CN110625401B - Processing device and method under laser-induced material coupling reaction - Google Patents
Processing device and method under laser-induced material coupling reaction Download PDFInfo
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- CN110625401B CN110625401B CN201910438289.8A CN201910438289A CN110625401B CN 110625401 B CN110625401 B CN 110625401B CN 201910438289 A CN201910438289 A CN 201910438289A CN 110625401 B CN110625401 B CN 110625401B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
Abstract
The invention discloses a processing device and a processing method under the coupling reaction of a laser-induced material. This processingequipment includes: a laser generating device and a milling machine processing device; the milling machine processing device comprises a main shaft, a micro milling cutter and a workbench; the laser generating device, the main shaft and the micro milling cutter are all positioned above the workbench; the micro milling cutter is fixed on the main shaft; the laser generating device and the micro milling cutter are both right opposite to the workbench; the workbench is used for placing or fixing a workpiece to be processed, the surface of which is coated with a coupling reaction material; the laser generating device is used for generating laser with the power lower than 6W to irradiate the surface to be processed; the micro milling cutter is used for processing a workpiece to be processed along the laser track of the surface to be processed; the coupling reaction material is a material which generates chemical reaction with a workpiece to be processed when being heated by laser. The processing device and the method can improve the processing efficiency, the surface quality and the three-dimensional microstructure service performance of the workpiece and prolong the service life of the micro milling cutter.
Description
Technical Field
The invention relates to the field of advanced manufacturing, in particular to a processing device and a processing method under the coupling reaction of a laser-induced material.
Background
The ceramic material has excellent performances of high temperature resistance, wear resistance, corrosion resistance, ablation resistance and the like, can bear the severe working environment which is hard to be met by metal materials and high polymer materials, and is widely applied to the fields of energy, aerospace, automobile, metallurgy, chemical industry, electronics and the like. For example, in the field of electronic industry, ceramic microgrooves are important structures in heat dissipation devices of ceramic flat heat pipes and ceramic resistor systems; in the field of aerospace, the ceramic microstructure can be used as a hydrodynamic groove of a ceramic sealing ring; in the biomedical field, ceramic microstructures can be used as surface hydrophobic structures on dentures. The ceramic material has the characteristics of high hardness, high brittleness and low fracture toughness, so the processing difficulty is very high. If the processing method is not properly selected, the structure of the surface layer of the workpiece is damaged, and the processing with high precision, high efficiency and high reliability is difficult to realize, so that the further expansion of the application range of the ceramic is limited. Therefore, the processing technology for ceramic microstructures is at the front of research in the field of microfabrication.
However, in the process of processing the ceramic microstructure, due to the properties of high hardness, high brittleness and low fracture toughness of the ceramic, the micro milling cutter for processing the ceramic is seriously abraded, and the service life of the micro milling cutter is greatly shortened.
Disclosure of Invention
The invention aims to provide a processing device and a processing method under the coupling reaction of a laser-induced material, which can prolong the service life of a micro milling cutter.
In order to achieve the purpose, the invention provides the following scheme:
a processing apparatus under laser-induced material coupling reaction, comprising: a laser generating device and a milling machine processing device; the milling machine processing device comprises a main shaft, a micro milling cutter and a workbench;
the laser generating device, the spindle and the micro milling cutter are all positioned above the workbench; the micro milling cutter is fixed on the main shaft; the laser generating device and the micro milling cutter are both opposite to the workbench;
the workbench is used for placing or fixing a workpiece to be processed, the surface of which is coated with a coupling reaction material; the laser generating device is used for generating laser with power lower than 6W to irradiate the surface to be processed; the micro milling cutter is used for processing the workpiece to be processed along the laser track of the surface to be processed;
the coupling reaction material is a material which generates chemical reaction with the workpiece to be processed when being heated by laser.
Optionally, the laser generating device includes a laser, a beam expander, a galvanometer, and a focusing lens; the laser is used for generating a laser beam and transmitting the laser beam to the beam expander; the beam expanding lens is used for expanding the laser beam to form expanded beam laser and inputting the expanded beam laser to the vibrating lens; the galvanometer is used for adjusting the angle of the beam expanding laser to enable the beam expanding laser to irradiate a specified position; the focusing lens is located the laser exit end of mirror that shakes, focusing lens is used for the warp the beam expanding laser after the mirror adjustment that shakes focuses on, makes beam expanding laser converges to treating the processing surface.
