CN114029625A

CN114029625A - Laser processing device, processing equipment and processing method

Info

Publication number: CN114029625A
Application number: CN202011551185.7A
Authority: CN
Inventors: 梁乔春; 李志刚; 朱凡; 朱胜鹏
Original assignee: Wuhan DR Llaser Technology Corp Ltd
Current assignee: Wuhan DR Llaser Technology Corp Ltd
Priority date: 2020-12-23
Filing date: 2020-12-23
Publication date: 2022-02-11

Abstract

The invention provides a laser processing device, processing equipment and a processing method, which comprise the following steps: the laser adjusting module is used for dividing the first laser beam into a plurality of first sub laser beams and dividing the second laser beam into a plurality of second sub laser beams, the plurality of first sub laser beams form a plurality of first light spots, the plurality of second sub laser beams form a plurality of second light spots, and any first light spot is positioned at a preset distance in front of one second light spot; the first motion module is used for driving the first laser, the second laser and the laser adjusting module to move, or driving the to-be-cut device to move, so that when the plurality of first sub laser beams move along the plurality of preset cutting paths respectively, the plurality of second sub laser beams also move along the plurality of preset cutting paths respectively, and any one of the first sub laser beams and any one of the second sub laser beams sequentially form a cutting groove and a cutting line on one preset cutting path, so that the cutting time is saved, the cutting production process is shortened, and the cutting productivity is improved.

Description

Laser processing device, processing equipment and processing method

Technical Field

The present invention relates to the field of laser processing technology, and more particularly, to a laser processing apparatus, a processing device, and a processing method.

Background

With the development of the laser nondestructive cutting technology, the laser nondestructive cutting technology is also applied to the technical field of solar cells. The solar cell slice cutting method comprises the steps of scanning a solar cell slice along a path to be cut by laser to form one or more cutting grooves, scanning another laser along the path to be cut to form thermal stress, and enabling the solar cell slice to crack along the path to be cut to realize the cutting of the solar cell slice. However, the cutting productivity of the conventional solar cell is to be further improved.

Disclosure of Invention

In view of the above, the present invention provides a laser processing apparatus, a processing device and a processing method to improve the throughput of laser cutting.

In order to achieve the purpose, the invention provides the following technical scheme:

a laser processing apparatus comprising:

a first laser for emitting a first laser beam;

a second laser for emitting a second laser beam;

the laser adjusting module is used for dividing the first laser beam into a plurality of first sub laser beams with different optical paths, dividing the second laser beam into a plurality of second sub laser beams with different optical paths, forming a plurality of first light spots on the surface of a device to be cut by the plurality of first sub laser beams, forming a plurality of second light spots on the surface of the device to be cut by the plurality of second sub laser beams, and enabling any one of the first light spots to be located at a preset distance in front of the second light spot;

the first motion module is used for driving the first laser, the second laser and the laser adjusting module to move, or driving the to-be-cut device to move, so that the plurality of first sub laser beams respectively move along a plurality of preset cutting paths of the to-be-cut device, the plurality of second sub laser beams also respectively move along the plurality of preset cutting paths, any one of the first sub laser beams and one of the second sub laser beams sequentially form a cutting groove and a cutting line on the preset cutting path, and the to-be-cut device is cut along the plurality of cutting lines.

Optionally, the laser adjustment module includes at least one beam splitter, at least two optical path guiding modules, and at least two focusing devices;

the at least one light splitting device is used for splitting the first laser beam into a plurality of first sub laser beams with different optical paths and splitting the second laser beam into a plurality of second sub laser beams with different optical paths;

the optical path guiding module is used for guiding the first sub laser beam and/or the second sub laser beam to be transmitted to a preset cutting path of the surface of the device to be cut; the at least two optical path guiding modules are used for guiding the plurality of first sub laser beams and the plurality of second sub laser beams to be transmitted to a plurality of preset cutting paths on the surface of the device to be cut;

the at least two focusing devices are respectively located on optical paths of the first laser beam and the second laser beam, or the at least two focusing devices are respectively located on optical paths of the plurality of first sub-laser beams and the plurality of second sub-laser beams and are used for focusing the plurality of first sub-laser beams and the plurality of second sub-laser beams.

Optionally, the focusing devices located on the optical paths of the second laser beams or respectively located on the optical paths of the second sub laser beams are shaping focusing devices for shaping and focusing the spots of the second sub laser beams.

Optionally, the laser adjustment module at least includes a first light splitter, a first optical path guiding module, and a second optical path guiding module;

the first light splitting device is used for splitting the first laser beam into a first sub laser beam transmitted along a first optical path and a first sub laser beam transmitted along a second optical path, and splitting the second laser beam into a second sub laser beam transmitted along the first optical path and a second sub laser beam transmitted along the second optical path;

the first light path guiding module is used for guiding the first sub laser beam and the second sub laser beam on the first light path to be transmitted to a first preset cutting path on the surface of the device to be cut; the second light path guiding module is used for guiding the first sub laser beam and the second sub laser beam on the second light path to be transmitted to a second preset cutting path on the surface of the device to be cut;

a preset included angle or a preset distance is formed between the first sub laser beam transmitted along the first light path and the second sub laser beam transmitted along the first light path, so that a first light spot formed by the first sub laser beam at the first preset cutting path is located at a preset distance in front of a second light spot formed by the second sub laser beam;

and a preset included angle or a preset distance is formed between the first sub laser beam transmitted along the second light path and the second sub laser beam transmitted along the second light path, so that a first light spot formed by the first sub laser beam at the second preset cutting path is positioned at a preset distance in front of a second light spot formed by the second sub laser beam.

Optionally, the first optical path guiding module and the second optical path guiding module each include at least one reflecting device;

the laser adjusting module further comprises a first focusing device positioned on the first optical path, a second focusing device positioned on the second optical path and a shaping focusing device positioned between the second laser and the first light splitting device;

or, the laser adjusting module further comprises a first focusing device located between the first laser and the first light splitting device, and a shaping focusing device located between the second laser and the first light splitting device.

Optionally, the laser adjustment module at least includes a first optical splitter, a second optical splitter, a first optical path guiding module and/or a second optical path guiding module, a third optical path guiding module and/or a fourth optical path guiding module;

the first light splitting device is used for splitting the second laser beam into a second sub laser beam transmitted along the first optical path and a second sub laser beam transmitted along the second optical path;

the first light path guiding module is used for guiding the second sub laser beam on the first light path to be transmitted to a first preset cutting path on the surface of the device to be cut; the second light path guiding module is used for guiding the second sub laser beam on the second light path to be transmitted to a second preset cutting path on the surface of the device to be cut;

the second light splitting device is used for splitting the first laser beam into a first sub laser beam transmitted along the third optical path and a first sub laser beam transmitted along the fourth optical path;

the third light path guiding module is used for guiding the first sub laser beam on the third light path to be transmitted to a first preset cutting path on the surface of the device to be cut, and enabling a first light spot formed by the first sub laser beam to be located at a preset distance in front of a second light spot formed by a second sub laser beam on the first preset cutting path; the fourth light path guiding module is used for guiding the first sub laser beam on the fourth light path to be transmitted to a second preset cutting path on the surface of the device to be cut, and enabling a first light spot formed by the first sub laser beam to be located at a preset distance in front of a second light spot formed by a second sub laser beam on the second preset cutting path.

