CN218089349U - Cutting and splitting integrated machine - Google Patents
Cutting and splitting integrated machine Download PDFInfo
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- CN218089349U CN218089349U CN202221939779.XU CN202221939779U CN218089349U CN 218089349 U CN218089349 U CN 218089349U CN 202221939779 U CN202221939779 U CN 202221939779U CN 218089349 U CN218089349 U CN 218089349U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
The utility model relates to a cutting equipment technical field specifically discloses a cutting lobe of a leaf all-in-one, include: the cutting and feeding mechanism is used for conveying a workpiece to be cut; the picosecond laser cutting machine is positioned above the cutting and feeding mechanism and used for cutting the workpiece to be cut; the splitting feeding mechanism and the cutting feeding mechanism are arranged in parallel and used for conveying workpieces to be split; and the carbon dioxide splitting machine is positioned above the splitting feeding mechanism and is used for splitting the workpiece to be cut. The utility model provides a cutting lobe of a leaf all-in-one can have cutting and two kinds of functions of lobe of a leaf concurrently, is favorable to improving the convenience of adding man-hour to the glass substrate.
Description
Technical Field
The utility model relates to a cutting equipment technical field especially relates to a cutting lobe of a leaf all-in-one.
Background
When the glass substrate is thick, the cutting resistance is large, and it is difficult to directly penetrate the entire glass substrate at one time to complete the cutting. Thus, for thicker glass substrates, the following slitting methods are generally used:
(1) cutting treatment: cutting a cutting mark on the front surface of the glass substrate by using a cutting mechanism such as a picosecond laser cutting machine;
(2) and (3) splitting treatment: and (3) impacting the back of the cut mark by using a cracking mechanism such as a carbon dioxide cracking machine, so that certain cracks are generated on the glass base material along the thickness direction after cutting, the cracks gradually expand to the cut mark, and finally the glass base material is separated along each cut mark.
The current picosecond laser cutting machine and the carbon dioxide splitting machine are generally arranged separately and are very inconvenient to use. Therefore, a cutting and splitting integrated machine needs to be developed, which can integrate a picosecond laser cutting machine and a carbon dioxide splitting machine together and is convenient for cutting and splitting a glass substrate.
The above information disclosed in this background section is only included to enhance understanding of the background of the disclosure and, thus, may contain information that does not form the prior art that is currently known to those of ordinary skill in the art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a cutting lobe of a leaf all-in-one can have cutting and two kinds of functions of lobe of a leaf concurrently, is favorable to improving the convenience of adding man-hour to the glass substrate.
For reaching above purpose, the utility model provides a cutting lobe of a leaf all-in-one, include:
the cutting and feeding mechanism is used for conveying a workpiece to be cut;
the picosecond laser cutting machine is positioned above the cutting and feeding mechanism and used for cutting the workpiece to be cut;
the splitting feeding mechanism and the cutting feeding mechanism are arranged in parallel and used for conveying workpieces to be split;
and the carbon dioxide splitting machine is positioned above the splitting feeding mechanism and is used for splitting the workpiece to be cut.
Optionally, the cutting and feeding mechanism and the splinter feeding mechanism both comprise:
a vacuum suction plate;
the two retaining edges are vertically arranged at one vertex angle of the vacuum suction plate;
and the driving end of the X-axis linear driving mechanism is connected with the vacuum suction plate and is used for driving the vacuum suction plate to do reciprocating linear motion.
Optionally, the device further comprises a beam bracket;
the beam support is erected above the cutting and feeding mechanism and the splitting and feeding mechanism, and the picosecond laser cutting machine and the carbon dioxide splitting machine are both arranged on the beam support.
Optionally, the picosecond laser cutting machine comprises a picosecond laser generator, a cutting light path assembly and a cutting laser head, wherein the picosecond laser generator, the cutting light path assembly and the cutting laser head are mounted above the beam support;
picosecond laser generator is used for producing cutting and uses laser, cutting is with laser warp cutting light path subassembly transmits extremely cutting laser head department.
