CN106312567B - The orthogonal micro-cutting device and method of laser assisted followed automatically with laser spot - Google Patents
The orthogonal micro-cutting device and method of laser assisted followed automatically with laser spot Download PDFInfo
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- CN106312567B CN106312567B CN201610739003.6A CN201610739003A CN106312567B CN 106312567 B CN106312567 B CN 106312567B CN 201610739003 A CN201610739003 A CN 201610739003A CN 106312567 B CN106312567 B CN 106312567B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
- B23P23/04—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass for both machining and other metal-working operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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Abstract
Belong to machining equipment technical field with the orthogonal micro-cutting device and method of laser assisted that laser spot follows automatically, it is therefore intended that solve the problems, such as the height change that real-time monitoring work surface is unable in laser assisted Micro cutting Process of the existing technology.Moving cell of the invention, laser assisted processing unit are mounted on damped platform, and optics follows unit setting in laser assisted processing automatically；It includes lens A, lens B and linear CCD sensor that optics follows unit automatically；The laser that laser light source in laser assisted processing unit issues is irradiated to work surface through lens A, and the laser beam through work surface reflection focuses on linear CCD sensor through lens B；Work surface is mounted on moving cell, and laser action that computer control unit is fed back according to linear CCD sensor distance adjusts work surface in X to, the displacement of Y-direction and Z-direction by moving cell in real time.
Description
Technical field
The invention belongs to machining equipment technical fields, and in particular to a kind of laser followed automatically with laser spot
Assist orthogonal micro-cutting device and method.
Background technique
Demand with aerospace, national defense industry, the development of microelectronics industry, to precision three-dimensional complexity micro-structure part
Be increasingly urgent to, using function, material property, planform, reliability, in terms of requirement it is also higher and higher；For
High safety reliability of the guarantee system under the harsh environments such as high overload, high speed, high rotation, widely apply have intensity it is high,
Material (MMC) the processing microminiature thin walled cavity of light-weight, high tenacity, high ductibility and damage tolerant Flaw characterization, the complexity such as curved body,
Abnormity, integrated morphology, but difficulty of processing increases, and laser assisted micro-cutting technology is current one kind for solving difficult-to-machine material processing
Efficient processing method.Laser-assisted machining is the interaction by laser facula and material, in material by micro-cutting cutter
Change its performance before removal, so that its yield limit is reduced to fracture toughness hereinafter, generating visco-plasticity under the effect of micro-cutting cutter
Flowing.To reduce cutting force, improves tool life and service life, changes Chip Morphology, reduce vibration, reduce face crack,
Improve suface processing quality.
Jonathan A.Shelton et al. [14,15] is with 100 μ m diameter slotting cutters to Ti6Al4V, AISI 422, AISI
The equal materials of 316 and Inconel 718 carry out the micro- milling test of laser assisted, analyze the micro- milling of laser assisted to finished surface light
The influence of cleanliness and burrs on edges.In terms of laser assisted micro-cutting verification experimental verification, Ramesh Singh et al. [16,37,38]
The method of applied statistics analysis optimizes research to the micro- milling process of laser assisted minute groove, and improved statistical model is effective
Ground eliminates the heat affecting to machined surface, and make cutting force decrease, and experiment results proved can by laser auxiliary heating
Improve the accuracy of cutting groove depth.Melkote et al. [39] is 62HRC to hardness using TiAlN coated carbides slotting cutter
Hardening A2 tool steel has carried out the micro- milling fluting test experiments of laser assisted, the results showed that using the micro- milling of laser assisted
Tool wear and surface roughness can be reduced, improve cutting speed and groove depth accuracy.