Optionally, the processing device further comprises a computer; and the computer is electrically connected with the laser and the control input end of the vibrating mirror and is used for controlling the laser parameters of the laser and the angle of the vibrating mirror.
Optionally, the computer is further electrically connected to the stepping motor of the spindle and the driving motor of the micro milling cutter, and is configured to control the stepping motor to adjust the position of the spindle and control the driving motor to adjust the motion of the micro milling cutter.
Optionally, the processing device further comprises a CCD camera, and the CCD camera is directly opposite to the workbench and is used for recording and monitoring the processing process on the workbench.
Optionally, the workpiece to be processed is made of ceramic, and the coupling reaction material is silica gel or water-coated glass.
The invention also discloses a processing method under the coupling reaction of the laser-induced material, which is applied to the milling device under the coupling reaction of the laser-induced material; the processing method comprises the following steps:
coating a layer of coupling reaction material on the surface to be processed of the workpiece to be processed; the coupling reaction material is a material which generates chemical reaction with the workpiece to be processed when being heated by laser;
utilizing a laser generating device to emit laser and control the laser to irradiate the surface to be processed along a preprocessing track, so that the workpiece to be processed at the preprocessing track and the coupling reaction material are subjected to chemical reaction, and thus the material modification of the surface to be processed is realized;
and controlling the main shaft to move so that the micro milling cutter processes the modified workpiece to be processed along the laser irradiation track on the surface to be processed.
Optionally, before the coating of the coupling reaction material on the surface to be processed of the workpiece to be processed, the method further includes:
and cleaning the surface of the workpiece to be processed.
Optionally, the laser generating device is used to emit laser and control the laser to irradiate the surface to be processed along a preprocessing track, so that the workpiece to be processed at the preprocessing track and the coupling reaction material undergo a chemical reaction, and the method specifically includes:
adjusting the laser output power of a laser in the laser generating device to enable the power of the laser generated by the laser to be lower than 6W;
and adjusting the laser irradiation position by controlling the angle of a vibrating mirror in the laser generating device, so that the laser irradiates the surface to be processed along a preprocessing track.
Optionally, the controlling the spindle to move to enable the micro milling cutter to process the modified workpiece to be processed along the laser irradiation track on the surface to be processed specifically includes:
and controlling the spindle to move so that the micro milling cutter removes the biological layer deterioration layer, the subsurface layer and part of the base material of the workpiece to be processed, which are generated by the chemical reaction, along the laser irradiation track on the surface to be processed.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects: the invention discloses a processing device and a processing method under the coupling reaction of a laser-induced material. The machining device and the machining method under the laser-induced material coupling reaction reduce the hardness of the surface to be machined by changing the property of the surface to be machined, thereby reducing the milling force and the abrasion of a micro milling cutter, prolonging the service life of the micro milling cutter, and improving the quality of the machined surface and the microstructure service performance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
FIG. 1 is a schematic diagram of an apparatus for processing a material under coupling reaction of laser-induced materials according to an embodiment of the present invention;
FIG. 2 is a flowchart of a method of an embodiment of the present invention for processing laser-induced material coupling reaction.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Example 1:
FIG. 1 is a schematic diagram showing the structure of an apparatus for processing a material under laser-induced coupling reaction according to an embodiment of the present invention.
Referring to fig. 1, the processing apparatus under the laser-induced material coupling reaction includes: the milling machine machining device comprises a main shaft 1, a micro milling cutter 2 and a workbench 3;
the laser generating device, the spindle 1 and the micro milling cutter 2 are all positioned above the workbench 3; the micro milling cutter 2 is fixed on the main shaft 1; the laser generating device and the micro milling cutter are both opposite to the workbench 3;
the workbench 3 is used for placing or fixing a workpiece 5 to be processed, the surface of which is coated with a coupling reaction material 4; the laser generating device is used for generating laser 6 with power lower than 6W to irradiate the surface to be processed; the micro milling cutter 2 is used for processing the workpiece 5 to be processed along the laser track of the surface to be processed;
the coupling reaction material 4 is a material which chemically reacts with the workpiece 5 to be processed when heated by laser.
