CN214392849U

CN214392849U - Laser processing device and processing equipment

Info

Publication number: CN214392849U
Application number: CN202023141579.3U
Authority: CN
Inventors: 梁乔春; 李志刚; 朱凡; 朱胜鹏
Original assignee: Wuhan DR Llaser Technology Corp Ltd
Current assignee: Wuhan DR Llaser Technology Corp Ltd
Priority date: 2020-12-23
Filing date: 2020-12-23
Publication date: 2021-10-15
Anticipated expiration: 2030-12-23

Abstract

The utility model provides a laser processing device and processing equipment, include: the laser adjusting module is used for dividing the first laser beam into a plurality of first sub laser beams and dividing the second laser beam into a plurality of second sub laser beams, the plurality of first sub laser beams form a plurality of first light spots, the plurality of second sub laser beams form a plurality of second light spots, and any first light spot is positioned at a preset distance in front of one second light spot; the first motion module is used for driving the first laser, the second laser and the laser adjusting module to move, or driving the to-be-cut device to move, so that when the plurality of first sub laser beams move along the plurality of preset cutting paths respectively, the plurality of second sub laser beams also move along the plurality of preset cutting paths respectively, and any one of the first sub laser beams and any one of the second sub laser beams sequentially form a cutting groove and a cutting line on one preset cutting path, so that the cutting time is saved, the cutting production process is shortened, and the cutting productivity is improved.

Description

Laser processing device and processing equipment

Technical Field

The utility model relates to a laser beam machining technical field, more specifically say, relate to a laser beam machining device and processing equipment.

Background

With the development of the laser nondestructive cutting technology, the laser nondestructive cutting technology is also applied to the technical field of solar cells. The solar cell slice cutting method comprises the steps of scanning a solar cell slice along a path to be cut by laser to form one or more cutting grooves, scanning another laser along the path to be cut to form thermal stress, and enabling the solar cell slice to crack along the path to be cut to realize the cutting of the solar cell slice. However, the cutting productivity of the conventional solar cell is to be further improved.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a laser beam machining device and processing equipment to improve the productivity of laser cutting.

In order to achieve the above object, the utility model provides a following technical scheme:

a laser processing apparatus comprising:

a first laser for emitting a first laser beam;

a second laser for emitting a second laser beam;

the laser adjusting module is used for dividing the first laser beam into a plurality of first sub laser beams with different optical paths, dividing the second laser beam into a plurality of second sub laser beams with different optical paths, forming a plurality of first light spots on the surface of a device to be cut by the plurality of first sub laser beams, forming a plurality of second light spots on the surface of the device to be cut by the plurality of second sub laser beams, and enabling any one of the first light spots to be located at a preset distance in front of the second light spot;

the first motion module is used for driving the first laser, the second laser and the laser adjusting module to move, or driving the to-be-cut device to move, so that the plurality of first sub laser beams respectively move along a plurality of preset cutting paths of the to-be-cut device, the plurality of second sub laser beams also respectively move along the plurality of preset cutting paths, any one of the first sub laser beams and one of the second sub laser beams sequentially form a cutting groove and a cutting line on the preset cutting path, and the to-be-cut device is cut along the plurality of cutting lines.

Optionally, the laser adjustment module includes at least one beam splitter, at least two optical path guiding modules, and at least two focusing devices;

the at least one light splitting device is used for splitting the first laser beam into a plurality of first sub laser beams with different optical paths and splitting the second laser beam into a plurality of second sub laser beams with different optical paths;

the optical path guiding module is used for guiding the first sub laser beam and/or the second sub laser beam to be transmitted to a preset cutting path of the surface of the device to be cut; the at least two optical path guiding modules are used for guiding the plurality of first sub laser beams and the plurality of second sub laser beams to be transmitted to a plurality of preset cutting paths on the surface of the device to be cut;

the at least two focusing devices are respectively located on optical paths of the first laser beam and the second laser beam, or the at least two focusing devices are respectively located on optical paths of the plurality of first sub-laser beams and the plurality of second sub-laser beams and are used for focusing the plurality of first sub-laser beams and the plurality of second sub-laser beams.

Optionally, the focusing devices located on the optical paths of the second laser beams or respectively located on the optical paths of the second sub laser beams are shaping focusing devices for shaping and focusing the spots of the second sub laser beams.

Optionally, the laser adjustment module at least includes a first light splitter, a first optical path guiding module, and a second optical path guiding module;

the first light splitting device is used for splitting the first laser beam into a first sub laser beam transmitted along a first optical path and a first sub laser beam transmitted along a second optical path, and splitting the second laser beam into a second sub laser beam transmitted along the first optical path and a second sub laser beam transmitted along the second optical path;

the first light path guiding module is used for guiding the first sub laser beam and the second sub laser beam on the first light path to be transmitted to a first preset cutting path on the surface of the device to be cut; the second light path guiding module is used for guiding the first sub laser beam and the second sub laser beam on the second light path to be transmitted to a second preset cutting path on the surface of the device to be cut;

a preset included angle or a preset distance is formed between the first sub laser beam transmitted along the first light path and the second sub laser beam transmitted along the first light path, so that a first light spot formed by the first sub laser beam at the first preset cutting path is located at a preset distance in front of a second light spot formed by the second sub laser beam;

and a preset included angle or a preset distance is formed between the first sub laser beam transmitted along the second light path and the second sub laser beam transmitted along the second light path, so that a first light spot formed by the first sub laser beam at the second preset cutting path is positioned at a preset distance in front of a second light spot formed by the second sub laser beam.

Optionally, the first optical path guiding module and the second optical path guiding module each include at least one reflecting device;

the laser adjusting module further comprises a first focusing device positioned on the first optical path, a second focusing device positioned on the second optical path and a shaping focusing device positioned between the second laser and the first light splitting device;

or, the laser adjusting module further comprises a first focusing device located between the first laser and the first light splitting device, and a shaping focusing device located between the second laser and the first light splitting device.

