CN115365639A - Method for processing C/SiC composite material based on ultrasonic vibration assisted femtosecond laser - Google Patents
Method for processing C/SiC composite material based on ultrasonic vibration assisted femtosecond laser Download PDFInfo
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- CN115365639A CN115365639A CN202211176127.XA CN202211176127A CN115365639A CN 115365639 A CN115365639 A CN 115365639A CN 202211176127 A CN202211176127 A CN 202211176127A CN 115365639 A CN115365639 A CN 115365639A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
A method for processing C/SiC composite material based on ultrasonic-assisted high-repetition-frequency femtosecond laser comprises the steps of firstly building a femtosecond laser processing light path system, wherein a light path comprises a high-repetition-frequency femtosecond laser, laser output by the high-repetition-frequency femtosecond laser sequentially passes through a 1/2 wave plate, a beam splitter prism, a beam expander and the like to enter a vibrating mirror and vertically irradiate on a processing station of an ultrasonic vibration device, the amplitude of the ultrasonic vibration device is controlled by an ultrasonic generator, the position of the ultrasonic vibration device is controlled by a three-dimensional moving platform, and a computer is used for controlling the vibrating mirror so as to control the power, the motion track speed and the defocusing amount of a laser focus and the material surface in the processing process of the high-repetition-frequency femtosecond laser, the vibrating mirror and the three-dimensional moving platform; the ultrasonic vibration cavitation effect and the near-field convection enhancement effect of the invention are beneficial to reducing particle shielding, better cooling ablated particles and scraps, reducing the tendency of the particles and the scraps to be combined with the surface of a material, reducing surface oxidation, and improving the quality and the removal depth of a processed surface; the obtained C/SiC composite material has smooth and flat surface.
Description
Technical Field
The invention belongs to the technical field of ultrafast laser micromachining, and particularly relates to a method for machining a C/SiC composite material based on ultrasonic vibration assisted high repetition frequency femtosecond laser.
Background
The C/SiC composite material has the unique properties of low density, high temperature resistance, high strength, high toughness, high thermal conductivity and the like, and is an attractive high-temperature structural ceramic material in advanced aviation propulsion engines and high-speed civil transportation applications. However, since the C/SiC composite material composed of carbon fibers and a silicon carbide matrix is a difficult-to-process material, the reinforcing phase of the carbon fibers brings anisotropy and heterogeneity, while the hardness of the silicon carbide matrix is second only to diamond; therefore, processing high-quality C/SiC composite materials is still a problem to be solved urgently.
The machining method of the C/SiC composite material, such as grinding and milling, is a traditional and common machining method, but the method is easy to generate surface defects such as tipping, tearing, burrs, cracks, fibers and the like, and the machining defects seriously affect the quality and subsequent functional performance of parts. Compared with the traditional processing mode, the ultrashort pulse laser processing has the characteristics of small heat damage, high processing precision, low requirement on materials, wide processing range and the like, and can realize high-precision processing. Currently, laser processing methods applied to precision processing of composite materials mainly include laser tilt processing and ultrasonic vibration assisted laser processing. The laser tilt processing technology is mainly applied to the current laser tilt processing technology, a method for processing a workpiece in a tilt mode is mainly adopted to achieve laser tilt processing, a tilt device platform used in the method is complex, cooperative control operation among motion shafts is needed, the device is complex, operation difficulty is high, and transverse and longitudinal uniformity of a processed surface is difficult to guarantee. The ultrasonic vibration assisted laser processing is used for realizing the processing of the surface of the composite material, but the processing track of the existing method mainly needs the cooperative control of a scanning galvanometer and a moving platform, and the method also has the defects of complex operation, high requirement on motion precision, low processing efficiency and difficult guarantee of experimental effect. In addition, most of the existing ultrafast laser processing technologies are processing at a focus, and because the energy intensity of the laser focus is high, the filament effect is easily induced, and the instability of light beam transmission is caused.