CN114161000A - Splitting method and splitting device for laser cutting of glass - Google Patents
Splitting method and splitting device for laser cutting of glass Download PDFInfo
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- CN114161000A CN114161000A CN202210099497.1A CN202210099497A CN114161000A CN 114161000 A CN114161000 A CN 114161000A CN 202210099497 A CN202210099497 A CN 202210099497A CN 114161000 A CN114161000 A CN 114161000A
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- glass
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- heating
- closed track
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a splitting method and a splitting device for cutting glass by laser, which relate to the field of glass cutting, and comprise the following steps: after the glass is subjected to laser cutting in a required closed shape, heating an outer ring area of a glass cutting closed track, or heating an outer area of the glass cutting closed track, or heating the outer area and the inner ring area of the glass cutting closed track, and cooling the inner ring area of the glass cutting closed track to enable cracks formed by glass cutting to penetrate through. The heating and cooling are matched to enable the temperature change gradient of the glass cutting seam area to be greatly increased, so that cracks formed in the laser cutting process are enabled to be rapidly communicated and form wider cracks, and therefore, the thicker glass can be cut under the action of subsequent applied mechanical external force.
Description
Technical Field
The invention relates to the field of glass cutting, in particular to a splitting method and a splitting device for cutting glass by laser.
Background
With the increasing requirements of semiconductor technology, display technology and quality of life of people, glass with various specifications is used in more and more places. The precision, production efficiency, and shape of glass manufacturing processes are also increasing or increasing. Meanwhile, with the development of laser technology, laser processing of glass gradually or in the process of replacing traditional mechanical drill/saw blade processing and water jet processing. The laser cutting processing is a novel processing means and has the characteristics of simple production flow, no pollution, low noise, high precision, high production efficiency, high product yield and the like.
However, the current processing of glass closed shapes by ultrafast laser wire cutting has a problem that after laser cutting on thick (more than 2mm) glass, cracks formed after laser cutting are small, although heating (by CO) can be performed along a closed cutting track2Laser beam, or hot oil, or even chemical corrosion, etc.) to make the crack through, but because the cutting seam is tiny, the acting force between the cut piece and the substrate is large, the cut piece and the substrate can not fall off freely, even under the action of certain mechanical external force, the glass can not be separated without damage, and the methods are only suitable for cutting thin (less than 2mm) glass.
Therefore, how to increase the cutting thickness of the glass and realize the cutting of thicker glass becomes a problem to be solved urgently by those skilled in the art.
Disclosure of Invention
In order to solve the technical problems, the invention provides a splitting method and a splitting device for cutting glass by laser, which are used for increasing the cutting thickness of the glass and realizing the cutting of thicker glass.
In order to achieve the purpose, the invention provides the following scheme:
the invention provides a splitting method for cutting glass by laser, which comprises the following steps: after the glass is subjected to laser cutting in a required closed shape, heating an outer ring area of a glass cutting closed track, or heating an outer area of the glass cutting closed track, or heating the outer area and an inner ring area of the glass cutting closed track, and cooling the inner ring area of the glass cutting closed track to enable cracks formed by cutting the glass to be communicated, and finally realizing the cracking due to the fact that a gap enough for cracking is generated by thermal expansion and cold contraction.
Preferably, in the first step, the inner ring area of the glass cutting closed track is cooled by blowing cold air and/or coating strong cold medium and/or contacting high heat conduction material.
Preferably, in the first step, the outer ring area or the outer area and the inner ring area of the glass cutting closed track are heated by means of carbon dioxide laser beam and/or water bath and/or heating furnace and/or infrared irradiation.
Preferably, the glass is cut to the desired shape using ultrafast laser filamentation cutting prior to said first step.
Preferably, after the first step, or while cooling the inner ring area of the glass cutting closed track, an external force is applied to the area where the glass is cut to achieve the breaking of the glass.
