TWI400137B - Device for removing defects on edges of glass sheets and method therefor - Google Patents
Device for removing defects on edges of glass sheets and method therefor Download PDFInfo
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- TWI400137B TWI400137B TW99144580A TW99144580A TWI400137B TW I400137 B TWI400137 B TW I400137B TW 99144580 A TW99144580 A TW 99144580A TW 99144580 A TW99144580 A TW 99144580A TW I400137 B TWI400137 B TW I400137B
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Description
本發明係有關於一種移除玻璃板材邊緣微小缺陷之裝置及其方法,特別是有關於一種利用照射雷射光線之高溫度梯度差而在玻璃板材端面產成劈裂效應的裝置及其方法。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to an apparatus and method for removing minute defects in the edge of a glass sheet, and more particularly to an apparatus and method for producing a splitting effect at the end face of a glass sheet by utilizing a high temperature gradient difference of the irradiated laser light.
目前在加工玻璃板材時,如加工應用在LCD面板的玻璃基板,在玻璃基板經過輪刀切割、裂片(breaking)後,在斷面會有切割裂片過程產生的微裂紋(micro-crack),此微裂紋會造成玻璃強度的降低。其改善方法,有利用相對較耗時的機械磨邊(grinding),其處理的速度約為10~80 mm/s。另一種改善微裂紋方法,如台灣第I317667號專利所揭示,係利用於玻璃基板端面長邊方向70度以內、板厚方向70度以內的雷射光線照射玻璃基板端面,相對於玻璃基板速度為0.1~200 mm/s,同時以冷卻氣體對雷射光線照射部,進行送風,使加熱而熔融玻璃端面及其微裂紋,使平滑化玻璃基板的端面。At present, when processing glass sheets, such as processing on a glass substrate of an LCD panel, after the glass substrate is subjected to wheel cutting and rupture, there is a micro-crack generated in the cutting process in the section. Microcracks can cause a decrease in the strength of the glass. The improvement method utilizes relatively time-consuming mechanical grinding, which is processed at a speed of about 10 to 80 mm/s. Another method for improving microcracking, as disclosed in Japanese Patent No. I317667, is to irradiate the end surface of the glass substrate with laser light within 70 degrees of the longitudinal direction of the end surface of the glass substrate and within 70 degrees of the thickness direction of the glass substrate, and the speed of the glass substrate is 0.1 to 200 mm/s, while irradiating the portion of the laser beam with the cooling gas, the air is blown, and the end face of the glass substrate is smoothed by heating to melt the end face of the glass and the microcrack.
本發明係提供一種移除玻璃板材邊緣缺陷之裝置,其結構包含:一用以承載玻璃板材的載台。一用以輸出一雷 射光線的雷射輸出單元。一光路引導單元,係配置於雷射光線之光路上,用以引導雷射光線成為一雷射光束而照射於玻璃板材邊緣之一端面,該玻璃板材包括玻璃基板或鏡片等片狀材料。以及一控制單元,係電性耦接雷射輸出單元和光路引導單元,用以控制雷射輸出單元之雷射光線觸發時程及能量密度,與控制光路引導單元對雷射光束的照射路徑及移動速度,以在端面劈裂出一層玻璃削屑,以達成移除玻璃板材邊緣之缺陷,另可形成光滑面的端面。The present invention provides an apparatus for removing edge defects of a glass sheet, the structure comprising: a stage for carrying the glass sheet. One for outputting a mine A laser output unit that emits light. An optical path guiding unit is disposed on the optical path of the laser beam to guide the laser light into a laser beam and irradiate to one end of the edge of the glass plate. The glass plate comprises a sheet material such as a glass substrate or a lens. And a control unit electrically coupled to the laser output unit and the optical path guiding unit for controlling the laser ray triggering time history and energy density of the laser output unit, and controlling the illumination path of the laser beam by the optical path guiding unit and The speed of movement is such that a layer of glass shavings is split at the end face to achieve the defect of removing the edge of the glass sheet, and the end surface of the smooth surface can be formed.
