CN112207430A - Five laser milling process machine tools - Google Patents
Five laser milling process machine tools Download PDFInfo
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- CN112207430A CN112207430A CN202011176761.4A CN202011176761A CN112207430A CN 112207430 A CN112207430 A CN 112207430A CN 202011176761 A CN202011176761 A CN 202011176761A CN 112207430 A CN112207430 A CN 112207430A
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- 238000003801 milling Methods 0.000 title claims abstract description 40
- 238000012545 processing Methods 0.000 claims abstract description 63
- 239000000523 sample Substances 0.000 claims description 14
- 238000003754 machining Methods 0.000 claims description 12
- 238000009434 installation Methods 0.000 claims description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 8
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- 239000002912 waste gas Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
- B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to a five-axis laser milling machine tool, which comprises a frame, a mechanical motion assembly and a laser processing assembly, wherein the frame comprises a base, an X-axis mounting rack and two Y-axis mounting racks, the mechanical motion assembly comprises an X-axis motion assembly, a Y-axis motion assembly and a Z-axis motion assembly, the laser processing assembly comprises a laser, a light path system and a three-dimensional scanning galvanometer module, the X-axis motion assembly, the Y-axis motion assembly and the Z-axis motion assembly are used for carrying the laser processing assembly to respectively carry out linear motion in X, Y and Z-axis directions, the X-axis motion assembly, the Z-axis motion assembly and the Y-axis motion assembly are arranged on the Y-axis mounting rack to form a portal frame structure body, the processing precision is more stable in the processing motion process, the linked motion control of the laser processing assembly, a processed cutter and a laser beam is realized by adopting a X, Y, Z-axis motion, effectively improves the processing efficiency and the processing quality and is helpful for solving the processing and manufacturing problems of the high-end cutter.
Description
Technical Field
The invention relates to the technical field of laser processing machines, in particular to a five-axis laser milling machine tool.
Background
Typical difficult-to-process materials such as ceramics, glass, graphite, titanium alloy, nickel-based alloy and the like are increasingly widely applied in key fields of advanced manufacturing industries such as aerospace, medical treatment and the like, and simultaneously, higher and higher requirements are put forward on the processing quality and the processing efficiency of the processed materials. In order to meet the requirements of high-efficiency and high-quality processing of the materials difficult to process, high-end cutting tool materials are developed towards the directions of super hardness, wear resistance and the like, and the profile of the tool tends to be complex. However, due to the difficult processing characteristics of the tool material, when the high-end tool is manufactured by using the traditional process technologies such as electroplating and diamond grinding, the manufacturing cost is high, the processing efficiency is low, and the processing technology is complex.
Laser processing has become an important means of processing difficult-to-process materials due to its characteristics of no contact, no material selectivity and the like. However, most of the current international laser machine tools are suitable for laser cutting, punching and surface texture processing.
Disclosure of Invention
Therefore, in order to solve the technical problems, a five-axis laser milling machine tool is needed to be provided, wherein the five-axis laser milling machine tool can effectively improve the processing efficiency and the processing quality and is beneficial to solving the processing and manufacturing problems of a high-end cutter.
A five-axis laser milling machine for milling a cutting tool, comprising:
the X-axis installation rack and the Y-axis installation rack are arranged on the base in a spaced and opposite mode, and the base is also used for fixedly installing an AC-axis rotary table;
the mechanical motion assembly comprises an X-axis motion assembly, a Y-axis motion assembly and a Z-axis motion assembly, the X-axis motion assembly is mounted on the X-axis mounting rack, the Y-axis motion assembly is mounted on the Y-axis mounting rack, two ends of the X-axis mounting rack are movably mounted on the two Y-axis mounting racks respectively through the Y-axis motion assembly, and the Z-axis motion assembly is mounted on the X-axis motion assembly; and
the laser processing assembly comprises a laser, a light path system and a three-dimensional scanning mirror vibrating module, the laser and the light path system are arranged on the X-axis moving assembly, the three-dimensional scanning mirror vibrating module is arranged on the Z-axis moving assembly, and a laser beam generated by the laser is focused on a target processing area through the light path system and the three-dimensional scanning mirror vibrating module and is subjected to cutter milling processing.