Optionally, the laser adjustment module at least includes a first optical splitter, a second optical splitter, a first optical path guiding module and/or a second optical path guiding module, a third optical path guiding module and/or a fourth optical path guiding module;

the first light splitting device is used for splitting the second laser beam into a second sub laser beam transmitted along the first optical path and a second sub laser beam transmitted along the second optical path;

the first light path guiding module is used for guiding the second sub laser beam on the first light path to be transmitted to a first preset cutting path on the surface of the device to be cut; the second light path guiding module is used for guiding the second sub laser beam on the second light path to be transmitted to a second preset cutting path on the surface of the device to be cut;

the second light splitting device is used for splitting the first laser beam into a first sub laser beam transmitted along the third optical path and a first sub laser beam transmitted along the fourth optical path;

the third light path guiding module is used for guiding the first sub laser beam on the third light path to be transmitted to a first preset cutting path on the surface of the device to be cut, and enabling a first light spot formed by the first sub laser beam to be located at a preset distance in front of a second light spot formed by a second sub laser beam on the first preset cutting path; the fourth light path guiding module is used for guiding the first sub laser beam on the fourth light path to be transmitted to a second preset cutting path on the surface of the device to be cut, and enabling a first light spot formed by the first sub laser beam to be located at a preset distance in front of a second light spot formed by a second sub laser beam on the second preset cutting path.

Optionally, the first optical path guiding module and/or the second optical path guiding module includes at least one reflective device, and the third optical path guiding module and/or the fourth optical path guiding module includes at least one reflective device;

the laser adjusting module further comprises a third focusing device positioned on the third optical path, a fourth focusing device positioned on the fourth optical path, and a beam focusing and shaping device positioned between the second laser and the first light splitting device;

or, the laser adjusting module further includes a third focusing device located on the third optical path, a fourth focusing device located on the fourth optical path, a first focusing shaping device located on the first optical path, and a second focusing shaping device located on the second optical path.

Optionally, the optical path switching module further includes a plurality of optical path switching modules, and any of the optical path switching modules is located on an optical path of one of the first sub laser beams;

the optical path switching module is used for switching the optical path of the first sub laser beam into a fifth optical path or a sixth optical path;

if the preset cutting paths of the first sub laser beam and the second sub laser beam move towards a first direction, the optical path switching module switches the optical path of the first sub laser beam to a fifth optical path, so that the first light spot is located on a first side of the second light spot, and the first light spot is located in front of the second light spot in the first direction;

if the first sub laser beam and the second sub laser beam move towards a second direction along a preset cutting path, the optical path switching module switches the optical path of the first sub laser beam to a sixth optical path, so that the first light spot is located on a second side of the second light spot, the first light spot is located in front of the second light spot in the second direction, and the second direction is opposite to the first direction.

A laser processing apparatus comprising a laser processing device as claimed in any one of the above;

and a first laser and a second laser in the laser processing device perform laser processing on the workpiece to be cut at the same station.

Optionally, the laser processing equipment at least comprises a first station, a second station, a third station and a second motion module;

the first station is used for feeding and visually positioning a device to be cut;

the second station is used for enabling a first laser and a second laser in the laser processing device to carry out laser processing on a workpiece to be cut;

the third station is used for blanking a device to be cut;

or the first station is used for feeding and discharging a device to be cut;

the second station is used for visual positioning of a device to be cut;

the third station is used for enabling a first laser and a second laser in the laser processing device to carry out laser processing on a workpiece to be cut;

the second movement module is used for driving the processing table bearing the to-be-cut device to move to the first station, the second station and the third station in sequence.

Optionally, the laser processing equipment at least comprises a first station, a second station, a third station, a fourth station and a second motion module;

the first station and the third station are used for feeding, visual positioning and blanking of a device to be cut;

the second station and the fourth station are used for enabling a first laser module and a second laser module in the laser processing device to carry out laser processing on a device to be cut;

or the first station is used for feeding a device to be cut;

the second station is used for visual positioning of a device to be cut;

the third station is used for enabling a first laser module and a second laser module in the laser processing device to carry out laser processing on a device to be cut;

the fourth station is used for blanking a device to be cut;

the second movement module is used for driving a processing table bearing a device to be cut to move to the first station, the second station, the third station and the fourth station in sequence.

Compared with the prior art, the utility model provides a technical scheme has following advantage:

the laser processing device and the processing equipment provided by the utility model have the advantages that any first light spot is positioned at the preset distance in front of the second light spot, so that the first sub laser beam and the second sub laser beam can simultaneously move along the preset cutting path, and the cutting groove and the cutting line are sequentially formed on the preset cutting path, thereby saving the cutting time, shortening the cutting production process and improving the cutting productivity;

secondly, because the laser adjustment module divides the first laser beam into a plurality of first sub laser beams with different optical paths, and divides the second laser beam into a plurality of second sub laser beams with different optical paths, and the first motion module drives the first laser, the second laser and the laser adjustment module to move, or drives the device to be cut to move, therefore, when the plurality of first sub laser beams respectively move along a plurality of preset cutting paths of the device to be cut, the plurality of second sub laser beams also respectively move along a plurality of preset cutting paths, that is, the utility model discloses can form a plurality of cutting lines on the device to be cut simultaneously, thereby save cutting time, shorten cutting production process, and improve cutting productivity;

and thirdly, the first light spot is positioned at the preset distance in front of the second light spot, namely the positions of the first light spot and the second light spot are fixed and unchanged, so that the positions of the first laser, the second laser and the laser adjusting module are fixed and unchanged, and the first laser, the second laser and the laser adjusting module can be arranged at the same station, so that the station is saved, and the productivity is improved.

