CN213827472U - Laser turning machine tool - Google Patents
Laser turning machine tool Download PDFInfo
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- CN213827472U CN213827472U CN202022436124.8U CN202022436124U CN213827472U CN 213827472 U CN213827472 U CN 213827472U CN 202022436124 U CN202022436124 U CN 202022436124U CN 213827472 U CN213827472 U CN 213827472U
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Abstract
The utility model relates to a laser turning machine tool, which comprises a base, a Z-axis mounting rack, a Y-axis moving component, a Z-axis moving component and a laser processing component; the Z-axis moving assembly is arranged on the Y-axis moving assembly through a Z-axis mounting frame, and the Y-axis moving assembly is arranged on the base; the laser processing assembly is slidably mounted on the Z-axis moving assembly; the laser processing assembly comprises a laser, a three-dimensional scanning galvanometer and an f-theta field lens, wherein the laser is arranged on one side of the three-dimensional scanning galvanometer, and the f-theta field lens is arranged below the three-dimensional scanning galvanometer; laser beams emitted by the laser pass through the three-dimensional scanning galvanometer and the f-theta field lens and then are focused on a machining surface of the cutter, so that laser turning machining is carried out on the cutter. The laser turning machine tool has simple structure and small occupied area; the three-dimensional galvanometer component in the laser processing component and the f-theta field lens cooperate to realize laser processing with large focal spot area, and further, the laser processing of various shapes of the revolving body cutter is realized by matching with the revolving motion of the cutter.
Description
Technical Field
The utility model relates to a lathe especially relates to a laser turning machine tool.
Background
Typical difficult-to-process materials such as titanium alloy, nickel-based alloy, ceramics, glass and the like are increasingly widely applied in key fields of advanced manufacturing industries such as aerospace, medical treatment and the like, and simultaneously, higher and higher requirements are put forward on the processing quality and the processing efficiency of the processing materials. In order to meet the requirements of high-efficiency and high-quality processing of the materials difficult to process, high-end cutting tool materials are gradually developed towards the directions of super hardness, wear resistance and the like. However, due to the difficult machining characteristics of the tool material, when the traditional electric machining and grinding process technology is adopted to perform rough machining and manufacturing of the profile of a high-end tool, certain difficulties exist, the grinding material is high in loss, the machining efficiency is low, the electric machining flexibility is not enough, only a simple surface can be machined, the machining process is complex, the relative machining precision is poor, and the like.
Laser processing has become an important means of processing difficult-to-process materials because of its characteristics of no contact, no material selectivity, accurate focusing to micron level, high energy density, etc. The laser machine tool is mostly suitable for laser cutting, punching and surface texture processing in the world at present; in the processing mode, the foreign high-end laser processing machine tool is mainly used for laser milling. In addition, patent CN201920777081.4 discloses a laser turning machine tool design, but the equipment design is complicated and not dedicated to tool laser machining manufacturing.
SUMMERY OF THE UTILITY MODEL
Based on this, to above-mentioned technical problem, provide a laser turning machine tool, just laser turning machine tool is used for the manufacturing of cutter, and simple structure, machining efficiency height.
A laser turning machine comprising:
the machine comprises a rack, a cutter, a Z-axis mounting rack and a cutter positioning device, wherein the rack comprises a base and a Z-axis mounting rack, the base is also used for mounting a main shaft, a cutter to be machined is mounted in front of the main shaft, and the main shaft can drive the cutter to do rotary motion;
the laser processing device comprises a Z-axis moving assembly and a Y-axis moving assembly, wherein the Z-axis moving assembly is mounted on the Y-axis moving assembly through a Z-axis mounting frame, the Y-axis moving assembly is mounted on the base, and the Y-axis moving assembly is used for driving the Z-axis moving assembly and the laser processing assembly to move along the Y-axis direction;
the laser processing assembly is slidably mounted on the Z-axis moving assembly, and the Z-axis moving assembly is used for driving the laser processing assembly to move along the Z-axis direction; the laser processing assembly comprises a laser, a three-dimensional scanning galvanometer and an f-theta field lens, wherein the laser is arranged on one side of the three-dimensional scanning galvanometer, and the f-theta field lens is arranged below the three-dimensional scanning galvanometer;
and laser beams emitted by the laser device pass through the three-dimensional scanning galvanometer and the f-theta field lens and then are focused on the machining surface of the cutter so as to perform laser turning on the cutter.