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a method for processing a C/SiC composite material based on ultrasonic-assisted high-repetition-frequency femtosecond laser, which combines laser and ultrasonic processing methods, reduces the ion shielding effect and particle deposition in the laser processing process based on the cavitation effect and convection enhancement effect of ultrasonic vibration, and improves the quality of the processed surface; in addition, adjust three-dimensional moving platform's height control ultrasonic vibration device and go up the defocusing volume of sample surface and laser focus, and then control facula diameter size and energy density, utilize the scanning speed of scanning galvanometer control processing orbit simultaneously, cooperation between the two, can regulate and control the matching relation of supersound amplitude and energy density, and adjust facula size and scanning speed as required and optimize the facula overlap ratio and improve machining efficiency, its easy operation, machining efficiency is high, and the smooth surface of non-fiber breakage that can obtain, the fiber is extracted, the hole.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for processing a C/SiC composite material based on ultrasonic-assisted high repetition frequency femtosecond laser comprises the following steps:
1) Ultrasonically cleaning the C/SiC composite material by using acetone, absolute ethyl alcohol and deionized water respectively, and then drying by using dry nitrogen to obtain a clean C/SiC composite material sample 10;
2) The femtosecond laser processing light path system is set up, the light path comprises a high-repetition-frequency femtosecond laser 1, laser output by the high-repetition-frequency femtosecond laser 1 sequentially passes through a 1/2 wave plate 2, a beam splitter prism 4 and a first reflector 5, after the first reflector 5 enables the light path to rotate by 90 degrees, laser beams pass through a beam expander 6 and a second reflector 12 and then enter a vibrating mirror 11 through the second reflector 12 to vertically irradiate on a processing station of an ultrasonic vibration device 9, wherein the amplitude of the ultrasonic vibration device 9 is controlled by an ultrasonic generator 7, the position of the ultrasonic vibration device 9 is controlled by a three-dimensional moving platform 8, the laser power is detected by the combination of the 1/2 wave plate 2, the beam splitter prism 4 and a power meter 3, and meanwhile, a computer 13 is used for controlling the vibrating mirror 11 so as to control the power, the movement speed and the track of the high-repetition-frequency femtosecond laser 1, the vibrating mirror 11 and the three-dimensional moving platform 8 in the processing process;
3) Fixing a C/SiC composite material sample 10 on an ultrasonic vibration device 9, providing a sample processing region starting position by controlling an X axis and a Y axis of a three-dimensional moving platform 8, and adjusting the distance between a Z axis control laser focus and the surface of the C/SiC composite material sample 10;
4) The ultrasonic generator 7 is used for adjusting the power of ultrasonic vibration and controlling the amplitude of the ultrasonic vibration device 9 in the vertical direction;
5) Adjusting the output power of the high repetition frequency femtosecond laser 1 by using a computer 13, wherein the laser wavelength is 1030nm, the pulse width is 240fs, and the repetition frequency is 50kHz;
6) The movement track and the scanning speed on the surface of the C/SiC composite material sample 10 are regulated and controlled by using the galvanometer 11, transverse scanning is firstly carried out, and then longitudinal scanning is carried out, so that the surface of the C/SiC composite material with smooth surface and no fiber damage is obtained.
The distance between the laser Jiao Dianju and the surface of the C/SiC composite material sample 10 in the step 3) is 0-5 mm, and the negative sign indicates that the focus of the laser is below the surface of the C/SiC composite material sample 10.
The range of the vibration amplitude of the ultrasonic vibration device 9 in the step 4) is 10-40 μm.
The output power range of the high repetition frequency femtosecond laser 1 in the step 5) is 2-12W.
The interval of the scanning tracks in the step 6) is 5 mu m, and the scanning speed is 200-1400mm/s.
The invention has the beneficial effects that:
the amplitude of vibration is controlled by adjusting the ultrasonic power, and the plasma shielding, fiber breakage, fiber extraction, holes and surface particle deposition are favorably reduced under the cavitation effect and near-field convection enhancement effect of ultrasonic vibration; the negative defocusing amount can be controlled by adjusting the movement of the three-dimensional moving platform 8Z axis, the optical fiber effect of a focus on the surface of a material under high power can be avoided, and the diameter of a light spot can be controlled, so that the laser energy density and the light spot overlapping rate can be controlled, the matching relation between the energy density and the ultrasonic amplitude can be regulated, and the uniformity of the processing quality can be ensured; the scanning speed of the laser motion track and the defocusing amount are regulated and controlled by the galvanometer 5, so that the spot overlapping rate can be optimized, and the processing efficiency and quality are further improved.