The invention also provides a splitting device for cutting glass by laser, which comprises: the device comprises a heating device and a cooling device, wherein the heating device is used for heating the outer ring area of the glass cutting closed track after the glass is subjected to laser cutting in a required closed shape, and the cooling device is used for cooling the inner ring area of the glass cutting closed track.
Preferably, the heating means comprises: a carbon dioxide laser light source for emitting a carbon dioxide laser beam and a first mirror for changing a direction of the carbon dioxide laser beam; the cooling device includes: a duct for conveying cold air.
Preferably, the glass splitting device for laser cutting provided by the invention further comprises an ultrafast laser cutting device for performing laser cutting on the glass in a required shape, wherein the ultrafast laser cutting device comprises an ultrafast laser light source for emitting an ultrafast laser beam, a second reflector for changing the direction of the ultrafast laser beam, and a bessel cutting head for shaping and focusing the ultrafast laser beam after the direction of the second reflector is changed.
Preferably, the glass splitting device for laser cutting provided by the invention further comprises an external force applying device for applying an external force to the area of the glass to be cut, wherein the external force applying device comprises a top head, a first linear driving device and a second linear driving device, the first linear driving device is connected with the top head to drive the top head to reciprocate along the vertical direction, and the second linear driving device is connected with the first linear driving device to drive the first linear driving device and the top head to synchronously reciprocate along the horizontal direction.
Compared with the prior art, the invention has the following technical effects:
the invention provides a splitting method for cutting glass by laser, which comprises the following steps: after the glass is subjected to laser cutting in a required closed shape, heating an outer ring area of a glass cutting closed track, or heating an outer area of the glass cutting closed track, or heating the outer area and the inner ring area of the glass cutting closed track, and cooling the inner ring area of the glass cutting closed track to enable cracks formed by glass cutting to penetrate through. The heating and cooling are matched to enable the temperature change gradient of the glass cutting seam area to be greatly increased, so that cracks formed in the laser cutting process are enabled to be rapidly communicated and form wider cracks, and therefore, the thicker glass can be cut under the action of subsequent applied mechanical external force.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic diagram illustrating an arrangement of an inner ring region and an outer ring region according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a part of a laser cutting glass breaking apparatus provided in an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an ultrafast laser cutting apparatus provided in an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an external force applying apparatus provided in an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating an arrangement of inner and outer regions according to an embodiment of the present invention;
description of reference numerals: 1. a carbon dioxide laser light source; 2. a carbon dioxide laser beam; 3. a first reflector; 4. a delivery pipe; 5. an ultrafast laser light source; 6. ultrafast laser beam; 7. a second reflector; 8. a bessel cutting head; 9. a lens assembly; 10. a controller; 11. a work table; 12. a monitor; 13. a camera; 14. ejecting the head; 15. a horizontal guide rail; 16. a first linear driving device; 17. a second linear drive; 18. glass; 19. closing the track; 20. an outer ring region; 21. an inner ring region; 22. an outer region.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide a splitting method and a splitting device for laser cutting glass, which can improve the cutting thickness of glass and realize the cutting of thicker glass.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
As shown in fig. 1, the method for breaking glass by laser cutting according to the present embodiment includes the following steps: after the glass 18 is laser cut into a required closed shape, an outer ring area 20 of a closed track 19 cut by the glass 18 is heated, and an inner ring area 21 of the closed track 19 cut by the glass 18 is cooled, so that cracks formed by cutting the glass 18 penetrate. The combination of heating and cooling dramatically increases the temperature gradient of the cutting area of the glass 18, promotes the cracks formed in the laser cutting process to quickly run through and form wider cracks, thus realizing the cutting of thicker glass under the action of subsequent applied mechanical external force. Further, it is preferable that the heating and cooling are performed simultaneously.