Optionally, the picosecond laser cutting machine further comprises:
the Y-axis cutting linear driving mechanism is arranged at one side surface of the beam support;
the cutting side driving mounting plate is connected with the driving end of the Y-axis cutting linear driving mechanism and driven by the Y-axis cutting linear driving mechanism to slide along the beam support in a reciprocating manner;
the Z-axis cutting linear driving mechanism is arranged on the cutting side driving mounting plate; the cutting laser head is arranged at the driving end of the Y-axis cutting linear driving mechanism and driven by the Z-axis cutting linear driving mechanism to move up and down.
Optionally, the cutting optical path component includes:
the light path mounting plate is fixedly mounted on the beam support;
the beam expander is arranged on the optical path mounting plate;
the fixed light reflecting components are arranged on the light path mounting plate and used for guiding cutting laser to pass through the beam expander;
the movable light reflecting assembly is mounted on the cutting side driving mounting plate, and the cutting laser head is positioned right below the movable light reflecting assembly;
wherein, the first and the second end of the pipe are connected with each other,
the laser propagation direction between the last fixed light reflecting assembly and the movable light reflecting assembly on the laser propagation path for cutting is parallel to the driving direction of the Y-axis cutting linear driving mechanism;
the laser propagation direction between the movable light reflecting component and the cutting laser head is parallel to the driving direction of the Z-axis cutting linear driving mechanism.
Optionally, the fixed reflective assembly and the movable reflective assembly each comprise:
a reflector;
the reflector is arranged on the lens seat;
a bolt seat disposed opposite the lens seat;
the tension springs are positioned between the lens seat and the bolt seat and used for driving the lens seat and the bolt seat to approach each other;
one end of each reflection adjusting bolt abuts against the surface, close to the bolt seat, of the lens seat, the middle of each reflection adjusting bolt is in threaded connection with the bolt seat, and the other end of each reflection adjusting bolt extends to one side, far away from the lens seat, of the bolt seat to form a twisting portion.
Optionally, a beam expander is arranged between the beam expander and the light path mounting plate:
the fixing base is fixed on the light path mounting plate, a threaded hole and a stopping part opposite to the threaded hole extend out of one side face of the fixing base, and a strip-shaped groove is formed in the other side face of the fixing base;
the beam expander is arranged on the sliding block, and the bottom of the sliding block is in sliding connection with the fixed base;
the transverse adjusting bolt penetrates through the threaded hole and abuts against the stopping part;
and the locking bolt penetrates through the strip-shaped groove and then is in threaded connection with the sliding block.
Optionally, the carbon dioxide sheet splitting machine comprises a carbon dioxide laser generator, a carbon dioxide optical path component and a carbon dioxide laser head which are arranged above the beam support;
the carbon dioxide laser generator is used for generating laser for splitting, and the laser for splitting is transmitted to the carbon dioxide laser head through the carbon dioxide optical path component.
Optionally, the carbon dioxide wafer separator further comprises:
the Y-axis splinter linear driving mechanism is arranged at the other side surface of the beam bracket;
the splinter side driving mounting plate is connected with the driving end of the Y-axis splinter linear driving mechanism and is driven by the Y-axis splinter linear driving mechanism to slide along the cross beam support in a reciprocating manner;
the Z-axis splinter linear driving mechanism is arranged on the splinter side driving mounting plate; the carbon dioxide laser head is arranged at the driving end of the Y-axis linear lobe driving mechanism and driven by the Z-axis linear lobe driving mechanism to move up and down.
The beneficial effects of the utility model reside in that: the utility model provides a turnover and the transportation of material are accomplished to cutting feeding mechanism and lobe of a leaf feeding mechanism, and then effectively combine picosecond laser cutting machine and carbon dioxide lobe of a leaf machine to cutting lobe of a leaf all-in-one. Because have two kinds of functions of cutting and lobe of a leaf concurrently, so can accomplish two processes of cutting processing and lobe of a leaf processing in proper order, very big improvement production and processing's convenience.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive labor.
