CN115365649A - Water jet assisted laser-induced plasma processing method and device - Google Patents
Water jet assisted laser-induced plasma processing method and device Download PDFInfo
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- CN115365649A CN115365649A CN202211169880.6A CN202211169880A CN115365649A CN 115365649 A CN115365649 A CN 115365649A CN 202211169880 A CN202211169880 A CN 202211169880A CN 115365649 A CN115365649 A CN 115365649A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
Abstract
The invention provides a water jet assisted laser-induced plasma processing method and a device, which comprise an optical path system, a coupling unit, a workbench unit and a hydraulic system which are sequentially arranged. The laser beam with high power density emitted by the optical path system enters the coupling unit through focusing, the hydraulic system provides stable stepless pressure-regulating high-pressure water flow to the coupling unit, and a nozzle of the coupling unit generates stable high-speed water jet. The high-power density laser beam is focused in the water jet, plasma is generated in a focus area, and the surface of a workpiece is machined. The invention has the advantages that: the static water layer is not required to be generated on the surface of the workpiece, the water layer is prevented from shaking to influence focusing stability in the machining process, cavitation bubbles and slag generated in the machining process can be removed in time by the high-speed water jet, heat on the surface of the workpiece is taken away, the workpiece is effectively cooled, and the machining quality and the machining efficiency are improved.
Description
Technical Field
The invention relates to the technical field of laser plasma processing, in particular to a method and a device for processing water jet assisted laser-induced plasma.
Background
With the continuous emergence of hard and brittle materials with high hardness, large brittleness, low fracture and the like, the traditional machining method has certain limitation on the machining of the hard and brittle materials, and the conventional cutting method has the problem that the machining process is limited due to the abrasion of a cutter and the like; the electric spark processing has hindered the industrial use because of the problems of difficult manufacture of the microelectrode, low processing efficiency and the like; the conventional laser processing generates a heat affected zone and slag due to the photo-thermal effect, so that the processing quality is difficult to ensure, and the heat affected zone influences the original mechanical properties of the material. Because the industrial field has higher precision requirements on the size and the shape of high-precision parts, the processing of hard and brittle materials by adopting the traditional method can not meet the requirement of high-precision processing of the materials.
Laser-induced plasma processing is a high resolution, high precision, tool-less processing method. In laser-induced plasma processing, a workpiece is immersed in a transparent static or dynamic liquid, a beam of light is focused above the surface of the workpiece, and the laser breaks down the dielectric to generate a plasma that exceeds the melting and vaporization temperatures of the workpiece material, thereby achieving the purpose of material removal. The laser-induced plasma processing has a huge application prospect in the field of micro-nano manufacturing, can obtain higher material removal rate and larger depth-to-width ratio while ensuring resolution and processing precision, and is a novel and reliable hard and brittle material processing technology.
The existing laser-induced plasma processing usually focuses laser in a static water layer above a workpiece, but in the processing process, the movement of a moving platform will cause the shaking of the water layer, which affects the focusing of the laser in the water layer, causes the generation of unstable plasma, and affects the processing quality and the processing precision of the workpiece. In order to ensure the stability of the water layer, a lower scanning speed is required, but the lower scanning speed inevitably reduces the processing efficiency, and limits the application range of the technology. In addition, a large amount of slag and bubbles generated in the machining process cannot be effectively discharged, propagation of laser in water is blocked, laser power is lost, and the machining depth is limited.
Based on the defects, the problems of poor laser focusing stability, incapability of discharging slag and bubbles and the like caused by the shaking of a water layer on the surface of a workpiece in the laser-induced plasma processing process can be solved, the processing quality and the processing precision of the laser-induced plasma processing can be effectively improved, and the popularization of the laser-induced plasma processing technology in the field of high-precision and high-efficiency processing is promoted.
Disclosure of Invention
According to the method and the device for processing the laser-induced plasma assisted by the water jet, the laser beam is coupled into the flowing water jet, a static water layer is not required to be generated on the surface of a workpiece, and the phenomenon that the generation of the plasma is influenced due to poor focusing stability of the laser beam caused by the shaking of the water layer in the processing process is avoided; the heat, cavitation bubbles and ablation materials are discharged out of the processing area by using high-speed and large-diameter water jet, so that the processing quality, the processing efficiency and the processing precision are effectively improved.
In order to achieve the technical purpose and achieve the technical effects, the invention solves the problems through the following technical scheme:
a water jet assisted laser-induced plasma processing device comprises a light path system, a coupling unit, a hydraulic system and a workbench unit; the light path system consists of a laser, a beam expanding lens, a collimating lens and a focusing lens; the coupling unit consists of a coupling cavity, an optical window and a nozzle; the hydraulic system consists of a water tank, a high-pressure water suction pump, a one-way valve, an energy accumulator, an overflow valve and a high-precision filter; the workbench unit consists of a supporting platform, a water tank and a clamp.
