CN112317963A - Femtosecond laser composite rapid cutter servo orthogonal cutting device and method - Google Patents
Femtosecond laser composite rapid cutter servo orthogonal cutting device and method Download PDFInfo
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- CN112317963A CN112317963A CN202011130312.6A CN202011130312A CN112317963A CN 112317963 A CN112317963 A CN 112317963A CN 202011130312 A CN202011130312 A CN 202011130312A CN 112317963 A CN112317963 A CN 112317963A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The femtosecond laser composite fast tool servo orthogonal cutting device and method belong to the technical field of non-resonant metal cutting, and comprise a pneumatic vibration isolation platform, a fast tool servo device, a high-precision dividing head, an X-axis moving system, a Y-axis moving system, a Z-axis moving system, a femtosecond laser generator and a workpiece, wherein the pneumatic vibration isolation platform is a stable supporting structure; according to the invention, the metal surface is bombarded by laser, so that the superhard difficult-to-machine metal is softened before cutting, and the micro-nano functional surface is formed after cutting, thereby realizing metal cutting of the superhard difficult-to-machine material and realizing one-step manufacturing of the superhard functional surface.
Description
Technical Field
The invention belongs to the technical field of non-resonant metal cutting, and particularly relates to a femtosecond laser composite rapid cutter servo orthogonal cutting device and method.
Background
As one form of non-resonant metal cutting, a fast tool servo is mounted on a spindle of a machining center to perform cutting machining instead of a conventional milling cutter. The quick cutter servo cutting is a processing mode for realizing vibration cutting by utilizing a piezoelectric ceramic driving micro-displacement mechanism, and the cutter stroke can reach the scale of micrometer to 1 millimeter. The cutting machine can be arranged on a lathe or a milling machine by utilizing the quick tool servo. The working frequency is related to the selected piezoelectric ceramic stack, and the average using frequency is about 2 KHz.
The femtosecond laser processing technology has been introduced into the field of metal cutting in recent years. Femtosecond is a unit of time. One femtosecond equals minus 15 times a second of 10. Even if the time is shorter, the femtosecond laser is a pulsed light with a frequency of several tens to several hundreds KHz. The processing mode is non-contact processing, the unidirectionality is good, and no cutting force exists in the cutting process. Because of its many advantages, laser light plays an important role in metal surface etching and metal cutting processes.
Therefore, a new technical solution is needed in the prior art to combine the femtosecond laser processing technology with the fast tool servo cutting technology to solve the problem of one-step processing of the functional surface of the metal material.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: provides a femtosecond laser composite fast cutter servo orthogonal cutting device and a method, and realizes the one-step manufacture of the superhard functional surface.
The femtosecond laser composite fast tool servo orthogonal cutting device is characterized in that: the pneumatic vibration isolation platform is a stable supporting structure;
the X-axis moving system comprises an X-axis moving system fixing part and an X-axis moving system moving part, the X-axis moving system fixing part is fixedly arranged on the pneumatic vibration isolation platform, and the X-axis moving system moving part is arranged on the X-axis moving system fixing part and moves on the X-axis moving system fixing part along the X-axis direction;
the Z-axis moving system comprises a Z-axis moving system fixing part and a Z-axis moving system moving part, the Z-axis moving system fixing part is fixedly arranged on the X-axis moving system moving part, and the Z-axis moving system moving part is arranged on the Z-axis moving system fixing part and moves along the Z-axis direction on the Z-axis moving system fixing part;
the Y-axis moving system comprises a Y-axis moving system fixing part and a Y-axis moving system moving part, the Y-axis moving system fixing part is fixedly arranged on the Z-axis moving system moving part, and the Y-axis moving system moving part is arranged on the Y-axis moving system fixing part and moves on the Y-axis moving system fixing part along the Y-axis direction;
the rapid cutter servo device comprises a diamond cutter, a piezoelectric ceramic stack, a pre-tightening screw and a support assembly, wherein the support assembly is arranged on a moving part of a Z-axis moving system, the piezoelectric ceramic stack is arranged in the support assembly through the pre-tightening screw, the diamond cutter is arranged at the lower part of the support assembly, and the piezoelectric ceramic stack drives the diamond cutter to cut;
the high-precision indexing head comprises an indexing head fixing part and an indexing head rotating part, wherein the indexing head fixing part is arranged on the pneumatic vibration isolation platform, and the indexing head rotating part is arranged on the indexing head fixing part and rotates around the axis of the indexing head fixing part;
the femtosecond laser generator is arranged on the pneumatic vibration isolation platform, and an optical fiber of the femtosecond laser generator is arranged in the diamond cutter;
the workpiece is arranged on the indexing head rotating part.
