CN110625273A - Laser processing method and device - Google Patents
Laser processing method and device Download PDFInfo
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- CN110625273A CN110625273A CN201911040101.0A CN201911040101A CN110625273A CN 110625273 A CN110625273 A CN 110625273A CN 201911040101 A CN201911040101 A CN 201911040101A CN 110625273 A CN110625273 A CN 110625273A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
Abstract
The invention provides a laser processing method and a laser processing device. The method comprises the steps of firstly, adopting a gas-assisted laser processing technology to obtain a through hole with the diameter smaller than that of a target hole to be processed at a position to be processed; and then, further processing the through hole by adopting a liquid-assisted laser processing technology to obtain a target hole. Compared with a single gas-assisted or single liquid-assisted laser processing technology, the laser processing method has the advantages of small heat affected zone, good processing quality, high processing efficiency and the like. The processing device is small in size, and the rapid switching between gas-assisted laser processing and liquid-assisted laser processing can be realized by clamping a workpiece on the device once and controlling the gas on-off switch and the liquid on-off switch, so that the processing device is convenient to operate, has few processes, can shorten the processing time, and improves the processing precision and efficiency.
Description
Technical Field
The invention belongs to the technical field of laser processing, and particularly relates to a laser processing method and device.
Background
Laser processing uses laser beams to perform micromachining, cutting, welding, drilling, and the like on materials, and is increasingly widely used.
The conventional pulse laser processing often generates defects such as sputtering, slag, a heat affected zone, microcracks and the like, and influences the application of the conventional pulse laser in the high-end laser micro-processing field, so that the laser micro-processing generally adopts short pulse laser such as nanosecond laser, or ultrashort pulse laser such as picosecond laser, femtosecond laser and the like to be matched with a high-speed scanning galvanometer for processing. Ultrashort pulse laser processing has good quality, but has problems of low pulse energy, low processing efficiency, and heat accumulation with increasing depth. The nanosecond laser has the advantages of large pulse energy and high processing efficiency, and a processing heat affected zone of about 10-20 um still exists. In addition, high-speed and high-temperature impurities splashed during laser processing collide with the lens of the scanning galvanometer to contaminate the lens, which may cause damage to the lens.
The processing of a zero heat affected zone can be realized under a certain process window by combining water and nanosecond laser, namely the water assists the nanosecond laser processing, and meanwhile, the processing efficiency is far higher than that of the ultrashort pulse laser processing. However, it was found in the test that the water assisted laser machining efficiency was significantly reduced as the hole depth was increased, and for example, it took 10 seconds to machine a hole 1mm deep, 1 minute to machine a hole 2mm deep, and 10 minutes to machine a hole 3mm deep. As shown in fig. 1, this is because the water flow 30 of the water assisted laser exists in the stagnation region 26, and because the resistance of water is much greater than the resistance of air, when the processed hole 28 is not pierced, the impurities and residues generated by the laser processing cannot be effectively removed against the resistance of water, so that the processing efficiency is greatly reduced as the depth of the hole is increased during the liquid assisted laser processing.
Disclosure of Invention
In view of the above technical situation, the present invention aims to provide a laser processing method having advantages of small heat affected zone, good processing quality, high processing efficiency, etc.
In order to achieve the technical purpose, the inventor adopts a laser processing technology combining gas assistance and liquid assistance after a large number of experiments, and the technology specifically comprises the following steps:
a laser processing method is characterized in that: the method comprises the following steps:
(1) obtaining a through hole at a position to be processed by adopting a gas-assisted laser processing technology, wherein the diameter of the through hole is smaller than that of a target hole to be processed;
(2) and (2) further performing laser processing on the through hole prepared in the step (1) by adopting a liquid-assisted laser processing technology, and processing the through hole into a target hole.
The gas-assisted laser processing technology is characterized in that auxiliary gas is adopted in the laser processing process and used for blowing away splashes generated in the laser processing process and reducing the temperature of a laser processing area. Preferably, a coaxial gas-assisted laser processing technique is adopted, namely, a gas flow beam of auxiliary gas is coaxial with the laser beam, and the diameter of the gas flow beam is larger than the diameter of a laser beam focusing point; as a further preference, the gas stream beam is coaxial with the laser beam and the gas stream beam is located at the periphery of the laser beam.