FIG. 1 is a schematic structural diagram of an integrated cutting and splitting machine provided by an embodiment;
FIG. 2 is a schematic structural diagram of a picosecond laser cutter according to an embodiment;
FIG. 3 is a schematic structural diagram of a carbon dioxide splitter provided by an embodiment;
FIG. 4 is a schematic structural diagram of one side of a cut optical path component according to an embodiment;
FIG. 5 is a schematic structural diagram of another side of the optical path cutting component according to the embodiment;
FIG. 6 is a schematic front view of a fixed reflective assembly according to an exemplary embodiment;
FIG. 7 is a schematic view of a rear structure of a fixed reflector assembly according to an embodiment.
In the figure:
100a, a cutting and feeding mechanism; 100b, a splinter feeding mechanism;
1. a vacuum suction plate; 2. blocking edges; 3. an X-axis linear drive mechanism;
200. a picosecond laser cutter;
4. a picosecond laser generator;
5. cutting the optical path component; 501. a light path mounting plate; 502. a beam expander; 503a, a fixed reflective component; 503b, a movable reflective component; 5031. a reflector; 5032. a lens holder; 5033. a bolt seat; 5034. a tension spring; 5035. a light reflection adjusting bolt; 504. a fixed base; 5041. a stopper portion; 5042. a strip-shaped groove; 505. a slider; 506. a transverse adjusting bolt; 507. locking the bolt;
6. cutting a laser head;
7. a Y-axis cutting linear driving mechanism;
8. cutting the side drive mounting plate;
9. a Z-axis cutting linear driving mechanism;
300. a carbon dioxide cracking machine;
10. a carbon dioxide laser generator;
11. a carbon dioxide optical path component;
12. a carbon dioxide laser head;
13. a Y-axis splinter linear driving mechanism;
14. a fracture side drive mounting plate;
15. a Z-axis splinter linear driving mechanism;
400. a beam support;
500. a laser for cutting;
600. the splinters are produced by laser.
Detailed Description
To make the objects, features and advantages of the present invention more obvious and understandable, the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present.
Furthermore, the terms "long", "short", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, which are merely for convenience of description of the present invention, and do not indicate or imply that the device or element referred to must have the specific orientation, operate in the specific orientation configuration, and thus, should not be construed as limiting the present invention.
The present invention will be described in detail below with reference to specific embodiments shown in the drawings. However, these embodiments are not intended to limit the present invention, and structural, methodical, or functional changes that may be made by one of ordinary skill in the art based on these embodiments are all included in the scope of the present invention.
The utility model provides a cutting lobe of a leaf all-in-one is applicable to the application scene of waiting for the cutting work piece to cut thick glass substrate, can have cutting and two kinds of functions of lobe of a leaf concurrently, is favorable to improving the convenience of adding man-hour to glass substrate.
Referring to fig. 1, in the present embodiment, the cutting and splitting integrated machine includes a cutting and feeding mechanism 100a, a picosecond laser cutting machine 200, a splitting and feeding mechanism 100b, and a carbon dioxide splitting machine 300.
The cutting and feeding mechanism 100a is used for conveying a workpiece to be cut. The picosecond laser cutting machine 200 is located above the cutting and feeding mechanism 100a and is used for cutting the workpiece to be cut. The splitting and feeding mechanism 100b and the cutting and feeding mechanism 100a are arranged in parallel and used for conveying workpieces to be split. The carbon dioxide splitting machine 300 is located above the splitting feeding mechanism 100b and is used for splitting the workpiece to be cut.
The cutting and splitting integrated machine provided by the embodiment has the following specific operation process:
s10: a manipulator or a worker and the like firstly puts a glass substrate workpiece to be cut at a feeding station on a cutting and feeding mechanism 100a;
s20: the cutting and feeding mechanism 100a conveys the workpiece to be cut to the picosecond laser cutting machine 200, and the picosecond laser cutting machine 200 cuts the workpiece to be cut to form a cut mark; the workpiece to be cut becomes a workpiece to be cracked after being cut;
s30: the cutting and feeding mechanism 100a sends the workpiece to be cracked back to the feeding station, then a manipulator or a worker takes the workpiece to be cracked out from the cutting and feeding mechanism 100a, puts the workpiece to be cracked into the cracking and feeding mechanism 100b, and then puts a new workpiece to be cut into the cutting and feeding mechanism 100a
S40: the splitting feeding mechanism 100b conveys the workpiece to be split to the carbon dioxide splitting machine 300, and the carbon dioxide splitting machine 300 performs splitting treatment on the workpiece to be cut to complete splitting;
s50: the splinter feeding mechanism 100b feeds the cut product back to the feeding station, and the manipulator or the worker finishes blanking.