Optionally, the first optical path guiding module and/or the second optical path guiding module includes at least one reflective device, and the third optical path guiding module and/or the fourth optical path guiding module includes at least one reflective device;

the laser adjusting module further comprises a third focusing device positioned on the third optical path, a fourth focusing device positioned on the fourth optical path, and a beam focusing and shaping device positioned between the second laser and the first light splitting device;

or, the laser adjusting module further includes a third focusing device located on the third optical path, a fourth focusing device located on the fourth optical path, a first focusing shaping device located on the first optical path, and a second focusing shaping device located on the second optical path.

Optionally, the optical path switching module further includes a plurality of optical path switching modules, and any of the optical path switching modules is located on an optical path of one of the first sub laser beams;

the optical path switching module is used for switching the optical path of the first sub laser beam into a fifth optical path or a sixth optical path;

if the preset cutting paths of the first sub laser beam and the second sub laser beam move towards a first direction, the optical path switching module switches the optical path of the first sub laser beam to a fifth optical path, so that the first light spot is located on a first side of the second light spot, and the first light spot is located in front of the second light spot in the first direction;

if the first sub laser beam and the second sub laser beam move towards a second direction along a preset cutting path, the optical path switching module switches the optical path of the first sub laser beam to a sixth optical path, so that the first light spot is located on a second side of the second light spot, the first light spot is located in front of the second light spot in the second direction, and the second direction is opposite to the first direction.

A laser processing apparatus comprising a laser processing device as claimed in any one of the above;

and a first laser and a second laser in the laser processing device perform laser processing on the workpiece to be cut at the same station.

Optionally, the laser processing equipment at least comprises a first station, a second station, a third station and a second motion module;

the first station is used for feeding and visually positioning a device to be cut;

the second station is used for enabling a first laser and a second laser in the laser processing device to carry out laser processing on a workpiece to be cut;

the third station is used for blanking a device to be cut;

or the first station is used for feeding and discharging a device to be cut;

the second station is used for visual positioning of a device to be cut;

the third station is used for enabling a first laser and a second laser in the laser processing device to carry out laser processing on a workpiece to be cut;

the second movement module is used for driving the processing table bearing the to-be-cut device to move to the first station, the second station and the third station in sequence.

Optionally, the laser processing equipment at least comprises a first station, a second station, a third station, a fourth station and a second motion module;

the first station and the third station are used for feeding, visual positioning and blanking of a device to be cut;

the second station and the fourth station are used for enabling a first laser module and a second laser module in the laser processing device to carry out laser processing on a device to be cut;

or the first station is used for feeding a device to be cut;

the second station is used for visual positioning of a device to be cut;

the third station is used for enabling a first laser module and a second laser module in the laser processing device to carry out laser processing on a device to be cut;

the fourth station is used for blanking a device to be cut;

the second movement module is used for driving a processing table bearing a device to be cut to move to the first station, the second station, the third station and the fourth station in sequence.

A laser processing method, comprising:

dividing the first laser beam into a plurality of first sub laser beams with different optical paths, dividing the second laser beam into a plurality of second sub laser beams with different optical paths, wherein the plurality of first sub laser beams form a plurality of first light spots on the surface of a device to be cut, the plurality of second sub laser beams form a plurality of second light spots on the surface of the device to be cut, and any one first light spot is positioned at a preset distance in front of the second light spot;

and enabling the plurality of first sub laser beams to respectively move along a plurality of preset cutting paths of the device to be cut, enabling the plurality of second sub laser beams to respectively move along the plurality of preset cutting paths, enabling any one of the first sub laser beams and one of the second sub laser beams to sequentially form a cutting groove and a cutting line on one preset cutting path, and enabling the device to be cut to cut along the plurality of cutting lines.

Optionally, splitting the first laser beam into a plurality of first sub-laser beams having different optical paths, and splitting the second laser beam into a plurality of second sub-laser beams having different optical paths includes:

splitting the first laser beam into a plurality of first sub-laser beams having different optical paths and splitting the second laser beam into a plurality of second sub-laser beams having different optical paths by at least one beam splitting device;

guiding the plurality of first sub laser beams and the plurality of second sub laser beams to be transmitted to a plurality of preset cutting paths on the surface of the device to be cut through at least two optical path guiding modules;

focusing the plurality of first sub laser beams and the plurality of second sub laser beams by the at least two focusing devices.

Optionally, splitting the first laser beam into a plurality of first sub-laser beams having different optical paths, and splitting the second laser beam into a plurality of second sub-laser beams having different optical paths further comprises:

shaping the spots of the plurality of second sub laser beams by the at least one shaping device.

Optionally, positioning the first spot in front of the second spot comprises:

if the first sub laser beam and the second sub laser beam move towards a first direction along a preset cutting path of the device to be cut, switching the optical path of the first sub laser beam to a fifth optical path to enable the first light spot to be positioned on a first side of the second light spot, so that the first light spot is positioned in front of the second light spot in the first direction;

if the first sub laser beam and the second sub laser beam move towards a second direction along a preset cutting path of the device to be cut, switching the optical path of the first sub laser beam to a sixth optical path to enable the first light spot to be located on a second side of the second light spot, so that the first light spot is located in front of the second light spot in the second direction;

the second direction is opposite to the first direction, and the first side and the second side are respectively located on two opposite sides of the second light spot along the preset cutting path.

Optionally, after or while switching the optical path of the first sub laser beam to a fifth optical path, the method further includes:

moving a device to be cut to the processing range of the first light spot;

after or while switching the optical path of the first sub laser beam to the second optical path, the method further includes:

and moving another device to be cut to be within the processing range of the first light spot.

Compared with the prior art, the technical scheme provided by the invention has the following advantages:

according to the laser processing device, the processing equipment and the processing method, any first light spot is located at the preset distance in front of the second light spot, so that the first sub laser beam and the second sub laser beam can simultaneously move along the preset cutting path, and the cutting groove and the cutting line are sequentially formed on the preset cutting path, so that the cutting time is saved, the cutting production process is shortened, and the cutting productivity is improved;

secondly, the laser adjusting module divides the first laser beam into a plurality of first sub laser beams with different optical paths, and divides the second laser beam into a plurality of second sub laser beams with different optical paths, and the first motion module drives the first laser, the second laser and the laser adjusting module to move, or drives the device to be cut to move, so that the plurality of first sub laser beams respectively move along a plurality of preset cutting paths of the device to be cut, and simultaneously the plurality of second sub laser beams respectively move along a plurality of preset cutting paths, that is, the invention can simultaneously form a plurality of cutting lines on the device to be cut, thereby saving cutting time, shortening cutting production process and improving cutting productivity;

and thirdly, the first light spot is positioned at the preset distance in front of the second light spot, namely the positions of the first light spot and the second light spot are fixed and unchanged, so that the positions of the first laser, the second laser and the laser adjusting module are fixed and unchanged, and the first laser, the second laser and the laser adjusting module can be arranged at the same station, so that the station is saved, and the productivity is improved.