The liquid-assisted laser processing technology is characterized in that auxiliary liquid is adopted in the laser processing process and used for removing a heat affected zone generated by laser processing. Preferably, a coaxial liquid-assisted laser processing technique is employed, i.e., the liquid stream is coaxial with the laser beam and the diameter of the liquid stream is larger than the diameter of the laser beam focal point; as a further preference, the liquid flow is coaxial with the laser beam and the liquid flow is located at the periphery of the laser beam.
Preferably, the diameter of the through hole is 0.1mm to 1mm smaller than the diameter of the target hole.
Since the refractive indexes of liquid and air to light are different, the laser focusing point in the laser processing by the gas assist method in the step (1) is different in position from the laser focusing point in the laser processing by the liquid assist method in the step (2), and therefore, preferably, before the step (2), the position of the workpiece is first adjusted so that the focusing point of the laser in the step (2) is located in the region to be processed of the workpiece.
The auxiliary gas is not limited, and comprises one or a mixture of several of compressed air, nitrogen, helium, argon and the like.
The auxiliary liquid is not limited, and comprises one or more of deionized water, purified water, distilled water, tap water, sodium chloride solution and the like.
Preferably, the glass is a highly transparent quartz glass.
The invention also provides a device for realizing the laser processing method, which comprises a laser processing head, an auxiliary gas supply system and an auxiliary liquid supply system;
the laser processing head is internally provided with light-transmitting glass, and a laser beam enters the laser processing head through the light-transmitting glass and is emitted onto a workpiece through a nozzle of the laser processing head;
the auxiliary gas supply system comprises at least one gas channel arranged in the laser processing head, a gas pipeline positioned outside the laser processing head and a gas on-off switch; the gas on-off switch is turned on, and the auxiliary gas enters at least one gas channel in the laser processing head through the gas pipeline and then flows out from the nozzle position of the laser processing head;
the auxiliary liquid supply system comprises a liquid channel arranged in the laser processing head, a liquid pipeline and a liquid on-off switch, wherein the liquid pipeline and the liquid on-off switch are positioned outside the laser processing head; the liquid on-off switch is turned on, and auxiliary liquid enters a liquid channel in the laser processing head through a liquid pipeline and then flows out from a nozzle position of the laser processing head;
preferably, the laser processing head is further provided with a gas interface, and the gas pipeline is connected with the gas channel through the gas interface.
Preferably, the laser processing head is further provided with a liquid interface, and the liquid pipeline is connected with the liquid channel through the liquid interface.
As one implementation, the gas channel is in communication with the liquid channel.
As one implementation, the gas conduit is in communication with a liquid conduit.
As an implementation mode, the laser processing head consists of an upper cavity and a lower cavity which are connected together to form the complete laser processing head. Preferably, the gas channel and the liquid channel are located in the upper cavity, and the nozzle is located in the lower cavity. Preferably, the transparent glass is fixed on the upper cavity. The connection method is not limited, and the connection method may be screwed together, or may be fixed together by flange bolts, or the like. The light-transmitting glass is fixed on the upper cavity.
Preferably, the surface of the light-transmitting glass facing the nozzle is of a convex structure, so that bubbles are prevented from accumulating at the position of the light-transmitting glass when liquid passes through the nozzle, and water drops are prevented from accumulating at the position of the light-transmitting glass when gas passes through the nozzle, so that a smooth light path for laser transmission is ensured, and energy loss is reduced.
Preferably, the device further comprises a scanning system, and the laser beam enters the laser processing head after changing the path and focusing by the scanning system. As one implementation, the scanning system includes a scanning galvanometer for altering the path of the laser beam, and a field lens for focusing the laser beam. Preferably, at least two galvanometer lenses are arranged inside the scanning galvanometer and used for controlling the laser beam to move in at least X, Y two directions.
Preferably, a workpiece carrying mechanism is further provided for driving the workpiece to linearly move in the direction X, Y, Z, so as to adjust the position of the workpiece in the direction X, Y, Z. Further preferably, the workpiece carrying mechanism can also drive the workpiece to rotate.