Drawings
FIG. 1 is a schematic diagram of the optical path of the present invention.
FIG. 2 is a diagram of the movement locus of a C/SiC composite material beam processed by the method.
FIG. 3 is a graph showing the effect of the unprocessed C/SiC composite material of example 1, wherein (a) and (b) are surface topography at the transverse fibers and the longitudinal fibers, respectively, of the femtosecond laser processed C/SiC composite material sample piece of example 1 without applying ultrasonic vibration.
FIG. 4 is a graph showing the effect of laser processing the C/SiC composite material alone in example 1, wherein (a) and (b) are the surface topography at the transverse fibers and the longitudinal fibers, respectively, of the sample piece of femtosecond laser processed C/SiC composite material without ultrasonic vibration applied thereto in this example.
FIG. 5 is a graph showing the effect of the ultrasonic-assisted laser processing of the C/SiC composite material in example 1, wherein (a) and (b) are surface features of the transverse fibers and the longitudinal fibers of the sample processed by the ultrasonic-vibration-assisted femtosecond laser processing of the C/SiC composite material in this example, respectively.
Detailed Description
The invention is further illustrated with reference to the following figures and examples.
1) Respectively carrying out ultrasonic cleaning on the 30 x 30mm C/SiC composite material by using acetone, absolute ethyl alcohol and deionized water, and then drying by using dry nitrogen to obtain a clean C/SiC composite material sample 10;
2) The femtosecond laser processing light path system is set up, referring to fig. 1, the light path comprises a high-repetition-frequency femtosecond laser 1, laser output by the high-repetition-frequency femtosecond laser 1 sequentially passes through a 1/2 wave plate 2, a beam splitter prism 4 and a first reflector 5, after the light path is rotated by the first reflector 5 for 90 degrees, laser beams pass through a beam expander 6 and a second reflector 12 and then enter a vibrating mirror 11 through the second reflector 12 to vertically irradiate on a processing station of an ultrasonic vibration device 9, wherein the amplitude of the ultrasonic vibration device 9 is controlled by an ultrasonic generator 7, the position of the ultrasonic vibration device 9 is controlled by a three-dimensional moving platform 8, the laser power is detected by the combination of the 1/2 wave plate 2, the beam splitter prism 4 and a power meter 3, and meanwhile, a computer 13 is used for controlling the vibrating mirror 11 so as to control the power, the movement speed and the track of the high-repetition-frequency femtosecond laser 1, the vibrating mirror 11 and the three-dimensional moving platform 8 in the processing process;
3) Fixing a C/SiC composite material sample 10 on an ultrasonic vibration device 9, providing a sample processing area initial position by controlling an X axis and a Y axis of a three-dimensional moving platform 8, adjusting a Z axis to control the distance between a laser focus and the surface of the C/SiC composite material sample 10, wherein the distance between the laser Jiao Dianju C/SiC composite material sample 10 surface is-4 mm, and the minus sign indicates that the laser focus is below the surface of the C/SiC composite material sample 10;
4) The ultrasonic generator 7 is used for adjusting the power of ultrasonic vibration, and the amplitude of the ultrasonic vibration device 9 in the vertical direction is controlled to enable the range of the ultrasonic amplitude to be 28 microns;
5) Adjusting the output power of the high repetition frequency femtosecond laser 1 by using a computer 13, wherein the laser wavelength is 1030nm, the pulse width is 240fs, the repetition frequency is 50kHz, and the output power is 12W;
6) And regulating and controlling a motion track and a scanning speed on the surface of the C/SiC composite material sample 10 by using a galvanometer 11, wherein the interval of the scanning tracks is set to be 5 mu m, the scanning speed is set to be 1000mm/s, firstly, transverse scanning is carried out, then, longitudinal scanning is carried out, and referring to fig. 2, the surface of the C/SiC composite material with a smooth surface and no fiber damage is obtained, and the surface roughness of the C/SiC composite material reaches 1 mu m.