In the scheme, laser is emitted by a laser, and is focused and enters a coupling unit after beam expansion and collimation, the coupling unit inputs high-pressure water flow by a hydraulic system, a water layer with the thickness of 1-2mm is formed in a coupling cavity, and is emitted by a nozzle to form dynamic water jet, the laser focus position is positioned in the water jet, the laser intensity at the focus position exceeds the breakdown threshold value of the water, so that plasma is generated in the water jet, the thermal gasification comprehensive effect of shock waves generated by radial propagation of the expanded plasma and plasma contact materials is removed, and the processing of workpiece materials is completed. In the invention, a laser is selected, and the pulse width is 10ns; the selection range of the laser single pulse energy is 2-8mJ; the selection range of the laser pulse frequency is 1-10KHz; the selection range of the processing speed is 4-10mm/s; the water jet speed is selected within the range of 1-6m/s; the water jet diameter is selected in the range of 1-2mm.
Compared with the existing laser-induced plasma processing technology, the laser beam and the water jet are coaxially coupled and focused in the water jet, and plasma is generated in a focus area without generating a static water layer above a workpiece, so that the phenomenon that the laser focusing stability is reduced due to the water layer shaking caused by the movement of a platform in the processing process, and the generation of the plasma is influenced is avoided. Meanwhile, the high-speed water jet can discharge heat, bubbles and slag generated in the machining process out of a machining area in time, reduce laser energy loss and improve machining quality and machining efficiency.
A water jet assisted laser-induced plasma processing method adopts the water jet assisted laser-induced plasma processing device and comprises the following steps:
1) Clamping the workpiece at a working position corresponding to the workbench unit;
2) Starting a hydraulic system to convey high-pressure water to a coupling unit, and converting the high-pressure water into stable water jet to be output by the coupling unit;
3) The laser beam is emitted by the laser, is focused and enters the coupling unit after being expanded and collimated;
4) Coupling a laser beam with a water jet, wherein a focus is positioned above a workpiece to form optical breakdown of water to generate plasma, and removing materials by the combined effect of thermal gasification of shock waves generated by radial propagation of expanded plasma and plasma contact materials;
5) The coaxial high-speed water jet discharges heat, bubbles, slag and the like generated in the machining process out of a machining area in time;
6) And after the machining is finished, closing the laser and the hydraulic system in sequence to finish the machining.
A water jet assisted laser-induced plasma processing device comprises a light path system, a coupling unit, a workbench unit and a hydraulic system which are arranged in sequence; the light path system realizes the emission and the alignment focusing of the laser beam; the coupling unit realizes the coupling of the focusing laser and the water jet, and a hydraulic system inputs stable stepless pressure regulating high-pressure water flow; the output end of the coupling unit is provided with a workbench unit, the workbench unit comprises a supporting platform, a water tank and a clamp, the water tank and the clamp are arranged on the supporting platform and used for placing a workpiece; the water inlet end of the hydraulic system is connected with the water tank, and the water outlet end of the hydraulic system is connected with the coupling unit to provide stable stepless pressure-regulating high-pressure water flow.
The invention has the advantages and effects that:
1. compared with the existing laser-induced plasma processing method, the method and the device for processing the laser-induced plasma assisted by the water jet do not need to generate a static water layer on the surface of a workpiece, the laser is directly coupled into the coaxial water jet, the laser with high power density breaks through water in a focus area to generate plasma, the focusing stability and the generation of the plasma are prevented from being influenced by the shaking of the water layer in the processing process in the existing processing method and the device, and the processing quality and the processing precision are improved.
2. According to the method and the device for processing the laser-induced plasma assisted by the water jet, laser is coupled with the high-speed large-diameter water jet, so that cavitation bubbles and slag generated in the processing process can be removed in time by the high-speed water jet, and the loss of laser energy caused by the scattering effect of the bubbles and the slag on the laser is avoided. Meanwhile, the high-speed water jet can take away heat on the surface of the workpiece in time, and the workpiece is effectively cooled.
Drawings
FIG. 1 is a schematic diagram of a water jet assisted laser induced plasma processing principle in an embodiment;
FIG. 2 is a schematic view of a nozzle configuration according to an embodiment;
FIG. 3 is a schematic diagram of laser-induced generation of plasma in an embodiment;
FIG. 4 is a schematic diagram of a mechanism for removing material by laser-induced plasma in accordance with an embodiment.