The laser processing method adopting the combination of gas assistance and liquid assistance has the following beneficial effects:
(1) the invention firstly adopts a gas-assisted laser processing technology and then adopts a liquid-assisted laser processing technology. Through the gas-assisted laser processing technology, a through hole which is provided with a heat affected zone and has a diameter smaller than the diameter of a target hole can be quickly formed, namely, the through hole is punched to form a channel for discharging liquid and impurities during subsequent liquid-assisted laser processing, so that the processing efficiency of the subsequent liquid-assisted laser processing can be effectively improved, and meanwhile, the pollution of the impurities splashed during the laser processing and the damage to a lens of a scanning galvanometer can be avoided. In addition, the heat affected zone generated during gas-assisted laser processing can be effectively removed by the liquid-assisted laser processing technology, and finally, the size required by the target hole can be accurately processed.
(2) Compared with a single gas-assisted laser processing technology and a single liquid-assisted laser processing technology, the laser processing method has the advantages of small heat affected zone, good processing quality, high processing efficiency and the like.
(3) The processing device has the characteristics of small volume and convenient operation, and can realize the quick switching of gas-assisted laser processing and liquid-assisted laser processing by clamping a workpiece on the device once and controlling the gas on-off switch and the liquid on-off switch, thereby avoiding the space positioning and position correction after the secondary clamping of the workpiece, being beneficial to reducing the processing procedures, shortening the processing time and improving the processing precision and efficiency.
(4) The processing quality of the processing device is equivalent to that of the ultrashort pulse laser, and the processing efficiency and the processing depth capability of the processing device are superior to those of the ultrashort pulse laser, so that three-dimensional processing with large depth and high efficiency of nanosecond laser can be realized simultaneously.
Drawings
FIG. 1 is a schematic illustration of water assisted laser machining with stagnation zones when the hole is not pierced.
Fig. 2 is a schematic structural view of a laser processing apparatus in embodiment 1 of the present invention.
Fig. 3 is a schematic view of laser processing in example 1 of the present invention.
Fig. 4 is a diagram showing effects of laser processing in example 1 of the present invention.
Fig. 5 is a schematic structural view of a laser processing apparatus in embodiment 2 of the present invention.
The reference numerals in figures 1, 2, 3, 5 are: 1-scanning galvanometer; 2-a field lens; 3-a laser beam; 4-a workpiece; 5-interface; 6-a pipeline; 7-an auxiliary gas; 8-an auxiliary liquid; 9-gas on-off electromagnetic valve; 10-liquid on-off solenoid valve; 11-a gas pipeline; 12-a liquid conduit; 13-gas interface; 14-liquid interface; 15-laser composite processing head; 16-high light transmission quartz glass; 17-an upper chamber body; 18-a lower cavity; 19-machining head internal gas passage; 20-processing head internal liquid passage; 21-machining head internal passages; 22-gas-assisted laser rough machining of the obtained through hole; 23-a heat affected zone; 24-target hole obtained by liquid-assisted laser finish machining, 25-nozzle 25, 26-stagnation zone, 27-free jet flow zone, 28-deep hole processed by laser, 29-near wall surface zone and 30-water flow.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, which are intended to facilitate the understanding of the present invention and are not intended to limit the present invention in any way.
Example 1:
in the present embodiment, the laser processing apparatus includes a laser processing head 15, an assist gas supply system, an assist liquid supply system, and a scanning system, as shown in fig. 2.
The scanning system comprises a scanning galvanometer 1 for changing the path of the laser beam 3 and a field lens 2 for focusing the laser beam 3. At least two galvanometer plates are disposed within the scanning galvanometer for controlling the movement of the laser beam in at least X, Y two directions.
The laser processing head 15 is provided with highly transparent quartz glass 16 inside, and the laser beam 3 enters the laser processing head 15 through the highly transparent quartz glass 16 and is emitted onto the workpiece 4 through a nozzle 25 of the laser processing head 15.
The auxiliary gas supply system comprises at least one gas channel 19 arranged inside the laser processing head 15, a gas pipe 11 located outside the processing head 15 and a gas on-off solenoid valve 9. The gas on-off solenoid valve 9 is used to control the inflow of outside gas into the gas passage 19. The gas on-off solenoid valve 9 is opened and gas 7 enters at least one gas passage 19 inside the laser processing head 15 through the gas pipe 11 and then flows out from the position of the nozzle 25 of the laser processing head 15. The laser processing head 15 is also provided with a gas connection 13, through which gas connection 13 the gas line 11 is connected to a gas channel 19.