The laser generating device comprises a laser 7, a beam expander 8, a galvanometer 9 and a focusing lens 10; the laser 7 is used for generating a laser beam and emitting the laser beam to the beam expander 8; the beam expander 8 is used for expanding the laser beam to form expanded laser, and inputting the expanded laser to the vibrating mirror 9; the galvanometer 9 is used for adjusting the angle of the expanded beam laser to enable the expanded beam laser to irradiate a specified position; the focusing lens 10 is located the laser exit end of the galvanometer 9, the focusing lens 10 is used for focusing the beam expanding laser after the galvanometer 9 is adjusted, so that the beam expanding laser is converged on a surface to be processed.
Laying a layer of coupling reaction material on the surface to be processed, heating the coupling reaction material on the surface to be processed by a laser, utilizing the instantaneous high temperature generated by the laser to enable the workpiece to be processed on the surface to be processed to generate a rapid and controllable chemical reaction with the coupling reaction material, adjusting laser parameters such as laser power and frequency by adjusting the laser so as to control the rate of the chemical reaction, the microstructure and the structure of a product, forming a product deterioration layer which is easy to remove on the surface to be processed, forming a subsurface layer below the deterioration layer, wherein the subsurface layer is a non-product layer material affected by the heat of the laser and the chemical reaction and is an interlayer between the deterioration layer and a base material; and then, establishing a corresponding micro-processing scheme according to the microstructures and the thicknesses of the affected layer and the subsurface layer.
The laser 7 is a pulse type laser or a continuous type laser.
As an alternative embodiment, the processing device further comprises a computer 11; and the computer 11 is electrically connected with the laser 7 and the control input end of the galvanometer 9 and is used for controlling the laser parameters of the laser 7 and the angle of the galvanometer 9. The laser parameters include laser power, spot diameter, pulse width, and frequency.
As an alternative embodiment, the computer 11 is further electrically connected to a stepping motor of the spindle 1 and a driving motor of the micro milling cutter 2, and is configured to adjust the position of the spindle 1 by controlling the stepping motor and adjust the motion of the micro milling cutter 2 by controlling the driving motor. During machining, the computer 11 adjusts the angle of the galvanometer 9 and the position of the spindle 1 to keep a laser irradiation point on the surface to be machined and the machining position of the micro milling cutter 2 at a set distance. The control mode of the driving motor is to realize the control of the driving motor by adjusting the cutting parameters of the computer aided machining software integrated in the computer.
The cutting parameters comprise the rotating speed of the main shaft, the feed per tooth of the micro milling cutter and the axial cutting depth of the micro milling cutter.
As an optional implementation manner, the processing apparatus further includes a CCD camera 13, where the CCD camera 13 is directly opposite to the workbench 3, and is used for recording and monitoring the processing process on the workbench 3. The CCD camera 13 is connected to the computer 11 for transmitting the monitoring video to the computer 11.
The computer 11 of the invention is connected with the CCD camera 13, the stepping motor of the main shaft 1, the driving motor of the micro milling cutter 2, the laser 7 and the galvanometer 9 through leads 12.
As an optional implementation manner, the workpiece 5 to be processed is made of ceramic, including alumina ceramic and zirconia ceramic, and the coupling reaction material 4 is silica gel or water-coated glass.
As an alternative embodiment, the processing device further comprises a vertical workbench (not shown in the figure) and a vertical guide rail (not shown in the figure), wherein the vertical guide rail is fixed on the vertical workbench; the galvanometer is slidable in a vertical direction along the vertical guide rail.
Example 2:
FIG. 2 is a flowchart of a method of an embodiment of the present invention for processing laser-induced material coupling reaction.
The processing method under the laser-induced material coupling reaction is applied to the milling device under the laser-induced material coupling reaction.
Referring to fig. 2, the processing method includes:
step 101: and cleaning the surface of the workpiece to be processed. The method specifically comprises the following steps: and (2) polishing the workpiece to be processed, polishing by using a polishing agent, and then carrying out ultrasonic cleaning in an absolute ethyl alcohol solution, thereby removing impurities and organic matter stains on the surface of the workpiece to be processed.
Step 102: coating a layer of coupling reaction material on the surface to be processed of the workpiece to be processed; the coupling reaction material is a material which generates chemical reaction with the workpiece to be processed when being heated by laser.