In one embodiment, the focusing range of the three-dimensional scanning galvanometer module in the Z-axis direction is-20 mm, the scanning range in the X-axis and Y-axis directions is 150 × 150 mm-300 × 300mm, the scanning speed is 0-8000 mm/s, and the scanning repetition precision is 1 rad-4 rad.
In one embodiment, the maximum linear movement range of the X-axis motion assembly in the X-axis direction is 330mm, the maximum linear movement range of the Y-axis motion assembly in the Y-axis direction is 400mm, and the maximum linear movement range of the Z-axis motion assembly in the Z-axis direction is 370 mm.
In one embodiment, the X-axis motion assembly, the Y-axis motion assembly and the Z-axis motion assembly are controlled in a closed loop mode by adopting a grating ruler, and the positioning precision is less than or equal to 5 microns.
In one embodiment, the Y-axis moving components on the two Y-axis mounting frames are controlled in a closed loop mode by a servo motor and a grating ruler.
In one embodiment, the device further comprises a CCD camera and a measuring probe, wherein the CCD camera is used for measuring and correcting the relative position of the measuring probe and the three-dimensional scanning galvanometer module, and the measuring probe is used for monitoring the position of the cutter and the machining precision on line.
In one embodiment, the device further comprises a bearing frame, the bearing frame comprises a Y bearing support plate, a Z axis mounting plate and a reinforcing side plate, the Z axis mounting plate is arranged on the Z axis motion assembly, the Y bearing support plate is fixed on the Z axis mounting plate, the reinforcing side plate is respectively and fixedly connected with the Y bearing support plate and the Z axis mounting plate, and the CCD camera, the measuring probe and the three-dimensional scanning galvanometer module are all arranged on the Y bearing support plate.
In one embodiment, the laser is a nanosecond laser, a picosecond laser, or a femtosecond laser.
In one embodiment, the AC shaft turntable drives the A shaft and the C shaft to rotate through the direct drive motor, the rotation range of the A shaft is-30-120 degrees, the rotation range of the C shaft is 0-360 degrees, and the rotation positioning precision is less than or equal to 0.003 degrees.
In one embodiment, the five-axis laser milling machine tool is provided with a mute dust collector and a dustproof device for removing waste chips and waste gas.
The five-axis laser milling machine tool at least has the following advantages:
according to the processing track of a tool to be processed, the laser processing assembly is carried by the X-axis motion assembly, the Y-axis motion assembly and the Z-axis motion assembly to carry out X, Y linear motion and Z-axis linear motion respectively, the X-axis motion assembly and the Z-axis motion assembly are installed on the Y-axis installation frame through the Y-axis motion assembly to form a portal frame structure body, so that the laser processing assembly is more stable in the processing motion process to improve the processing precision, the AC-axis turntable clamps the tool through the tool holder to realize the rotary motion of the tool to be processed in the directions of the A axis and the C axis, a laser beam generated by a laser is focused on a target processing area through the optical path system and the three-dimensional scanning galvanometer module to carry out tool milling processing, and therefore through design, the linked motion control of the laser processing assembly, the tool to be processed and the laser beam can be realized by adopting the X, Y, Z-axis motion assembly, the AC, the method realizes one-time laser processing and forming of the complex-profile difficult-to-process cutter, can effectively improve the processing efficiency and the processing quality compared with the traditional processing and manufacturing method, and is beneficial to solving the processing and manufacturing problems of the high-end cutter.
Drawings
FIG. 1 is a schematic diagram of a five-axis laser milling machine in one embodiment;
FIG. 2 is an enlarged view of a portion of FIG. 1 at I;
FIG. 3 is a schematic view of the five-axis laser milling machine shown in FIG. 1 from another perspective.