The femtosecond laser composite fast cutter servo orthogonal cutting method and the femtosecond laser composite fast cutter servo orthogonal cutting device are applied, and the method comprises the following steps which are sequentially carried out,
step one, designing a processing path of a diamond cutter by programming a numerical control program;
secondly, designing a laser processing program according to the numerical control program in the first step, and selecting the working frequency of a femtosecond laser generator to be 100 KHz;
step three, mounting the workpiece on a rotary part of the dividing head;
opening a controller of the piezoelectric ceramic stack to enable the diamond cutter to vibrate at the frequency of 2 KHz;
fifthly, adjusting the positions of the high-precision dividing head, the X-axis moving system, the Y-axis moving system and the Z-axis moving system respectively, and adjusting the workpiece to be right below the diamond cutter;
and sixthly, operating a numerical control program and a laser processing program to process the composite microstructure of the workpiece.
The workpiece comprises a cutting structure and a surface ablation structure after cutting processing.
Through the design scheme, the invention can bring the following beneficial effects: the femtosecond laser composite fast cutter servo orthogonal cutting device and method achieve softening of superhard and difficult-to-machine metal before cutting through laser bombardment of the metal surface, form a micro-nano functional surface after cutting, and achieve metal cutting of superhard and difficult-to-machine materials.
The invention has the further beneficial effects that:
1. the processing range of a common numerical control machine tool is expanded, the processing efficiency of the machine tool is improved, and materials which cannot be processed before the processing are finished are obtained.
2. For metal material processing, a functional surface with a micro-nano structure can be manufactured in one step by femtosecond laser composite fast cutter servo orthogonal cutting.
3. The femtosecond laser composite rapid cutter servo orthogonal cutting greatly reduces cutter abrasion, improves cutting efficiency and improves the cutting state of the cutter and the surface.
Drawings
The invention is further described with reference to the following figures and detailed description:
FIG. 1 is a schematic structural diagram of a femtosecond laser composite fast tool servo orthogonal cutting device.
FIG. 2 is a schematic structural diagram of an upper part device of a pneumatic vibration isolation platform of the femtosecond laser composite fast tool servo orthogonal cutting device.
FIG. 3 is a schematic cutting diagram of the femtosecond laser composite fast tool servo orthogonal cutting device of the invention.
FIG. 4 is a schematic diagram of a workpiece machined by the femtosecond laser composite fast tool servo orthogonal cutting method.
In the figure, 1-a pneumatic vibration isolation platform, 2-a quick tool servo device, 3-a high-precision index head, a 4-X axis moving system, a 5-Y axis moving system, a 6-Z axis moving system, a 7-femtosecond laser generator, 8-a workpiece, 201-a diamond tool, 202-a piezoelectric ceramic stack, 203-a pretightening screw, 204-a bracket overall body, 301-an index head fixing part, 302-an index head rotating part, 401-X axis moving system fixing part, 402-X axis moving system moving part, 501-Y axis moving system fixing part, 502-Y axis moving system moving part, 601-Z axis moving system fixing part, 602-Z axis moving system moving part, 701-an optical fiber, 801-a cutting structure, a cutting structure, 802-surface ablation structure.
Detailed Description
The femtosecond laser composite fast tool servo orthogonal cutting device and the method thereof are shown in figures 1-4, and the device comprises the following components: a pneumatic vibration isolation platform 1, a fast cutter servo device 2, a high-precision indexing head 3, an X-axis moving system 4, a Y-axis moving system 5, a Z-axis moving system 6, a femtosecond laser generator 7 and a workpiece 8,
the pneumatic vibration isolation platform 1, the quick cutter servo device 2, the high-precision indexing head 3, the X-axis moving system 4, the Y-axis moving system 5, the Z-axis moving system 6, the femtosecond laser generator 7 and the workpiece 8 are all arranged on the dynamic vibration isolation platform 1 to support the components.
The X-axis moving system 4 mainly includes an X-axis moving system fixing part 401 and an X-axis moving system moving part 402; the X-axis moving system fixing member 401 is mounted on the pneumatic vibration isolation table 1, and the X-axis moving system moving member 402 moves left and right with respect to the X-axis moving system fixing member 401.
The Z-axis moving system 6 mainly includes a Z-axis moving system fixing part 601 and a Z-axis moving system moving part 602; the Z-axis moving system fixing member 601 is attached to the X-axis moving system moving member 402, and the Z-axis moving system moving member 602 moves up and down relative to the X-axis moving system fixing member 601.
The Y-axis moving system 5 mainly includes a Y-axis moving system fixing part 501 and a Y-axis moving system moving part 502; the Y-axis moving system fixing member 501 is attached to the Z-axis moving system moving member 602, and the Y-axis moving system moving member 502 moves forward and backward with respect to the Y-axis moving system fixing member 501.