在進行本發明研究開始時,係先在玻璃板材端面上之缺陷放置玻璃粉,再利用雷射光照射於玻璃板材端面,因雷射光照射時會將玻璃粉噴開,或先利用雷射光照射於玻璃板材端面,再放置玻璃粉,均無法移除玻璃板材邊緣之缺陷,另外一種方法為利用雷射光照射於玻璃板材端面成高溫狀態,再用外力壓平,因當雷射光線照射於玻璃板材端面移除雷射光時,光線照射後之能量迅速降低,仍無法壓平而將玻璃板材邊緣之缺陷移除。茲將本發明實驗成功說明如下。At the beginning of the research of the present invention, the glass powder is first placed on the end face of the glass sheet, and then irradiated with the laser light to the end surface of the glass sheet, and the glass powder is sprayed when irradiated by the laser light, or irradiated with the laser light first. The end face of the glass plate, and then the glass powder, can not remove the defects of the edge of the glass plate. Another method is to use the laser light to illuminate the end face of the glass plate to a high temperature state, and then flatten it with an external force, because the laser light is irradiated on the glass plate. When the laser light is removed from the end face, the energy after the light is irradiated rapidly decreases, and the defect of the edge of the glass sheet is still not removed. The experiments of the present invention were successfully described as follows.
本發明係利用雷射光束照射於玻璃板材端面,以產生高的溫度梯度差,進而在端面產生劈裂效應,以達成移除玻璃板材邊緣之缺陷,另可使端面形成光滑面。The invention utilizes a laser beam to illuminate the end surface of the glass sheet to produce a high temperature gradient difference, thereby generating a splitting effect on the end surface, thereby achieving the defect of removing the edge of the glass sheet, and further forming the smooth surface of the end surface.
茲配合圖式將本發明諸實施例詳細說明如下。The embodiments of the present invention are described in detail below with reference to the drawings.
如圖1所示,本實施例之移除玻璃板材10邊緣微小缺 陷之裝置包含:一載台20,可控制x,y,z軸方向運動,以承載玻璃板材10,其玻璃板材10可被固定於載台20上,並欲加工的端面11朝向外側。一雷射輸出單元30,以輸出一雷射光線31。一光路引導單元40,該光路引導單元40可為一掃描裝置,係配置於雷射光線31之光路上,係可應用該光路引導單元40內之光學組件(圖中未示出),將雷射光線31導引為雷射光束41,雷射光束41再照射於該玻璃板材10邊緣之一端面11上。一控制單元50,係電性耦接雷射輸出單元30和光路引導單元40,由控制單元50輸出電訊信號51以控制該雷射輸出單元30的該雷射光線31之觸發時程及能量密度,控制單元50之輸出電訊信號51亦可控制該光路引導單元40之該雷射光束41的照射路徑t及移動速度。藉由雷射光束41的照射,可在該端面11產生劈裂出一層玻璃削屑s(如圖5所示),以達成移除玻璃板材邊緣之缺陷,另可使該端面11形成一光滑面。As shown in FIG. 1, the edge of the removed glass sheet 10 of the present embodiment is slightly missing. The trapping device comprises: a stage 20 for controlling movement in the x, y, and z axes to carry the glass sheet 10, and the glass sheet 10 can be fixed to the stage 20, and the end surface 11 to be processed faces outward. A laser output unit 30 outputs a laser beam 31. An optical path guiding unit 40, which can be a scanning device disposed on the optical path of the laser beam 31, can apply an optical component (not shown) in the optical path guiding unit 40, and The ray 31 is guided as a laser beam 41, which is then irradiated onto one end face 11 of the edge of the glazing unit 10. A control unit 50 is electrically coupled to the laser output unit 30 and the optical path guiding unit 40. The control unit 50 outputs a telecommunication signal 51 to control the trigger time history and energy density of the laser beam 31 of the laser output unit 30. The output telecommunication signal 51 of the control unit 50 can also control the illumination path t and the moving speed of the laser beam 41 of the optical path guiding unit 40. By the irradiation of the laser beam 41, a layer of glass shavings s (as shown in FIG. 5) can be generated on the end surface 11 to achieve the defect of removing the edge of the glass sheet, and the end surface 11 can be formed into a smooth surface. surface.