10, five-axis laser milling machining tool; 110. a base; 120. an X-axis mounting rack; 130. a Y-axis mounting rack; 20. an AC axis turntable; 140. the X shaft is connected with a frame; 210. an X-axis motion assembly; 220. a Y-axis motion assembly; 230. a Z-axis motion assembly; 211. the X-axis driving motor screw rod module; 212. an X-axis slide rail; 213. an X-axis slider; 221. a Y-axis driving motor lead screw module; 222. a Y-axis slide rail; 223. a Y-axis slider; 231. a Z-axis driving motor lead screw module; 232. a Z-axis slide rail; 233. a Z-axis slide block; 310. a laser; 320. an optical path system; 330. a three-dimensional scanning galvanometer module; 400. a CCD camera; 500. a measurement probe; 600. a carrier; 610. a Y bearing support plate; 620. a Z-axis mounting plate; 630. and reinforcing the side plates.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
It should be understood that the terms "first", "second", etc. are used herein to describe various information, but the information should not be limited to these terms, which are only used to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
Referring to fig. 1 to 3, a five-axis laser milling machine 10 according to an embodiment is used for milling a tool, and includes a frame, a mechanical motion assembly, and a laser processing assembly. In the present embodiment, the five-axis laser milling machine tool 10 processes the tool in a laser processing manner, the tool may be made of a superhard material such as CBN, PCD, cemented carbide, etc., and a specific laser processing technology can process a complex profile and achieve excellent surface quality.
Specifically, the rack includes a base 110, an X-axis mounting rack 120 and two Y-axis mounting racks 130, the two Y-axis mounting racks 130 are oppositely mounted on the base 110 at intervals, and the base 110 is also used for fixedly mounting the AC-axis turntable 20. In this embodiment, the two Y-axis mounting frames 130 are parallel to each other and spaced apart from each other on the base 110, and in order to ensure better stability, an X-axis mounting frame 140 may be integrally formed at one end of the two Y-axis mounting frames 130 to form a gantry structure. The AC axis turret 20 may be self-contained to the machine tool or may be mounted to the machine tool by a commercially available means, and the AC axis turret 20 may effect rotation in the a (as shown in fig. 1) and C (as shown in fig. 1) directions.
The mechanical movement assembly comprises an X-axis movement assembly 210, a Y-axis movement assembly 220 and a Z-axis movement assembly 230, wherein the X-axis movement assembly 210 is installed on the X-axis installation frame 120, the Y-axis movement assembly 220 is installed on the Y-axis installation frame 130, two ends of the X-axis installation frame 120 are movably installed on the two Y-axis installation frames 130 through the Y-axis movement assembly 220 respectively, and the Z-axis movement assembly 230 is installed on the X-axis movement assembly 210.
Specifically, the X-axis moving assembly 210 includes an X-axis driving motor screw module 211, an X-axis sliding rail 212 and an X-axis slider 213, the X-axis sliding rail 212 is fixedly mounted on the X-axis mounting frame 120, and the X-axis driving motor screw module 211 is configured to drive the X-axis slider 213 to move along the X-axis sliding rail 212. The Y-axis moving assembly 220 includes a Y-axis driving motor screw module 221, a Y-axis slide rail 222 and a Y-axis slide block 223, the Y-axis slide rail 222 is fixedly mounted on the Y-axis mounting frame 130, the Y-axis driving motor screw module 221 is used for driving the Y-axis slide block 223 to move along the Y-axis slide rail 222, and two ends of the X-axis mounting frame 120 are mounted on the Y-axis slide block 223 and move along with the movement of the Y-axis slide block 223. The driving motor in the Y-axis driving motor lead screw module 221 is a servo motor. The Z-axis moving assembly 230 includes a Z-axis driving motor lead screw module 231, a Z-axis slide rail 232 and a Z-axis slider 233, the Z-axis slide rail 232 is disposed on the X-axis slider 213 and moves along with the movement of the X-axis slider 213, and the Z-axis driving motor lead screw module 231 is used for driving the Z-axis slider 233 to move along the Z-axis slide rail 232.
The laser processing assembly includes a laser 310, an optical path system 320, and a three-dimensional scanning galvanometer module 330, wherein the laser 310 and the optical path system 320 are disposed on the X-axis moving assembly 210. Specifically, the laser 310 and the optical path system 320 are disposed on the X-axis slider 213 and move along the X-axis direction with the movement of the X-axis slider 213. Laser 310 may be a picosecond laser, such as a tunable pulse width picosecond fiber laser. The picosecond laser provides an energy source for laser processing, belongs to ultrafast laser, and has small damage to materials. The wavelength range of the picosecond laser is 1064 +/-2 nm, the output power is 0-50W, the pulse energy is less than or equal to 200uJ, and the peak power is less than or equal to 20 MW. Of course, in other embodiments, the laser 310 may also be a nanosecond laser, a femtosecond laser, or the like.