The quick cutter servo device 2 mainly comprises a diamond cutter 201, a piezoelectric ceramic stack 202, a pre-tightening screw 203 and a bracket assembly 204; the bracket assembly 204 is arranged on a moving component 602 of the Z-axis moving system and can move up and down, the piezoelectric ceramic stack 202 is arranged on the bracket assembly 204 through a pretightening screw 203, and the piezoelectric ceramic stack 202 drives the diamond cutter 201 to perform low-frequency vibration cutting.
The high-precision index head 3 mainly comprises an index head fixing part 301 and an index head rotating part 302; the index head fixing part 301 is installed on the pneumatic vibration isolation platform 1, and the index head rotating part 302 can rotate around the axis of the index head fixing part 301.
The femtosecond laser generator 7 is matched with the optical fiber 701 to etch the surface to be processed by the optical fiber. The optical fiber 701 is embedded in the diamond tool 201, and laser processing is performed through the diamond tool 201.
The workpiece 8 has a surface with two-stage structures, including a cutting structure 801 and a surface ablation structure 802.
The femtosecond laser composite fast cutter servo orthogonal cutting method adopts the femtosecond laser composite fast cutter servo orthogonal cutting device to process, comprises the following steps which are sequentially carried out,
the method comprises the following steps: programming a numerical control program and designing a processing path of the diamond cutter 201;
step two: designing a laser processing program according to the numerical control program in the first step, and selecting the working frequency of the femtosecond laser generator 7 as 100 KHz;
step three: mounting the workpiece 8 on the index head rotating portion 302 in preparation for machining;
step four: opening a controller of the piezoelectric ceramic stack 202 to enable the diamond cutter 201 to vibrate at the frequency of 2 KHz;
step five: respectively adjusting the positions of the high-precision index head 3, the X-axis moving system 4, the Y-axis moving system 5 and the Z-axis moving system 6, and adjusting the workpiece 8 to be right below the diamond cutter 201;
step six: and running a numerical control program and a laser program to process the composite microstructure of the workpiece 8.
Claims (3)
1. The femtosecond laser composite fast tool servo orthogonal cutting device is characterized in that: the high-precision precise vibration isolation device comprises a pneumatic vibration isolation platform (1), a quick cutter servo device (2), a high-precision indexing head (3), an X-axis moving system (4), a Y-axis moving system (5), a Z-axis moving system (6), a femtosecond laser generator (7) and a workpiece (8), wherein the pneumatic vibration isolation platform (1) is a stable supporting structure;
the X-axis moving system (4) comprises an X-axis moving system fixing part (401) and an X-axis moving system moving part (402), the X-axis moving system fixing part (401) is fixedly arranged on the pneumatic vibration isolation platform (1), the X-axis moving system moving part (402) is arranged on the X-axis moving system fixing part (401) and moves on the X-axis moving system fixing part (401) along the X-axis direction;
the Z-axis moving system (6) comprises a Z-axis moving system fixing part (601) and a Z-axis moving system moving part (602), wherein the Z-axis moving system fixing part (601) is fixedly arranged on the X-axis moving system moving part (402), the Z-axis moving system moving part (602) is arranged on the Z-axis moving system fixing part (601) and moves along the Z-axis direction on the Z-axis moving system fixing part (601);
the Y-axis moving system (5) comprises a Y-axis moving system fixing part (501) and a Y-axis moving system moving part (502), the Y-axis moving system fixing part (501) is fixedly arranged on the Z-axis moving system moving part (602), the Y-axis moving system moving part (502) is arranged on the Y-axis moving system fixing part (501) and moves on the Y-axis moving system fixing part (501) along the Y-axis direction;
the quick cutter servo device (2) comprises a diamond cutter (201), a piezoelectric ceramic stack (202), a pre-tightening screw (203) and a support assembly (204), the support assembly (204) is arranged on a moving part (602) of a Z-axis moving system, the piezoelectric ceramic stack (202) is arranged inside the support assembly (204) through the pre-tightening screw (203), the diamond cutter (201) is arranged at the lower part of the support assembly (204), and the piezoelectric ceramic stack (202) drives the diamond cutter (201) to cut;
the high-precision index head (3) comprises an index head fixing part (301) and an index head rotating part (302), wherein the index head fixing part (301) is arranged on the pneumatic vibration isolation platform (1), and the index head rotating part (302) is arranged on the index head fixing part (301) and rotates around the axis of the index head fixing part (301);
the femtosecond laser generator (7) is arranged on the pneumatic vibration isolation platform (1), and an optical fiber (701) of the femtosecond laser generator (7) is arranged in the diamond cutter (201);
the workpiece (8) is arranged on the index head rotating part (302).