Thirdly, because the positions of the first light spot and the second light spot are fixed and unchangeable, namely the first light spot and the second light spot are aligned when the positions are fixed, the second light spot and the cutting groove do not need to be aligned after the cutting groove is formed, and therefore the problems that the cutting line deviates from a preset cutting path and the sizes of the cut pieces are different due to poor alignment of the cutting groove and the laser light spots forming the cutting line in the prior art are solved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a cutting groove formed on a solar cell in the prior art;

fig. 2 is a schematic structural view of a scribe line and a scribe line formed on a solar cell in the prior art;

fig. 3 is a schematic structural diagram of a laser processing apparatus according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of forming a cutting groove Q1 and a cutting line Q2 on a device to be cut according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of forming cutting grooves Q1, Q3 and a cutting line Q2 on a device to be cut according to an embodiment of the present invention;

fig. 6 is a schematic diagram of the first sub laser beam and the second sub laser beam being shifted on the Z-axis according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a laser processing apparatus according to another embodiment of the present invention;

fig. 8 is a schematic structural diagram of a laser processing apparatus according to another embodiment of the present invention;

fig. 9 is a schematic structural diagram of a laser processing apparatus according to another embodiment of the present invention;

fig. 10 is a schematic structural diagram of a laser processing apparatus according to another embodiment of the present invention;

fig. 11 is a schematic diagram of the first sub laser beam and the second sub laser beam being shifted on the Z-axis according to another embodiment of the present invention;

fig. 12 is a schematic structural diagram of an optical path switching apparatus according to an embodiment of the present invention;

fig. 13 is a schematic structural diagram of forming a cutting groove Q4 and a cutting line Q5 on a device to be cut according to an embodiment of the present invention;

fig. 14 is a schematic structural diagram of forming cutting grooves Q4, Q6 and a cutting line Q5 on a device to be cut according to an embodiment of the present invention;

fig. 15 is a schematic view of a plurality of stations in a laser processing apparatus according to an embodiment of the present invention;

fig. 16 and 17 are schematic diagrams illustrating a plurality of stations in a laser processing apparatus according to another embodiment of the present invention;

fig. 18 is a schematic view illustrating an arrangement of a plurality of stations in a laser processing apparatus according to another embodiment of the present invention;

fig. 19 is a schematic view of a setting mode of a plurality of stations in a laser processing apparatus according to another embodiment of the present invention.

Detailed Description

As background art, the cutting productivity of the existing solar cell is to be further improved. The utility model discloses people research discovery, as shown in fig. 1, all adopt first laser at solar wafer 10 among the prior art to cut the head and the tail formation of route and cut groove 11 at first station, then as shown in fig. 2, adopt second laser (thermal stress laser) to form cutting line 12 along waiting to cut the route scanning again at the second station, make solar wafer 10 split (second laser is along waiting to cut the route scanning and providing heat gradient promptly, it produces the crazing line and extends and makes and waits to cut the device along waiting to cut the route and cut line 12 and split to wait along cutting groove 11 to cut the device), and the reason that causes the lower problem of productivity is mainly that, the solar wafer 10 is cut in turn respectively at two stations of first laser and second laser, make the cutting process longer.

When the solar cell 10 is to be cut into a plurality of pieces, all the cutting grooves 11 are sequentially processed as described above in the first station, and all the cutting lines 12 are sequentially processed as described above in the second station, which also results in a long cutting process.

Based on this, the utility model provides a laser beam machining device and processing equipment to overcome the above-mentioned problem that prior art exists, the laser beam machining device includes:

a first laser for emitting a first laser beam;

a second laser for emitting a second laser beam;

the laser adjusting module is used for dividing the first laser beam into a plurality of first sub laser beams with different optical paths, dividing the second laser beam into a plurality of second sub laser beams with different optical paths, forming a plurality of first light spots on the surface of a device to be cut by the plurality of first sub laser beams, forming a plurality of second light spots on the surface of the device to be cut by the plurality of second sub laser beams, and enabling any one first light spot to be positioned at a preset distance in front of one second light spot;

the first motion module is used for driving the first laser, the second laser and the laser adjusting module to move, or driving the to-be-cut device to move, so that when the plurality of first sub laser beams move along a plurality of preset cutting paths of the to-be-cut device respectively, the plurality of second sub laser beams also move along the plurality of preset cutting paths respectively, any one of the first sub laser beams and any one of the second sub laser beams sequentially form a cutting groove and a cutting line on one preset cutting path, and the to-be-cut device is cut along the plurality of cutting lines.

Any first light spot is positioned at a preset distance in front of a second light spot, so that the first sub laser beam and the second sub laser beam can simultaneously move along a preset cutting path to sequentially form a cutting groove and a cutting line on the preset cutting path (the first sub laser beam is used for forming the cutting groove, the second sub laser beam is positioned behind the first laser beam and moves along the preset cutting line path to provide a thermal gradient, so that the object to be cut generates cracks along the induction groove and extends to crack the object to be cut along the cutting line path), thereby saving the cutting time, shortening the cutting production process and improving the cutting productivity;

Above is the core thought of the utility model, for making the above-mentioned purpose, characteristic and advantage of the utility model can be more obvious understandable, will combine below in the embodiment of the utility model the drawing, to technical scheme in the embodiment of the utility model is clear, completely describe, obviously, the embodiment that describes is only a partial embodiment of the utility model, rather than whole embodiment. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

An embodiment of the present invention provides a laser processing apparatus, as shown in fig. 3, including a first laser 21, a second laser 22, a laser adjustment module 23 and a first movement module (not shown in the figure).

Wherein the first laser 21 is arranged to emit a first laser beam B1.

The second laser 22 is used to emit a second laser beam B2.

The laser adjusting module 23 is configured to divide the first laser beam B1 into a plurality of first sub-laser beams, such as B11 and B12, with different optical paths, and divide the second laser beam B2 into a plurality of second sub-laser beams, such as B21 and B22, with different optical paths, as shown in fig. 3 and 4, the plurality of first sub-laser beams, such as B11 and B12, form a plurality of first light spots S1 on the surface of the device a to be cut, the plurality of second sub-laser beams, such as B21 and B22, form a plurality of second light spots S2 on the surface of the device a to be cut, and any one of the first light spots S1 is located at a preset distance in front of one of the second light spots S2.

The first motion module is configured to drive the first laser 21, the second laser 22, and the laser adjustment module 23 to move, or drive the device a to be cut to move, so that while the first sub-laser beams, such as B11 and B12, respectively move along the preset cutting paths C of the device a to be cut, the second sub-laser beams, such as B21 and B22, respectively move along the preset cutting paths C, and any one of the first sub-laser beams, such as B11, and the second sub-laser beam, such as B21, sequentially forms a cutting groove Q1 and a cutting line Q2 on a preset cutting path C, and the device a to be cut is cut along the cutting lines Q2.