The secondary liquid supply system comprises at least one liquid passage 20 provided inside the laser machining head 15, a liquid conduit 12 located outside the machining head 15 and a liquid on-off solenoid valve 10. The liquid on-off solenoid valve 10 is used to control the ingress of external liquid into the gas passage 19. The liquid on-off solenoid valve 10 is opened and the liquid 8 enters the liquid passage 20 inside the laser processing head 15 through the liquid pipe 12 and then flows out from the position of the nozzle 25 of the laser processing head 15. The laser machining head 15 is further provided with a liquid connection 14, and the liquid line 12 is connected to the liquid channel 20 via the liquid connection 14.
In this embodiment, the laser processing head 15 is composed of an upper chamber 17 and a lower chamber 18, a gas passage 19 and a liquid passage 20 are located in the upper chamber, and a nozzle 25 is located in the lower chamber. The upper cavity and the lower cavity are connected together through threads or fixed together through flange bolts to form a complete laser processing head 15.
The method for performing laser processing by using the laser processing device comprises the following steps:
(1) as shown in fig. 3 (a), the workpiece is mounted on the five-axis motion stage, the five-axis motion stage is moved to position the workpiece below the laser processing head, and the position of the workpiece is adjusted to focus the laser beam on the position of the workpiece to be processed after passing through the scanning system and the laser processing head.
(2) As shown in fig. 3 (b), the gas on-off solenoid valve 9 is opened while the liquid on-off solenoid valve 10 is kept closed, and gas enters the laser-machined gas passage 19 from the gas pipe 11 and then flows out through the nozzle 25. The pressure of the gas pipe 11 may be set to 0.1MPa to 1MPa (relative pressure). And then, starting the laser beam, enabling the scanning galvanometer to act according to a set scanning path, changing the position of the workpiece to be processed irradiated by the laser, and processing the workpiece to obtain a through hole 22 with the diameter being about 0.1-1 mm smaller than the diameter of the target hole by using a gas-assisted laser rough processing technology, wherein a heat affected zone 23 with the size of about 1-100 um possibly exists at the edge of the through hole. After the processing is finished, the gas on-off electromagnetic valve 9 is closed.
(3) As shown in fig. 3 (c), due to the difference in refractive index between water and air to the laser, the focus point of the laser moves downward when the water-assisted laser machining is performed, so that the Z axis of the five-axis motion stage is moved to move the workpiece downward by a certain distance along the Z axis, and the focus point of the laser during the water-assisted laser machining performed in step (4) is located in the region to be machined.
(4) As shown in fig. 3 (d), the liquid on-off solenoid valve 10 is turned on, air in the laser head is removed for 1-10 s, and a stable laminar water column is formed at the nozzle of the laser head. The pressure of the liquid pipe 12 may be set to 0.1MPa to 1MPa (relative pressure). And then, starting the laser beam, enabling the scanning galvanometer to act according to a set scanning path, changing the position of the workpiece to be processed irradiated by the laser, and processing the workpiece to obtain the target hole with the required size by a liquid-assisted laser finish machining technology. At the same time, the heat affected zone 23 of about 1um to 100um size is also removed in this liquid-assisted laser finishing, resulting in a high-precision, low-damage pass with essentially no heat affected zone. After the processing is completed, the liquid on-off solenoid valve 10 is closed.
The target hole obtained by the above processing is a special-shaped hole as shown in fig. 4, the depth thereof is about 6mm, and the processing time is about 4 minutes. The same special-shaped hole is processed, and the simple water-assisted laser processing method needs 20 minutes.
Example 2:
in this embodiment, the structure of the laser processing apparatus is shown in fig. 5. The structure of this laser processing device is substantially the same as that of embodiment 1, except that a gas passage 19 inside the processing head communicates with a liquid passage 20, a processing head internal passage 21 is formed, and a gas pipe 11 communicates with a liquid pipe 12.
In this embodiment, the laser processing apparatus is configured as shown in fig. 5, and includes a laser processing head 15, an assist gas and liquid supply system, and a scanning system.