Thirdly, because the positions of the first light spot and the second light spot are fixed and unchangeable, namely the first light spot and the second light spot are aligned when the positions are fixed, the second light spot and the cutting groove do not need to be aligned after the cutting groove is formed, and therefore the problems that the cutting line deviates from a preset cutting path and the sizes of the cut pieces are different due to poor alignment of the cutting groove and the laser light spots forming the cutting line in the prior art are solved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a cutting groove formed on a solar cell in the prior art;

fig. 2 is a schematic structural view of a scribe line and a scribe line formed on a solar cell in the prior art;

fig. 3 is a schematic structural diagram of a laser processing apparatus according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a device to be cut with cutting grooves Q1 and cutting lines Q2 formed thereon according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of forming cutting grooves Q1, Q3 and a cutting line Q2 on a device to be cut according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of the first sub-laser beam and the second sub-laser beam being shifted in the Z-axis according to one embodiment of the present invention;

fig. 7 is a schematic structural diagram of a laser processing apparatus according to another embodiment of the present invention;

fig. 8 is a schematic structural diagram of a laser processing apparatus according to another embodiment of the present invention;

fig. 9 is a schematic structural diagram of a laser processing apparatus according to another embodiment of the present invention;

fig. 10 is a schematic structural view of a laser processing apparatus according to another embodiment of the present invention;

FIG. 11 is a schematic diagram of the first sub-laser beam and the second sub-laser beam being shifted in the Z-axis according to another embodiment of the present invention;

fig. 12 is a schematic structural diagram of an optical path switching apparatus according to an embodiment of the present invention;

fig. 13 is a schematic structural diagram of forming a cutting groove Q4 and a cutting line Q5 on a device to be cut according to an embodiment of the present invention;

fig. 14 is a schematic structural diagram of forming cutting grooves Q4, Q6 and a cutting line Q5 on a device to be cut according to an embodiment of the present invention;

FIG. 15 is a schematic diagram of a plurality of stations in a laser machining apparatus according to an embodiment of the present invention;

FIGS. 16 and 17 are schematic views illustrating the arrangement of a plurality of stations in a laser processing apparatus according to another embodiment of the present invention;

FIG. 18 is a schematic diagram of a plurality of stations in a laser machining apparatus according to another embodiment of the present invention;

FIG. 19 is a schematic diagram of a plurality of stations in a laser machining apparatus according to another embodiment of the present invention;

fig. 20 is a flowchart of a laser processing method according to an embodiment of the present invention.

Detailed Description

As background art, the cutting productivity of the existing solar cell is to be further improved. The inventor researches and discovers that in the prior art, as shown in fig. 1, a cutting groove 11 is formed at the head and the tail of a path to be cut of a solar cell piece 10 by using a first laser at a first station, then, as shown in fig. 2, a second laser (thermal stress laser) is used at a second station to scan along the path to be cut to form a cutting line 12, so that the solar cell piece 10 is cracked (namely the second laser scans along the path to be cut to provide a thermal gradient, and a device to be cut generates micro cracks along the cutting groove 11 and extends to crack the device to be cut along the path to be cut, namely the cutting line 12), and the reason for causing the problem of low productivity is mainly that the solar cell piece 10 is cut by the first laser and the second laser alternately at two stations, so that the cutting process is long.

When the solar cell 10 is to be cut into a plurality of pieces, all the cutting grooves 11 are sequentially processed as described above in the first station, and all the cutting lines 12 are sequentially processed as described above in the second station, which also results in a long cutting process.

Accordingly, the present invention provides a laser processing apparatus, a processing device and a processing method to overcome the above problems of the prior art, the laser processing apparatus comprising:

a first laser for emitting a first laser beam;

a second laser for emitting a second laser beam;

the laser adjusting module is used for dividing the first laser beam into a plurality of first sub laser beams with different optical paths, dividing the second laser beam into a plurality of second sub laser beams with different optical paths, forming a plurality of first light spots on the surface of a device to be cut by the plurality of first sub laser beams, forming a plurality of second light spots on the surface of the device to be cut by the plurality of second sub laser beams, and enabling any one first light spot to be positioned at a preset distance in front of one second light spot;

the first motion module is used for driving the first laser, the second laser and the laser adjusting module to move, or driving the to-be-cut device to move, so that when the plurality of first sub laser beams move along a plurality of preset cutting paths of the to-be-cut device respectively, the plurality of second sub laser beams also move along the plurality of preset cutting paths respectively, any one of the first sub laser beams and any one of the second sub laser beams sequentially form a cutting groove and a cutting line on one preset cutting path, and the to-be-cut device is cut along the plurality of cutting lines.

Any first light spot is positioned at a preset distance in front of a second light spot, so that the first sub laser beam and the second sub laser beam can simultaneously move along a preset cutting path to sequentially form a cutting groove and a cutting line on the preset cutting path (the first sub laser beam is used for forming the cutting groove, the second sub laser beam is positioned behind the first laser beam and moves along the preset cutting line path to provide a thermal gradient, so that the object to be cut generates cracks along the induction groove and extends to crack the object to be cut along the cutting line path), thereby saving the cutting time, shortening the cutting production process and improving the cutting productivity;

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the above is the core idea of the present invention, and the above objects, features and advantages of the present invention can be more clearly understood. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

An embodiment of the present invention provides a laser processing apparatus, as shown in fig. 3, including a first laser 21, a second laser 22, a laser adjustment module 23, and a first movement module (not shown).

Wherein the first laser 21 is arranged to emit a first laser beam B1.

The second laser 22 is used to emit a second laser beam B2.

The laser adjusting module 23 is configured to divide the first laser beam B1 into a plurality of first sub-laser beams, such as B11 and B12, with different optical paths, and divide the second laser beam B2 into a plurality of second sub-laser beams, such as B21 and B22, with different optical paths, as shown in fig. 3 and 4, the plurality of first sub-laser beams, such as B11 and B12, form a plurality of first light spots S1 on the surface of the device a to be cut, the plurality of second sub-laser beams, such as B21 and B22, form a plurality of second light spots S2 on the surface of the device a to be cut, and any one of the first light spots S1 is located at a preset distance in front of one of the second light spots S2.

The first motion module is configured to drive the first laser 21, the second laser 22, and the laser adjustment module 23 to move, or drive the device a to be cut to move, so that while the first sub-laser beams, such as B11 and B12, respectively move along the preset cutting paths C of the device a to be cut, the second sub-laser beams, such as B21 and B22, respectively move along the preset cutting paths C, and any one of the first sub-laser beams, such as B11, and the second sub-laser beam, such as B21, sequentially forms a cutting groove Q1 and a cutting line Q2 on a preset cutting path C, and the device a to be cut is cut along the cutting lines Q2.

It is noted that the component a to be cut is placed on a processing table which is arranged to be movable to and from the processing station. When the processing table bearing the device A to be cut moves to a processing station, the laser processing device is positioned above the device A to be cut and used for carrying out nondestructive cutting on the device A to be cut. The device A to be cut comprises a solar cell and the like.

After the machining table bearing the device a to be cut moves to the machining station, the first motion module drives the first laser 21, the second laser 22 and the laser adjustment module 23 to move simultaneously, or drives the device a to be cut to move, as shown in fig. 4, so that while the plurality of first sub laser beams move along the plurality of preset cutting paths C respectively, the plurality of second sub laser beams also move along the plurality of preset cutting paths C respectively, that is, while the plurality of first light spots S1 move along the plurality of preset cutting paths C respectively, the plurality of second light spots S2 also move along the plurality of preset cutting paths C respectively, and any one of the first light spots S1 is located in front of one of the second light spots S2 by a preset distance L, so that the plurality of first sub laser beams and the plurality of second sub laser beams form a cutting groove Q1 and a cutting line Q2 on the preset cutting paths C.