Step 103: and utilizing a laser generating device to emit laser and control the laser to irradiate the surface to be processed along a preprocessing track, so that the material of the surface of the workpiece to be processed at the preprocessing track and the coupling reaction material are subjected to chemical reaction at high temperature induced by the laser, and thus, the material modification of the surface to be processed is realized. The method specifically comprises the following steps:
fixing a workpiece to be machined on a workbench, opening a main shaft, adjusting the relative position of a micro milling cutter and the surface of the workpiece to be machined to enable a cutter point and the surface to be machined to be in the same horizontal position, realizing tool setting, opening a laser, adjusting the relative position of a laser lens and the workpiece to be machined to enable laser spots to be focused on the surface to be machined, and realizing adjustment of the focal length of the laser. Setting equal laser parameters of laser power, frequency and scanning speed, wherein the laser power is lower than 6W, setting corresponding preprocessing track and cutting parameters, and realizing the adjustment of the laser irradiation position by controlling the angle of a vibrating mirror in the laser generating device, so that the laser irradiates the surface to be processed along the preprocessing track.
Step 104: and controlling the main shaft to move so that the micro milling cutter processes the modified workpiece to be processed along the laser irradiation track on the surface to be processed. The method specifically comprises the following steps:
and controlling the spindle to move so that the micro milling cutter removes the biological layer deterioration layer, the subsurface layer and part of the base material of the workpiece to be processed, which are generated by the chemical reaction, along the laser irradiation track on the surface to be processed.
Step 105: and after the machining is finished, closing the laser, retracting the cutter and closing the main shaft.
The invention has the following beneficial effects:
1) through the coupling effect of the laser-induced surface to be processed and the coupling reaction material, the workpiece to be processed is subjected to rapid and controllable chemical reaction to form a loose and easily-removed deteriorated layer, a micro-milling removal mechanism of the workpiece to be processed can be changed, the cutting load is reduced, and the processing efficiency is improved. The hardness of the surface to be processed is reduced by changing the property of the surface to be processed, so that the abrasion of the micro milling cutter is reduced when the micro milling cutter is used for processing, and the service life of the micro milling cutter is prolonged.
2) The laser power required by the chemical reaction (namely the laser power lower than 6W adopted by the invention) is far lower than the laser power required by laser processing or laser heating auxiliary softening material, so the heat influence generated by the laser is smaller, and the laser keeps a distance with the micro milling cutter, thereby avoiding the influence of the laser on the performance of the micro milling cutter.
3) The micro milling cutter aims at the processing of the ceramic microstructure, the cutting amount of a workpiece to be processed in the processing process is small and is equivalent to the scale of the deteriorated layer, and the micro milling cutter only needs to remove the deteriorated layer and a small amount of sub-surface layer materials every time, so that the accumulation of burrs can be reduced, and the surface integrity is improved.
4) The chemical reaction rate under laser irradiation, the microstructure and the structure of a product (an altered layer) can be accurately controlled by adjusting laser parameters, and the process controllability is high.
5) The processing device and the processing method provided by the invention can realize the efficient and high-quality processing of complex three-dimensional structures and true free-form surfaces of difficult-to-process materials such as high-temperature ceramics and the like.
Example 3:
the scheme of the invention is further explained by taking alumina ceramic as a workpiece to be processed, silica gel or water-coated glass as a coupling reaction material, a YLP type pulse optical fiber laser as a laser, and a laser-micro composite machine tool by adopting a mode of modifying layer by layer and removing layer by layer.
Under the coupling action of laser-induced high temperature and a coupling reaction material, the alumina ceramic and the coupling reaction material can generate rapid chemical reaction to form silicate easy to remove, and the surface layer is in a loose and porous structure due to heat released in the reaction process, so that the surface to be processed is converted into a loose and easy-to-remove product altered layer in a very short time, and then the altered layer and a small amount of sub-surface layer materials are rapidly removed by using a micro milling cutter. Because the micro milling of the micro milling cutter has small removal amount which is equivalent to the scale of the metamorphic layer, each milling only needs to remove the metamorphic layer and a small amount of sub-surface layer materials to obtain a high-precision machined surface.
This embodiment of the invention specifically comprises the steps of:
firstly, preprocessing a workpiece to be processed, grinding alumina ceramics by using 320-2000 # waterproof abrasive paper, then polishing by using a high-efficiency diamond polishing agent with the granularity of 1 mu m to ensure that the surface roughness Ra is less than or equal to 0.3 mu m, and then ultrasonically cleaning in an absolute ethyl alcohol solution for 10-15 min to remove impurities and organic matter stains on the surface.