In the present embodiment, in the first step, the inner ring area 21 of the glass 18 cut by the closed track 19 is cooled by blowing cold air and/or applying a strong cold medium and/or contacting with a high thermal conductivity material. The specific cold air blowing, the coating of the strong cold medium and the contact of the high-heat-conductivity material belong to the prior art, for example, the cold air blowing can specifically select dry ice blowing or liquid nitrogen blowing, and the high-heat-conductivity material can specifically select copper, silver and other materials with high heat conductivity.
In the present embodiment, in the first step, the outer ring area 20 of the closed path 19 for cutting the glass 18 is heated by using the carbon dioxide laser beam 2 and/or water bath and/or heating furnace and/or infrared irradiation. In addition, the outer annular region 20 of the glass 18 cut closed track 19 can be heated with thermal oil.
In this embodiment, the glass 18 is cut to the desired shape using ultrafast laser filamentation prior to step one. The ultrafast laser filamentation cutting technique belongs to the prior art and is not described in detail herein. In addition, "ultrafast laser" means that the pulse width of the output laser is 10-12s is a pulsed laser on the order of picoseconds or less.
In this embodiment, after step one, or while cooling the inner ring area 21 of the glass 18 cutting the closed track 19, an external force is applied to the cut area of the glass 18 to achieve breaking of the glass (separation of the cut piece from the substrate).
As shown in fig. 2 to 4, the present embodiment further provides a splitting apparatus for laser cutting glass, including: after laser cutting of the glass 18 to the desired closed shape, a heating device for heating the outer ring region 20 of the glass 18 cut closed track 19 and a cooling device for cooling the inner ring region 21 of the glass 18 cut closed track 19.
In this embodiment, as shown in fig. 2, the heating device includes: a carbon dioxide laser light source 1 for emitting a carbon dioxide laser beam 2 and a first mirror 3 for changing the direction of the carbon dioxide laser beam 2; the cooling device includes: a duct 4 for conveying cold air. In particular, during use, the duct 4 feeds cold air to one of the outer annular region 20 and the inner annular region 21 of the cutting trajectory 19 of the glass 18 while heating the other by the carbon dioxide laser beam 2.
In the present embodiment, as shown in fig. 3, the glass splitting apparatus for laser cutting glass further includes an ultrafast laser cutting apparatus for performing laser cutting on the glass 18 to a desired shape, and the ultrafast laser cutting apparatus includes an ultrafast laser light source 5 for emitting an ultrafast laser beam 6, a second reflecting mirror 7 for changing the direction of the ultrafast laser beam 6, and a bessel cutting head 8 for shaping and focusing the ultrafast laser beam 6 after the second reflecting mirror 7 is changed in direction. In this embodiment, an ultrafast laser is specifically selected as the laser source. In addition, the splitting device for cutting the glass by the laser further comprises a controller 10, a lens assembly 9, a monitor 12, a camera 13 and a workbench 11 provided with a sucker. The glass 18 is placed on the table 11, and the glass 18 is sucked by a suction pad to fix the position of the glass 18. Lens subassembly 9 sets up between ultrafast laser light source 5 and second reflector 7, and lens subassembly 9 is used for expanding the beam to ultrafast laser beam 6 that ultrafast laser light source 5 sent, collimation, and the concrete structure of lens subassembly 9 belongs to prior art. The monitor 12 is used for facilitating manual observation, the camera 13 collects information of the ultrafast laser beam 6 and transmits the collected information of the ultrafast laser beam 6 to the monitor 12 and the controller 10, and the controller 10 controls the ultrafast laser light source 5 to work according to the information of the ultrafast laser beam 6 collected by the camera 13. The controller is specifically a PLC controller. During cutting, the worktable 11 bears the glass 18 to be processed and moves along the track, and the laser beam enters the Bessel cutting head 8 through beam expansion and reflection to irradiate the surface of the glass 18 to be cut so as to perform laser cutting on the glass 18.