And (3) identifying the figure number: 1. the device comprises an optical path system 11, a laser 12, a beam expander 13, a collimating mirror 14 and a focusing lens; 2. a coupling unit 21, an optical window 22, a coupling cavity 23 and a nozzle; 3. a workbench unit 31, a support platform 32, a water tank 33, a clamp 34 and a workpiece; 4. the system comprises a hydraulic system 41, a water tank 42, a high-pressure water suction pump 43, a one-way valve 44, an energy accumulator 45, an overflow valve 46 and a high-precision filter;
Detailed Description
The technical solution in the embodiment of the present invention is clearly and completely described below with reference to the drawings in the embodiment of the present invention. The specific embodiments described herein are merely illustrative of the invention and do not delimit the invention.
A water jet assisted laser-induced plasma processing device is shown in figure 1 and comprises an optical path system 1, a coupling unit 2, a workbench unit 3 and a hydraulic system 4 which are sequentially arranged.
The laser 11 is nanosecond high-power-density pulse laser, and the output power density can reach 10 9 -10 12 W/cm 2 In order of magnitude, a laser beam is emitted by the laser 11 and passes through the beam expander 12 and the collimator 13 which are sequentially arranged, the beam expander 12 expands the beam waist radius of the beam and reduces the divergence angle, the collimator 13 converts the expanded divergence light into parallel plane wave front light with equal diameter, the laser beam after passing through the collimator 13 enters the focusing lens 14 as parallel light, and the parallel light enters the coupling unit 2 after being focused by the focusing lens 14.
The coupling unit 2 comprises an optical window 21, a coupling cavity 22 and a nozzle 23 which are sequentially arranged, the optical window 21 is made of transparent quartz glass, the transmittance of a laser beam is greater than 99%, the focused laser beam penetrates through the optical window 21 and enters the coupling cavity 22, a water inlet is formed in the side of the coupling cavity 22, a high-pressure water flow is provided by a hydraulic system 4, a water layer with the thickness of 1-2mm is formed in the coupling cavity, the water layer is emitted out through the nozzle 23 at the bottom of the coupling cavity 22 under the action of pressure to form a stable high-speed large-diameter water jet, the nozzle 23 is made of ruby and is of a downward conical structure, and the structure is shown in figure 2.
The table unit 3 includes a support platform 31, a water tank 32, and a jig 33. The supporting platform 31 is installed at the output end of the coupling unit 2 corresponding to the working position, and the water tank 32 is installed at the supporting platform 31 for recycling waste water. A jig 33 is installed in the water tank 32 for fixing the workpiece 34. The water inlet end of the hydraulic system 4 is connected with the water tank 32, the water outlet end is connected with the coupling cavity 22 of the coupling unit 2 to provide stable stepless pressure-regulating high-pressure water flow, the laser beam is focused by the focusing lens 14 and then coupled into the water jet, the focus is positioned above the workpiece, and the high-power-density laser optically breaks down the water to generate plasma, as shown in figure 3. The combined effect of shock waves generated by radial propagation of the expanding plasma and thermal gasification of the plasma contact material removes the material, and the processing of the workpiece material is completed, as shown in figure 4.
The hydraulic system 4 comprises a main liquid supply loop formed by sequentially connecting a water tank 41, a high-pressure water suction pump 42, a one-way valve 43 and an energy accumulator 44, wherein a water outlet pipeline of the main liquid supply loop is connected to the coupling unit 2 to output stable high-pressure water flow, and a water inlet pipeline is connected with the water tank 32 to return cooling water; an overflow valve 45 is arranged between the water outlet of the high-pressure water suction pump 42 and the water tank 41 to form a pressure regulating loop, so that the main liquid supply loop is kept stable and overload is prevented. Both the outlet and inlet lines are provided with high precision filters 46 for filtering the fluid.
The processing device comprises the following steps:
1) Clamping the workpiece 34 at a working position corresponding to the worktable unit 3;
2) Starting a hydraulic system 4 to convey high-pressure water to the coupling unit 2, and converting the high-pressure water into stable water jet to be output by the coupling unit 2;
3) The laser beam is emitted by the laser, passes through the beam expander 12 and the collimator 13 in sequence and then is focused to enter the coupling unit 2;
4) Coupling a laser beam with a water jet, wherein a focus is positioned above a workpiece to form optical breakdown of water to generate plasma, and removing materials by the combined effect of thermal gasification of shock waves generated by radial propagation of expanded plasma and plasma contact materials;
5) The coaxial high-speed water jet discharges heat, bubbles, slag and the like generated in the machining process out of a machining area in time;
6) And after the machining is finished, closing the laser 11 and the hydraulic system 4 in sequence to finish the machining.