It does not consider the influence of material microstructure comprehensively in the experiment of above-mentioned laser assisted micro-cutting, and is cut in micro-cutting
Thickness is between 0.1-200 μm, the scale and cutting edge roundness blunt circle of reinforcement and matrix grain size generally at 0.1-100 μm
Radius is dimensionally suitable, and the formation mechenism and material deformation mechanism of chip are inevitable brilliant with laser temperature field, reinforcement and matrix
Grain size, distribution and orientation are closely related.It therefore, should be by dividing for difficult-to-machine material laser assisted micro-cutting process
It is micro- to laser assisted to analyse laser temperature field, reinforcement and matrix grain size, distribution, orientation and reinforcement-matrix grain boundary effect
The influence that superficial layer microdefect is formed in cutting process, research superficial layer microdefect is formed and mechanism of Evolution, could go deep into,
Analysis difficult-to-machine material laser assisted Micro cutting Process physical essence comprehensively.In Milling Processes, the removal process ratio of material
The process of orthogonal cutting is increasingly complex.It is real using orthogonal micro-cutting when studying difficult-to-machine material laser assisted micro-cutting mechanism
Complicated milling process can be optimized for simple one-dimensional orthogonal cutting process by proved recipe method, and researcher can establish and actual cut
The close cutting Model of process.As needing to consider shadow caused by the operating distance of laser and material in laser assisted processing
Ring, especially in micro-cutting process, processing capacity in 0.1-200 μ m, workpiece be cut actual cut thickness with
The given thickness of cutting of Machining Instruction has differences, so needing to carry out precise measurement and control to the operating distance of laser.Mesh
Before, most of researcher be all directly laser light source and traditional milling machine or lathe are carried out it is compound, in entire system of processing
In, it is unable to the height change of real-time monitoring work surface.
Summary of the invention
It is an object of the invention to propose a kind of orthogonal micro-cutting device of the laser assisted followed automatically with laser spot
And method, solve the height change that real-time monitoring work surface is unable in laser assisted Micro cutting Process of the existing technology
The problem of, realize that work surface follows the laser action distance set in real time.
To achieve the above object, the orthogonal micro-cutting device packet of laser assisted followed automatically with laser spot of the invention
It includes damped platform, moving cell, laser assisted processing unit, optics and follows unit and computer control unit automatically；
The moving cell is mounted on the damped platform, and gantry support frame of laser assisted processing unit is fixed on institute
It states on damped platform, the optics follows unit to be arranged on gantry support frame of the laser assisted processing unit automatically；
It includes lens A, lens B and linear CCD sensor that the optics follows unit automatically；Laser assisted is processed in unit
The laser that issues of laser light source be irradiated to work surface through lens A and fix a cutting tool along the front end of direction of feed, through table to be processed
The laser beam of face reflection focuses on linear CCD sensor, the linear CCD sensor and the computer control through lens B
Unit connection processed；
The work surface is mounted on moving cell, and computer control unit is fed back according to linear CCD sensor
Laser action distance adjusts work surface in X to, the displacement of Y-direction and Z-direction by moving cell in real time.
The moving cell includes X to slide unit, Y-direction slide unit, Z-direction slide unit and work piece holder；The Z-direction slide unit, which is fixed on, to be subtracted
It shakes on platform, the Y-direction slide unit is fixed on Z-direction slide unit；X is fixed on Y-direction slide unit to slide unit, work piece holder be fixed on X to
On slide unit；The X is driven to slide unit using linear motor, and the Y-direction slide unit and Z-direction slide unit are driven using servo motor；Z-direction is sliding
Platform is big stroke slide unit, and computer control unit control X is moved to slide unit, Y-direction slide unit and Z-direction slide unit.
The laser assisted processing unit further includes mounting bracket, cutting tool and force snesor；Laser light source passes through peace
Dress bracket is mounted on gantry bracing frame crossbeam top；Laser light source axis is mounted on cutting tool along the front end of direction of feed and hangs down
Directly in X to slide unit table top, the cutting tool is mounted on force snesor, and the main cutting edge of cutting tool is perpendicular to table to be processed
Face direction of feed.
The laser light source axis is consistent with lens A axis.
Micro-cutting method based on the orthogonal micro-cutting device of laser assisted followed automatically with laser spot includes following
Step:
Step 1: adjustment micro-cutting device clamps work surface by work piece holder；
Step 2: the operating distance of adjustment lens A and work surface is L；
Step 3: computer control unit control moving cell drives work surface to carry out doing orthogonal motion, realizes just
Meet is cut；
Step 4: the laser beam that laser light source issues is irradiated to work surface through lens A, reflects through work surface
Laser beam focus on linear CCD sensor through lens B；
Step 5, whether real-time judge laser has displacement in the image planes of linear CCD sensor, if so, thening follow the steps
Six, if it is not, thening follow the steps eight；
Step 6, the displacement d ' that computer control unit is formed in the image planes of linear CCD sensor according to laser pass through
The move distance d of work surface in the Y direction is calculated in formula (1):
Wherein: a is the intersection point of laser light incident optical axis and reflection optical axis to the distance of lens B front principal plane；
B is distance of the lens B back interarea to linear CCD sensor image plane center point；
θ1For the angle of laser light incident optical axis and reflection optical axis；
θ2For the angle of laser reflection optical axis and linear CCD sensor image planes；
Arrangement obtains the move distance d of work surface in the Y direction:
Step 7: computer control unit drives according to the move distance d of the work surface obtained in step 6 in the Y direction
Dynamic Y-direction slide unit movement, makes work surface and lens A distance L；
Step 8: cutting tool continues to process work surface；
Step 9: step 5 is repeated to step 8 until completing the process.