The three-dimensional scanning galvanometer module 330 is disposed on the Z-axis moving assembly 230. Specifically, the three-dimensional scanning galvanometer module 330 is disposed on the Z-axis slider 233 and moves in the Z-axis direction along with the movement of the Z-axis slider 233. The focusing range of the three-dimensional scanning galvanometer module 330 in the Z-axis direction is-20 mm to 20mm, for example, the focusing range is ± 13.5 mm. The scanning range in the X-axis and Y-axis directions is 150X 150mm to 300X 300mm, for example, 200X 200 mm. The scanning speed is 0-8000 mm/s, for example 750 mm/s. The scan repetition accuracy is 1rad to 4rad, for example 2 rad. The maximum gain drift was 15ppm/K and the maximum position drift was 10 μ rad/K. The laser beam generated by the laser 310 is focused on the target processing area through the optical path system 320 and the three-dimensional scanning galvanometer module 330, and the tool milling processing is performed. The three-dimensional scanning galvanometer module 330 can meet the machining requirements in the process of machining the cutter after adopting the parameters.
Further, the maximum linear movement range of the X-axis motion assembly 210 in the X-axis direction is 330mm, the maximum linear movement range of the Y-axis motion assembly 220 in the Y-axis direction is 400mm, and the maximum linear movement range of the Z-axis motion assembly 230 in the Z-axis direction is 370 mm.
Furthermore, the X-axis motion assembly 210, the Y-axis motion assembly 220 and the Z-axis motion assembly 230 are controlled in a closed loop manner by adopting a grating ruler, and the positioning precision is less than or equal to 5 μm. The method has the characteristics of large detection range, high detection precision and high response speed.
Further, the Y-axis moving assemblies 220 on the two Y-axis mounting frames 130 are both controlled by the servo motors and the grating scales in a closed loop manner, so that a structure of double-side servo motors and double-side grating scales is formed, and the gantry structure is combined, so that the moment balance is kept when the X-axis mounting frame 120 moves on the Y-axis moving assemblies 220 in a large span manner, and the improvement of the processing precision is facilitated.
Further, the five-axis laser milling machine tool 10 further comprises a CCD camera 400 and a measuring probe 500, wherein the CCD camera 400 is used for measuring and correcting the relative position between the measuring probe 500 and the three-dimensional scanning galvanometer module 330, and the measuring probe 500 is used for monitoring the position of the tool and the machining precision on line. By arranging the CCD camera 400 and the measuring probe 500, the processing quality and the processing accuracy can be effectively ensured.
Further, the five-axis laser milling machine tool 10 further includes a bearing frame 600, the bearing frame 600 includes a Y bearing support plate 610, a Z axis mounting plate 620 and a reinforcing side plate 630, the Z axis mounting plate 620 is disposed on the Z axis moving assembly 230, the Y bearing support plate 610 is fixed on the Z axis mounting plate 620, the reinforcing side plate 630 is respectively fixedly connected with the Y bearing support plate 610 and the Z axis mounting plate 620, and the CCD camera 400, the measuring probe 500 and the three-dimensional scanning galvanometer module 330 are all disposed on the Y bearing support plate 610. The reinforcing side plate 630 is used to reinforce the strength of the Y-bearing carrier 610, and prevent unnecessary vibration from affecting the processing effect during the processing. The CCD camera 400, the measuring probe 500 and the three-dimensional scanning galvanometer module 330 are all integrated on the Y-bearing carrier plate 610, so that the structure is more compact, some unnecessary parts are omitted, and the structure is simplified.
Further, the AC shaft turntable 20 drives the A shaft and the C shaft to rotate through the direct drive motor, the rotation range of the A shaft is-30-120 degrees, the rotation range of the C shaft is 0-360 degrees, and the rotation positioning precision is less than or equal to 0.003 degrees. The rotating speed of the shaft A ranges from 0rpm to 50rpm, and the rotating speed of the shaft C ranges from 0rpm to 50 rpm. The parameters of the AC shaft turntable 20 are set to be the parameters, so that the rotation of the processed cutter can be realized, and the processing efficiency and the processing quality can be improved by matching with the laser milling processing.