The laser processing device comprises a laser processing assembly, a three-dimensional scanning galvanometer, a CCD camera and a measuring probe, wherein the CCD camera is positioned on one side of the laser processing assembly, the probe is installed below the three-dimensional scanning galvanometer, the CCD camera is used for measuring and correcting the relative position of the measuring probe and the three-dimensional scanning galvanometer, and the measuring probe is used for monitoring the position of a cutter and the processing precision on line.
Furthermore, the Y-axis moving assembly and the Z-axis moving assembly are controlled in a closed loop mode by a grating ruler, and the positioning precision is less than or equal to 10 microns.
Further, the laser is a nanosecond laser, a picosecond laser or a femtosecond laser.
Furthermore, the focusing range of the three-dimensional scanning galvanometer in the Z-axis direction is-30 mm to +30mm, the scanning range in the X-axis and Y-axis directions is 150 multiplied by 150mm to 300 multiplied by 300mm, the scanning speed is 0 to 8000mm/s, and the scanning repetition precision is 1rad to 4 rad.
Further, the full diagonal scanning angle of the f-theta field lens is 0-50 degrees.
Furthermore, laser turning machine tool still includes silence dust catcher and dust keeper, silence dust catcher and dust keeper are all installed on the base.
Further, the maximum linear movement range of the Z-axis moving assembly in the Z-axis direction is 330 mm; the maximum linear movement range of the Y-axis moving assembly in the Y-axis direction is 280 mm.
The Y-axis moving assembly is arranged on the base through the Y-axis mounting frame; the cross section of the Y-axis mounting rack is triangular.
The device further comprises a laser processing assembly fixing frame, wherein the laser processing assembly fixing frame is slidably mounted on the Z-axis moving assembly; the laser is fixedly arranged on the laser processing assembly fixing frame.
The base of the laser turning machine tool is provided with a laser processing assembly and an Y, Z shaft moving assembly, the laser processing assembly is mounted on the Z shaft moving assembly, the Z shaft moving assembly and the laser processing assembly are mounted on the base of the machine frame through a Y shaft assembly, the base is also used for bearing and clamping a main shaft of a tool to be processed, and the laser turning machine tool is simple in structure and small in occupied area; the three-dimensional galvanometer component in the laser processing component and the f-theta field lens cooperate to realize laser processing with a large focal spot area, and further, the laser processing of various shapes of the revolving body cutter is realized by matching with the revolving motion of the cutter. And the laser processing has the characteristics of no contact and no material selectivity, and finally can realize the laser polishing and laser slicing, allowance removal, roughing, slotting, threading and other processing of hard and brittle materials such as hard alloy, ceramic, PCD and the like, such as inner and outer cylindrical surfaces, conical surfaces and arc curved surfaces.
Drawings
FIG. 1 is a schematic diagram of a laser turning machine in one embodiment;
the laser processing device comprises a 10-laser turning processing machine tool, a 110-base, a 120-Z-axis mounting base, a 130-Y-axis mounting base, a 140-spindle base, a 150-laser processing assembly mounting base, a 210-Z-axis moving assembly, a 211-Z-axis driving motor screw rod module, a 212-Z-axis sliding rail, a 220-Y-axis moving assembly, a 221-Y-axis driving motor screw rod module, a 222-Y-axis sliding rail, a 223-Y-axis sliding block, a 310-laser, a 320-three-dimensional scanning galvanometer, a 330-f-theta field lens, a 400-CCD camera, a 500-measuring probe, a 600-spindle and a 610-tool handle.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention can be embodied in many different forms other than those specifically described herein, and it will be apparent to those skilled in the art that similar modifications can be made without departing from the spirit and scope of the invention, and it is therefore not to be limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
Referring to fig. 1, the present embodiment specifically discloses a laser turning machine, which includes a frame, a Y-axis moving assembly 220, a Z-axis moving assembly 210, and a laser processing assembly; in the present embodiment, the laser turning machine 10 processes the tool by laser processing, the tool may be made of hard and brittle materials such as PCD and cemented carbide, and a unique laser processing technology can process various complex contours and achieve excellent surface quality.