2. The femtosecond laser composite fast cutter servo orthogonal cutting method is characterized in that: the femtosecond laser composite fast tool servo orthogonal cutting device of claim 1 is applied, which comprises the following steps, and the following steps are carried out in sequence,
step one, designing a processing path of a diamond cutter (201) by programming a numerical control program;
secondly, designing a laser processing program according to the numerical control program in the first step, and selecting the working frequency of a femtosecond laser generator (7) to be 100 KHz;
step three, mounting the workpiece (8) on the indexing head rotating part (302);
opening a controller of the piezoelectric ceramic stack (202) to enable the diamond cutter (201) to vibrate at the frequency of 2 KHz;
fifthly, adjusting the positions of the high-precision index head (3), the X-axis moving system (4), the Y-axis moving system (5) and the Z-axis moving system (6) respectively, and adjusting the workpiece (8) to be right below the diamond cutter (201);
and sixthly, operating a numerical control program and a laser processing program to process the composite microstructure of the workpiece (8).
3. The femtosecond laser composite fast tool servo orthogonal cutting method as set forth in claim 2, which is characterized in that: the workpiece (8) comprises a cutting structure (801) and a surface ablation structure (802) after cutting.
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| CN202011130312.6A CN112317963A (en) | 2020-10-21 | 2020-10-21 | Femtosecond laser composite rapid cutter servo orthogonal cutting device and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115229647A (en) * | 2022-07-20 | 2022-10-25 | 华侨大学 | Device and method for femtosecond laser-assisted diamond polishing |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040003689A1 (en) * | 2002-07-03 | 2004-01-08 | Bryan James B. | System and method for forming a non-rotationally symmetric portion of a workpiece |
| US20090240367A1 (en) * | 2008-03-19 | 2009-09-24 | Panasonic Corporation | Cutting device, machining method, and die machined by the machining method |
| CN101972856A (en) * | 2010-09-16 | 2011-02-16 | 长春工业大学 | Non-resonant three-dimensional elliptical diamond fly-cutting optical free curved surface method and special device |
| CN106312567A (en) * | 2016-08-26 | 2017-01-11 | 长春理工大学 | Laser-assisted orthogonal micro-cutting device and method having automatic laser focus following function |
| CN109551335A (en) * | 2018-11-26 | 2019-04-02 | 南京航空航天大学 | A kind of technique of laser assisted accurate grinding transparent material |
| CN110340669A (en) * | 2019-07-22 | 2019-10-18 | 长春理工大学 | A method of the fast tool servo based on laser in-situ auxiliary processes hard brittle material free form surface |
| CN110548908A (en) * | 2019-10-14 | 2019-12-10 | 吉林大学 | gantry type coarse-fine composite five-axis precision machine tool and machining method |
| CN111070433A (en) * | 2019-12-31 | 2020-04-28 | 华中科技大学 | Multi-field auxiliary diamond cutting equipment |
-
2020
- 2020-10-21 CN CN202011130312.6A patent/CN112317963A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040003689A1 (en) * | 2002-07-03 | 2004-01-08 | Bryan James B. | System and method for forming a non-rotationally symmetric portion of a workpiece |
| US20090240367A1 (en) * | 2008-03-19 | 2009-09-24 | Panasonic Corporation | Cutting device, machining method, and die machined by the machining method |
| CN101972856A (en) * | 2010-09-16 | 2011-02-16 | 长春工业大学 | Non-resonant three-dimensional elliptical diamond fly-cutting optical free curved surface method and special device |
| CN106312567A (en) * | 2016-08-26 | 2017-01-11 | 长春理工大学 | Laser-assisted orthogonal micro-cutting device and method having automatic laser focus following function |
| CN109551335A (en) * | 2018-11-26 | 2019-04-02 | 南京航空航天大学 | A kind of technique of laser assisted accurate grinding transparent material |
| CN110340669A (en) * | 2019-07-22 | 2019-10-18 | 长春理工大学 | A method of the fast tool servo based on laser in-situ auxiliary processes hard brittle material free form surface |
| CN110548908A (en) * | 2019-10-14 | 2019-12-10 | 吉林大学 | gantry type coarse-fine composite five-axis precision machine tool and machining method |
| CN111070433A (en) * | 2019-12-31 | 2020-04-28 | 华中科技大学 | Multi-field auxiliary diamond cutting equipment |
Non-Patent Citations (1)
| Title |
|---|
| 林盛等: "《空间柔顺机构综合方法与应用》", 30 September 2019, 轻工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115229647A (en) * | 2022-07-20 | 2022-10-25 | 华侨大学 | Device and method for femtosecond laser-assisted diamond polishing |
| CN115229647B (en) * | 2022-07-20 | 2023-08-29 | 华侨大学 | Device for polishing diamond with assistance of femtosecond laser and polishing method thereof |
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