The cutting and splitting integrated machine provided by the embodiment uses the cutting and feeding mechanism 100a and the splitting and feeding mechanism 100b to complete the turnover and transportation of materials, and further effectively combines the picosecond laser cutting machine 200 and the carbon dioxide splitting machine 300. Because have two kinds of functions of cutting and lobe of a leaf concurrently, so can accomplish two processes of cutting processing and lobe of a leaf processing in proper order, very big improvement production and processing's convenience.
Optionally, the cutting and feeding mechanism 100a and the splinter feeding mechanism 100b each include a vacuum suction plate 1, two flanges 2, and an X-axis linear driving mechanism 3. The two flanges 2 are vertically arranged at a vertex angle of the vacuum suction plate 1; the driving end of the X-axis linear driving mechanism 3 is connected with the vacuum suction plate 1 and is used for driving the vacuum suction plate 1 to do reciprocating linear motion along the front-back direction.
Optionally, the cutting and splitting integrated machine further comprises a beam support 400. The beam support 400 is erected above the cutting and feeding mechanism 100a and the splitting and feeding mechanism 100b, and the picosecond laser cutting machine 200 and the carbon dioxide splitting machine 300 are both mounted on the beam support 400.
Specifically, the length direction of the beam bracket 400 is perpendicular to the feeding direction of the two feeding mechanisms.
Referring to fig. 2, the picosecond laser cutting machine 200 comprises a picosecond laser generator 4, a cutting optical path assembly 5 and a cutting laser head 6 which are arranged above the beam support 400;
The picosecond laser cutting machine 200 further comprises a Y-axis cutting linear driving mechanism 7, a cutting side driving mounting plate 8 and a Z-axis cutting linear driving mechanism 9.
The Y-axis cutting linear driving mechanism 7 is installed at one side surface of the beam bracket 400. The cutting side driving mounting plate 8 is connected with the driving end of the Y-axis cutting linear driving mechanism 7 and is driven by the Y-axis cutting linear driving mechanism 7 to slide back and forth along the beam support 400. The Z-axis cutting linear driving mechanism 9 is arranged on the cutting side driving mounting plate 8; the cutting laser head 6 is arranged at the driving end of the Y-axis cutting linear driving mechanism 7 and is driven by the Z-axis cutting linear driving mechanism 9 to move up and down.
It can be understood that the X-axis linear driving mechanism 3 can drive the workpiece to be cut to move back and forth along the X axis relative to the cutting laser head 6, the Y-axis linear driving mechanism 7 can drive the cutting laser head 6 to move left and right along the Y axis relative to the workpiece to be cut, and the Z-axis linear driving mechanism 9 can drive the cutting laser head 6 to move up and down relative to the workpiece to be cut, so that the X-axis linear driving mechanism 3, the Y-axis linear driving mechanism 7 and the Z-axis linear driving mechanism 9 are mutually matched to enable the cutting laser head 6 and the workpiece to be cut to move relatively in all directions, and cutting operations in various paths are completed.
The cutting light path assembly 5 comprises a light path mounting plate 501, a beam expander 502, a plurality of fixed light reflecting assemblies 503a and a movable light reflecting assembly 503b.
The optical path mounting plate 501 is fixedly mounted on the beam bracket 400. The beam expander 502 is mounted on the optical path mounting plate 501. Each of the fixed reflective assemblies 503a is mounted on the optical path mounting plate 501, and is configured to guide the cutting laser 500 through the beam expander 502. The movable reflecting component 503b is mounted on the cutting side driving mounting plate 8, and the cutting laser head 6 is positioned right below the movable reflecting component 503 b;
wherein, the first and the second end of the pipe are connected with each other,
the laser propagation direction between the last fixed reflective assembly 503a and the movable reflective assembly 503b on the cutting laser propagation path is parallel to the driving direction of the Y-axis cutting linear driving mechanism 7;
the laser propagation direction between the movable reflective assembly 503b and the cutting laser head 6 is parallel to the driving direction of the Z-axis cutting linear driving mechanism 9.