It is noted that the component a to be cut is placed on a processing table which is arranged to be movable to and from the processing station. When the processing table bearing the device A to be cut moves to a processing station, the laser processing device is positioned above the device A to be cut and used for carrying out nondestructive cutting on the device A to be cut. The device A to be cut comprises a solar cell and the like.

After the machining table bearing the device a to be cut moves to the machining station, the first motion module drives the first laser 21, the second laser 22 and the laser adjustment module 23 to move simultaneously, or drives the device a to be cut to move, as shown in fig. 4, so that while the plurality of first sub laser beams move along the plurality of preset cutting paths C respectively, the plurality of second sub laser beams also move along the plurality of preset cutting paths C respectively, that is, while the plurality of first light spots S1 move along the plurality of preset cutting paths C respectively, the plurality of second light spots S2 also move along the plurality of preset cutting paths C respectively, and any one of the first light spots S1 is located in front of one of the second light spots S2 by a preset distance L, so that the plurality of first sub laser beams and the plurality of second sub laser beams form a cutting groove Q1 and a cutting line Q2 on the preset cutting paths C.

Since any one of the first light spots S1 is located at the preset distance L in front of the second light spot S2, as shown in fig. 4, when the first light spots S1 and the second light spots S2 move on the preset cutting paths C from left to right in the direction indicated by the arrow X, the first sub laser beams may be irradiated onto the device a to be cut, the cutting grooves Q1 may be formed on the preset cutting paths C on the left side of the device a to be cut, and after the first sub laser beams move to the right by the preset distance L, the second sub laser beams may be irradiated onto the device a to be cut, and the cutting lines Q2 may be formed on the device a to be cut along the preset cutting paths C.

Then, the plurality of first light spots S1 and the plurality of second light spots S2 continuously move to the right, as shown in fig. 5, the plurality of first sub laser beams form a plurality of cutting grooves Q3 on the plurality of preset cutting paths C on the right side of the device a to be cut and leave the device a to be cut, and the plurality of second sub laser beams leave the device a to be cut after forming a plurality of complete cutting lines Q2 on the plurality of preset cutting paths C.

Because any first light spot S1 is positioned at the preset distance L in front of a second light spot S2, any first sub-laser beam and any second sub-laser beam can simultaneously move along a preset cutting path C, and a cutting groove and a cutting line are sequentially formed on the preset cutting path C, so that the cutting time is saved, the cutting production process is shortened, and the cutting productivity is improved;

moreover, since the laser adjustment module 23 divides the first laser beam B1 into a plurality of first sub laser beams such as B11 and B12 having different optical paths, and divides the second laser beam B2 into a plurality of second sub laser beams such as B21 and B22 having different optical paths, and the first motion module drives the first laser 21, the second laser 22 and the laser adjustment module 23 to move, or drives the device a to be cut to move, while the plurality of first sub laser beams such as B11 and B12 respectively move along the plurality of preset cutting paths C of the device a to be cut, the plurality of second sub laser beams such as B21 and B22 also respectively move along the plurality of preset cutting paths C, that is, the utility model discloses a plurality of cutting lines can be formed on the device a to be cut at the same time, thereby saving the cutting time, shortening the cutting process and improving the cutting productivity;

secondly, because the first light spot S1 is located at the preset distance L in front of the second light spot S2, that is, the positions of the first light spot S1 and the second light spot S2 are fixed and unchanged, the positions of the first laser 21, the second laser 22 and the laser adjustment module 23 are fixed and unchanged, and therefore, the first laser 21, the second laser 22 and the laser adjustment module 23 can be arranged at the same station, so that the station is saved, and the productivity is improved.

Thirdly, since the positions of the first light spot S1 and the second light spot S2 are fixed and unchanged, that is, the first light spot S1 and the second light spot S2 are already aligned when the positions are fixed, after the cutting groove is formed, the second light spot S2 does not need to be aligned with the cutting groove, so that the problems that the cutting line deviates from the preset cutting path and the size of the cut piece is different due to poor alignment of the cutting groove and the laser light spot forming the cutting line in the prior art are solved.

The present invention provides an optical module for adjusting laser beam 23, which comprises at least one beam splitter, at least two optical path guiding modules and at least two focusing devices.

Wherein, at least one beam splitting device is used for splitting the first laser beam B1 into a plurality of first sub laser beams with different optical paths and splitting the second laser beam B2 into a plurality of second sub laser beams with different optical paths;

the optical path guiding module is used for guiding one first sub laser beam and/or one second sub laser beam to be transmitted to a preset cutting path C on the surface of the device A to be cut; the at least two optical path guiding modules are used for guiding the plurality of first sub laser beams and the plurality of second sub laser beams to be transmitted to a plurality of preset cutting paths C on the surface of the device A to be cut;

On this basis, in some embodiments of the present invention, the focusing device located on the optical path of the second laser beam, or the focusing devices respectively located on the optical paths of the plurality of second sub-laser beams, is a shaping focusing device, for example, it is a cylindrical mirror or a cylindrical mirror group, and is used for shaping and focusing the light spots of the plurality of second sub-laser beams.

Alternatively, the spectroscopic device includes a spectroscope or the like. The optical path guiding module comprises at least one reflecting device, and the reflecting device comprises a reflecting mirror and the like. The focusing device comprises a focusing lens or a shaping focusing device consisting of the cylindrical lens or the cylindrical lens group. Optionally, a shaping and focusing device located on the optical path of the second laser beam or on the optical paths of the plurality of second sub-laser beams is used for shaping the spots of the second sub-laser beams into strip-shaped spots or line spots.

In some embodiments, the laser adjustment module 23 includes a first beam splitter 230, a first optical path guiding module and a second optical path guiding module. As shown in fig. 3 or fig. 7, the first light splitting device 230 is configured to split the first laser beam B1 into a first sub-laser beam B11 traveling along a first optical path and a first sub-laser beam B12 traveling along a second optical path, and split the second laser beam B2 into a second sub-laser beam B21 traveling along the first optical path and a second sub-laser beam B22 traveling along the second optical path.

