CN116553815A - Glass processing integrated machine, method, equipment and computer readable storage medium - Google Patents
Glass processing integrated machine, method, equipment and computer readable storage medium Download PDFInfo
- Publication number
- CN116553815A CN116553815A CN202310447594.XA CN202310447594A CN116553815A CN 116553815 A CN116553815 A CN 116553815A CN 202310447594 A CN202310447594 A CN 202310447594A CN 116553815 A CN116553815 A CN 116553815A
- Authority
- CN
- China
- Prior art keywords
- glass
- laser
- chamfering
- splitting
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 113
- 238000000034 method Methods 0.000 title claims abstract description 7
- 239000000087 laser glass Substances 0.000 claims abstract description 51
- 238000003698 laser cutting Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000003672 processing method Methods 0.000 claims description 22
- 238000004590 computer program Methods 0.000 claims description 4
- 230000000977 initiatory effect Effects 0.000 claims description 2
- 230000001413 cellular effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention provides a glass processing integrated machine, a method, equipment and a computer readable storage medium, belongs to the technical field of glass automatic processing, and provides a CO ₂ laser cutting, splitting and chamfering integrated machine for a mobile phone matt glass cover plate, which is provided with a CO ₂ laser glass cutting machine, a CO ₂ laser glass splitting device and a CO ₂ laser glass chamfering machine; the CO ₂ laser glass cutting machine is used for performing rectangular cutting on the glass substrate to obtain cut glass; the CO ₂ laser glass splitting device is used for cutting the outside of the rectangular contour line of the cut glass to form a splitting auxiliary line, and splitting to obtain rectangular glass sheets with round corners; the CO ₂ laser glass chamfering machine is used for chamfering the edge of the upper surface of the rectangular glass sheet with the round corners to obtain a finished product. The multi-process treatment is realized through one device, and the processing efficiency is improved.
Description
Technical Field
The invention belongs to the technical field of processing of mobile phone matt glass cover plates, and particularly relates to a CO (carbon monoxide) for a mobile phone matt glass cover plate 2 Laser cutting, breaking and chamfering integrated machine, glass processing method, glass processing apparatus, and non-volatile computer readable storage medium storing a computer program.
Background
In the prior art, the layout of parts of glass equipment is complex, and unified and flow treatment cannot be realized on glass.
Disclosure of Invention
In order to solve the technical problems, a CO for a mobile phone matt glass cover plate is provided 2 Laser cutting, splitting and chamfering all-in-one machine provided with CO 2 Laser glass cutting machine, CO 2 Laser glass breaking device and CO 2 A laser glass chamfering machine;
CO 2 the laser glass cutting machine is used for carrying out rectangular cutting on the glass substrate to obtain cut glass;
CO 2 the laser glass splitting device is used for cutting the outside of the rectangular contour line of the cut glass to form a splitting auxiliary line, and splitting to obtain rectangular glass sheets with round corners;
CO 2 the laser glass chamfering machine is used for chamfering the edge of the upper surface of the rectangular glass sheet with the round corners to obtain a finished product.
Optionally, a conveying mechanism is provided for conveying the glass substrate to the CO 2 Laser glass cutting machine for conveying cut glass to CO 2 Laser glass splitting equipment for conveying rectangular glass sheet with round corners to CO 2 A laser glass chamfering machine.
Optionally, CO 2 A spectroscope is arranged in the laser glass cutting machine and used for initiating a beam of CO 2 Laser beam conversionTwo sub-beams.
Alternatively, one of the sub-laser beams has an energy density L and an initial CO 2 The ratio between the energy densities M of the laser beams is Z, and Z is more than or equal to 0.2.
Optionally, a galvanometer mechanism is arranged at the output end of the laser glass splitting device and is used for splitting glass along a splitting auxiliary line formed by cutting.
Optionally, CO 2 The laser glass chamfering machine is used for outputting a rotating laser spot.
Optionally, CO 2 The laser glass chamfering machine is internally provided with a rotary driving piece, the rotary driving piece drives the laser lens to rotate, and when the laser lens rotates, CO 2 The laser output by the laser glass chamfering machine forms a rotating light spot on the surface of the glass.