如圖2所示,本實施例中,移除玻璃板材10邊緣微小缺陷之方法的步驟包含:步驟S10,以一雷射光束41照射於一玻璃板材10端面11。以及步驟S20,控制該雷射光束41的照射路徑t,使該雷射光束41依序走完該玻璃板材10端面11(或者是走完要劈裂加工區域的起點至終點),該玻璃板材10端面11因該雷射光束41的照射與未照射之間的一高的溫度梯度差,而在該端面11產生劈裂出一層玻璃削屑s(如圖5所示),使該端面11形成光滑加工面。而其劈裂方向為沿著該雷射光束41的照射路徑t的方向。As shown in FIG. 2, in the embodiment, the method for removing the micro-defects of the edge of the glass sheet 10 comprises: step S10, irradiating a laser beam 41 to the end surface 11 of a glass sheet 10. And step S20, controlling the illumination path t of the laser beam 41, and causing the laser beam 41 to sequentially finish the end surface 11 of the glass sheet 10 (or the starting point to the end point of the processing region to be split), the glass sheet The 10 end face 11 is caused by a high temperature gradient difference between the irradiation of the laser beam 41 and the non-irradiation, and a layer of glass shavings s (shown in FIG. 5) is generated at the end face 11 to make the end face 11 Form a smooth machined surface. The splitting direction is the direction along the irradiation path t of the laser beam 41.
再請參照圖3,並同時參考圖1所示,上述實施例中, 一載台20,可控制x,y,z軸方向運動,使得該雷射光束41的照射路徑t包含與該玻璃板材10端面11之一短邊12形成複數個平行線,每一平行線之間維持一間距p,而其照射路徑t的走勢依序為:觸發該雷射光線31照射後,利用該光路引導單元40使該雷射光束41行走平行該短邊12的路徑t1;再停止該雷射光線31的照射,並將該雷射光束41的照射位置按照路徑t2移動;再次觸發該雷射光線31的照射,並依路徑t3移動,再停止照射並依路徑t4移動,且重覆此一照射及移動方式走完整個端面11區域(或者是走完要劈裂的起點至終點)。Referring to FIG. 3 again, and referring to FIG. 1 at the same time, in the above embodiment, A stage 20 is configured to control the movement of the x, y, and z axes, such that the illumination path t of the laser beam 41 includes a plurality of parallel lines with one of the short sides 12 of the end surface 11 of the glass sheet 10, and each parallel line Maintaining a pitch p, and the direction of the illumination path t is sequentially: after the laser beam 31 is triggered to be irradiated, the laser beam guiding unit 40 is used to walk the laser beam 41 parallel to the path t1 of the short side 12; Irradiation of the laser beam 31, and moving the irradiation position of the laser beam 41 according to the path t2; triggering the irradiation of the laser beam 31 again, and moving according to the path t3, stopping the irradiation and moving according to the path t4, and Cover the entire end face 11 area with this illumination and movement (or the starting point to the end point of the split).
請參照圖4,並同時參考圖1所示,上述實施例中,該雷射光束41的照射路徑t包含與該玻璃板材10端面11之一長邊13形成複數個平行線,每一平行線之間維持一間距p,而其照射路徑t的走勢依序為:觸發該雷射光線31照射後,利用該光路引導單元40使該雷射光束41行走平行該長邊13的路徑t5;再使該雷射光線31停止照射,並將該雷射光束41的照射位置按照路徑t6移動;再次觸發該雷射光線31的照射,並依路徑t7移動,再停止照射並依路徑t8移動,且重覆此一照射及移動方式走完整個端面11區域。Referring to FIG. 4, and referring to FIG. 1 at the same time, in the above embodiment, the illumination path t of the laser beam 41 includes a plurality of parallel lines, one parallel line, with one long side 13 of the end surface 11 of the glass sheet 10. Maintaining a distance p between them, and the direction of the illumination path t is sequentially: after the laser beam 31 is triggered to be irradiated, the laser beam guiding unit 40 is used to walk the laser beam 41 parallel to the path t5 of the long side 13; Stopping the laser beam 31, and moving the irradiation position of the laser beam 41 according to the path t6; triggering the irradiation of the laser beam 31 again, and moving according to the path t7, stopping the irradiation and moving according to the path t8, and Repeat this illumination and move the entire end face 11 area.
在上述實施中,該雷射輸出單元30所輸出該雷射光線31的輸出波長最好為3至12 um波段之間,或更佳波長為9至12 um波段之間。In the above embodiment, the output wavelength of the laser beam 31 outputted by the laser output unit 30 is preferably between 3 and 12 um, or more preferably between 9 and 12 um.
上述實施中,控制雷射光束41的照射能量,使其劈裂 出之該層玻璃削屑厚度係可介於1 um至1 mm之間。In the above implementation, the irradiation energy of the laser beam 41 is controlled to cause it to split. The layer of glass shavings can range from 1 um to 1 mm.
上述實施中,該雷射光束41相對於該玻璃板材10端面11的速度係大於500 mm/s。In the above embodiment, the speed of the laser beam 41 relative to the end face 11 of the glass sheet 10 is greater than 500 mm/s.