The movable reflective member 503b is used to guide the cutting laser 500 at the last fixed reflective member 503a on the path of the cutting laser to the cutting laser head 6. It can be understood that, since the laser propagation direction between the last fixed reflective member 503a and the movable reflective member 503b on the laser propagation path for cutting is parallel to the driving direction of the Y-axis cutting linear driving mechanism 7, when the Y-axis cutting linear driving mechanism 7 drives the movable reflective member 503b to move left and right along with the cutting side driving mounting plate 8, the cutting laser 500 reflected by the last fixed reflective member 503a on the laser propagation path for cutting can always irradiate into the movable reflective member 503 b;
further, since the laser propagation direction between the movable reflective component 503b and the cutting laser head 6 is parallel to the driving direction of the Z-axis linear cutting driving mechanism 9, when the Z-axis linear cutting driving mechanism 9 drives the cutting laser head 6 to move up and down, the cutting laser 500 reflected by the movable reflective component 503b can always irradiate into the cutting laser head 6.
Referring to fig. 6 and 7, the fixed light reflecting assembly 503a and the movable light reflecting assembly 503b each include a light reflector 5031, a lens seat 5032, a bolt seat 5033, a plurality of tension springs 5034, and a plurality of light reflecting adjusting bolts 5035.
The mirror 5031 is mounted on the mirror holder 5032. The bolt seat 5033 is disposed opposite the lens seat 5032. Each of the tension springs 5034 is disposed between the lens seat 5032 and the bolt seat 5033 for urging the lens seat 5032 and the bolt seat 5033 toward each other. One end of the light reflection adjusting bolt 5035 abuts against the surface of the lens seat 5032 close to the bolt seat 5033, the middle part of the light reflection adjusting bolt is in threaded connection with the bolt seat 5033, and the other end of the light reflection adjusting bolt extends to one side of the bolt seat 5033 far away from the lens seat 5032 to form a screwing part.
It is understood that the distance between each position of the lens holder 5032 and the bolt holder 5033 can be adjusted by screwing each reflective adjustment bolt 5035, thereby adjusting the installation angle of the reflective mirror 5031.
Referring to fig. 4 and 5, a fixed base 504, a sliding block 505, a transverse adjusting bolt 506 and a locking bolt 507 are arranged between the beam expander 502 and the optical path mounting plate 501. Unable adjustment base 504 is fixed in on the light path mounting panel 501, unable adjustment base 504's a side extend out the screw hole and with backstop portion 5041 that the screw hole is relative, another side is equipped with strip groove 5042. The beam expander 502 is mounted on the sliding block 505, and the bottom of the sliding block 505 is slidably connected with the fixed base 504. The transverse adjusting bolt 506 penetrates through the threaded hole and abuts against the stop portion 5041. The locking bolt 507 passes through the strip-shaped groove 5042 and then is in threaded connection with the sliding block 505.
Specifically, locking bolt 507 is loosened, sliding block 505 is manually pushed to stop portion 5041 to abut against lateral adjusting bolt 506, then lateral adjusting bolt 506 is slowly screwed, lateral adjusting bolt 506 gradually pushes stop portion 5041 inwards, and beam expander 502 on sliding block 505 is driven to slide laterally, so that fine adjustment of the lateral position of beam expander 502 is achieved, fine adjustment is completed, and locking bolt 507 is screwed. Further, fine adjustment of the position of the beam expander 502 in the vertical direction may also be achieved through a similar structure, which is not described in detail in this embodiment.
In this embodiment, the carbon dioxide splitter 300 includes a carbon dioxide laser generator 10, a carbon dioxide optical path component 11 and a carbon dioxide laser head 12 which are installed above the beam support 400. The carbon dioxide laser generator 10 is used for generating splitting laser 600, the splitting laser 600 is transmitted to the carbon dioxide laser head 12 through the carbon dioxide optical path component 11, and then splitting processing is carried out on a workpiece to be split.
The carbon dioxide splitting machine 300 further comprises a Y-axis splitting linear driving mechanism 13, a splitting side driving mounting plate 14 and a Z-axis splitting linear driving mechanism 15.