The invention has the benefit that the orthogonal micro-cutting dress of the laser assisted followed automatically with laser spot of the invention
It sets and method changes its performance before material is removed by micro-cutting cutter, make its surrender by the interaction of laser and material
The limit is reduced to fracture toughness hereinafter, generating viscoplastic flow under the effect of micro-cutting cutter.To reduce cutting force, knife is improved
Have durability and service life, change Chip Morphology, reduces vibration, reduce face crack, improve suface processing quality.In addition, this hair
Bright optics follows unit for laser automatically while being used in location of workpiece feedback, and the height of real-time monitoring work surface becomes
Change.Laser also acts as location of workpiece feedback effect, optics of the invention follows list automatically in addition to playing the heat effect to workpiece
Member directlys adopt the laser light source in existing laser assisted processing as light source, cost is saved, in addition, more high-precision in order to realize
The micro-cutting of degree is processed, need to consider different materials theoretical cutting-in and real cutting depth present in difference, this difference can be with
It measures to obtain by the variation to processing rear surface height, and the accurate micro-cutting of realization is compensated to this difference.By
The characteristic that laser light source itself in the processing of existing laser assisted is installed, optical path of the invention are pacified perpendicular to finished surface
Dress, precise measurement while, will not interfere with processing unit (plant), highly integrated measurement and processing unit (plant).It ensure that position is anti-
The precision of feedback；The present invention provides a kind of more accurate methods to realize following automatically for workpiece surface, solves laser assisted
In cutting process, the problem of workpiece surface height is unable to precise measurement, machining accuracy is improved.
Detailed description of the invention
Fig. 1 is the orthogonal micro-cutting apparatus structure schematic diagram of laser assisted followed automatically with laser spot of the invention；
Fig. 2 be in the orthogonal micro-cutting device of laser assisted followed automatically with laser spot of the invention optics automatically with
With index path；
Fig. 3 be in the orthogonal micro-cutting device of laser assisted followed automatically with laser spot of the invention optics automatically with
With schematic diagram；
Fig. 4 is the orthogonal micro-cutting method flow diagram of laser assisted followed automatically with laser spot of the invention；
Wherein: 1, damped platform, 2, Z-direction slide unit, 3, Y-direction slide unit, 4, X to slide unit, 5, work piece holder, 6, cutting tool,
7, force snesor, 8, laser light source, 9, mounting bracket, 10, lens A, 11, linear CCD sensor, 12, lens B, 13, gantry branch
Support.
Specific embodiment
Embodiments of the present invention are described further with reference to the accompanying drawing.
Referring to attached drawing 1, the orthogonal micro-cutting device of laser assisted followed automatically with laser spot of the invention includes subtracting
Shake platform 1, moving cell, laser assisted processing unit, optics follow unit and computer control unit automatically；
The moving cell is mounted on the damped platform 1, and gantry support frame 13 that laser assisted processes unit is fixed
On the damped platform 1, the optics follows unit that gantry support frame that the laser assisted processes unit is arranged in automatically
On 13；
It includes lens A10, lens B12 and linear CCD sensor 11 that the optics follows unit automatically；Laser assisted processing
The laser that laser light source 8 in unit issues is irradiated to work surface through lens A10 and fixes a cutting tool along the front end of direction of feed, warp
The laser beam of work surface reflection focuses on linear CCD sensor 11, the linear CCD sensor 11 through lens B12
It is connected with the computer control unit；
The work surface is mounted on moving cell, and computer control unit is fed back according to linear CCD sensor 11
Laser action distance work surface is adjusted in X to, the displacement of Y-direction and Z-direction by moving cell in real time.