Compared with the existing laser-induced plasma processing method, the method and the device for processing the laser-induced plasma assisted by the water jet do not need to generate a static water layer on the surface of a workpiece, the laser is directly coupled into the coaxial water jet, the laser with high power density forms optical breakdown of water in a focus area to generate plasma, the thermal gasification comprehensive effect of a material contacting shock waves generated by radial propagation of the expanded plasma and the plasma removes materials, and the influence on focusing stability and generation of the plasma caused by the shaking of the water layer in the processing process in the existing processing method and the device is avoided. The high-speed water jet can remove cavitation bubbles and slag generated in the machining process in time, and avoids laser energy loss caused by the scattering effect of the bubbles and the slag on laser. Meanwhile, the high-speed water jet can take away heat on the surface of the workpiece in time, effectively cool the workpiece and improve the processing quality and the processing precision.
The embodiments of the present invention are described in detail above with reference to the drawings, but the present invention is not limited to the described embodiments. Many changes, modifications, substitutions and alterations to these embodiments are within the scope of the present invention without departing from the principles and spirit of the invention.
Claims (6)
1. A water jet assisted laser-induced plasma processing method and apparatus for processing a workpiece (34), characterized by: the device comprises a light path system (1), a coupling unit (2), a workbench unit (3) and a hydraulic system (4) which are arranged in sequence.
2. The method and the device for processing the laser-induced plasma assisted by the water jet as claimed in claim 1, wherein: the optical path system comprises a laser (11), a beam expander (12), a collimating lens (13) and a focusing lens (14). The laser (11) emits laser beams, the beam waist radius of the beam is expanded by the beam expander (12) to reduce the divergence angle, and the divergent light after beam expansion is changed into parallel plane wavefront light with equal diameter by the collimator lens (13).
3. The method and the device for processing the laser-induced plasma assisted by the water jet according to claim 2, wherein: the laser (11) adopts a Q-switched subnanosecond high-power density laser, a Q-switched narrow pulse width laser, a mopa narrow pulse width laser or a picosecond laser generator, and the output power density of the laser reaches 10 9 -10 12 W/cm 2 Magnitude.
4. The method and the device for processing the laser-induced plasma assisted by the water jet according to claim 1, wherein the method comprises the following steps: the coupling unit (2) comprises an optical window (21), a coupling cavity (22) and a nozzle (23). The focused laser beam passes through a transparent optical window (21) and a water layer in a coupling cavity (22) and is coupled into a high-speed water jet generated by a nozzle (23).
5. The method and the device for processing the laser-induced plasma assisted by the water jet as claimed in claim 1, wherein: the workbench unit (3) comprises a supporting platform (31), a water tank (32) and a clamp (33). A water tank (32) is installed on the supporting platform (31) to recycle waste water, and a clamp (33) is installed in the water tank (32) to fix a workpiece (34).
6. The method and the device for processing the laser-induced plasma assisted by the water jet according to claim 1, wherein the method comprises the following steps: the hydraulic system (4) comprises a water tank (41), a high-pressure water suction pump (42), a one-way valve (43), an energy accumulator (44), an overflow valve (45) and a high-precision filter (46). The water outlet pipeline of the main liquid supply loop is connected to the coupling unit (2) to output stable high-pressure water flow, and the water inlet pipeline is connected with the water tank (32) to return cooling water; an overflow valve (45) is arranged between the water outlet of the high-pressure water suction pump (42) and the water tank (41) to form a pressure regulating loop, so that the main liquid supply loop is kept stable and overload is prevented. The water outlet pipeline and the water inlet pipeline are both provided with high-precision filters (46) for filtering fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202211169880.6A CN115365649A (en) | 2022-09-26 | 2022-09-26 | Water jet assisted laser-induced plasma processing method and device |
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| CN202211169880.6A CN115365649A (en) | 2022-09-26 | 2022-09-26 | Water jet assisted laser-induced plasma processing method and device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117644281A (en) * | 2024-01-29 | 2024-03-05 | 西安晟光硅研半导体科技有限公司 | Optical structure for coupling linear laser and microjet and processing equipment |
| CN117644281B (en) * | 2024-01-29 | 2024-04-30 | 西安晟光硅研半导体科技有限公司 | Optical structure for coupling linear laser and microjet and processing equipment |
-
2022
- 2022-09-26 CN CN202211169880.6A patent/CN115365649A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117644281A (en) * | 2024-01-29 | 2024-03-05 | 西安晟光硅研半导体科技有限公司 | Optical structure for coupling linear laser and microjet and processing equipment |
| CN117644281B (en) * | 2024-01-29 | 2024-04-30 | 西安晟光硅研半导体科技有限公司 | Optical structure for coupling linear laser and microjet and processing equipment |
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