The scanning system comprises a scanning galvanometer 1 for changing the path of the laser beam 3 and a field lens 2 for focusing the laser beam 3. At least two galvanometer plates are disposed within the scanning galvanometer for controlling the movement of the laser beam in at least X, Y two directions.
The laser processing head 15 is provided with highly transparent quartz glass 16 inside, and the laser beam 3 enters the laser processing head 15 through the highly transparent quartz glass 16 and is emitted onto the workpiece 4 through a nozzle 25 of the laser processing head 15.
The auxiliary gas and liquid supply system comprises at least one channel 21 arranged inside the laser processing head 15, a port 5 located outside the processing head 15, a gas pipe 11, a gas on-off solenoid valve 9, a liquid pipe 12 and a liquid on-off solenoid valve 10. The gas pipe 11 is communicated with the liquid pipe 12 to form a pipe 6, and the pipe 6 is connected with the channel 21 through the interface 5.
The gas on-off solenoid valve 9 is used to control the inflow of outside gas into the gas passage 19. The gas on/off solenoid valve 9 is opened and gas 7 is admitted through gas line 11 into line 6 and then into passage 21 within the laser machining head and out through the nozzle 25 of the laser machining head 15. The liquid on-off solenoid valve 10 is opened and liquid 8 enters the conduit 6 through the liquid conduit 12 and then enters the passage 21 inside the laser machining head and exits from the nozzle location of the laser machining head 15.
The laser processing device is used for carrying out laser processing, and comprises the following specific steps:
(1) as shown in fig. 3 (a), the workpiece is mounted on the five-axis motion stage, the five-axis motion stage is moved to position the workpiece below the laser processing head, and the position of the workpiece is adjusted to focus the laser beam on the position of the workpiece to be processed after passing through the scanning system and the laser processing head.
(2) As shown in fig. 3 (b), the gas on-off solenoid valve 9 is opened while the liquid on-off solenoid valve 10 is kept closed, and gas enters the pipe 6 from the gas pipe 11, then enters the laser-machined passage 21, and finally flows out through the nozzle. The pressure of the gas pipe 11 may be set to 0.1MPa to 1MPa (relative pressure). And then, starting the laser beam, enabling the scanning galvanometer to act according to a set scanning path, changing the position of the workpiece to be processed irradiated by the laser, and processing the workpiece to obtain a through hole 22 with the diameter being about 0.1-1 mm smaller than the diameter of the target hole by using a gas-assisted laser rough processing technology, wherein a heat affected zone 23 with the size of about 1-100 um possibly exists at the edge of the through hole. After the processing is finished, the gas on-off electromagnetic valve 9 is closed.
(3) As shown in fig. 3 (c), due to the difference in refractive index between water and air to the laser, the focus point of the laser moves downward when the water-assisted laser processing is performed, so that the Z axis of the five-axis motion stage is moved to move the workpiece downward by a certain distance along the Z axis, and the focus point of the laser is located in the region to be processed when the water-assisted laser processing is performed.
(4) As shown in fig. 3 (d), the liquid on-off solenoid valve 10 is opened, the liquid enters the pipeline 6 from the liquid pipeline 12, then enters the laser processing channel 21, finally flows out through the nozzle, and the air in the laser head is removed within 1-10 s of maintaining the liquid of the solenoid valve 10, so that a stable laminar water column is formed at the nozzle of the laser head. And then, starting the laser beam, enabling the scanning galvanometer to act according to a set scanning path, changing the position of the workpiece to be processed irradiated by the laser, and processing the workpiece to obtain the target hole with the required size by a liquid-assisted laser finish machining technology. The pressure of the liquid pipe 12 may be set to 0.1MPa to 1MPa (relative pressure). At the same time, the heat affected zone 23 of about 1um to 100um size is also removed in this liquid-assisted laser finishing, resulting in a high-precision, low-damage pass with essentially no heat affected zone. After the processing is completed, the liquid on-off solenoid valve 10 is closed.
The embodiments described above are intended to illustrate the technical solutions of the present invention in detail, and it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modification, supplement or similar substitution made within the scope of the principles of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A laser processing method is characterized in that: the method comprises the following steps:
(1) obtaining a through hole at a position to be processed by adopting a gas-assisted laser processing technology, wherein the diameter of the through hole is smaller than that of a target hole to be processed;
(2) and (2) further performing laser processing on the through hole prepared in the step (1) by adopting a liquid-assisted laser processing technology, and processing the through hole into a target hole.