Since any one of the first light spots S1 is located at the preset distance L in front of the second light spot S2, as shown in fig. 4, when the first light spots S1 and the second light spots S2 move on the preset cutting paths C from left to right in the direction indicated by the arrow X, the first sub laser beams may be irradiated onto the device a to be cut, the cutting grooves Q1 may be formed on the preset cutting paths C on the left side of the device a to be cut, and after the first sub laser beams move to the right by the preset distance L, the second sub laser beams may be irradiated onto the device a to be cut, and the cutting lines Q2 may be formed on the device a to be cut along the preset cutting paths C.

Then, the plurality of first light spots S1 and the plurality of second light spots S2 continuously move to the right, as shown in fig. 5, the plurality of first sub laser beams form a plurality of cutting grooves Q3 on the plurality of preset cutting paths C on the right side of the device a to be cut and leave the device a to be cut, and the plurality of second sub laser beams leave the device a to be cut after forming a plurality of complete cutting lines Q2 on the plurality of preset cutting paths C.

Because any first light spot S1 is positioned at the preset distance L in front of a second light spot S2, any first sub-laser beam and any second sub-laser beam can simultaneously move along a preset cutting path C, and a cutting groove and a cutting line are sequentially formed on the preset cutting path C, so that the cutting time is saved, the cutting production process is shortened, and the cutting productivity is improved;

moreover, since the laser adjustment module 23 divides the first laser beam B1 into a plurality of first sub laser beams with different optical paths, such as B11 and B12, and divides the second laser beam B2 into a plurality of second sub laser beams with different optical paths, such as B21 and B22, and the first motion module drives the first laser 21, the second laser 22 and the laser adjustment module 23 to move, or drives the device a to be cut to move, while the plurality of first sub laser beams, such as B11 and B12, respectively move along the plurality of preset cutting paths C of the device a to be cut, the plurality of second sub laser beams, such as B21 and B22, respectively move along the plurality of preset cutting paths C, that is, the invention can simultaneously form a plurality of cutting lines on the device a to be cut, thereby saving cutting time, shortening cutting production process, and improving cutting productivity;

secondly, because the first light spot S1 is located at the preset distance L in front of the second light spot S2, that is, the positions of the first light spot S1 and the second light spot S2 are fixed and unchanged, the positions of the first laser 21, the second laser 22 and the laser adjustment module 23 are fixed and unchanged, and therefore, the first laser 21, the second laser 22 and the laser adjustment module 23 can be arranged at the same station, so that the station is saved, and the productivity is improved.

Thirdly, since the positions of the first light spot S1 and the second light spot S2 are fixed and unchanged, that is, the first light spot S1 and the second light spot S2 are already aligned when the positions are fixed, after the cutting groove is formed, the second light spot S2 does not need to be aligned with the cutting groove, so that the problems that the cutting line deviates from the preset cutting path and the size of the cut piece is different due to poor alignment of the cutting groove and the laser light spot forming the cutting line in the prior art are solved.

In some embodiments of the present invention, the laser adjusting module 23 includes at least one beam splitter, at least two optical path directing modules, and at least two focusing devices.

Wherein, at least one beam splitting device is used for splitting the first laser beam B1 into a plurality of first sub laser beams with different optical paths and splitting the second laser beam B2 into a plurality of second sub laser beams with different optical paths;

the optical path guiding module is used for guiding one first sub laser beam and/or one second sub laser beam to be transmitted to a preset cutting path C on the surface of the device A to be cut; the at least two optical path guiding modules are used for guiding the plurality of first sub laser beams and the plurality of second sub laser beams to be transmitted to a plurality of preset cutting paths C on the surface of the device A to be cut;

On this basis, in some embodiments of the present invention, the focusing device located on the optical path of the second laser beam, or respectively located on the optical paths of the plurality of second sub-laser beams, is a shaping focusing device, for example, it is a cylindrical mirror or a cylindrical mirror group, and is used for shaping and focusing the spots of the plurality of second sub-laser beams.

Alternatively, the spectroscopic device includes a spectroscope or the like. The optical path guiding module comprises at least one reflecting device, and the reflecting device comprises a reflecting mirror and the like. The focusing device comprises a focusing lens or a shaping focusing device consisting of the cylindrical lens or the cylindrical lens group. Optionally, a shaping and focusing device located on the optical path of the second laser beam or on the optical paths of the plurality of second sub-laser beams is used for shaping the spots of the second sub-laser beams into strip-shaped spots or line spots.

In some embodiments of the present invention, the laser adjusting module 23 includes a first beam splitter 230, a first optical path guiding module and a second optical path guiding module. As shown in fig. 3 or fig. 7, the first light splitting device 230 is configured to split the first laser beam B1 into a first sub-laser beam B11 traveling along a first optical path and a first sub-laser beam B12 traveling along a second optical path, and split the second laser beam B2 into a second sub-laser beam B21 traveling along the first optical path and a second sub-laser beam B22 traveling along the second optical path.

The first optical path guiding module is used for guiding the first sub laser beam B11 and the second sub laser beam B21 on the first optical path to be transmitted to the first preset cutting path C of the surface of the device A to be cut. The second optical path guiding module is used for guiding the first sub laser beam B12 and the second sub laser beam B22 on the second optical path to be transmitted to a second preset cutting path C of the surface of the device A to be cut.

Also, as shown in fig. 6, a preset included angle or a preset distance is formed between the first sub laser beam B11 propagating along the first optical path and the second sub laser beam B21 propagating along the first optical path in the Z-axis direction, so that the first spot S1 formed by the first sub laser beam at the first preset cutting path C is located in front of the second spot S2 formed by the second sub laser beam by a preset distance L. The first sub laser beam B12 propagating along the second optical path and the second sub laser beam B22 propagating along the second optical path have a predetermined angle or a predetermined distance therebetween, such that the first spot S1 formed by the first sub laser beam at the second predetermined cutting path C is located in front of the second spot S2 formed by the second sub laser beam by a predetermined distance L.

In some embodiments of the present invention, the first optical path guiding module and the second optical path guiding module each include at least one reflecting device. Alternatively, as shown in fig. 3 and 7, the first optical path directing module includes a reflecting device 231, and the second optical path directing modules each include reflecting

devices

232 and 233.

In addition, in some embodiments of the present invention, as shown in fig. 3, the laser adjustment module 23 further includes a first focusing device 234 located on the first optical path, a second focusing device 235 located on the second optical path, and a shaping focusing device 236 located between the second laser 22 and the first light splitting device 230. In this embodiment, the first focusing device 234 is disposed on the optical paths of the first sub laser beam B11 and the second sub laser beam B21; the second focusing device is disposed on the optical paths of the first sub laser beam B2 and the second sub laser beam B22. Of course, the invention is not limited thereto, and in other embodiments, as shown in fig. 7, the laser alignment module 23 further includes a first focusing device 238 located between the first laser 21 and the first beam splitter 230, and a shaping focusing device 239 located between the second laser 22 and the first beam splitter 230.

In other embodiments of the present invention, as shown in fig. 8 and 9, the laser adjusting module 23 includes a first light splitter 241, a second light splitter 242, a first optical path guiding module and/or a second optical path guiding module, a third optical path guiding module and/or a fourth optical path guiding module.

Wherein the first light splitting device 241 is used for splitting the second laser beam B2 into a second sub-laser beam B23 traveling along the first optical path and a second sub-laser beam B24 traveling along the second optical path. The first light path guiding module is used for guiding the second sub laser beam B23 on the first light path to be transmitted to a first preset cutting path C on the surface of the device A to be cut; the second optical path guiding module is used for guiding the second sub laser beam B24 on the second optical path to be transmitted to the second preset cutting path C on the surface of the device a to be cut.