上述實施中,玻璃板材10端面11的雷射光束41照射路徑t的間距p係為:(光斑直徑d/25)≦間距p≦光斑直徑d,其中,光斑直徑d係為該雷射光束41的聚焦後光斑直徑大小,該聚焦後光斑直徑d係以能量分佈降低至最高部分的1/e2 時的寬度,e為自然對數函數的底數。且該雷射光束41的能量密度介於1* 104 至1* 106 W/cm2 之間。In the above embodiment, the pitch p of the laser beam 41 irradiating the path t of the end face 11 of the glass sheet 10 is: (spot diameter d / 25) ≦ pitch p ≦ spot diameter d, wherein the spot diameter d is the laser beam 41 The size of the spot diameter after focusing, the spot diameter d after the focus is reduced by the energy distribution to the width of 1/e 2 of the highest portion, and e is the base of the natural logarithm function. And the energy density of the laser beam 41 is between 1 * 10 4 and 1 * 10 6 W/cm 2 .
請再參閱圖5及圖6所示,在本實施例中與前揭實施例的裝置或施作步驟大部分相同,但更包含有設置一送風噴嘴60,該送風噴嘴60可對該玻璃板材10或者是對該雷射光束41照射後之該端面11區域輸出冷卻氣體g,藉以更提高該溫度梯度差,進而提升劈裂速度。Referring to FIG. 5 and FIG. 6 again, in the embodiment, the device or the application step of the foregoing embodiment is mostly the same, but further includes a blowing nozzle 60, and the air blowing nozzle 60 can be used for the glass plate. 10 or the cooling gas g is outputted from the end surface 11 region after the laser beam 41 is irradiated, thereby further increasing the temperature gradient difference, thereby increasing the splitting speed.
值得一提的是,如圖2、圖5所示,在施行步驟S10之前,該玻璃板材10端面11可預刻一刻痕14,作為劈裂的起點或終點,當然也可同時預刻一起點及一終點。而該刻痕14係可利用機械式刀具或雷射光線而刻成。It is worth mentioning that, as shown in FIG. 2 and FIG. 5, before the step S10 is performed, the end surface 11 of the glass sheet 10 can be pre-engraved with a score 14 as a starting point or an end point of the splitting. And an end point. The score 14 can be engraved with a mechanical cutter or laser light.
本發明之特點係在於,本發明利用雷射光線在玻璃板材端面照射,玻璃板材吸收雷射光線的熱量後形成高溫度梯度,產生的熱脹冷縮形成一熱應力,使玻璃板材端面劈裂一層玻璃屑,藉此消除玻璃板材邊緣表面上的微裂紋,使玻璃板材端面光滑平整,可以提升玻璃應力強度。The invention is characterized in that the invention irradiates the end face of the glass plate with laser light, and the glass plate absorbs the heat of the laser light to form a high temperature gradient, and the thermal expansion and contraction generate a thermal stress, so that the end face of the glass plate is cleaved. A layer of glass swarf, thereby eliminating micro-cracks on the edge surface of the glass sheet, smoothing the end surface of the glass sheet and improving the stress strength of the glass.
綜上所述,乃僅記載本發明為呈現解決問題所採用的 技術手段之實施方式或實施例而已,並非用來限定本發明專利實施之範圍。即凡與本發明專利申請範圍文義相符,或依本發明專利範圍所做的均等變化與修飾,皆為本發明專利範圍所涵蓋。In summary, it is only described that the present invention is used to solve the problem. The embodiments or the embodiments of the technical means are not intended to limit the scope of the practice of the invention. That is, the equivalent changes and modifications made in accordance with the scope of the patent application of the present invention or the scope of the invention are covered by the scope of the invention.