The Y-axis splitting linear driving mechanism 13 is installed at the other side surface of the beam bracket 400. The splinter side driving mounting plate 14 is connected with the driving end of the Y-axis splinter linear driving mechanism 13 and is driven by the Y-axis splinter linear driving mechanism 13 to slide back and forth along the beam support 400. The Z-axis splinter linear driving mechanism 15 is mounted on the splinter side driving mounting plate 14; the carbon dioxide laser head 12 is mounted at the driving end of the Y-axis splinter linear driving mechanism 13 and is driven by the Z-axis splinter linear driving mechanism 15 to move up and down.
In this embodiment, the carbon dioxide optical path component 11 has a structure similar to that of the cutting optical path component 5. Further, the Y-axis linear driving mechanism 13 and the Z-axis linear driving mechanism 15 drive the carbon dioxide laser head 12 to move through, similarly to the Y-axis linear driving mechanism 7 and the Z-axis linear driving mechanism 9 drive the cutting laser head 6 to move through, and the description is omitted here.
Optionally, each linear driving mechanism can be for cylinder, pneumatic cylinder, electric jar or motor lead screw module etc. the utility model discloses do not do the restriction to this.
The cutting and splitting all-in-one machine that this embodiment provided possesses following advantage:
(1) the material turnover and transportation are completed by using the cutting and feeding mechanism 100a and the splitting and feeding mechanism 100b, so that the picosecond laser cutting machine 200 and the carbon dioxide splitting machine 300 are effectively combined, and the convenience of cutting and splitting glass substrates and other workpieces is improved;
(2) the cutting and feeding mechanism 100a, the picosecond laser cutting machine 200, the splitting and feeding mechanism 100b and the carbon dioxide splitting machine 300 are distributed around the beam support 400, so that the overall structure compactness is high;
(3) when the laser head moves up and down, left and right, the laser beam can keep irradiating into the laser head and can not deviate;
(4) the reflecting angle of the reflector 5031 is adjustable;
(5) the lateral position of the beam expander 502 can be fine tuned.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above list of detailed descriptions is only for the specific description of the feasible embodiments of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent embodiments or modifications that do not depart from the technical spirit of the present invention should be included within the scope of the present invention.
Claims (10)
1. The utility model provides a cutting lobe of a leaf all-in-one which characterized in that includes:
the cutting and feeding mechanism is used for conveying a workpiece to be cut;
the picosecond laser cutting machine is positioned above the cutting and feeding mechanism and used for cutting the workpiece to be cut;
the splitting feeding mechanism and the cutting feeding mechanism are arranged in parallel and used for conveying workpieces to be split;
and the carbon dioxide splitting machine is positioned above the splitting feeding mechanism and is used for splitting the workpiece to be cut.
2. The cutting and splitting integrated machine according to claim 1, wherein the cutting and feeding mechanism and the splitting and feeding mechanism each comprise:
a vacuum suction plate;
the two flanges are vertically arranged at one vertex angle of the vacuum suction plate;
and the driving end of the X-axis linear driving mechanism is connected with the vacuum suction plate and is used for driving the vacuum suction plate to do reciprocating linear motion.
3. The cutting and splitting integrated machine according to claim 1, further comprising a beam support;
the beam support is erected above the cutting and feeding mechanism and the splitting and feeding mechanism, and the picosecond laser cutting machine and the carbon dioxide splitting machine are both arranged on the beam support.
4. The cutting and splitting integrated machine according to claim 3, wherein the picosecond laser cutting machine comprises a picosecond laser generator, a cutting light path component and a cutting laser head which are arranged above the beam support;
picosecond laser generator is used for producing cutting laser, cutting laser warp cutting light path subassembly transmits extremely cutting laser head department.
5. The cutting and splitting all-in-one machine according to claim 4, wherein the picosecond laser cutting machine further comprises:
the Y-axis cutting linear driving mechanism is arranged at one side surface of the beam bracket;
the cutting side driving mounting plate is connected with the driving end of the Y-axis cutting linear driving mechanism and driven by the Y-axis cutting linear driving mechanism to slide along the beam support in a reciprocating manner;
a Z-axis cutting linear drive mechanism mounted on the cutting side drive mounting plate; the cutting laser head is arranged at the driving end of the Y-axis cutting linear driving mechanism and driven by the Z-axis cutting linear driving mechanism to move up and down.