The effect of this embodiment: referring to fig. 3, 4 and 5, (a) and (b) in fig. 3 are surface morphologies at the transverse fibers and the longitudinal fibers of the femtosecond laser processed C/SiC composite material sample wafer without ultrasonic vibration in the present embodiment, respectively, the material surface is rough, there are significant fiber breakage and extraction, and the distribution is not uniform; fig. 4 (a) and (b) show the surface topography of the transverse fibers and the longitudinal fibers of the sample wafer of the C/SiC composite material processed by the femtosecond laser without applying ultrasonic vibration in the present embodiment, respectively, the material surface is rough, and has significant defects such as fiber pull-out, fiber breakage, and holes, and the surface has a large amount of particle deposition and holes; in fig. 5, (a) and (b) are the surface morphologies of the transverse fibers and the longitudinal fibers of the C/SiC composite material processing sample processed by the ultrasonic vibration assisted femtosecond laser in the embodiment, respectively, the surface quality of the material is significantly improved, the surface of the material is smooth, and the defects such as fiber extraction, holes, particle deposition and the like are avoided.
Example 2, the distance from the surface of the laser Jiao Dianju C/SiC composite sample 10 in step 3) of example 1 was changed to 0mm; the range of the vibration amplitude of the ultrasonic vibration device 9 in the step 4) is changed to 10 μm; step 5), changing the output power of the medium-high frequency femtosecond laser 1 to 2W; the scanning speed in the step 6) is changed to 200mm/s; other steps are the same as in example 1; the effect of this example is similar to that of example 1.
Example 3, the distance from the surface of the laser Jiao Dianju C/SiC composite sample 10 in step 3) of example 1 was changed to-5 mm; the range of the vibration amplitude of the ultrasonic vibration device 9 in the step 4) is changed to 40 μm; the scanning speed in the step 6) is changed to 1400mm/s; the other steps are the same as in example 1; the effect of this example is similar to that of example 1.
Claims (6)
1. A method for processing a C/SiC composite material based on an ultrasonic-assisted high-repetition-frequency femtosecond laser is characterized by comprising the following steps:
1) Respectively carrying out ultrasonic cleaning on the C/SiC composite material by using acetone, absolute ethyl alcohol and deionized water, and then drying by using dry nitrogen to obtain a clean C/SiC composite material sample (10);
2) The femtosecond laser processing light path system is set up, the light path comprises a high repetition frequency femtosecond laser (1), laser output by the high repetition frequency femtosecond laser (1) sequentially passes through a 1/2 wave plate (2), a beam splitter prism (4) and a first reflector (5), after the light path is rotated by 90 degrees by the first reflector (5), the laser beam passes through a beam expander (6) and a second reflector (12), then enters a vibrating mirror (11) through the second reflector (12) and vertically irradiates on a processing station of an ultrasonic vibration device (9), wherein the amplitude of the ultrasonic vibration device (9) is controlled by an ultrasonic generator (7), the position of the ultrasonic vibration device (9) is controlled by a three-dimensional moving platform (8), the laser power is detected by combining a 1/2 wave plate (2), the beam splitter prism (4) and a power meter (3), and meanwhile, a computer (13) is used for controlling the vibrating mirror (11) so as to control the power, the motion speed and the trajectory of the high repetition frequency femtosecond laser (1), the vibrating mirror (11) and the three-dimensional moving platform (8) in the processing process;
3) Fixing a C/SiC composite material sample 10 on an ultrasonic vibration device 9, providing a sample processing region starting position by controlling an X axis and a Y axis of a three-dimensional moving platform 8, and adjusting the distance between a Z axis control laser focus and the surface of the C/SiC composite material sample 10;
4) Controlling the amplitude of the ultrasonic vibration device (9) in the vertical direction by using an ultrasonic generator (7);
5) Adjusting the output power of a high repetition frequency femtosecond laser (1) by using a computer (13), wherein the laser wavelength is 1030nm, the pulse width is 240fs, and the repetition frequency is 50kHz;
6) And regulating and controlling the motion track and the scanning speed on the surface of the C/SiC composite material sample (10) by using a galvanometer (11), firstly carrying out transverse scanning, and then carrying out longitudinal scanning to obtain the C/SiC composite material surface with a smooth surface and no fiber damage.