The first optical path guiding module is used for guiding the first sub laser beam B11 and the second sub laser beam B21 on the first optical path to be transmitted to the first preset cutting path C of the surface of the device A to be cut. The second optical path guiding module is used for guiding the first sub laser beam B12 and the second sub laser beam B22 on the second optical path to be transmitted to a second preset cutting path C of the surface of the device A to be cut.

Also, as shown in fig. 6, a preset included angle or a preset distance is formed between the first sub laser beam B11 propagating along the first optical path and the second sub laser beam B21 propagating along the first optical path in the Z-axis direction, so that the first spot S1 formed by the first sub laser beam at the first preset cutting path C is located in front of the second spot S2 formed by the second sub laser beam by a preset distance L. The first sub laser beam B12 propagating along the second optical path and the second sub laser beam B22 propagating along the second optical path have a predetermined angle or a predetermined distance therebetween, such that the first spot S1 formed by the first sub laser beam at the second predetermined cutting path C is located in front of the second spot S2 formed by the second sub laser beam by a predetermined distance L.

On the basis of the above embodiments, in some embodiments of the present invention, the first optical path guiding module and the second optical path guiding module each include at least one reflecting device. Alternatively, as shown in fig. 3 and 7, the first optical path directing module includes a reflecting device 231, and the second optical path directing modules each include reflecting

devices

232 and 233.

In addition, in some embodiments of the present invention, as shown in fig. 3, the laser adjustment module 23 further includes a first focusing device 234 located on the first optical path, a second focusing device 235 located on the second optical path, and a shaping focusing device 236 located between the second laser 22 and the first light splitting device 230. In this embodiment, the first focusing device 234 is disposed on the optical paths of the first sub laser beam B11 and the second sub laser beam B21; the second focusing device is disposed on the optical paths of the first sub laser beam B2 and the second sub laser beam B22. Of course, the present invention is not limited thereto, and in other embodiments, as shown in fig. 7, the laser adjustment module 23 further includes a first focusing device 238 located between the first laser 21 and the first beam splitter 230, and a shaping focusing device 239 located between the second laser 22 and the first beam splitter 230.

In other embodiments of the present invention, as shown in fig. 8 and 9, the laser adjustment module 23 includes a first light splitter 241, a second light splitter 242, a first light path guiding module and/or a second light path guiding module, a third light path guiding module and/or a fourth light path guiding module.

Wherein the first light splitting device 241 is used for splitting the second laser beam B2 into a second sub-laser beam B23 traveling along the first optical path and a second sub-laser beam B24 traveling along the second optical path. The first light path guiding module is used for guiding the second sub laser beam B23 on the first light path to be transmitted to a first preset cutting path C on the surface of the device A to be cut; the second optical path guiding module is used for guiding the second sub laser beam B24 on the second optical path to be transmitted to the second preset cutting path C on the surface of the device a to be cut.

The second light splitting device 242 serves to split the first laser beam B1 into a first sub-laser beam B13 traveling along the third optical path and a first sub-laser beam B14 traveling along the fourth optical path. The third optical path guiding module is used for guiding the first sub laser beam B13 on the third optical path to be transmitted to the first preset cutting path C on the surface of the device a to be cut, and enabling the first light spot S1 formed by the first sub laser beam B13 to be located at the preset distance L in front of the second light spot S2 formed by the second sub laser beam B23 at the first preset cutting path C. The fourth optical path guiding module is configured to guide the first sub laser beam B14 on the fourth optical path to be transmitted to a second preset cutting path C on the surface of the device a to be cut, and to position a first light spot S1 formed by the first sub laser beam B14 at a preset distance L in front of a second light spot S2 formed by the second sub laser beam B24 on the second preset cutting path C.

On the basis of the above-mentioned embodiment, in some embodiments of the utility model, first light path guide module and/or second light path guide module include at least one reflection device, and third light path guide module and/or fourth light path guide module all include at least one reflection device.

Alternatively, as shown in fig. 8, the first optical path guiding module includes a reflecting device 243, the second optical path guiding module includes reflecting

devices

244 and 245, and the third optical path guiding module includes a reflecting device 246. Alternatively, as shown in fig. 9, the first optical path directing module includes a reflecting device 243, and the third optical path directing module includes a reflecting device 246.

In some embodiments of the present invention, as shown in fig. 8, the laser adjustment module 23 further includes a third focusing device 247 located on the third optical path, a fourth focusing device 248 located on the fourth optical path, and a shaping focusing device 249 located between the second laser 22 and the first light splitting device 241. In this embodiment, the third focusing device 247 is disposed on the optical path of the first sub laser beam B13, and the fourth focusing device is disposed on the optical path of the first sub laser beam B14.

Of course, the present invention is not limited thereto, and in another embodiment, as shown in fig. 9, the laser adjustment module 23 further includes a third focusing device 247 located on the third optical path, a fourth focusing device 248 located on the fourth optical path, a first shaping focusing device 251 located on the first optical path, and a second shaping focusing device 252 located on the second optical path. In this embodiment, the third focusing device 247 is disposed on the optical path of the first sub laser beam B13, and the fourth focusing device 248 is disposed on the optical path of the first sub laser beam B14.

In other embodiments of the present invention, the laser adjustment module 23 further includes at least one third light splitting device and/or at least one fourth light splitting device; the third light splitting device is positioned on the optical path of any one of the second sub laser beams and is used for splitting the second sub laser beams; the fourth light splitting device is located on the optical path of any one of the first sub laser beams and is used for splitting the first sub laser beams.

As shown in fig. 10, the laser adjustment module 23 further includes a third light splitting device 254 and a fourth light splitting device 257, the third light splitting device 254 is located on the optical path of the second sub laser beam B24 and is used for splitting the second sub laser beam B24 to form the second sub laser beams B25 and B26, and the fourth light splitting device 257 is located on the optical path of the first sub laser beam B14 and is used for splitting the first sub laser beam B14 to form the first sub laser beams B15 and B16.