Further, the five-axis laser milling machine 10 is equipped with a silent dust collector and a dustproof device for removing the waste chips and the waste gas.
The five-axis laser milling machine 10 has the following specific working process:
according to the processing track of the tool to be processed, the laser processing component is carried by the X-axis motion component 210, the Y-axis motion component 220 and the Z-axis motion component 230 to perform X, Y linear motion and Z-axis linear motion respectively, the X-axis motion component 210 and the Z-axis motion component 230 are mounted on the Y-axis mounting frame 130 through the Y-axis motion component 220 to form a portal frame structure body, so that the laser processing component is more stable in the processing motion process to improve the processing precision, the AC-axis turntable 20 clamps the tool through the tool holder to realize the rotating motion of the tool to be processed in the A-axis and C-axis directions, the laser beam generated by the laser 310 is focused on a target processing area through the optical path system 320 and the three-dimensional scanning galvanometer module 330 to perform tool milling processing, and therefore through design, the X, Y, Z-axis motion component 230, the AC-axis turntable 20 and the three-dimensional scanning galvanometer can be adopted to perform tool milling processing on, The machined tool and the laser beam are subjected to linkage motion control, one-time laser machining forming of the tool with a complex profile and difficult machining is achieved, compared with a traditional machining and manufacturing method, machining efficiency and machining quality can be effectively improved, and the machining and manufacturing problems of high-end tools can be solved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The utility model provides a five-axis laser milling machine tool which characterized in that, five-axis laser milling machine tool is used for the milling cutter utensil, and it includes:
the X-axis installation rack and the Y-axis installation rack are arranged on the base in a spaced and opposite mode, and the base is also used for fixedly installing an AC-axis rotary table;
the mechanical motion assembly comprises an X-axis motion assembly, a Y-axis motion assembly and a Z-axis motion assembly, the X-axis motion assembly is mounted on the X-axis mounting rack, the Y-axis motion assembly is mounted on the Y-axis mounting rack, two ends of the X-axis mounting rack are movably mounted on the two Y-axis mounting racks respectively through the Y-axis motion assembly, and the Z-axis motion assembly is mounted on the X-axis motion assembly; and
the laser processing assembly comprises a laser, a light path system and a three-dimensional scanning mirror vibrating module, the laser and the light path system are arranged on the X-axis moving assembly, the three-dimensional scanning mirror vibrating module is arranged on the Z-axis moving assembly, and a laser beam generated by the laser is focused on a target processing area through the light path system and the three-dimensional scanning mirror vibrating module and is subjected to cutter milling processing.
2. The five-axis laser milling machine tool according to claim 1, characterized in that the three-dimensional scanning galvanometer module has a focusing range of-20 mm to 20mm in the Z-axis direction, a scanning range of 150X 150mm to 300X 300mm in the X-axis and Y-axis directions, a scanning speed of 0 to 8000mm/s, and a scanning repetition precision of 1rad to 4 rad.
3. The five-axis laser milling machine tool according to claim 1, wherein the maximum linear movement range of the X-axis motion assembly in the X-axis direction is 330mm, the maximum linear movement range of the Y-axis motion assembly in the Y-axis direction is 400mm, and the maximum linear movement range of the Z-axis motion assembly in the Z-axis direction is 370 mm.
4. The five-axis laser milling machine tool according to claim 1, wherein the X-axis motion assembly, the Y-axis motion assembly and the Z-axis motion assembly are controlled in a closed loop manner by a grating ruler, and the positioning precision is less than or equal to 5 μm.
5. The five-axis laser milling machine tool according to claim 1, wherein the Y-axis motion assemblies on both Y-axis mounts are closed-loop controlled using servo motors and a grating scale.
6. The five-axis laser milling machine tool according to claim 1, further comprising a CCD camera for measuring and correcting the relative position of the measurement probe and the three-dimensional scanning galvanometer module, and a measurement probe for online monitoring of the tool position and machining accuracy.
