: 60 °
Water jet range: 2mm
Workpiece is installed: silicon single crystal wafer workpiece 4 is installed on diaxon and moves on the numerical control table, NC table 13, moves numerical control table, NC table 13 by diaxon and drives the silicon single crystal wafers feeding of finishing the work.The moving displacement that diaxon moves numerical control table, NC table 13 can reach 300mm, kinematic accuracy 1 μ m.
The adjustment of back biasing laser-water jet combined cutting device: at first through regulating horizontal adjusting slider 9 separately, make water jet nozzle along moving horizontally, regulating the water jet offset or dish is 0.6mm; Through being installed on the accurate focal plane position adjusting handle in the laser cutting head 7 on the vertical adjusting slide plate 5, the optical lens position of manual adjustments laser cutting head optical system, the focal plane position that makes laser beam is 0mm; Through regulating laser cutting head 7 selection pulsed laser energies is 0.6mJ; Through regulating the laser pulse frequency that diaxon moves the translational speed of numerical control table, NC table 13 and selects to adapt with it, it is 99.9% that the laser pulse overlap coefficient is moved in control; The pressure of regulating pneumatic booster pump selection water jet is 20MPa; The water jet nozzle rotation adjusting support 11 selection water jet erosion angles that are installed on the horizontal adjusting slider 9 through adjusting are 60 °; Interlock through vertical adjusting slide plate 5 and horizontal adjusting slider 9 is regulated, and realizes that water jet nozzle moves along its axis, to realize that the water jet range is 2mm.
In the process; The laser that at first utilizes laser cutting head 7 to send heats the silicon single crystal wafer material, soften; Utilize the water jet of 20MPa to impact the silicon single crystal wafer surface with 60 ° of erosion angles again, through the erosion effect softening material is removed, the while is cooling silicon single crystal wafer material rapidly.
Present embodiment shows; Through rational selection laser power and technological parameters such as other parameter, laser spot plan range, mobile laser pulse overlap coefficient (relevant with the cutting head translational speed), water jet pressure, water jet offset or dish and erosion angle with laser frequency; Realization is with the laser of smaller power; The erosion effect of hydrous water jet realizes the high efficiency cutting of silicon single crystal wafer; One-stroke cutting processing thickness be the cutting width of silicon single crystal wafer of 700 μ m greater than 120 μ m, and finished surface is near no fire damage, thermal injury zone's width is less than 25 μ m.
Claims (3)
1. laser-water jet composite fine processing technology, it is characterized by laser-water jet composite fine processing technology is that water jet is placed on laser beam, and water jet is tilted, and makes laser and water jet act on material surface simultaneously; The water jet offset or dish is that the range of choice of distance between laser beam application point and the rearmounted water jet eroded spot is: 0.4-0.8mm; The adjusting range of the focal plane position of laser beam (fpp) is: according to the processing request of different depths of cut and width, adjusting range is-0.6mm-0mm; The range of choice of pulsed laser energy is: 0.3mJ-0.6mJ; The range of choice that moves the laser pulse overlap coefficient is: 99.3%-99.9%; The range of choice of water jet pressure is: 5MPa-20MPa; The range of choice of water jet erosion angle is: 30 °-60 °.
2. implement the back biasing laser-water jet combined cutting device of claim 1 processing technology; Cooperate numerical control diaxon travelling table to use; The diaxon travelling table is placed in the bottom, cut unit of back biasing laser-water jet combined cutting device, it is characterized by the matrix of being made up of horizontal guide rail, vertical guide rail, horizontal adjusting slider, vertical adjusting slide plate, revolution adjusting support, water jet unit, cut unit and constitutes; Horizontal adjusting slider is installed on the horizontal guide rail, revolution is installed on the horizontal adjusting slider regulates support, the vertical adjusting slide plate is installed on the vertical guide rail, horizontal adjusting slider and vertical adjusting slide plate are respectively by driven by servomotor; The water jet unit is installed in revolution and regulates on the support, and the cut unit is installed on the vertical adjusting slide plate; The water jet unit is to be made up of water jet nozzle, water jet nozzle pipe, water under high pressure pipeline, accumulator and pneumatic booster pump; The cut unit is made up of laser cutting head and optical system thereof and accurate focal plane position adjusting device.
3. biasing laser-water jet combined cutting device in back according to claim 2 is characterized by described water jet nozzle bore and is preferably 0.57mm.
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Application publication date: 20120704 |