In this embodiment, as shown in fig. 4, the glass splitting apparatus for laser cutting glass further includes an external force applying device for applying an external force to a region of the glass 18 to be cut, the external force applying device includes a plug 14, a first linear driving device 16 and a second linear driving device 17, the first linear driving device 16 is connected to the plug 14 to drive the plug 14 to reciprocate along a vertical direction, and the second linear driving device 17 is connected to the first linear driving device 16 to drive the first linear driving device 16 and the plug 14 to reciprocate synchronously along a horizontal direction. In this embodiment, the first linear driving device 16 and the second linear driving device 17 both use air cylinders, the external force applying device further includes a horizontal guide rail 15, and the second linear driving device 17 is slidably disposed on the horizontal guide rail 15. In addition, the specific structure of the plug 14 is known in the art, such as a mechanical plug.
In the specific use process, the first linear driving device 16 is used for driving the ejector 14 to move downwards, external force is applied to the cut area, and the glass 18 is split, so that the whole process of cutting the glass by laser can be completed. In addition, in order to reinforce the action of the mechanical force splitting, ultrasonic waves may be applied to the plug 14. How to apply ultrasonic waves belongs to the prior art, and details are not described herein.
The splitting method and the splitting device for cutting glass by laser provided by the embodiment have the following advantages:
the cracks are wider and even occur as follows: the glass has smaller adhesion and is easier to separate by certain mechanical external force;
the glass is not easy to be damaged in the splitting process;
is suitable for cutting thicker glass.
Example two
As shown in fig. 5, this embodiment includes some or all of the technical features of the first embodiment, except that in the first step, after the glass 18 is laser cut into a desired closed shape, the outer region 22 of the closed track 19 cut by the glass 18 is heated, and the inner ring region 21 of the closed track 19 cut by the glass 18 is cooled, so that the crack formed by cutting the glass 18 penetrates; alternatively, the outer region 22 and the inner ring region 21 of the glass 18 cut closed track 19 are heated, and the inner ring region 21 of the glass 18 cut closed track 19 is cooled so that the crack formed by cutting the glass 18 penetrates.
Further, in the present embodiment, specifically, the outer region 22 or the outer region 22 and the inner ring region 21 of the closed path 19 for cutting the glass 18 are heated by means of the carbon dioxide laser beam 2 and/or a water bath and/or a heating furnace and/or infrared irradiation.
As shown in fig. 5, the outer region refers to a region other than the closed locus 19, and the outer region 22 includes the outer ring region 21. As shown in fig. 1, the inner ring region 21 refers to a region within the closed locus 19, and the inner ring region 21 is an inner region of the closed locus 19.
In the description of the present invention, it should be noted that "connected" is to be understood broadly, for example, it may be fixed, detachable, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The principle and the implementation mode of the present invention are explained by applying specific examples in the present specification, and the above descriptions of the examples are only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (9)
1. The splitting method for cutting the glass by laser is characterized by comprising the following steps of:
after the glass is subjected to laser cutting in a required closed shape, heating an outer ring area of a glass cutting closed track, or heating an outer area of the glass cutting closed track, or heating the outer area and an inner ring area of the glass cutting closed track, and cooling the inner ring area of the glass cutting closed track to enable cracks formed by cutting the glass to penetrate through.
2. The glass splitting method according to claim 1, wherein in the first step, the inner ring area of the glass cutting closed track is cooled by blowing cold air and/or coating strong cold medium and/or contacting high heat conduction material.
3. The glass splitting method according to claim 1, wherein in the first step, the outer ring area or the outer area and the inner ring area of the glass cutting closed track are heated by means of carbon dioxide laser beam and/or water bath and/or heating furnace and/or infrared irradiation.
4. The method for breaking glass by laser cutting according to claim 1, wherein the glass is cut into a desired shape by ultrafast laser wire-cutting before the first step.
5. The method for breaking glass by laser cutting according to claim 1, wherein after the first step, or while cooling the inner ring area of the glass cutting closed track, an external force is applied to the area of the glass to be cut to achieve breaking of the glass.