The CO for the mobile phone matte glass cover plate is provided by any one of the above glass processing methods 2 The laser cutting, splitting and chamfering integrated machine executes the steps of the glass processing method.
A glass processing method is proposed, comprising:
step S1, during the cutting phase, by CO 2 Rectangular cutting is carried out on the glass substrate by the laser beam, so that cut glass is obtained;
step S2, in the splitting stage, by CO 2 Cutting the outer side of the rectangular contour line of the cut glass by using a laser beam to form a split auxiliary line, and splitting to obtain a rectangular glass sheet with round corners;
step S3, in the chamfering stage, by CO 2 And chamfering the edge of the upper surface of the rectangular glass sheet with the round corners by using a laser beam to obtain a finished product.
In the above glass processing method, optionally:
in the chamfering stage, CO 2 The laser beam rotates to form a rotating light spot.
In the above glass processing method, optionally:
in the chamfering stage, CO 2 The laser beam passes through the spectroscope and then the first CO 2 Sub-laser beam and second CO 2 Sub-laserA bundle; by a first CO 2 The sub-laser beam is led to the upper edge of the glass by a second CO 2 The sub-laser beams melt the glass filaments.
In the above glass processing method:
a beam of CO is passed through a spectroscope 2 Dividing laser beam into first CO 2 Sub-laser beam and second CO 2 Sub-laser beams; by another spectroscope to carry out the second CO 2 Dividing sub-laser beams into third CO 2 Sub-laser beam and fourth CO 2 Sub-laser beams;
first CO 2 The sub-laser beams are used in the cutting stage;
third CO 2 Sub-laser beams are used in the splitting stage;
fourth CO 2 The sub-laser beams are used in the chamfering stage.
A glass processing apparatus is provided for performing the steps of any of the glass processing methods described above.
A non-transitory computer readable storage medium storing a computer program is presented that when executed by one or more processors implements any of the above glass processing methods.
The beneficial effects of the invention are as follows: the multi-process treatment is realized through one device, and the processing efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present application;
FIG. 2 is a schematic diagram of a connection state of a non-volatile computer readable storage medium and a processor according to some embodiments of the present application.
Description of the embodiments
The following description of the embodiments is provided in connection with the accompanying drawings 1 to 2 of the specification:
in one embodiment, a CO for a matte glass cover plate of a mobile phone is provided 2 Laser cutting, splitting and chamfering all-in-one machine provided with CO 2 Laser glass cutter 1, CO 2 Laser glass breaking device 2 and CO 2 A laser glass chamfering machine 3;
CO 2 the laser glass cutting machine 1 is used for performing rectangular cutting on a glass substrate to obtainTo the cut glass;
CO 2 the laser glass splitting device 2 is used for cutting the outside of the rectangular contour line of the cut glass to form a splitting auxiliary line, and splitting to obtain rectangular glass sheets with round corners;
CO 2 the laser glass chamfering machine 3 is used for chamfering the edge of the upper surface of the rectangular glass sheet with the round corners to obtain a finished product.
In the present embodiment, CO 2 Laser glass cutter 1, CO 2 Laser glass breaking device 2 and CO 2 The laser glass chamfering machine 3 is integrated in one operation flow, realizes continuous processing of cutting, splitting and chamfering of glass, and has high automation degree.
In one embodiment, a handling mechanism is provided for handling the glass substrate to the CO 2 A laser glass cutter 1 for conveying cut glass to CO 2 Laser glass breaking device 2 for conveying rectangular glass sheet with round angle to CO 2 And a laser glass chamfering machine 3. Automatic transportation of glass is achieved through a conveying mechanism, and the conveying mechanism can be a clamp, a manipulator and a belt conveying device.
In one embodiment, CO 2 A spectroscope is arranged in the laser glass cutting machine 1, and the spectroscope uses a beam of initial CO 2 The laser beam is converted into two sub-laser beams. One laser beam can be divided into two sub-laser beams through a spectroscope, and different glasses or different positions of the same glass can be processed through the two sub-laser beams.