Specifically, the machine frame includes a base 110 and a Z-axis mounting frame 120, the Z-axis mounting frame 120 is mounted on the base 110 through a Y-axis moving assembly 220, and the Y-axis moving assembly 220 is used for driving the Z-axis moving assembly 210 and the laser processing assembly to move along a Y-axis direction; the Z-axis moving assembly 210 is mounted on the Z-axis mounting frame 120, the laser processing assembly is slidably mounted on the Z-axis moving assembly 210, and the Z-axis moving assembly 210 is used for driving the laser processing assembly to move along the Z-axis direction, so that a laser beam can be focused on a surface to be processed; the laser processing assembly comprises a laser 310, a three-dimensional scanning galvanometer 330 and an f-theta field lens 320, wherein the laser 310 is arranged on one side of the three-dimensional scanning galvanometer 310, and the f-theta field lens 320 is arranged below the three-dimensional scanning galvanometer 330; the laser beam emitted by the laser 310 firstly passes through the three-dimensional scanning galvanometer 330, then is focused by the f-theta field lens 320, and finally contacts with the processing surface of the tool to be processed, so as to perform laser turning on the tool.
The three-dimensional scanning galvanometer 330 is used for controlling the deflection of a laser in a three-dimensional space, so that a laser beam rapidly moves on a processing surface according to a required requirement to form a scanning track, the f-theta field lens 320 is used for keeping a focused spot of the laser to have proper defocusing amount at different height parts of a tool to be processed, the three-dimensional galvanometer component 330 and the f-theta field lens 320 can cooperate to realize large-area laser processing of the focused spot, and the focused spot is accurately emitted to the processing surface of the tool to be processed, so that the tool is subjected to laser processing, and the processing precision is improved.
Further, as shown in fig. 1, a spindle seat 140 is further installed on the base 110, a spindle 600 is disposed in the spindle seat 140, a tool to be machined is clamped in a tool holder 610 at the front end of the spindle 600, the spindle 600 can drive the tool to perform a rotary motion, and the spindle 600 can be provided for a machine tool itself and can also be installed on the machine tool in an outsourcing manner. The laser outlet of the laser processing assembly is positioned above the cutter 610, and the laser turning processing of various shapes of the cutter is realized through the synergistic effect of the three-dimensional galvanometer assembly 330 and the f-theta field lens 320 in the laser processing assembly and further matched with the rotary motion of the cutter.
Because the cutter is arranged on the main shaft 600, the cutter only rotates under the driving of the main shaft 600; the axial direction of the cutter is parallel to the Y-axis direction, so that the cutter has no displacement in the Y-axis direction, and under the condition, the laser turning is only limited to a certain position of the cutter, and the turning of the whole cutter cannot be finished; in this embodiment, a Y-axis moving assembly is provided, and the Y-axis moving assembly 220 can drive the Z-axis moving assembly 210 and the laser processing assembly to move along the Y-axis direction, so that laser focusing spots can be processed along the axial direction of the tool, and laser turning of the whole tool is completed.
Specifically, the Z-axis moving assembly 210 includes a Z-axis driving motor screw module 211, a Z-axis sliding rail 212 and a Z-axis slider (not shown in the figure), the Z-axis sliding rail 212 is fixedly mounted on the Z-axis mounting frame 120, and the Z-axis driving motor screw module 211 is used for driving the Z-axis slider to move along the Z-axis sliding rail 212. The Y-axis moving assembly 220 includes a Y-axis driving motor screw module 221, a Y-axis slide rail 222 and a Y-axis slide block 223, the Y-axis slide rail 222 is fixedly mounted on the Y-axis mounting frame 130, the Y-axis driving motor screw module 221 is used for driving the Y-axis slide block 223 to move along the Y-axis slide rail 222, and the Z-axis mounting frame 120 is mounted on the Y-axis slide block 223 and moves along with the movement of the Y-axis slide block 223. The driving motor in the Y-axis driving motor lead screw module 221 is a servo motor.
The Y-axis mounting frame 130 is fixedly mounted on the base 110, the cross section of the Y-axis mounting frame 130 is in a right triangle shape, the Y-axis slide rail 222 is fixedly arranged on the inclined plane of the triangle shape along the horizontal direction, the strength of the Y-axis mounting frame 130 can be enhanced by the triangle structure, the integral rigidity of the lathe can be enhanced, and the influence on the machining effect caused by unnecessary vibration generated in the machining process can be prevented. Of course, in other embodiments, the Y-axis moving assembly may be directly disposed on the base, thereby omitting the Y-axis mounting bracket.