The second light splitting device 242 serves to split the first laser beam B1 into a first sub-laser beam B13 traveling along the third optical path and a first sub-laser beam B14 traveling along the fourth optical path. The third optical path guiding module is used for guiding the first sub laser beam B13 on the third optical path to be transmitted to the first preset cutting path C on the surface of the device a to be cut, and enabling the first light spot S1 formed by the first sub laser beam B13 to be located at the preset distance L in front of the second light spot S2 formed by the second sub laser beam B23 at the first preset cutting path C. The fourth optical path guiding module is configured to guide the first sub laser beam B14 on the fourth optical path to be transmitted to a second preset cutting path C on the surface of the device a to be cut, and to position a first light spot S1 formed by the first sub laser beam B14 at a preset distance L in front of a second light spot S2 formed by the second sub laser beam B24 on the second preset cutting path C.

On the basis of the foregoing embodiments, in some embodiments of the present invention, the first optical path guiding module and/or the second optical path guiding module includes at least one reflective device, and the third optical path guiding module and/or the fourth optical path guiding module includes at least one reflective device.

Alternatively, as shown in fig. 8, the first optical path guiding module includes a reflecting device 243, the second optical path guiding module includes reflecting

devices

244 and 245, and the third optical path guiding module includes a reflecting device 246. Alternatively, as shown in fig. 9, the first optical path directing module includes a reflecting device 243, and the third optical path directing module includes a reflecting device 246.

In some embodiments of the present invention, as shown in fig. 8, the laser adjustment module 23 further includes a third focusing device 247 located on the third optical path, a fourth focusing device 248 located on the fourth optical path, and a shaping focusing device 249 located between the second laser 22 and the first light splitting device 241. In this embodiment, the third focusing device 247 is disposed on the optical path of the first sub laser beam B13, and the fourth focusing device is disposed on the optical path of the first sub laser beam B14.

Of course, the present invention is not limited thereto, and in another embodiment, as shown in fig. 9, the laser adjusting module 23 further includes a third focusing device 247 located on the third optical path, a fourth focusing device 248 located on the fourth optical path, a first shaping focusing device 251 located on the first optical path, and a second shaping focusing device 252 located on the second optical path. In this embodiment, the third focusing device 247 is disposed on the optical path of the first sub laser beam B13, and the fourth focusing device 248 is disposed on the optical path of the first sub laser beam B14.

In other embodiments of the present invention, the laser adjustment module 23 further includes at least one third light splitting device and/or at least one fourth light splitting device; the third light splitting device is positioned on the optical path of any one of the second sub laser beams and is used for splitting the second sub laser beams; the fourth light splitting device is located on the optical path of any one of the first sub laser beams and is used for splitting the first sub laser beams.

As shown in fig. 10, the laser adjustment module 23 further includes a third light splitting device 254 and a fourth light splitting device 257, the third light splitting device 254 is located on the optical path of the second sub laser beam B24 and is used for splitting the second sub laser beam B24 to form the second sub laser beams B25 and B26, and the fourth light splitting device 257 is located on the optical path of the first sub laser beam B14 and is used for splitting the first sub laser beam B14 to form the first sub laser beams B15 and B16.

On this basis, laser adjustment module 23 still includes two at least light path guide module, and a light path guide module includes reflecting device 255, and another light path guide module includes reflecting device 258. The laser adjustment module 23 further includes a plurality of focusing devices such as 262, 263 and 264, and a plurality of shaping focusing

devices

259, 260 and 261, wherein the plurality of focusing devices such as 262, 263 and 264 are used for focusing the plurality of first sub laser beams, and the plurality of shaping focusing

devices

259, 260 and 261 are used for shaping and focusing the second sub laser beams.

In any of the above embodiments, the first laser 21 further has a reflecting device 237 on the optical path, and the reflecting device 237 is used to change the direction of the first laser beam B1. Of course, in other embodiments, the optical path of the first laser 21 may not have the reflection device 237, and will not be described herein.

Of course, the laser adjusting module 23 in the embodiment of the present invention is not limited to this, and in practical applications, other reflection devices, beam expanders, and the like may be arranged according to actual situations to optimize the optical path or adjust the optical path, so as to adjust the positions of the plurality of first light spots S1 and the plurality of second light spots S2.

It should be noted that, in the structures shown in fig. 8 to 10, taking the structure shown in fig. 8 as an example, as shown in fig. 11, the optical paths of any one of the first sub-laser beam and the second sub-laser beam have a predetermined distance on the Z-axis, so that the first spot S1 and the second spot S2 have a predetermined distance L therebetween.

In some embodiments of the invention, the predetermined distance L between the first spot S1 and the second spot S2 is less than or equal to 200 mm. The preset distance L is a distance between edges of the first and second light spots S1 and S2. Optionally, the preset distance L is less than or equal to 30mm, and more preferably, the preset distance L is less than or equal to 5mm, so as to achieve a better process effect on the basis of effectively reducing the distance between the first light spot S1 and the second light spot S2 and reducing the process time.

It should be noted that, in the embodiment of the present invention, the preset distance L between the first light spot S1 and the second light spot S2 is adjustable. In some embodiments of the present invention, the first motion module is further configured to drive at least some components of the laser adjustment module 23 to move or rotate, so as to adjust the distance between the first light spot S1 and the second light spot S2.

In some embodiments of the present invention, as shown in fig. 12, the laser adjusting module 23 further includes an optical path switching module 265. Any one of the optical path switching modules 265 is located on the optical path of a first sub-laser beam, and the optical path switching module 265 is configured to switch the optical path of the first sub-laser beam to a fifth optical path G1 or a sixth optical path G2. It should be noted that, in the embodiment of the present invention, the optical path switching module 265 is disposed before the focusing module.

When the first sub laser beam and the second sub laser beam move towards the first direction X along the preset cutting path C, the optical path switching module 265 switches the optical path of the first sub laser beam to a fifth optical path G1, so that the first sub laser beam irradiates the surface of the device a to be cut along the fifth optical path G1, and the first light spot S1 is located on the first side of the second light spot S2, so that the first light spot S1 is located in front of the second light spot S2 in the first direction X.

When the first sub laser beam and the second sub laser beam move towards the second direction X 'along the preset cutting path C, the optical path switching module 265 switches the optical path of the first sub laser beam to a sixth optical path G2, so that the first sub laser beam irradiates the surface of the device a to be cut along the sixth optical path G2, the first light spot S1 is located at the second side of the second light spot S2, and the first light spot S1 is located in front of the second light spot S2 in the second direction X'; wherein the second direction X' is opposite to the first direction X, and the first side and the second side are respectively located at two opposite sides of the second light spot S2 along the preset cutting path C.

In practical application, the optical path switching module 265 firstly switches the optical path of the first sub laser beam to a fifth optical path G1, then the first sub laser beam and the second sub laser beam move towards the first direction X to cut the first device a to be cut, as shown in fig. 4 and 5, so that the first sub laser beam and the second sub laser beam successively form cutting grooves Q1, Q3 and a cutting line Q2 on the first device a to be cut, then the optical path switching module 265 switches the optical path of the first sub laser beam to a sixth optical path G2, and the first sub laser beam and the second sub laser beam move towards the second direction X ', as shown in fig. 13 and 14, so that the first sub laser beam and the second sub laser beam successively form cutting grooves Q4, Q6 and a cutting line Q5 on the second device a' to be cut.