In one embodiment, one of the sub-beams has an energy density L and an initial CO 2 The ratio between the energy densities M of the laser beams is Z, and Z is more than or equal to 0.2. The driving piece can also drive different spectroscopes, so that the different spectroscopes can carry out light splitting according to a certain light splitting proportion.
In an embodiment, the output end of the laser glass breaking device 2 is provided with a galvanometer mechanism, and the galvanometer mechanism is used for breaking glass along a breaking auxiliary line formed by cutting.
In one embodiment, CO 2 Laser glass chamfering machine3 for outputting a rotating laser spot, the laser beam needs to pass through a rotatable optical lens before reaching the glass, and when the laser enters the spot on the surface of the glass, the spot also rotates, and the specific position of the spot changes, for example, when the spot is approximately elliptical, the relatively long end is located at 0 o 'clock in the initial stage, and when the optical lens rotates, the relatively long end can move to 3 o' clock.
In one embodiment, CO 2 The laser glass chamfering machine 3 is internally provided with a rotary driving piece which drives the laser lens to rotate, and when the laser lens rotates, CO 2 The laser beam output from the laser glass chamfering machine 3 forms a rotating spot on the glass surface.
The CO for the mobile phone matte glass cover plate is provided by any one of the above glass processing methods 2 The laser cutting, splitting and chamfering integrated machine executes the steps of the glass processing method.
A glass processing method is proposed, comprising:
step S1, during the cutting phase, by CO 2 Rectangular cutting is carried out on the glass substrate by the laser beam, so that cut glass is obtained;
step S2, in the splitting stage, by CO 2 Cutting the outer side of the rectangular contour line of the cut glass by using a laser beam to form a split auxiliary line, and splitting to obtain a rectangular glass sheet with round corners;
step S3, in the chamfering stage, by CO 2 And chamfering the edge of the upper surface of the rectangular glass sheet with the round corners by using a laser beam to obtain a finished product.
Can pass a beam of CO 2 The laser beam sequentially realizes the functions of cutting, splitting and chamfering, integrates multiple functions in one device, and has high integration degree.
In one embodiment:
in the chamfering stage, CO 2 The laser beam rotates to form a rotating light spot.
In the above glass processing method, optionally:
in the chamfering stage, CO 2 Laser beam is first passed through spectroscopeAfter that, first CO 2 Sub-laser beam and second CO 2 Sub-laser beams; by a first CO 2 The sub-laser beam is led to the upper edge of the glass by a second CO 2 The sub-laser beams melt the glass filaments.
In the above glass processing method:
a beam of CO is passed through a spectroscope 2 Dividing laser beam into first CO 2 Sub-laser beam and second CO 2 Sub-laser beams; by another spectroscope to carry out the second CO 2 Dividing sub-laser beams into third CO 2 Sub-laser beam and fourth CO 2 Sub-laser beams;
first CO 2 The sub-laser beams are used in the cutting stage;
third CO 2 Sub-laser beams are used in the splitting stage;
fourth CO 2 The sub-laser beams are used in the chamfering stage.
Converting a beam of laser beam into a plurality of laser beams, and adopting different laser beams to respectively treat different positions of the same glass, or sequentially treating one glass according to a preset stage sequence, wherein the stage sequence comprises cutting firstly, splitting later and chamfering finally. The processing efficiency can be improved.
A glass processing apparatus is provided for performing the steps of any of the glass processing methods described above.
Referring to fig. 2, a non-transitory computer readable storage medium 200 storing a computer program is presented that when executed by one or more processors 40 implements a glass processing method of any of the above.
While embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the present application, and that variations, modifications, alternatives, and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the present application.
Claims (14)
1. CO for mobile phone matte glass cover plate 2 Laser cutting, splitting and chamfering all-in-one machine is characterized in thatIs provided with
CO 2 Laser glass cutter (1) and CO 2 Laser glass breaking device (2) and CO 2 A laser glass chamfering machine (3);
the CO 2 The laser glass cutting machine (1) is used for performing rectangular cutting on the glass substrate to obtain cut glass;
the CO 2 The laser glass splitting device (2) is used for cutting the outside of the rectangular contour line of the cut glass to form a splitting auxiliary line, and splitting to obtain a rectangular glass sheet with round corners;
the CO 2 And the laser glass chamfering machine (3) is used for chamfering the edge of the upper surface of the rectangular glass sheet with the round corners to obtain a finished product.