Further, laser turning machine tool 10 still includes CCD camera 400 and measuring probe 500, CCD camera 400 is installed one side of laser beam machining subassembly, measuring probe 500 is installed three-dimensional scanning shakes the below of mirror 330, CCD camera 400 is used for right measuring probe 500 with three-dimensional scanning shakes the mirror 330 and carries out relative position measurement and correction, measuring probe 500 is used for carrying out on-line monitoring to cutter position and machining precision. By arranging the CCD camera 400 and the measuring probe 500, the processing quality and the processing accuracy can be effectively ensured.
Specifically, as shown in fig. 1, the laser turning machine 10 further includes a laser processing assembly fixing frame 150, the laser processing assembly fixing frame 150 is slidably mounted on the Z-axis moving assembly 210, the laser 310 is mounted on the laser processing assembly fixing frame 150, the three-dimensional scanning galvanometer 330 is mounted on one side of the laser 310, the CCD camera is disposed on the other side of the laser processing assembly fixing frame 150, and the measuring probe 500 is mounted below the laser processing assembly fixing frame 150. The laser processing assembly fixing frame 150 is slidably mounted on the Z-axis sliding block 213, and the laser 310, the three-dimensional scanning galvanometer 330, the f-theta field lens 320, the CCD camera 400 and the measuring probe 500 are integrated on the laser processing assembly fixing frame 150, so that the structure is more compact, some unnecessary parts are omitted, and the structure is simplified.
Further, the laser 310 may be a picosecond laser, such as a tunable pulse width picosecond fiber laser. The picosecond laser provides an energy source for laser processing, belongs to ultrafast laser, and has small damage to materials. The wavelength range of the picosecond laser is 1064 +/-2 nm, the output power is 0-50W, the pulse energy is less than or equal to 200uJ, and the peak power is less than or equal to 20 MW. Of course, in other embodiments, the laser 310 may also be a nanosecond laser, a femtosecond laser, or the like.
The focusing range of the three-dimensional scanning galvanometer 330 in the Z-axis direction is-20 mm to 20mm, for example, the focusing range is ± 13.5 mm. The scanning range in the X-axis and Y-axis directions is 150X 150mm to 300X 300mm, for example, 200X 200 mm. The scanning speed is 0-8000 mm/s, for example 750 mm/s. The scan repetition accuracy is 1rad to 4rad, for example 2 rad. The maximum gain drift was 15ppm/K and the maximum position drift was 10 μ rad/K.
Further, the Y-axis moving assembly 220 and the Z-axis moving assembly 210 are both controlled by a grating ruler in a closed loop manner, and the positioning accuracy is less than or equal to 10 μm. The method has the characteristics of large detection range, high detection precision and high response speed.
Further, the full diagonal scan angle of the f-theta field lens 320 is 0-50 deg..
Furthermore, laser turning machine tool still includes silence dust catcher and dust keeper for realize getting rid of sweeps, waste gas, silence dust catcher and dust keeper are all installed in the frame.