The moving cell includes X to slide unit 4, Y-direction slide unit 3, Z-direction slide unit 2 and work piece holder 5；The Z-direction slide unit 2 is solid
It is scheduled on damped platform 1, the Y-direction slide unit 3 is fixed on Z-direction slide unit 2；X is fixed on Y-direction slide unit 3 to slide unit 4, workpiece clamp
Tool 5 is fixed on X on slide unit 4；The X is driven to slide unit 4 using linear motor, and the Y-direction slide unit 3 and 2 use of Z-direction slide unit are watched
Take motor driven；Z-direction slide unit 2 is big stroke slide unit, and computer control unit controls X to slide unit 4, Y-direction slide unit 3 and Z-direction slide unit 2
Movement.Due to static load minimum, the high speed feed in orthogonal cutting may be implemented using straight line slide unit；Use work piece holder 5
Convenient for the quick despatch of workpiece.
The laser assisted processing unit further includes mounting bracket 9, cutting tool 6 and force snesor 7；Laser light source 8 is logical
It crosses mounting bracket 9 and is mounted on 13 beam top of gantry support frame；8 axis of laser light source is mounted on cutting tool 6 along direction of feed
Front end and perpendicular to X to 4 table top of slide unit, the cutting tool 6 is mounted on force snesor 7, the main cutting edge of cutting tool 6
Perpendicular to work surface direction of feed, laser assisted processing cell position is fixed, moving cell drive workpiece complete into
It gives, realizes laser assisted orthogonal cutting.
8 axis of laser light source is consistent with lens A10 axis, 8 vertical incidence lens forming superlaser of laser light source
Beam acts on work surface.
Referring to attached drawing 2, optics follows unit optical path using the laser light source 8 in laser assisted processing unit automatically, passes through
Linear CCD sensor 11 acquires the laser position that workpiece surface returns and calculates optical path difference variable quantity in optical path, and laser assisted is just
It hands in Micro cutting Process, before cutting tool 6 cuts workpiece, laser light source 8 acts on work surface by lens A10, cuts
6 cutting edge of cutting knife tool is constant at a distance from 8 optical axis of laser light source, and setting finishes before processing, and action time depends on cutting
6 cutting edge of cutter follows unit anti-at a distance from 8 optical axis of laser light source and the feed speed of workpiece automatically by optics
The optical path difference variable quantity of feedback, the i.e. variation of laser action distance adjust the height of workpiece, guarantee workpiece always in the laser of setting
It is processed under operating distance；The computer control unit is reached by the feeding that digital control system controls moving cell with laser action
To synchronization.
Referring to attached drawing 3 and attached drawing 4, based on the micro- of the orthogonal micro-cutting device of laser assisted followed automatically with laser spot
Cutting process the following steps are included:
Step 1: adjustment micro-cutting device clamps work surface by work piece holder 5；
Step 2: the operating distance of adjustment lens A10 and work surface is L；
Step 3: computer control unit control moving cell drives work surface to carry out doing orthogonal motion, realizes just
Meet is cut；
Step 4: the laser beam that laser light source 8 issues is irradiated to work surface through lens A10, through work surface
The laser beam of reflection focuses on linear CCD sensor 11 through lens B12；
Step 5, whether real-time judge laser has displacement in the image planes of linear CCD sensor 11, if so, executing step
Rapid six, if it is not, thening follow the steps eight；
Step 6, computer control unit are logical according to the displacement d ' that laser is formed in the image planes of linear CCD sensor 11
It crosses formula (1) and the move distance d of work surface in the Y direction is calculated:
Wherein: a is the intersection point of laser light incident optical axis and reflection optical axis to the distance of lens B12 front principal plane；
B is distance of the lens B12 back interarea to 11 image plane center point of linear CCD sensor；
θ1For the angle of laser light incident optical axis and reflection optical axis；
θ2For the angle of 11 image planes of laser reflection optical axis and linear CCD sensor；
Arrangement obtains the move distance d of work surface in the Y direction:
Step 7: computer control unit drives according to the move distance d of the work surface obtained in step 6 in the Y direction
Dynamic Y-direction slide unit 3 moves, and makes work surface and lens A10 distance L；
Step 8: cutting tool 6 continues to process work surface；
Step 9: step 5 is repeated to step 8 until completing the process.