2. The method of claim 1, wherein: the distance between the laser Jiao Dianju and the surface of the C/SiC composite material sample (10) in the step 3) is 0-6 cm, and the minus sign indicates that the laser focus is below the surface of the C/SiC composite material sample (10).
3. The method of claim 1, wherein: the range of the vibration amplitude of the ultrasonic vibration device (9) in the step 4) is 10-40 μm.
4. The method of claim 1, wherein: the output power range of the high-repetition-frequency femtosecond laser (1) in the step 5) is 2-12W.
5. The method of claim 1, wherein: in the step 6), the interval of the scanning tracks is 5 mu m, and the scanning speed is 200-1600mm/s.
6. The method of claim 1, comprising the steps of:
1) Respectively carrying out ultrasonic cleaning on the 30 multiplied by 30mm C/SiC composite material by using acetone, absolute ethyl alcohol and deionized water, and then drying by using dry nitrogen to obtain a clean C/SiC composite material sample (10);
2) The femtosecond laser processing light path system is set up, the light path comprises a high repetition frequency femtosecond laser (1), laser output by the high repetition frequency femtosecond laser (1) sequentially passes through a 1/2 wave plate (2), a beam splitter prism (4) and a first reflector (5), after the light path is rotated by 90 degrees by the first reflector (5), the laser beam passes through a beam expander (6) and a second reflector (12), then enters a vibrating mirror (11) through the second reflector (12) and vertically irradiates on a processing station of an ultrasonic vibration device (9), wherein the amplitude of the ultrasonic vibration device (9) is controlled by an ultrasonic generator (7), the position of the ultrasonic vibration device (9) is controlled by a three-dimensional moving platform (8), the laser power is detected by combining a 1/2 wave plate (2), the beam splitter prism (4) and a power meter (3), and meanwhile, a computer (13) is used for controlling the vibrating mirror (11) so as to control the power, the motion speed and the trajectory of the high repetition frequency femtosecond laser (1), the vibrating mirror (11) and the three-dimensional moving platform (8) in the processing process;
3) Fixing a C/SiC composite material sample (10) on an ultrasonic vibration device (9), providing a sample processing area starting position by controlling an X axis, a Y axis and a Z axis of a three-dimensional moving platform (8), wherein the X axis, the Y axis and the Z axis are matched and moved to adjust the distance between a laser focus and the surface of the C/SiC composite material sample (10), the distance between the laser Jiao Dianju C/SiC composite material sample (10) surface is-4 cm, and the minus sign indicates that the laser focus is below the surface of the C/SiC composite material sample (10);
4) Controlling the amplitude of the ultrasonic vibration device (9) in the vertical direction by using an ultrasonic generator (7) to enable the ultrasonic amplitude to be 28 microns;
5) Adjusting the output power of a high repetition frequency femtosecond laser (1) by using a computer (13), wherein the laser wavelength is 1030nm, the pulse width is 240fs, the repetition frequency is 50kHz, and the output power is 12W;
6) And (2) regulating and controlling a motion track and a scanning speed on the surface of the C/SiC composite material sample (10) by using a galvanometer (11), wherein the interval of the scanning tracks is set to be 5 mu m, the scanning speed is set to be 1000mm/s, firstly, transverse scanning is carried out, and then, longitudinal scanning is carried out, so that the surface of the C/SiC composite material with a smooth surface and no fiber damage is obtained.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117162540A (en) * | 2023-11-02 | 2023-12-05 | 湖南科技大学 | Microwave ultrasonic curing forming equipment and curing forming method for resin matrix composite material |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117162540A (en) * | 2023-11-02 | 2023-12-05 | 湖南科技大学 | Microwave ultrasonic curing forming equipment and curing forming method for resin matrix composite material |
| CN117162540B (en) * | 2023-11-02 | 2024-01-26 | 湖南科技大学 | Microwave ultrasonic curing forming equipment and curing forming method for resin matrix composite material |
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