Based on this, in the embodiment of the present invention, the second device to be cut a ' can be cut only by switching the optical paths on the right sides of the first device to be cut a ' and the second device to be cut a ', and the cutting groove is always located in front of the cutting line during cutting, without moving the first sub laser beam and the second sub laser beam to the left side of the second device to be cut a ', and then the second device to be cut a ' is cut, so as to ensure that the cutting groove is located in front of the cutting line, thereby saving time and improving productivity.

In some embodiments of the present invention, the laser processing apparatus further comprises a first control module. The first control module is configured to control the optical path switching module 265 to reflect the first sub-laser beam to switch the optical path of the first sub-laser beam to a fifth optical path G1, and control the optical path switching module 265 to transmit the first sub-laser beam or control the optical path switching module 265 to leave the optical path of the first sub-laser beam to switch the optical path of the first sub-laser beam to a sixth optical path G2.

Optionally, the optical path switching module 265 includes a shutter, a scanning galvanometer, or a movable mirror. Alternatively, the optical gate may be an electromechanical optical gate with a total reflection mirror, or an optical gate combining a half-wave plate and a polarization beam splitter, or other optical gates that can achieve the same function. The scanning galvanometer can be a one-dimensional galvanometer with angular deflection.

When the optical path switching module 265 is a movable mirror, the first control module controls the optical path switching module 265 to enter the optical path of the first sub laser beam, that is, the optical path of the first sub laser beam is controlled by the control mirror to enter the optical path of the first sub laser beam, and reflects the first sub laser beam, so as to switch the optical path of the first sub laser beam to the fifth optical path G1, and controls the optical path switching module 265 to leave the optical path of the first sub laser beam, that is, the optical path of the first sub laser beam is switched to the sixth optical path G2 by controlling the optical path switching module 265 to leave the optical path of the first sub laser beam, that is, the control mirror to leave the optical path of the first sub laser beam.

When the optical path switching module 265 is a shutter, the first control module controls the shutter to be opened to reflect the first sub-laser beam to switch the optical path of the first sub-laser beam to the fifth optical path G1, and controls the optical path switching module 265 to be closed to switch the optical path of the first sub-laser beam to the sixth optical path G2.

When the optical path switching module 265 is a scanning galvanometer, the first control module controls the switching of the optical path of the first sub laser beam between the fifth optical path G1 and the sixth optical path G2 by controlling the angle of the scanning galvanometer.

It should be noted that, during the process that the first sub laser beam and the second sub laser beam move along the preset cutting path C, the second sub laser beam always processes the device a to be cut to form the cutting line Q2, and the first sub laser beam processes the device a to be cut only in the area where the cutting groove is to be formed. Of course, in the embodiment of the present invention, only two cutting grooves are formed on the left and right sides of the device a to be cut, but the present invention is not limited thereto, and in other embodiments, one or more cutting grooves may be formed at intervals on the preset cutting path C.

In this regard, in some embodiments of the present invention, the laser processing apparatus further includes a second control module. The second control module is used for controlling the first laser 21 to be turned on when a cutting groove is formed, controlling the first laser 21 to be turned off in other periods, controlling the second laser 22 to be turned on when a cutting line is formed, and controlling the second laser 22 to be turned off in other periods.

The embodiment of the invention also provides laser processing equipment which comprises the laser processing device provided by any one of the above embodiments, wherein the first laser 21, the second laser 22 and the laser adjusting module 23 in the laser processing device perform laser processing on the workpiece to be cut at the same station.

The laser processing equipment in the embodiment of the invention further comprises a processing table and a second movement module, wherein the processing table is used for placing a device to be cut. Optionally, the processing table is a negative pressure adsorption processing table surface to better fix the device to be cut. The second motion module is used for driving the processing table to move so as to move the processing table to the processing station, the laser processing device is used for processing the device to be cut, and then the processing table is taken away from the processing station.

In some embodiments of the invention, the processing stations are arranged in sequence, while the first processing station finishes processing and leaves the processing station, the second processing station is moved to the processing station for processing, and so on, so that continuous processing can be realized.

In some embodiments of the present invention, as shown in fig. 15, the second moving module 51 is a rotating motor, the plurality of processing tables 52 are arranged along the circumferential direction of the rotating motor, and the second moving module 51, i.e., the rotating motor, drives the processing tables 52 to rotate and sequentially pass through the processing stations.

It should be noted that the laser processing equipment not only comprises a processing station, but also comprises a feeding station, a discharging station and a visual positioning station, wherein the visual positioning station is used for carrying out visual positioning on a device to be cut, and for providing visual positioning data for processing, the visual positioning data can be realized by arranging a CCD camera and the like above the station. The feeding station is used for placing a device to be cut on the processing table, and the device to be cut can be fed through a mechanical arm and the like. And the blanking station is used for taking the to-be-cut device which is processed away from the station, and the to-be-cut device can be blanked through a mechanical arm and the like. And the plurality of working tables sequentially pass through the stations and stay at the corresponding stations to finish corresponding actions, so that continuous processing is realized.

In the embodiment of the invention, one working position can be saved by combining the working position where the first laser is positioned and the working position where the second laser is positioned into one working position. Compared with the existing four-table-board rotary processing table, the production capacity can be further improved.

In some embodiments of the invention, one station is adopted as the feeding station, the blanking station and the visual positioning station, and four stations can realize the simultaneous processing of two devices to be cut, thereby greatly improving the productivity. That is, in some embodiments of the present invention, as shown in fig. 15, the laser processing apparatus includes at least two first stations 53, second stations 54, third stations 55, and fourth stations 56; the first station 53 and the third station 55 are used for feeding, visual positioning and blanking of a device to be cut; the second station 54 and the fourth station 56 are used for enabling a first laser module and a second laser module in the laser processing device to carry out laser processing on a device to be cut; the second movement module 51 is configured to drive the processing table carrying the device to be cut to move to the first station 53, the second station 54, the third station 55, and the fourth station 56 in sequence, wherein the second movement module 51 drives the processing table to move along the circumferential direction of the processing table.

The first station 53 carries out feeding and visual positioning, the second station 54 carries out laser processing, the third station 55 carries out blanking and feeding and visual positioning, the fourth station 56 carries out laser processing, the first station 53 carries out blanking, feeding and visual positioning, and then the processes are repeated, so that uninterrupted processing is realized, and the productivity is improved by two times.

As shown in fig. 15, the second moving module 51 drives the processing table to move to the first station 53 for loading and visual positioning, then to move to the second station 54 for laser processing, and then to move to the third station 55 for unloading. The laser processing device moves along the X direction to cut a to-be-cut device on the processing table, then the processing table leaves the second station 54 to the third station 55 to perform blanking, the other processing table moves from the first station 53 to the second station 54, and the light path switching device in the laser processing device switches the light path of the first laser, for example, the first light path is switched to the second light path, the laser processing device moves along the X' direction to cut the to-be-cut device on the other processing table, and the processes are repeated, so that the continuous processing of the laser processing device is realized, and the processing efficiency and the productivity are improved.

Alternatively, when the optical path switching device is not provided, the first moving module may be used to return during the process of moving from the first station 53 to the second station 54, or moving from the third station 55 to the fourth station 56, and during the process, the laser processing device moves in the X direction to cut the device to be cut on the processing table.