2. The laser processing method according to claim 1, wherein: in the step (1), the gas flow beam of the auxiliary gas is coaxial with the laser beam, and the diameter of the gas flow beam is larger than the diameter of a focusing point of the laser beam;
preferably, in the step (1), the gas flow stream is coaxial with the laser beam, and the gas flow stream is located at the periphery of the laser beam.
3. The laser processing method according to claim 1, wherein: in the step (2), the liquid flow is coaxial with the laser beam, and the diameter of the liquid flow is larger than the diameter of a focusing point of the laser beam;
preferably, in the step (2), the liquid flow is coaxial with the laser beam, and the liquid flow is positioned at the periphery of the laser beam;
preferably, in the step (2), the workpiece position is first adjusted so that the focusing point of the laser light in the step (2) is located in the region to be processed of the workpiece.
4. The laser processing method according to claim 1, wherein: the diameter of the through hole is 0.1 mm-1 mm smaller than that of the target hole.
5. The laser processing method according to claim 1, wherein: the auxiliary gas comprises one or a mixture of several of compressed air, nitrogen, helium and argon;
preferably, the auxiliary liquid comprises one or more of deionized water, purified water, distilled water, tap water and a sodium chloride solution.
6. An apparatus for carrying out the laser processing method according to any one of claims 1 to 5, characterized in that: the laser processing device comprises a laser processing head, an auxiliary gas supply system and an auxiliary liquid supply system;
the laser processing head is internally provided with light-transmitting glass, and a laser beam enters the laser processing head through the light-transmitting glass and is emitted onto a workpiece through a nozzle of the laser processing head;
the auxiliary gas supply system comprises at least one gas channel arranged in the laser processing head, a gas pipeline positioned outside the processing head and a gas on-off switch; the gas on-off switch is turned on, and the auxiliary gas enters at least one gas channel in the laser processing head through the gas pipeline and then flows out from the nozzle position of the laser processing head;
the auxiliary liquid supply system comprises a liquid channel arranged in the laser processing head, a liquid pipeline and a liquid on-off switch, wherein the liquid pipeline and the liquid on-off switch are positioned outside the laser processing head; and when the liquid on-off switch is opened, the auxiliary liquid enters a liquid channel inside the laser processing head through the liquid pipeline and then flows out from the position of a nozzle of the laser processing head.
7. The apparatus of claim 6, wherein: the gas pipeline is communicated with the liquid pipeline;
preferably, the laser processing head is further provided with a gas interface, and the gas pipeline is connected with the gas channel through the gas interface;
preferably, the laser processing head is further provided with a liquid interface, and the liquid pipeline is connected with the liquid channel through the liquid interface.
8. The apparatus of claim 6, wherein: the laser processing head consists of an upper cavity and a lower cavity which are connected together to form a complete laser processing head;
preferably, the gas channel and the liquid channel are positioned in an upper cavity, and the nozzle is positioned in a lower cavity; further preferably, the transparent glass is fixed on the upper cavity;
preferably, the surface of the light-transmitting glass facing the nozzle is in a convex structure.
9. The apparatus of claim 6, wherein: the device also comprises a scanning system, and the laser beam enters the laser processing head after changing the path and focusing through the scanning system;
preferably, the scanning system includes a scanning galvanometer for altering the path of the laser beam, and a field lens for focusing the laser beam.
10. The apparatus of claim 6, wherein: the device also comprises a workpiece carrying mechanism which is used for driving the workpiece to linearly move in the direction X, Y, Z;
further preferably, the workpiece carrying mechanism can also drive the workpiece to rotate.
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| CN112824004B (en) * | 2019-11-20 | 2022-11-22 | 中国科学院宁波材料技术与工程研究所 | Composite water-assisted laser processing system and processing method thereof |
| CN112658446B (en) * | 2020-12-10 | 2023-04-07 | 中国科学院宁波材料技术与工程研究所 | Laser-induced plasma micro-machining device and method |
| CN116851914B (en) * | 2023-07-27 | 2024-01-09 | 安徽埃特智能装备有限公司 | Intelligent welding robot and welding method |
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| CN109773355A (en) | 2019-05-21 |
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