On this basis, laser adjustment module 23 still includes two at least light path guide module, and a light path guide module includes reflecting device 255, and another light path guide module includes reflecting device 258. The laser adjustment module 23 further includes a plurality of focusing devices such as 262, 263 and 264, and a plurality of shaping focusing

devices

259, 260 and 261, wherein the plurality of focusing devices such as 262, 263 and 264 are used for focusing the plurality of first sub laser beams, and the plurality of shaping focusing

devices

259, 260 and 261 are used for shaping and focusing the second sub laser beams.

In any of the above embodiments, the first laser 21 further has a reflecting device 237 on the optical path, and the reflecting device 237 is used to change the direction of the first laser beam B1. Of course, in other embodiments, the optical path of the first laser 21 may not have the reflection device 237, and will not be described herein.

Of course, the embodiment of the present invention is not limited to this, and in practical applications, other reflection devices or beam expanders can be set according to actual conditions to optimize or adjust the optical path, so as to adjust the positions of the first light spots S1 and the second light spots S2.

It should be noted that, in the structures shown in fig. 8 to 10, taking the structure shown in fig. 8 as an example, as shown in fig. 11, the optical paths of any one of the first sub-laser beam and the second sub-laser beam have a predetermined distance on the Z-axis, so that the first spot S1 and the second spot S2 have a predetermined distance L therebetween.

In some embodiments of the present invention, the predetermined distance L between the first light spot S1 and the second light spot S2 is less than or equal to 200 mm. The preset distance L is a distance between edges of the first and second light spots S1 and S2. Optionally, the preset distance L is less than or equal to 30mm, and more preferably, the preset distance L is less than or equal to 5mm, so as to achieve a better process effect on the basis of effectively reducing the distance between the first light spot S1 and the second light spot S2 and reducing the process time.

It should be noted that, in the embodiment of the present invention, the preset distance L between the first light spot S1 and the second light spot S2 is adjustable. In some embodiments, the first motion module is further configured to drive at least some of the components of the laser adjustment module 23 to move or rotate to adjust the distance between the first light spot S1 and the second light spot S2.

In some embodiments of the present invention, as shown in fig. 12, the laser adjusting module 23 further includes a light path switching module 265. Any one of the optical path switching modules 265 is located on the optical path of a first sub-laser beam, and the optical path switching module 265 is configured to switch the optical path of the first sub-laser beam to a fifth optical path G1 or a sixth optical path G2. It should be noted that, in the embodiment of the present invention, the optical path switching module 265 is disposed before the focusing module.

When the first sub laser beam and the second sub laser beam move towards the first direction X along the preset cutting path C, the optical path switching module 265 switches the optical path of the first sub laser beam to a fifth optical path G1, so that the first sub laser beam irradiates the surface of the device a to be cut along the fifth optical path G1, and the first light spot S1 is located on the first side of the second light spot S2, so that the first light spot S1 is located in front of the second light spot S2 in the first direction X.

When the first sub laser beam and the second sub laser beam move towards the second direction X 'along the preset cutting path C, the optical path switching module 265 switches the optical path of the first sub laser beam to a sixth optical path G2, so that the first sub laser beam irradiates the surface of the device a to be cut along the sixth optical path G2, the first light spot S1 is located at the second side of the second light spot S2, and the first light spot S1 is located in front of the second light spot S2 in the second direction X'; wherein the second direction X' is opposite to the first direction X, and the first side and the second side are respectively located at two opposite sides of the second light spot S2 along the preset cutting path C.

In practical application, the optical path switching module 265 firstly switches the optical path of the first sub laser beam to a fifth optical path G1, then the first sub laser beam and the second sub laser beam move towards the first direction X to cut the first device a to be cut, as shown in fig. 4 and 5, so that the first sub laser beam and the second sub laser beam successively form cutting grooves Q1, Q3 and a cutting line Q2 on the first device a to be cut, then the optical path switching module 265 switches the optical path of the first sub laser beam to a sixth optical path G2, and the first sub laser beam and the second sub laser beam move towards the second direction X ', as shown in fig. 13 and 14, so that the first sub laser beam and the second sub laser beam successively form cutting grooves Q4, Q6 and a cutting line Q5 on the second device a' to be cut.

Based on this, the embodiment of the utility model provides an in, only need wait to cut device A and second and wait to cut the right side of device A ' and carry out the switching of light path and can wait to cut device A ' to the second and cut device A ' and cut, and, make the cutting groove be located line the place ahead of cutting all the time during the cutting, and need not remove first sub laser beam and second sub laser beam to the second and wait to cut the left side of device A ', wait to cut device A ' to the second again and cut, guarantee to cut the groove and be located line the place ahead of cutting, thereby the time is saved, the productivity has been improved.

In some embodiments, the laser processing apparatus further comprises a first control module. The first control module is configured to control the optical path switching module 265 to reflect the first sub-laser beam to switch the optical path of the first sub-laser beam to a fifth optical path G1, and control the optical path switching module 265 to transmit the first sub-laser beam or control the optical path switching module 265 to leave the optical path of the first sub-laser beam to switch the optical path of the first sub-laser beam to a sixth optical path G2.

Optionally, the optical path switching module 265 includes a shutter, a scanning galvanometer, or a movable mirror. Alternatively, the optical gate may be an electromechanical optical gate with a total reflection mirror, or an optical gate combining a half-wave plate and a polarization beam splitter, or other optical gates that can achieve the same function. The scanning galvanometer can be a one-dimensional galvanometer with angular deflection.

When the optical path switching module 265 is a movable mirror, the first control module controls the optical path switching module 265 to enter the optical path of the first sub laser beam, that is, the optical path of the first sub laser beam is controlled by the control mirror to enter the optical path of the first sub laser beam, and reflects the first sub laser beam, so as to switch the optical path of the first sub laser beam to the fifth optical path G1, and controls the optical path switching module 265 to leave the optical path of the first sub laser beam, that is, the optical path of the first sub laser beam is switched to the sixth optical path G2 by controlling the optical path switching module 265 to leave the optical path of the first sub laser beam, that is, the control mirror to leave the optical path of the first sub laser beam.