And secondly, researching the distribution condition of the temperature field under the action of laser by a finite element simulation method, researching the tissue structures and the thicknesses of the altered layer and the subsurface layer of the surface reaction area to be processed under different laser parameters according to the distribution condition of the temperature field and an experimental method, preferably selecting appropriate laser parameters, and formulating a micro-milling process scheme according to the selected laser parameters and the tissue structures and the thicknesses of the altered layer and the subsurface layer formed by inducing chemical reaction at high temperature.
Fixing the workpiece to be machined on a workbench, opening a main shaft, and adjusting the relative position of the micro milling cutter and the surface to be machined to enable the cutter point and the surface to be machined to be in the same horizontal position, so that the cutter setting of the micro milling machine is realized; and opening the laser, and adjusting the relative position of the lens of the laser and the surface to be processed to focus laser spots on the surface to be processed, so as to realize the adjustment of the focal length of the laser.
Opening a jet pipe valve, setting laser parameters such as laser power, frequency and scanning speed, setting corresponding feed path and cutting parameters, enabling laser to irradiate on the surface to be processed according to the feed path by adjusting the angle of a vibrating mirror, enabling the laser to induce the chemical reaction between the workpiece to be processed and the bedding coupling reaction material at high temperature, and then rapidly removing a deteriorated layer, a subsurface layer and a small amount of workpiece substrate material to be processed by a micro milling cutter along the feed path, namely processing the microstructure with the high depth-to-width ratio in a mode of deterioration layer by layer and removal layer by layer.
And step five, closing the laser, retracting the cutter and closing the main shaft.
The laser power is preferably 5W, the spot diameter is 57 μm, the pulse width is 100ns, and the frequency is 20 KHz.
The micro milling cutter is a diamond coated hard alloy end mill with the diameter of 500 mu m.
The main shaft rotating speed is 20000RPM, the feed amount per tooth is 1 mu m/z, and the axial cutting depth of the micro milling cutter is 15 mu m.
The principles and embodiments of the present invention have been described herein using specific examples, which are provided only to help understand the method and the core concept of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (8)
1. A processing apparatus under laser-induced material coupling reaction, comprising: the device comprises a laser generating device, a milling machine processing device and a computer; the milling machine processing device comprises a main shaft, a micro milling cutter and a workbench;
the laser generating device, the spindle and the micro milling cutter are all positioned above the workbench; the micro milling cutter is fixed on the main shaft; the laser generating device and the micro milling cutter are both opposite to the workbench; the laser generating device comprises a laser, a beam expanding lens, a vibrating lens and a focusing lens; the laser is used for generating a laser beam and transmitting the laser beam to the beam expander; the beam expanding lens is used for expanding the laser beam to form expanded beam laser and inputting the expanded beam laser to the vibrating lens; the galvanometer is used for adjusting the angle of the beam expanding laser to enable the beam expanding laser to irradiate a specified position; the focusing lens is positioned at the laser emitting end of the galvanometer and is used for focusing the expanded beam laser adjusted by the galvanometer so as to converge the expanded beam laser on the surface to be processed;
the workbench is used for placing or fixing a workpiece to be processed, the surface of which is coated with a coupling reaction material; the laser generating device is used for generating laser with power lower than 6W to irradiate the surface to be processed; the micro milling cutter is used for processing the workpiece to be processed along the laser track of the surface to be processed;
the coupling reaction material is a material which generates chemical reaction with the workpiece to be processed when being heated by laser;
and the computer is electrically connected with the laser and the control input end of the vibrating mirror and is used for controlling the laser parameters of the laser and the angle of the vibrating mirror.
2. The apparatus of claim 1, wherein the computer is further electrically connected to a stepping motor of the spindle and a driving motor of the micro milling cutter, and is configured to control the stepping motor to adjust the position of the spindle and control the driving motor to adjust the motion of the micro milling cutter.
3. The device for processing under the coupling reaction of the laser-induced material according to claim 1, further comprising a CCD camera facing the worktable for recording and monitoring the processing process on the worktable.
4. The device for processing under the coupling reaction of the laser-induced material according to claim 1, wherein the workpiece to be processed is made of ceramic, and the coupling reaction material is silica gel or water-coated glass.