Claims (4)
1. the micro-cutting method with the orthogonal micro-cutting device of laser assisted that laser spot follows automatically, which is characterized in that
The orthogonal micro-cutting device of laser assisted followed automatically with laser spot includes damped platform (1), moving cell, laser
Secondary process unit and computer control unit；
The moving cell is mounted on the damped platform (1), and gantry support frame (13) that laser assisted processes unit is fixed
On the damped platform (1)；
It further include that optics follows unit automatically, the optics follows unit that the dragon that the laser assisted processes unit is arranged in automatically
On door support frame (13)；It includes lens A(10 that the optics follows unit automatically), lens B(12) and linear CCD sensor
(11)；The laser that laser light source (8) in laser assisted processing unit issues is irradiated to work surface upper slitter through lens A(10)
For tool along the front end of direction of feed, the laser beam through work surface reflection penetrates lens B(12) focus on linear CCD sensor
(11), the linear CCD sensor (11) connects with the computer control unit；
The work surface is mounted on moving cell, and computer control unit is fed back according to linear CCD sensor (11)
Laser action distance adjusts work surface in X to, the displacement of Y-direction and Z-direction by moving cell in real time；
The micro-cutting method the following steps are included:
Step 1: adjustment micro-cutting device clamps work surface by work piece holder (5)；
Step 2: adjustment lens A(10) and work surface operating distance be L；
Step 3: computer control unit control moving cell drives work surface to carry out doing orthogonal motion, realizes positive meet
It cuts；
Step 4: the laser beam that laser light source (8) issues is irradiated to work surface through lens A(10), through work surface
The laser beam of reflection focuses on linear CCD sensor (11) through lens B(12)；
Step 5, whether real-time judge laser has displacement in the image planes of linear CCD sensor (11), if so, thening follow the steps
Six, if it is not, thening follow the steps eight；
Step 6, the displacement d ' that computer control unit is formed in the image planes of linear CCD sensor (11) according to laser pass through
The move distance d of work surface in the Y direction is calculated in formula (1):
(1)
Wherein: a is the intersection point of laser light incident optical axis and reflection optical axis to the distance of lens B(12) front principal plane；
B be lens B(12) back interarea to linear CCD sensor (11) image plane center point distance；
θ1For the angle of laser light incident optical axis and reflection optical axis；
θ2For the angle of laser reflection optical axis and linear CCD sensor (11) image planes；
Arrangement obtains the move distance d of work surface in the Y direction:
(2)；
Step 7: computer control unit drives Y according to the move distance d of the work surface obtained in step 6 in the Y direction
It is moved to slide unit (3), makes work surface and lens A(10) distance L；
Step 8: cutting tool (6) continues to process work surface；
Step 9: step 5 is repeated to step 8 until completing the process.
2. micro-cutting method according to claim 1, which is characterized in that the moving cell includes X to slide unit (4), Y-direction
Slide unit (3), Z-direction slide unit (2) and work piece holder (5)；The Z-direction slide unit (2) is fixed on damped platform (1), the Y-direction slide unit
(3) it is fixed on Z-direction slide unit (2)；X is fixed on Y-direction slide unit (3) to slide unit (4), and work piece holder (5) is fixed on X to slide unit
(4) on；The X is driven to slide unit (4) using linear motor, and the Y-direction slide unit (3) and Z-direction slide unit (2) are driven using servo motor
It is dynamic；Z-direction slide unit (2) is big stroke slide unit, and computer control unit controls X to slide unit (4), Y-direction slide unit (3) and Z-direction slide unit (2)
Movement.
3. micro-cutting method according to claim 2, which is characterized in that the laser assisted processing unit further includes installation
Bracket (9), cutting tool (6) and force snesor (7)；Laser light source (8) is mounted on gantry support frame by mounting bracket (9)
(13) beam top；Laser light source (8) axis is mounted on cutting tool (6) along the front end of direction of feed and perpendicular to X to slide unit
(4) table top, the cutting tool (6) are mounted on force snesor (7), and the main cutting edge of cutting tool (6) is perpendicular to be processed
Surface direction of feed.
4. according to micro-cutting method described in one claim of any of the above, which is characterized in that laser light source (8) axis
It is consistent with lens A(10) axis.
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| CN105252144A (en) * | 2014-07-17 | 2016-01-20 | 大族激光科技产业集团股份有限公司 | High-precision laser follow-up cutting head and monitoring and automatic focus finding method thereof |
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