6. A lobe of a leaf device of laser cutting glass, its characterized in that includes: the device comprises a heating device and a cooling device, wherein the heating device is used for heating the outer ring area of the glass cutting closed track after the glass is subjected to laser cutting in a required closed shape, and the cooling device is used for cooling the inner ring area of the glass cutting closed track.
7. The apparatus for breaking glass by laser cutting according to claim 6, wherein the heating means comprises: a carbon dioxide laser light source for emitting a carbon dioxide laser beam and a first mirror for changing a direction of the carbon dioxide laser beam; the cooling device includes: a duct for conveying cold air.
8. The glass splitting apparatus according to claim 6, further comprising an ultrafast laser cutting apparatus for performing laser cutting of the glass into a desired shape, wherein the ultrafast laser cutting apparatus comprises an ultrafast laser light source for emitting an ultrafast laser beam, a second mirror for changing a direction of the ultrafast laser beam, and a Bezier cutter head for shaping and focusing the ultrafast laser beam after the second mirror is changed.
9. The glass splitting device for laser cutting according to claim 6, further comprising an external force applying device for applying an external force to the area of the glass to be cut, wherein the external force applying device comprises a top head, a first linear driving device and a second linear driving device, the first linear driving device is connected with the top head to drive the top head to reciprocate along the vertical direction, and the second linear driving device is connected with the first linear driving device to drive the first linear driving device and the top head to synchronously reciprocate along the horizontal direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110622491.3A CN113333967A (en) | 2021-06-04 | 2021-06-04 | Splitting method and splitting device for laser cutting of glass |
| CN2021106224913 | 2021-06-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114161000A true CN114161000A (en) | 2022-03-11 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110622491.3A Pending CN113333967A (en) | 2021-06-04 | 2021-06-04 | Splitting method and splitting device for laser cutting of glass |
| CN202210099497.1A Pending CN114161000A (en) | 2021-06-04 | 2022-01-27 | Splitting method and splitting device for laser cutting of glass |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110622491.3A Pending CN113333967A (en) | 2021-06-04 | 2021-06-04 | Splitting method and splitting device for laser cutting of glass |
Country Status (3)
| Country | Link |
|---|---|
| CN (2) | CN113333967A (en) |
| BR (1) | BR112023009553A2 (en) |
| WO (1) | WO2022253064A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114850700A (en) * | 2022-06-09 | 2022-08-05 | 浙江华工光润智能装备技术有限公司 | Laser cutting equipment and method for laminated glass |
| WO2022253064A1 (en) * | 2021-06-04 | 2022-12-08 | 浙江华工光润智能装备技术有限公司 | Splitting method and splitting apparatus for laser-cut glass |
| CN115521055A (en) * | 2022-10-25 | 2022-12-27 | 深圳市益铂晶科技有限公司 | Icing and splitting method for glass laser cutting |
| CN115536260A (en) * | 2022-10-25 | 2022-12-30 | 深圳市益铂晶科技有限公司 | Method for cutting glass by carbon dioxide laser |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113814578B (en) * | 2021-09-30 | 2022-06-14 | 深圳市吉祥云科技有限公司 | Method for processing brittle material |
| CN114309987A (en) * | 2022-01-13 | 2022-04-12 | 武汉华工激光工程有限责任公司 | Laser cutting method and device for display panel |
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2021
- 2021-06-04 CN CN202110622491.3A patent/CN113333967A/en active Pending
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- 2022-05-25 BR BR112023009553A patent/BR112023009553A2/en unknown
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| CN115536260A (en) * | 2022-10-25 | 2022-12-30 | 深圳市益铂晶科技有限公司 | Method for cutting glass by carbon dioxide laser |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022253064A1 (en) | 2022-12-08 |
| BR112023009553A2 (en) | 2023-12-12 |
| CN113333967A (en) | 2021-09-03 |
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