In other embodiments of the present invention, the plurality of processing stations and the plurality of processing stations are arranged in a linear direction, and the second motion module 52, which moves linearly, drives the processing stations to move and pass through the plurality of processing stations in sequence. As shown in fig. 16 and 17, the laser processing apparatus includes at least a first station 53, a second station 54, and a third station 55; the first station 53 is used for feeding and visually positioning a device to be cut; the second station 54 is used for enabling a first laser module and a second laser module in the laser processing device to carry out laser processing on a device to be cut; the third station 55 is used for blanking a device to be cut; the second movement module 51 is used for driving the processing table carrying the device to be cut to move to the first station 53, the second station 54 and the third station 55 in sequence.

The second moving module 51 drives the processing table to move to the first station 53 for loading and visual positioning, then to move to the second station 54 for laser processing, and then to move to the third station 55 for unloading. As shown in fig. 16, the laser processing apparatus moves in the X direction to cut the device to be cut on the first processing table, then the first processing table leaves the second station 54 to the third station 55 for blanking, the second processing table moves from the first station 53 to the second station 54, and the optical path switching device in the laser processing apparatus switches the optical path of the first laser, for example, the first optical path is switched to the second optical path, as shown in fig. 17, the laser processing apparatus moves in the X' direction to cut the device to be cut on the second processing table, and the above processes are repeated, thereby realizing continuous processing of the laser processing apparatus, and improving the processing efficiency and productivity.

Optionally, when there is no optical path switching device, the laser processing device may move along the X direction to cut the device to be cut on the processing table when moving from the first station 53 to the second station 54.

Of course, the present invention is not limited thereto, and in other embodiments, as shown in fig. 18, the laser processing apparatus includes at least a first station 53, a second station 54, and a third station 55, wherein the first station 53, the second station 54, and the third station 55 are arranged in a circumferential direction; the first station 53 is used for loading and unloading of a device to be cut; the second station 54 is used for visual positioning of the device to be cut; the third station 55 is used for enabling the first laser module and the second laser module in the laser processing device to carry out laser processing on the device to be cut; the second movement module 51 is used for driving the processing table carrying the device to be cut to move to the first station 53, the second station 53 and the third station 55 in sequence.

The second moving module 51 drives the processing table to move to the first station 53 for loading, then to move to the second station 54 for visual positioning, then to move to the third station 55 for laser processing, and then to move to the first station 53 for unloading. In the third station 55, the laser processing device moves in the X direction to cut the first to-be-cut device on the processing table, then the processing table leaves the third station 55 to the first station 53 to perform blanking, the processing table performs feeding from the first station 53 to move to the second station 54 and the third station 55, and the optical path switching device in the laser processing device switches the optical path of the first laser, and if the first optical path is switched to the second optical path, the laser processing device moves in the X' direction to cut the second to-be-cut device, and the above processes are repeated, so that the continuous processing of the laser processing device is realized, and the processing efficiency and the productivity are improved.

In other embodiments of the present invention, as shown in fig. 19, the laser processing apparatus includes at least a first station 53, a second station 54, a third station 55, a fourth station 56, and a second movement module, wherein the first station 53, the second station 54, the third station 55, and the fourth station 56 are arranged in a linear direction; the first station 53 is used for feeding a device to be cut; the second station 54 is used for visual positioning of the device to be cut; the third station 55 is used for enabling the first laser module and the second laser module in the laser processing device to carry out laser processing on the device to be cut; the fourth station 56 is used for blanking the devices to be cut.

The second moving module drives the processing table to move to the first station 53 for loading, then to the second station 54 for visual positioning, then to the third station 55 for laser processing, and then to the fourth station 56 for unloading. In the third station 55, the laser processing device moves along the X direction to cut the first to-be-cut device on the processing table, then the processing table leaves the third station 55 to the fourth station 56 for blanking, the other processing table moves from the second station 54 to the third station 55, and the light path switching device in the laser processing device switches the light path of the first laser, for example, the first light path is switched to the second light path, the laser processing device moves along the X' direction to cut the to-be-cut device on the other processing table, and the above processes are repeated, so that the continuous processing of the laser processing device is realized, and the processing efficiency and the productivity are improved.

It should be noted that the feeding station, the positioning station, the processing station, and the discharging station may be four stations according to the processing requirement, or may be combined, for example, the feeding station and the positioning station in the foregoing embodiment are combined, or the feeding station and the discharging station are combined, and are not described in detail herein.

An embodiment of the present invention further provides a laser processing method, which is applied to the laser processing apparatus or the laser processing device provided in any of the above embodiments, and as shown in fig. 20, the method includes:

s101: dividing the first laser beam into a plurality of first sub laser beams with different light paths, dividing the second laser beam into a plurality of second sub laser beams with different light paths, forming a plurality of first light spots on the surface of a device to be cut by the plurality of first sub laser beams, forming a plurality of second light spots on the surface of the device to be cut by the plurality of second sub laser beams, and enabling any first light spot to be located at a preset distance in front of the second light spot;

as shown in fig. 3, the first laser 21 emits a first laser beam B1. Second laser 22 emits a second laser beam B2. The laser adjustment module 23 divides the first laser beam B1 into a plurality of first sub laser beams such as B11 and B12 having different optical paths, and divides the second laser beam B2 into a plurality of second sub laser beams such as B21 and B22 having different optical paths, as shown in fig. 3 and 4, the plurality of first sub laser beams such as B11 and B12 form a plurality of first light spots S1 on the surface of the device a to be cut, the plurality of second sub laser beams such as B21 and B22 form a plurality of second light spots S2 on the surface of the device a to be cut, and any one of the first light spots S1 is located at a preset distance in front of one of the second light spots S2.

S102: and enabling the plurality of first sub laser beams to respectively move along a plurality of preset cutting paths of the device to be cut, enabling the plurality of second sub laser beams to respectively move along the plurality of preset cutting paths, enabling any one of the first sub laser beams and one of the second sub laser beams to sequentially form a cutting groove and a cutting line on one preset cutting path, and cutting the device to be cut along the plurality of cutting lines.

The first motion module drives the first laser 21, the second laser 22 and the laser adjustment module 23 to move, or drives the device a to be cut to move, so that while the plurality of first sub laser beams, such as B11 and B12, respectively move along the plurality of preset cutting paths C of the device a to be cut, the plurality of second sub laser beams, such as B21 and B22, respectively move along the plurality of preset cutting paths C, and any one of the first sub laser beams, such as B11, and a second sub laser beam, such as B21, sequentially forms a cutting groove Q1 and a cutting line Q2 on a preset cutting path C, and the device a to be cut is cut along the plurality of cutting lines Q2.