The laser turning machine 10 has the following specific working process:
according to the processing track of the tool to be processed, the Y-axis moving component 220 and the Z-axis moving component 210 carry laser processing components to perform linear motion in the Y-axis direction and the Z-axis direction respectively, the Z-axis moving component 210 is installed on the Y-axis installation frame 130 through the Y-axis moving component 220, the main shaft 600 clamps the tool through the tool holder to realize rotary motion of the tool to be processed, laser beams generated by the laser 310 are focused on a target processing area through the three-dimensional scanning galvanometer 330 and the f-theta field lens 320 to perform tool turning processing, and therefore through design, linkage motion control of the laser processing components, the tool to be processed and the laser beams can be performed by adopting the Y, Z-axis moving component 210, the main shaft 600 and the three-dimensional scanning galvanometer 330. And the utility model discloses in mainly adopting three-dimensional mirror scanning cooperation side to feed the mode of cutting that shakes, three-dimensional mirror scanning that shakes can the quick adjustment facula route, makes facula steady motion, and the side is fed and is reduced the light facula because the damage that stops to bring for the material, and the processing mode that adopts three-dimensional mirror scanning cooperation side to feed the cutting that shakes can the turning dysmorphism and obtain better roughness. Thereby avoiding possible damage to the material of the raw surface due to the uncontrolled and energy distribution of the laser. The laser turning machine tool realizes one-time laser processing and forming of the complex-profile difficult-to-process cutter, can effectively improve the processing efficiency and the processing quality compared with the traditional processing and manufacturing method, and is beneficial to solving the processing and manufacturing problems of high-end cutters.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A laser turning machine, comprising:
the machine comprises a rack, a cutter, a Z-axis mounting rack and a cutter positioning device, wherein the rack comprises a base and a Z-axis mounting rack, the base is also used for mounting a main shaft, a cutter to be machined is mounted in front of the main shaft, and the main shaft can drive the cutter to do rotary motion;
the laser processing device comprises a Z-axis moving assembly and a Y-axis moving assembly, wherein the Z-axis moving assembly is mounted on the Y-axis moving assembly through a Z-axis mounting frame, the Y-axis moving assembly is mounted on the base, and the Y-axis moving assembly is used for driving the Z-axis moving assembly and the laser processing assembly to move along the Y-axis direction;
the laser processing assembly is slidably mounted on the Z-axis moving assembly, and the Z-axis moving assembly is used for driving the laser processing assembly to move along the Z-axis direction; the laser processing assembly comprises a laser, a three-dimensional scanning galvanometer and an f-theta field lens, wherein the laser is arranged on one side of the three-dimensional scanning galvanometer, and the f-theta field lens is arranged below the three-dimensional scanning galvanometer;
and laser beams emitted by the laser device pass through the three-dimensional scanning galvanometer and the f-theta field lens and then are focused on the machining surface of the cutter so as to perform laser turning on the cutter.
2. The laser turning machine of claim 1 further comprising a CCD camera located on one side of the laser machining assembly and a measurement probe mounted below the three-dimensional scanning galvanometer for relative position measurement and correction of the measurement probe and the three-dimensional scanning galvanometer, the measurement probe for on-line monitoring of tool position and machining accuracy.
3. The laser turning machine according to claim 1, wherein the Y-axis moving assembly and the Z-axis moving assembly are both closed-loop controlled by a grating ruler, and the positioning accuracy is less than or equal to 10 μm.
4. The laser turning machine of claim 1, wherein the laser is a nanosecond laser, a picosecond laser, or a femtosecond laser.
5. The laser turning machine tool according to claim 1, wherein the three-dimensional scanning galvanometer has a focusing range of-30 mm to +30mm in the Z-axis direction, a scanning range of 150X 150mm to 300X 300mm in the X-axis and Y-axis directions, a scanning speed of 0 to 8000mm/s, and a scanning repetition accuracy of 1rad to 4 rad.
6. The laser turning machine of claim 1, wherein the full diagonal scan angle of the f-theta field lens is 0-50 °.
7. The laser turning machine of claim 1 further comprising a silent dust collector and a dust guard, both mounted on the base.
8. The laser turning machine of claim 1 wherein the maximum linear range of movement of the Z-axis moving assembly in the Z-axis direction is 330 mm; the maximum linear movement range of the Y-axis moving assembly in the Y-axis direction is 280 mm.
9. The laser turning machine of claim 1 further comprising a Y-axis mount, the Y-axis motion assembly being mounted to the base by the Y-axis mount; the cross section of the Y-axis mounting rack is triangular.
10. The laser turning machine of claim 1, further comprising a laser machining assembly mount slidably mounted on the Z-axis moving assembly; the laser is fixedly arranged on the laser processing assembly fixing frame.
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| CN202022436124.8U CN213827472U (en) | 2020-10-28 | 2020-10-28 | Laser turning machine tool |
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| CN202022436124.8U CN213827472U (en) | 2020-10-28 | 2020-10-28 | Laser turning machine tool |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115922098A (en) * | 2022-11-22 | 2023-04-07 | 苏州天弘激光股份有限公司 | Full-automatic layered laser scribing equipment |
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- 2020-10-28 CN CN202022436124.8U patent/CN213827472U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115922098A (en) * | 2022-11-22 | 2023-04-07 | 苏州天弘激光股份有限公司 | Full-automatic layered laser scribing equipment |
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