7. The five-axis laser milling machine tool according to claim 6, further comprising a bearing support, wherein the bearing support comprises a Y bearing support plate, a Z-axis mounting plate and a reinforcing side plate, the Z-axis mounting plate is disposed on the Z-axis moving assembly, the Y bearing support plate is fixed on the Z-axis mounting plate, the reinforcing side plate is respectively fixedly connected with the Y bearing support plate and the Z-axis mounting plate, and the CCD camera, the measuring probe and the three-dimensional scanning galvanometer module are disposed on the Y bearing support plate.
8. The five-axis laser milling machine tool according to claim 1, wherein the laser is a nanosecond laser, a picosecond laser, or a femtosecond laser.
9. The five-axis laser milling machine tool according to claim 1, wherein the AC axis turntable drives the A axis and the C axis to rotate through the direct drive motor, the rotation range of the A axis is-30 degrees to 120 degrees, the rotation range of the C axis is 0 degree to 360 degrees, and the rotation positioning precision is less than or equal to 0.003 degrees.
10. The five-axis laser milling machine according to claim 1, wherein the five-axis laser milling machine is provided with a silent dust collector and a dustproof device for removing scraps and waste gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011176761.4A CN112207430A (en) | 2020-10-28 | 2020-10-28 | Five laser milling process machine tools |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011176761.4A CN112207430A (en) | 2020-10-28 | 2020-10-28 | Five laser milling process machine tools |
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| CN112872617A (en) * | 2021-01-15 | 2021-06-01 | 上海颢珊机械有限公司 | Five-axis laser machine for machining large-diameter diamond saw blade |
| CN113001029A (en) * | 2021-03-24 | 2021-06-22 | 镭泽精密制造(苏州)有限公司 | Laser equipment of multidimension degree stamp mark |
| CN113001030A (en) * | 2021-03-24 | 2021-06-22 | 镭泽精密制造(苏州)有限公司 | Embedded linear motor moving module applied to laser engraving machine |
| CN113020910A (en) * | 2021-03-12 | 2021-06-25 | 江苏维力安智能科技有限公司 | Control method of cantilever machine tool for mounting laser cutting head and milling electric spindle |
| CN113118651A (en) * | 2021-03-30 | 2021-07-16 | 华东师范大学 | Five-axis motion two-dimensional galvanometer laser processing air film hole device |
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| CN114985902A (en) * | 2022-07-05 | 2022-09-02 | 深圳市力博刀具技术有限公司 | Device for machining integral PCD cutter through laser linkage |
| CN117464205A (en) * | 2023-12-28 | 2024-01-30 | 深圳市艾姆克斯科技有限公司 | Eight-axis linkage laser cutting equipment |
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| CN112872617A (en) * | 2021-01-15 | 2021-06-01 | 上海颢珊机械有限公司 | Five-axis laser machine for machining large-diameter diamond saw blade |
| CN113020910A (en) * | 2021-03-12 | 2021-06-25 | 江苏维力安智能科技有限公司 | Control method of cantilever machine tool for mounting laser cutting head and milling electric spindle |
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| CN113118651A (en) * | 2021-03-30 | 2021-07-16 | 华东师范大学 | Five-axis motion two-dimensional galvanometer laser processing air film hole device |
| CN114453781A (en) * | 2021-11-15 | 2022-05-10 | 广东原点智能技术有限公司 | Five-axis laser processing machine tool |
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| CN114346743A (en) * | 2021-12-17 | 2022-04-15 | 宁波赛伯微芯精机制造有限公司 | Desktop formula five-axis linkage processingequipment |
| CN114985902A (en) * | 2022-07-05 | 2022-09-02 | 深圳市力博刀具技术有限公司 | Device for machining integral PCD cutter through laser linkage |
| CN117464205A (en) * | 2023-12-28 | 2024-01-30 | 深圳市艾姆克斯科技有限公司 | Eight-axis linkage laser cutting equipment |
| CN117697126A (en) * | 2023-12-29 | 2024-03-15 | 武汉元禄光电技术有限公司 | Method and device for laser precision machining of 3D nonmetallic forming part |
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