2. The CO for a mobile phone matte glass cover plate according to claim 1 2 The laser cutting, splitting and chamfering integrated machine is characterized by comprising a conveying mechanism for conveying the glass substrate to the CO 2 Laser glass cutter (1) for conveying cut glass to CO 2 Laser glass breaking device (2) for conveying rectangular glass sheets with round corners to CO 2 A laser glass chamfering machine (3).
3. The CO for a mobile phone matte glass cover plate according to claim 1 2 Laser cutting, splitting and chamfering integrated machine, which is characterized in that CO 2 A spectroscope is arranged in the laser glass cutting machine (1), and the spectroscope is used for initiating a beam of CO 2 The laser beam is converted into two sub-laser beams.
4. A CO for a mobile phone matt glass cover plate in accordance with claim 3 2 The laser cutting, splitting and chamfering integrated machine is characterized in that the energy density L of one sub-laser beam and the initial CO 2 The ratio between the energy densities M of the laser beams is Z, and Z is more than or equal to 0.2.
5. Root of Chinese characterThe CO for a matte glass cover plate for a cellular phone according to claim 1 2 The laser cutting, splitting and chamfering all-in-one machine is characterized in that the output end of the laser glass splitting device (2) is provided with a vibrating mirror mechanism, and the vibrating mirror mechanism is used for splitting glass along a splitting auxiliary line formed by cutting.
6. The CO for a mobile phone matte glass cover plate according to claim 1 2 Laser cutting, splitting and chamfering integrated machine, which is characterized in that CO 2 The laser glass chamfering machine (3) is used for outputting a rotating laser spot.
7. The CO for a mobile phone matte glass cover plate according to claim 1 2 Laser cutting, splitting and chamfering all-in-one machine is characterized in that the CO 2 The laser glass chamfering machine (3) is internally provided with a rotary driving piece, the rotary driving piece drives the laser lens to rotate, and when the laser lens rotates, the CO 2 The laser output by the laser glass chamfering machine (3) forms a rotating light spot on the surface of the glass.
8. A glass processing method characterized by passing CO for a mobile phone matt glass cover plate according to any one of claims 1 to 7 2 The laser cutting, splitting and chamfering integrated machine executes the steps of the glass processing method.
9. A method of glass processing comprising:
step S1, during the cutting phase, by CO 2 Rectangular cutting is carried out on the glass substrate by the laser beam, so that cut glass is obtained;
step S2, in the splitting stage, by CO 2 Cutting the outer part of the rectangular outline of the cut glass by using a laser beam to form a split auxiliary line, and splitting to obtain a rectangular glass sheet with round corners;
step S3, in the chamfering stage, by CO 2 Chamfering the upper surface edge of the rectangular glass sheet with the round corners by a laser beamAnd (5) processing to obtain a finished product.
10. The glass processing method according to claim 9, wherein during the chamfering stage, CO 2 The laser beam rotates to form a rotating light spot.
11. The glass processing method according to claim 9, wherein during the chamfering stage, CO 2 The laser beam passes through the spectroscope and then the first CO 2 Sub-laser beam and second CO 2 Sub-laser beams; through the first CO 2 The sub-laser beams lead the upper edge of the glass to pass through the second CO 2 The sub-laser beams melt the glass filaments.
12. The glass processing method according to claim 9, wherein a beam of CO is passed through a beam splitter 2 Dividing laser beam into first CO 2 Sub-laser beam and second CO 2 Sub-laser beams; by another spectroscope to carry out the second CO 2 Dividing sub-laser beams into third CO 2 Sub-laser beam and fourth CO 2 Sub-laser beams;
the first CO 2 The sub-laser beams are used in the cutting stage;
the third CO 2 Sub-laser beams are used in the splitting stage;
the fourth CO 2 The sub-laser beams are used in the chamfering stage.