In some embodiments of the present invention, splitting the first laser beam into a plurality of first sub-laser beams having different optical paths, and splitting the second laser beam into a plurality of second sub-laser beams having different optical paths comprises:

On the basis of the above-described embodiment, splitting the first laser beam into a plurality of first sub-laser beams having different optical paths, and splitting the second laser beam into a plurality of second sub-laser beams having different optical paths further includes:

In some embodiments of the present invention, as shown in fig. 3 and 7, splitting the first laser beam into a plurality of first sub-laser beams having different optical paths, and splitting the second laser beam into a plurality of second sub-laser beams having different optical paths includes:

splitting the first laser beam B1 into a first sub-laser beam B11 traveling along a first optical path and a first sub-laser beam B12 traveling along a second optical path through the first light splitting device 230, splitting the second laser beam B2 into a second sub-laser beam B21 traveling along the first optical path and a second sub-laser beam B22 traveling along the second optical path;

guiding a first sub laser beam B11 and a second sub laser beam B21 on the first optical path to be transmitted to a first preset cutting path C of the surface of the device A to be cut through a first optical path guiding module;

guiding the first sub laser beam B12 and the second sub laser beam B22 on the second optical path to a second preset cutting path C of the surface of the device A to be cut through a second optical path guiding module;

the first sub laser beam B11 propagating along the first optical path and the second sub laser beam B21 propagating along the first optical path have a predetermined included angle or a predetermined distance therebetween, so that the first spot S1 formed by the first sub laser beam at the first predetermined cutting path C is located in front of the second spot S2 formed by the second sub laser beam by a predetermined distance L. The first sub laser beam B12 propagating along the second optical path and the second sub laser beam B22 propagating along the second optical path have a predetermined angle or a predetermined distance therebetween, such that the first spot S1 formed by the first sub laser beam at the second predetermined cutting path C is located in front of the second spot S2 formed by the second sub laser beam by a predetermined distance L.

In other embodiments of the present invention, as shown in fig. 8 and 9, splitting the first laser beam into a plurality of first sub-laser beams having different optical paths, and splitting the second laser beam into a plurality of second sub-laser beams having different optical paths includes:

the second laser beam B2 is split into a second sub-laser beam B23 traveling along the first optical path and a second sub-laser beam B24 traveling along the second optical path by the first light splitting device 241;

guiding a second sub laser beam B23 on the first optical path to be transmitted to a first preset cutting path C on the surface of the device A to be cut through a first optical path guiding module;

guiding a second sub laser beam B24 on a second optical path to be transmitted to a second preset cutting path C on the surface of the device A to be cut through a second optical path guiding module;

the first laser beam B1 is split into a first sub-laser beam B13 traveling along the third optical path and a first sub-laser beam B14 traveling along the fourth optical path by the second beam splitter 242;

guiding the first sub laser beam B13 on the third optical path to be transmitted to a first preset cutting path C of the surface of the device A to be cut through a third optical path guiding module, and enabling a first light spot S1 formed by the first sub laser beam B13 to be located at a preset distance L in front of a second light spot S2 formed by a second sub laser beam B23 on the first preset cutting path C;

and guiding the first sub laser beam B14 on the fourth optical path to be transmitted to a second preset cutting path C of the surface of the device A to be cut through the fourth optical path guiding module, and enabling the first light spot S1 formed by the first sub laser beam B14 to be positioned at a preset distance L in front of the second light spot S2 formed by the second sub laser beam B24 at the second preset cutting path C.

In some embodiments of the invention, positioning the first spot in front of the second spot comprises:

when the first sub laser beam and the second sub laser beam move towards the first direction X along the preset cutting path C, the optical path switching module 265 switches the optical path of the first sub laser beam to a fifth optical path G1, so that the first sub laser beam irradiates the surface of the device a to be cut along the fifth optical path G1, the first light spot S1 is located on the first side of the second light spot S2, and the first light spot S1 is located in front of the second light spot S2 in the first direction X.

When the first sub laser beam and the second sub laser beam move towards the second direction X 'along the preset cutting path C, the optical path switching module 265 switches the optical path of the first sub laser beam to a sixth optical path G2, so that the first sub laser beam irradiates the surface of the device a to be cut along the sixth optical path G2, the first light spot S1 is located at the second side of the second light spot S2, and the first light spot S1 is located in front of the second light spot S2 in the second direction X';

wherein the second direction X' is opposite to the first direction X, and the first side and the second side are respectively located at two opposite sides of the second light spot S2 along the preset cutting path C.

In the embodiment of the invention, the second device A 'to be cut can be cut only by switching the light paths on the right sides of the first device A to be cut and the second device A' to be cut, and the cutting groove is always positioned in front of the cutting line during cutting without moving the first laser and the second laser to the left side of the second device A 'to be cut and then cutting the second device A' to be cut to ensure that the cutting groove is positioned in front of the cutting line, so that the time is saved and the productivity is improved.

Based on this, in some embodiments of the present invention, after or while switching the optical path of the first sub laser beam to the fifth optical path, the method further includes:

moving a device to be cut to the processing range of the first light spot;

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A laser processing apparatus, comprising:

a first laser for emitting a first laser beam;

a second laser for emitting a second laser beam;

2. The apparatus of claim 1, wherein the laser adjustment module comprises at least one beam splitter, at least two optical path directing modules, and at least two focusing devices;

3. The apparatus according to claim 2, wherein the focusing devices located in the optical paths of the second laser beams or respectively located in the optical paths of the second sub-laser beams are shaping focusing devices for shaping and focusing the spots of the second sub-laser beams.

4. The apparatus of claim 1, wherein the laser adjustment module comprises at least a first beam splitter, a first optical path guiding module, and a second optical path guiding module;

5. The apparatus of claim 4, wherein the first optical path directing module and the second optical path directing module each comprise at least one reflective device;

6. The apparatus according to claim 1, wherein the laser adjusting module comprises at least a first beam splitter, a second beam splitter, a first and/or second optical path guiding module, a third and/or fourth optical path guiding module;

7. The apparatus of claim 6, wherein the first optical path directing module and/or the second optical path directing module comprises at least one reflective device, and the third optical path directing module and/or the fourth optical path directing module comprises at least one reflective device;

the laser adjusting module further comprises a third focusing device positioned on the third optical path, a fourth focusing device positioned on the fourth optical path, and a beam shaping focusing device positioned between the second laser and the first light splitting device;

or, the laser adjustment module further includes a third focusing device located on the third optical path, a fourth focusing device located on the fourth optical path, a first shaping focusing device located on the first optical path, and a second shaping focusing device located on the second optical path.

8. The apparatus of claim 1, further comprising a plurality of optical path switching modules, wherein any of the optical path switching modules is located on an optical path of one of the first sub-laser beams;

9. A laser processing apparatus comprising the laser processing device according to any one of claims 1 to 8;

10. The apparatus according to claim 9, characterized in that said laser machining apparatus comprises at least a first station, a second station, a third station and a second movement module;

the third station is used for blanking a device to be cut;

or the first station is used for feeding and discharging a device to be cut;

the second station is used for visual positioning of a device to be cut;

11. The apparatus according to claim 9, wherein the laser machining apparatus comprises at least a first station, a second station, a third station, a fourth station, and a second motion module;

or the first station is used for feeding a device to be cut;

the second station is used for visual positioning of a device to be cut;

the fourth station is used for blanking a device to be cut;

12. A laser processing method, comprising:

13. The laser processing method according to claim 12, wherein splitting the first laser beam into a plurality of first sub-laser beams different in optical path, and splitting the second laser beam into a plurality of second sub-laser beams different in optical path comprises:

14. The laser processing method according to claim 13, wherein splitting the first laser beam into a plurality of first sub-laser beams different in optical path, and splitting the second laser beam into a plurality of second sub-laser beams different in optical path further comprises:

15. The laser machining method of claim 12, wherein positioning the first spot in front of the second spot comprises:

16. The laser processing method according to claim 15, wherein after or while switching the optical path of the first sub laser beam to a fifth optical path, further comprising:

moving a device to be cut to the processing range of the first light spot;