6. The cutting and splitting all-in-one machine according to claim 5, wherein the cutting light path assembly comprises:
the light path mounting plate is fixedly mounted on the beam support;
the beam expander is arranged on the optical path mounting plate;
the fixed light reflecting components are arranged on the light path mounting plate and used for guiding cutting laser to pass through the beam expander;
the movable light reflecting assembly is mounted on the cutting side driving mounting plate, and the cutting laser head is positioned right below the movable light reflecting assembly;
wherein the content of the first and second substances,
the laser propagation direction between the last fixed light reflecting component and the movable light reflecting component on the laser propagation path for cutting is parallel to the driving direction of the Y-axis cutting linear driving mechanism;
the laser propagation direction between the movable light reflecting component and the cutting laser head is parallel to the driving direction of the Z-axis cutting linear driving mechanism.
7. The integrated cutting and splitting machine as claimed in claim 6, wherein the fixed light reflecting assembly and the movable light reflecting assembly each comprise:
a reflective mirror;
the reflector is arranged on the lens seat;
a bolt seat disposed opposite the lens seat;
the tension springs are positioned between the lens seat and the bolt seat and used for driving the lens seat and the bolt seat to approach each other;
one end of each reflection adjusting bolt abuts against the surface, close to the bolt seat, of the lens seat, the middle of each reflection adjusting bolt is in threaded connection with the bolt seat, and the other end of each reflection adjusting bolt extends to one side, far away from the lens seat, of the bolt seat to form a twisting part.
8. The cutting and splitting all-in-one machine according to claim 6, wherein a beam expander and a light path mounting plate are arranged between the beam expander and the light path mounting plate:
the fixing base is fixed on the light path mounting plate, a threaded hole and a stopping part opposite to the threaded hole extend out of one side face of the fixing base, and a strip-shaped groove is formed in the other side face of the fixing base;
the beam expander is arranged on the sliding block, and the bottom of the sliding block is in sliding connection with the fixed base;
the transverse adjusting bolt penetrates through the threaded hole and abuts against the stopping part;
and the locking bolt penetrates through the strip-shaped groove and then is in threaded connection with the sliding block.
9. The cutting and splitting integrated machine according to claim 6, wherein the carbon dioxide splitting machine comprises a carbon dioxide laser generator, a carbon dioxide optical path assembly and a carbon dioxide laser head which are arranged above the beam bracket;
the carbon dioxide laser generator is used for generating splitting laser, and the splitting laser is transmitted to the carbon dioxide laser head through the carbon dioxide optical path component.
10. The cutting and splitting all-in-one machine according to claim 9, wherein the carbon dioxide splitting machine further comprises:
the Y-axis splinter linear driving mechanism is arranged at the other side surface of the beam bracket;
the splinter side driving mounting plate is connected with the driving end of the Y-axis splinter linear driving mechanism and driven by the Y-axis splinter linear driving mechanism to slide along the beam support in a reciprocating manner;
the Z-axis splinter linear driving mechanism is arranged on the splinter side driving mounting plate; the carbon dioxide laser head is arranged at the driving end of the Y-axis linear lobe driving mechanism and driven by the Z-axis linear lobe driving mechanism to move up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221939779.XU CN218089349U (en) | 2022-07-26 | 2022-07-26 | Cutting and splitting integrated machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221939779.XU CN218089349U (en) | 2022-07-26 | 2022-07-26 | Cutting and splitting integrated machine |
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| CN218089349U true CN218089349U (en) | 2022-12-20 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116553815A (en) * | 2023-04-24 | 2023-08-08 | 深圳市联赢激光股份有限公司 | Glass processing integrated machine, method, equipment and computer readable storage medium |
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2022
- 2022-07-26 CN CN202221939779.XU patent/CN218089349U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116553815A (en) * | 2023-04-24 | 2023-08-08 | 深圳市联赢激光股份有限公司 | Glass processing integrated machine, method, equipment and computer readable storage medium |
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