13. A glass processing apparatus characterized by the steps for performing the glass processing method of any of claims 8 to 12.
14. A non-transitory computer readable storage medium (200) storing a computer program which, when executed by one or more processors (40), implements any of the methods of glass processing described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310447594.XA CN116553815A (en) | 2023-04-24 | 2023-04-24 | Glass processing integrated machine, method, equipment and computer readable storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310447594.XA CN116553815A (en) | 2023-04-24 | 2023-04-24 | Glass processing integrated machine, method, equipment and computer readable storage medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116553815A true CN116553815A (en) | 2023-08-08 |
Family
ID=87499302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310447594.XA Pending CN116553815A (en) | 2023-04-24 | 2023-04-24 | Glass processing integrated machine, method, equipment and computer readable storage medium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116553815A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002241141A (en) * | 2001-02-08 | 2002-08-28 | Nippon Steel Techno Research Corp | Working method for glass by means of laser and device therefor |
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| CN103214174A (en) * | 2013-03-29 | 2013-07-24 | 东莞光韵达光电科技有限公司 | Machining method for glass cover plate of mobile phone touch screen |
| US20160315010A1 (en) * | 2015-04-21 | 2016-10-27 | Asm Technology Singapore Pte Ltd | Method and device for cutting wafers |
| CN109352184A (en) * | 2018-10-23 | 2019-02-19 | 深圳赛意法微电子有限公司 | The beam splitting laser cutting method of silicon-based wafer |
| CN109434278A (en) * | 2018-11-06 | 2019-03-08 | 大族激光科技产业集团股份有限公司 | A kind of laser processing device and method |
| CN113800758A (en) * | 2020-06-12 | 2021-12-17 | 大族激光科技产业集团股份有限公司 | Laser cutting method and laser cutting device for glass module |
| CN114029625A (en) * | 2020-12-23 | 2022-02-11 | 武汉帝尔激光科技股份有限公司 | Laser processing device, processing equipment and processing method |
| CN114309987A (en) * | 2022-01-13 | 2022-04-12 | 武汉华工激光工程有限责任公司 | Laser cutting method and device for display panel |
| CN218089349U (en) * | 2022-07-26 | 2022-12-20 | 深圳力星激光智能装备有限公司 | Cutting and splitting integrated machine |
-
2023
- 2023-04-24 CN CN202310447594.XA patent/CN116553815A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002241141A (en) * | 2001-02-08 | 2002-08-28 | Nippon Steel Techno Research Corp | Working method for glass by means of laser and device therefor |
| CN102249527A (en) * | 2011-01-13 | 2011-11-23 | 苏州德龙激光有限公司 | Apparatus for cutting glass, and method thereof |
| CN103214174A (en) * | 2013-03-29 | 2013-07-24 | 东莞光韵达光电科技有限公司 | Machining method for glass cover plate of mobile phone touch screen |
| US20160315010A1 (en) * | 2015-04-21 | 2016-10-27 | Asm Technology Singapore Pte Ltd | Method and device for cutting wafers |
| CN109352184A (en) * | 2018-10-23 | 2019-02-19 | 深圳赛意法微电子有限公司 | The beam splitting laser cutting method of silicon-based wafer |
| CN109434278A (en) * | 2018-11-06 | 2019-03-08 | 大族激光科技产业集团股份有限公司 | A kind of laser processing device and method |
| CN113800758A (en) * | 2020-06-12 | 2021-12-17 | 大族激光科技产业集团股份有限公司 | Laser cutting method and laser cutting device for glass module |
| CN114029625A (en) * | 2020-12-23 | 2022-02-11 | 武汉帝尔激光科技股份有限公司 | Laser processing device, processing equipment and processing method |
| CN114309987A (en) * | 2022-01-13 | 2022-04-12 | 武汉华工激光工程有限责任公司 | Laser cutting method and device for display panel |
| CN218089349U (en) * | 2022-07-26 | 2022-12-20 | 深圳力星激光智能装备有限公司 | Cutting and splitting integrated machine |
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