5. A processing method under the coupling reaction of laser-induced materials is characterized by being applied to a processing device under the coupling reaction of laser-induced materials as claimed in any one of claims 1 to 4; the processing method comprises the following steps:
coating a layer of coupling reaction material on the surface to be processed of the workpiece to be processed; the coupling reaction material is a material which generates chemical reaction with the workpiece to be processed when being heated by laser;
utilizing a laser generating device to emit laser and control the laser to irradiate the surface to be processed along a preprocessing track, so that the workpiece to be processed at the preprocessing track and the coupling reaction material are subjected to chemical reaction, and thus the material modification of the surface to be processed is realized; the laser generating device comprises a laser, a beam expanding lens, a vibrating lens and a focusing lens; the laser is used for generating a laser beam and transmitting the laser beam to the beam expander; the beam expanding lens is used for expanding the laser beam to form expanded beam laser and inputting the expanded beam laser to the vibrating lens; the galvanometer is used for adjusting the angle of the beam expanding laser to enable the beam expanding laser to irradiate a specified position; the focusing lens is positioned at the laser emitting end of the galvanometer and is used for focusing the expanded beam laser adjusted by the galvanometer so as to converge the expanded beam laser on the surface to be processed;
and controlling the main shaft to move so that the micro milling cutter processes the modified workpiece to be processed along the laser irradiation track on the surface to be processed.
6. The method for processing under laser-induced material coupling reaction as claimed in claim 5, further comprising, before coating a layer of coupling reaction material on the surface to be processed of the workpiece to be processed, the steps of:
and cleaning the surface of the workpiece to be processed.
7. The processing method under the coupling reaction of the laser-induced material as claimed in claim 5, wherein the emitting laser light by the laser generator and controlling the laser light to irradiate the surface to be processed along a pre-processing track to make the workpiece to be processed at the pre-processing track chemically react with the coupling reaction material specifically includes:
adjusting the laser output power of a laser in the laser generating device to enable the power of the laser generated by the laser to be lower than 6W;
and adjusting the laser irradiation position by controlling the angle of a vibrating mirror in the laser generating device, so that the laser irradiates the surface to be processed along a preprocessing track.
8. The method for processing under the coupling reaction of the laser-induced material according to claim 5, wherein the controlling the spindle to move to enable the micro milling cutter to process the modified workpiece to be processed along the laser irradiation track on the surface to be processed specifically comprises:
and controlling the spindle to move so that the micro milling cutter removes the biological layer deterioration layer, the subsurface layer and part of the base material of the workpiece to be processed, which are generated by the chemical reaction, along the laser irradiation track on the surface to be processed.
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| CN112222625A (en) * | 2020-10-19 | 2021-01-15 | 山东理工大学 | Method and processing system for laser in-situ induction of graphene composite microtexture on surface of nodular cast iron material |
| CN112976127B (en) * | 2021-01-25 | 2023-01-24 | 中国建材国际工程集团有限公司 | Machining equipment and machining method for integrated milling cutter of film-coated material |
| CN114571064B (en) * | 2022-04-21 | 2023-02-03 | 南京航空航天大学 | Laser-induced oxidation auxiliary milling composite processing device and method |
| CN114918438B (en) * | 2022-06-14 | 2023-07-25 | 南京航空航天大学 | Composite machining device and method for laser-induced modification auxiliary turning |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107363552A (en) * | 2017-07-04 | 2017-11-21 | 南京航空航天大学 | A kind of induced with laser oxidation assist turning machining device and its method |
| CN108746994A (en) * | 2018-06-21 | 2018-11-06 | 南京航空航天大学 | A kind of device and method of compound Milling Process micro-structure |
| CN109652786A (en) * | 2019-01-21 | 2019-04-19 | 南京航空航天大学 | A kind of color method and device based on metal material surface dye technology |
-
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107363552A (en) * | 2017-07-04 | 2017-11-21 | 南京航空航天大学 | A kind of induced with laser oxidation assist turning machining device and its method |
| CN108746994A (en) * | 2018-06-21 | 2018-11-06 | 南京航空航天大学 | A kind of device and method of compound Milling Process micro-structure |
| CN109652786A (en) * | 2019-01-21 | 2019-04-19 | 南京航空航天大学 | A kind of color method and device based on metal material surface dye technology |
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