10‧‧‧玻璃板材10‧‧‧glass plate
11‧‧‧端面11‧‧‧ end face
12‧‧‧短邊12‧‧‧ Short side
13‧‧‧長邊13‧‧‧Longside
14‧‧‧刻痕14‧‧‧ Scotch
20‧‧‧載台20‧‧‧ stage
30‧‧‧雷射輸出單元30‧‧‧Laser output unit
31‧‧‧雷射光線31‧‧‧Laser light
40‧‧‧光路引導單元40‧‧‧Light path guiding unit
41‧‧‧雷射光束41‧‧‧Laser beam
50‧‧‧控制單元50‧‧‧Control unit
51‧‧‧電訊信號51‧‧‧Telecom signal
60‧‧‧送風噴嘴60‧‧‧Air supply nozzle
d‧‧‧光斑直徑D‧‧‧ spot diameter
g‧‧‧冷卻氣體g‧‧‧Cooling gas
s‧‧‧玻璃削屑S‧‧‧glass shavings
t‧‧‧照射路徑t‧‧‧Irradiation path
t1,t2,t3,t4‧‧‧路徑T1, t2, t3, t4‧‧‧ path
t5,t6,t7,t8‧‧‧路徑T5, t6, t7, t8‧‧‧ path
p‧‧‧間距P‧‧‧ spacing
步驟S10、步驟S20‧‧‧方法步驟Step S10, step S20‧‧‧ method steps
圖1繪示本發明之移除玻璃板材邊緣微小缺陷之裝置之實施例的系統方塊示意圖;圖2繪示本發明之移除玻璃板材邊緣微小缺陷之方法的步驟流程圖;圖3繪示圖1之照射路徑第一實施例的立體示意圖;圖4繪示圖1之照射路徑第二實施例的立體示意圖;圖5繪示本發明加設一送風噴嘴以提供玻璃板材冷卻氣體實施例之立體示意圖;以及圖6繪示本發明加設一送風噴嘴以提供玻璃板材端面冷卻氣體實施例之立體示意圖。1 is a schematic block diagram of a system for removing a micro-defect of a glass sheet according to an embodiment of the present invention; FIG. 2 is a flow chart showing the steps of the method for removing micro-defects at the edge of a glass sheet according to the present invention; 1 is a perspective view of the first embodiment of the illumination path; FIG. 4 is a perspective view of the second embodiment of the illumination path of FIG. 1; FIG. 5 is a perspective view of the embodiment of the present invention with an air supply nozzle for providing a glass plate cooling gas. FIG. 6 is a schematic perspective view showing an embodiment of the present invention in which a blowing nozzle is provided to provide a glass plate end face cooling gas.
10‧‧‧玻璃板材10‧‧‧glass plate
11‧‧‧端面11‧‧‧ end face
20‧‧‧載台20‧‧‧ stage
30‧‧‧雷射輸出單元30‧‧‧Laser output unit
31‧‧‧雷射光線31‧‧‧Laser light
40‧‧‧光路引導單元40‧‧‧Light path guiding unit
41‧‧‧雷射光束41‧‧‧Laser beam
50‧‧‧控制單元50‧‧‧Control unit
51‧‧‧電訊信號51‧‧‧Telecom signal
Claims (18)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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TW99144580A TWI400137B (en) | 2010-12-17 | 2010-12-17 | Device for removing defects on edges of glass sheets and method therefor |
CN201010607453.2A CN102531370B (en) | 2010-12-17 | 2010-12-27 | Device and method for removing edge defects of glass plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW99144580A TWI400137B (en) | 2010-12-17 | 2010-12-17 | Device for removing defects on edges of glass sheets and method therefor |
Publications (2)
Publication Number | Publication Date |
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TW201226093A TW201226093A (en) | 2012-07-01 |
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TW200403193A (en) * | 2002-08-09 | 2004-03-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
TW200408486A (en) * | 2002-08-30 | 2004-06-01 | Sumitomo Heavy Industries | Laser material processing method and processing device |
TW200914385A (en) * | 2007-09-27 | 2009-04-01 | Mitsuboshi Diamond Ind Co Ltd | Method for processing brittle material substrate |
JP2009160625A (en) * | 2008-01-08 | 2009-07-23 | Nagano Prefecture | Laser beam machining device and laser beam machining method |
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US8168514B2 (en) * | 2006-08-24 | 2012-05-01 | Corning Incorporated | Laser separation of thin laminated glass substrates for flexible display applications |
TWI404585B (en) * | 2008-12-04 | 2013-08-11 | Ind Tech Res Inst | A laser processing apparatus |
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TW200403193A (en) * | 2002-08-09 | 2004-03-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
TW200408486A (en) * | 2002-08-30 | 2004-06-01 | Sumitomo Heavy Industries | Laser material processing method and processing device |
TW200914385A (en) * | 2007-09-27 | 2009-04-01 | Mitsuboshi Diamond Ind Co Ltd | Method for processing brittle material substrate |
JP2009160625A (en) * | 2008-01-08 | 2009-07-23 | Nagano Prefecture | Laser beam machining device and laser beam machining method |
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