When the optical path switching module 265 is a shutter, the first control module controls the shutter to be opened to reflect the first sub-laser beam to switch the optical path of the first sub-laser beam to the fifth optical path G1, and controls the optical path switching module 265 to be closed to switch the optical path of the first sub-laser beam to the sixth optical path G2.

When the optical path switching module 265 is a scanning galvanometer, the first control module controls the switching of the optical path of the first sub laser beam between the fifth optical path G1 and the sixth optical path G2 by controlling the angle of the scanning galvanometer.

It should be noted that, during the process that the first sub laser beam and the second sub laser beam move along the preset cutting path C, the second sub laser beam always processes the device a to be cut to form the cutting line Q2, and the first sub laser beam processes the device a to be cut only in the area where the cutting groove is to be formed. Of course, in the embodiment of the present invention, only two cutting grooves formed on the left and right sides of the device a to be cut are exemplified, however, the present invention is not limited thereto, and in other embodiments, one or more spaced cutting grooves may be formed on the preset cutting path C.

Based on this, in some embodiments of the present invention, the laser processing apparatus further comprises a second control module. The second control module is used for controlling the first laser 21 to be turned on when a cutting groove is formed, controlling the first laser 21 to be turned off in other periods, controlling the second laser 22 to be turned on when a cutting line is formed, and controlling the second laser 22 to be turned off in other periods.

The embodiment of the utility model provides a laser processing equipment is still provided, including the laser beam machining device that any embodiment provided as above, wherein, first laser instrument 21, second laser instrument 22 and laser adjustment module 23 among the laser beam machining device treat the cutter piece at same station and carry out laser beam machining.

The embodiment of the utility model provides an in laser beam machining equipment still include processing platform and second motion module, the processing platform is used for placing and treats the cutting device. Optionally, the processing table is a negative pressure adsorption processing table surface to better fix the device to be cut. The second motion module is used for driving the processing table to move so as to move the processing table to the processing station, the laser processing device is used for processing the device to be cut, and then the processing table is taken away from the processing station.

The utility model discloses in some embodiments, the processing platform is a plurality of for setting gradually, and when first processing platform processing was accomplished and is left the processing station, the second processing platform was removed and is processed to the processing station, analogizes in proper order, can realize continuous processing like this.

In some embodiments of the present invention, as shown in fig. 15, the second movement module 51 is a rotating electrical machine, and the plurality of processing tables 52 are arranged along the circumferential direction of the rotating electrical machine, and the second movement module 51, i.e., the rotating electrical machine, drives the processing tables 52 to rotate and sequentially passes through the processing stations.

It should be noted that the laser processing equipment not only comprises a processing station, but also comprises a feeding station, a discharging station and a visual positioning station, wherein the visual positioning station is used for carrying out visual positioning on a device to be cut, and for providing visual positioning data for processing, the visual positioning data can be realized by arranging a CCD camera and the like above the station. The feeding station is used for placing a device to be cut on the processing table, and the device to be cut can be fed through a mechanical arm and the like. And the blanking station is used for taking the to-be-cut device which is processed away from the station, and the to-be-cut device can be blanked through a mechanical arm and the like. And the plurality of working tables sequentially pass through the stations and stay at the corresponding stations to finish corresponding actions, so that continuous processing is realized.

The embodiment of the utility model provides an in, merge into one through the processing station with the processing station at first laser instrument place and the processing station at second laser instrument place, can save a station. Compared with the existing four-table-board rotary processing table, the production capacity can be further improved.

The utility model discloses an in some embodiments, material loading station, unloading station and visual positioning station adopt a station, and four stations can realize two simultaneous processing of waiting to cut the device, can promote the productivity greatly. That is, in some embodiments of the present invention, as shown in fig. 15, the laser processing apparatus includes at least two first stations 53, second stations 54, third stations 55, and fourth stations 56; the first station 53 and the third station 55 are used for feeding, visual positioning and blanking of a device to be cut; the second station 54 and the fourth station 56 are used for enabling a first laser module and a second laser module in the laser processing device to carry out laser processing on a device to be cut; the second movement module 51 is configured to drive the processing table carrying the device to be cut to move to the first station 53, the second station 54, the third station 55, and the fourth station 56 in sequence, wherein the second movement module 51 drives the processing table to move along the circumferential direction of the processing table.

The first station 53 carries out feeding and visual positioning, the second station 54 carries out laser processing, the third station 55 carries out blanking and feeding and visual positioning, the fourth station 56 carries out laser processing, the first station 53 carries out blanking, feeding and visual positioning, and then the processes are repeated, so that uninterrupted processing is realized, and the productivity is improved by two times.

As shown in fig. 15, the second moving module 51 drives the processing table to move to the first station 53 for loading and visual positioning, then to move to the second station 54 for laser processing, and then to move to the third station 55 for unloading. The laser processing device moves along the X direction to cut a to-be-cut device on the processing table, then the processing table leaves the second station 54 to the third station 55 to perform blanking, the other processing table moves from the first station 53 to the second station 54, and the light path switching device in the laser processing device switches the light path of the first laser, for example, the first light path is switched to the second light path, the laser processing device moves along the X' direction to cut the to-be-cut device on the other processing table, and the processes are repeated, so that the continuous processing of the laser processing device is realized, and the processing efficiency and the productivity are improved.

Alternatively, when the optical path switching device is not provided, the first moving module may be used to return during the process of moving from the first station 53 to the second station 54, or moving from the third station 55 to the fourth station 56, and during the process, the laser processing device moves in the X direction to cut the device to be cut on the processing table.

The utility model discloses an in other embodiments, a plurality of processing platforms and a plurality of processing station set up along rectilinear direction, and second motion module 52 through linear motion drives the processing platform and removes to make it pass through a plurality of processing stations in proper order. As shown in fig. 16 and 17, the laser processing apparatus includes at least a first station 53, a second station 54, and a third station 55; the first station 53 is used for feeding and visually positioning a device to be cut; the second station 54 is used for enabling a first laser module and a second laser module in the laser processing device to carry out laser processing on a device to be cut; the third station 55 is used for blanking a device to be cut; the second movement module 51 is used for driving the processing table carrying the device to be cut to move to the first station 53, the second station 54 and the third station 55 in sequence.

The second moving module 51 drives the processing table to move to the first station 53 for loading and visual positioning, then to move to the second station 54 for laser processing, and then to move to the third station 55 for unloading. As shown in fig. 16, the laser processing apparatus moves in the X direction to cut the device to be cut on the first processing table, then the first processing table leaves the second station 54 to the third station 55 for blanking, the second processing table moves from the first station 53 to the second station 54, and the optical path switching device in the laser processing apparatus switches the optical path of the first laser, for example, the first optical path is switched to the second optical path, as shown in fig. 17, the laser processing apparatus moves in the X' direction to cut the device to be cut on the second processing table, and the above processes are repeated, thereby realizing continuous processing of the laser processing apparatus, and improving the processing efficiency and productivity.

Optionally, when there is no optical path switching device, the laser processing device may move along the X direction to cut the device to be cut on the processing table when moving from the first station 53 to the second station 54.

Of course, the present invention is not limited thereto, and in other embodiments, as shown in fig. 18, the laser processing apparatus includes at least a first station 53, a second station 54, and a third station 55, wherein the first station 53, the second station 54, and the third station 55 are arranged along a circumferential direction; the first station 53 is used for loading and unloading of a device to be cut; the second station 54 is used for visual positioning of the device to be cut; the third station 55 is used for enabling the first laser module and the second laser module in the laser processing device to carry out laser processing on the device to be cut; the second movement module 51 is used for driving the processing table carrying the device to be cut to move to the first station 53, the second station 53 and the third station 55 in sequence.

The second moving module 51 drives the processing table to move to the first station 53 for loading, then to move to the second station 54 for visual positioning, then to move to the third station 55 for laser processing, and then to move to the first station 53 for unloading. In the third station 55, the laser processing device moves in the X direction to cut the first to-be-cut device on the processing table, then the processing table leaves the third station 55 to the first station 53 to perform blanking, the processing table performs feeding from the first station 53 to move to the second station 54 and the third station 55, and the optical path switching device in the laser processing device switches the optical path of the first laser, and if the first optical path is switched to the second optical path, the laser processing device moves in the X' direction to cut the second to-be-cut device, and the above processes are repeated, so that the continuous processing of the laser processing device is realized, and the processing efficiency and the productivity are improved.

In other embodiments of the present invention, as shown in fig. 19, the laser processing apparatus at least includes a first station 53, a second station 54, a third station 55, a fourth station 56, and a second movement module, wherein the first station 53, the second station 54, the third station 55, and the fourth station 56 are arranged along a straight line; the first station 53 is used for feeding a device to be cut; the second station 54 is used for visual positioning of the device to be cut; the third station 55 is used for enabling the first laser module and the second laser module in the laser processing device to carry out laser processing on the device to be cut; the fourth station 56 is used for blanking the devices to be cut.

The second moving module drives the processing table to move to the first station 53 for loading, then to the second station 54 for visual positioning, then to the third station 55 for laser processing, and then to the fourth station 56 for unloading. In the third station 55, the laser processing device moves along the X direction to cut the first to-be-cut device on the processing table, then the processing table leaves the third station 55 to the fourth station 56 for blanking, the other processing table moves from the second station 54 to the third station 55, and the light path switching device in the laser processing device switches the light path of the first laser, for example, the first light path is switched to the second light path, the laser processing device moves along the X' direction to cut the to-be-cut device on the other processing table, and the above processes are repeated, so that the continuous processing of the laser processing device is realized, and the processing efficiency and the productivity are improved.

It should be noted that the feeding station, the positioning station, the processing station, and the discharging station may be four stations according to the processing requirement, or may be combined, for example, the feeding station and the positioning station in the foregoing embodiment are combined, or the feeding station and the discharging station are combined, and are not described in detail herein.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A laser processing apparatus, comprising:

a first laser for emitting a first laser beam;

a second laser for emitting a second laser beam;

2. The apparatus of claim 1, wherein the laser adjustment module comprises at least one beam splitter, at least two optical path directing modules, and at least two focusing devices;

3. The apparatus according to claim 2, wherein the focusing devices located in the optical paths of the second laser beams or respectively located in the optical paths of the second sub-laser beams are shaping focusing devices for shaping and focusing the spots of the second sub-laser beams.

4. The apparatus of claim 1, wherein the laser adjustment module comprises at least a first beam splitter, a first optical path guiding module, and a second optical path guiding module;

5. The apparatus of claim 4, wherein the first optical path directing module and the second optical path directing module each comprise at least one reflective device;

6. The apparatus according to claim 1, wherein the laser adjusting module comprises at least a first beam splitter, a second beam splitter, a first and/or second optical path guiding module, a third and/or fourth optical path guiding module;

7. The apparatus of claim 6, wherein the first optical path directing module and/or the second optical path directing module comprises at least one reflective device, and the third optical path directing module and/or the fourth optical path directing module comprises at least one reflective device;

the laser adjusting module further comprises a third focusing device positioned on the third optical path, a fourth focusing device positioned on the fourth optical path, and a beam shaping focusing device positioned between the second laser and the first light splitting device;

or, the laser adjustment module further includes a third focusing device located on the third optical path, a fourth focusing device located on the fourth optical path, a first shaping focusing device located on the first optical path, and a second shaping focusing device located on the second optical path.

8. The apparatus of claim 1, further comprising a plurality of optical path switching modules, wherein any of the optical path switching modules is located on an optical path of one of the first sub-laser beams;

9. A laser processing apparatus comprising the laser processing device according to any one of claims 1 to 8;

10. The apparatus according to claim 9, characterized in that said laser machining apparatus comprises at least a first station, a second station, a third station and a second movement module;

the third station is used for blanking a device to be cut;

or the first station is used for feeding and discharging a device to be cut;

the second station is used for visual positioning of a device to be cut;

11. The apparatus according to claim 9, wherein the laser machining apparatus comprises at least a first station, a second station, a third station, a fourth station, and a second motion module;

or the first station is used for feeding a device to be cut;

the second station is used for visual positioning of a device to be cut;

the fourth station is used for blanking a device to be cut;